CN102029682A - Housing, production method therefor and electronic device - Google Patents
Housing, production method therefor and electronic device Download PDFInfo
- Publication number
- CN102029682A CN102029682A CN2010102904676A CN201010290467A CN102029682A CN 102029682 A CN102029682 A CN 102029682A CN 2010102904676 A CN2010102904676 A CN 2010102904676A CN 201010290467 A CN201010290467 A CN 201010290467A CN 102029682 A CN102029682 A CN 102029682A
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- self
- film
- housing
- healing
- manufacture method
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a surface-finishing housing, a production method therefor and an electronic device, which is capable of effectively performing a self-healing performance. First, a film (300) is disposed between a first mold (100) and a second mold (200). Then gap injection housing material, adhesive film (300) and main resin (10) are formed during the mold clamping of the first mold (100) and the second mold (200) by a nozzle (210) formed on the second mold (200). The housing is made of main resin (10).
Description
The application advocates the priority of Japanese patent application 2009-226665 number (applying date is on September 30th, 2009), and its full content is put down in writing in this manual by reference.
Technical field
The present invention relates to have manufacture method, housing and the electronic equipment of the housing of self-healing property.
Background technology
In recent years, electronic equipments such as notebook personal computer, pocket telephone, PDA (Personal Digital Assistant, personal digital assistant), portable game machine are popularized, and the user carries the chance that these electronic equipments go out and increases.
The a lot of situations of above-mentioned electronic equipment are placed down in the bag that the user holds.In addition, in bag, also put into key, stationery etc. under a lot of situations.Therefore, exist electronic equipment the surface since with inwall or other contents friction and the impaired situation of bag.
In addition, owing to when going out, be used under a lot of situations of electronic equipment, therefore there is the surface of electronic equipment owing to drop or the situation impaired with the collision of other objects.
In case electronic equipment is surperficial impaired, then influences the attractive in appearance of electronic equipment, user's satisfaction descends, and is not desired therefore.
Patent documentation 1 (the Japanese documentation spy opens the 2000-342127 communique) has been put down in writing the application parts that scribble self-healing property coating.
According to patent documentation 1, even if on the surface of application parts scar etc. has been arranged, this scar part is also by self-healing, thereby filming of application parts surface is reproduced.Therefore, even if on the surface of application parts, scar etc. has been arranged, can residual this scar part yet, consequently, the surface of application parts is difficult to impaired.
The application parts that patent documentation 1 is put down in writing since the lip-deep self-healing property coating by being coated on the application parts from the callus trace, so the surface of application parts is difficult to impairedly, can keep attractive in appearance.
Yet the purpose of the technology of patent documentation 1 is: be applicable to bicycle assembly parts or that the articles for use of fishing are such is small-sized and have parts of complicated shape.
Therefore, be difficult to the technology of patent documentation 1 is applied to casting of electronic device owing to following reason.
On the such flat surfaces of the top board of casting of electronic device or base plate,, therefore preferably remove foreign matter if there have foreign matter then to damage on the application surface to be attractive in appearance with predetermined area.
But,,, also can't suitably polish the application surface even if therefore use employed polishing machine in the foreign matter of common application is removed because application itself has self-healing property and soft film coating moves easily.That is, even if, also can't remove this foreign matter owing to have foreign matter on the application surface, so the yield rate variation of application.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method, housing and electronic equipment of housing of the Surface Machining that can implement self-healing property effectively.
In order to reach such purpose, the present invention has following feature.
The manufacture method of＜housing 〉
The manufacture method of the housing that the present invention relates to is characterised in that, comprises following operation:
The film that will have the self-healing layer is configured between the 1st mould and the 2nd mould, and wherein, As time goes on described self-healing layer can repair lip-deep scar;
Spray case material, bonding described film and described case material by the nozzle formed space to the time that is formed on described the 2nd mould with described the 1st mould and described the 2nd mould locked mode.
＜housing 〉
The housing that the present invention relates to is characterised in that,
The film and the case material that will have the self-healing layer are one-body molded, and wherein, As time goes on described self-healing layer can repair the scar on surface.
＜electronic equipment 〉
The electronic equipment that the present invention relates to is characterised in that,
The film and the case material that will have the self-healing layer are one-body molded, and wherein, As time goes on described self-healing layer can repair the scar on surface.
Description of drawings
Fig. 1 is the partial cross section figure of the casting of electronic device of the 1st embodiment;
Fig. 2 is the figure of the manufacture method of explanation the 1st embodiment;
Fig. 3 is the partial cross section figure of the casting of electronic device of the 2nd embodiment;
Fig. 4 is the figure of the manufacture method of explanation the 2nd embodiment.
The specific embodiment
The summary of the manufacture method of the pontic of＜present embodiment 〉
The manufacture method of the housing of present embodiment at first, is described with reference to Fig. 1, Fig. 2.
As shown in Figure 1, the housing of present embodiment has matrix resin 10, film basic unit 11, self-healing layer 12.Film 300 shown in Figure 2 has film basic unit 11 shown in Figure 1, self-healing layer 12.
In the housing of present embodiment, at first, shown in Fig. 2 (a), film 300 is configured between the 1st mould 100 and the 2nd mould 200.Next, spray matrix resin 10, adhesive film 300 and as the matrix resin 10 of case material as case material by being formed on 210 pairs at nozzle formed space when the 1st mould 100 and the 2nd mould 200 are carried out locked mode on the 2nd mould 200.
Thus, can implement the Surface Machining of self-healing property effectively.Below, with reference to accompanying drawing, detailed description is used to implement mode of the present invention.
(the 1st embodiment)
The 1st embodiment is to have implemented the manufacture method of the film and the one-body molded casting of electronic device that constitutes of resin of self-healing property Surface Machining.
Fig. 1 is the partial cross section figure by the casting of electronic device of the manufacture method manufacturing of the 1st embodiment.With reference to Fig. 1, the casting of electronic device of the manufacture method manufacturing by the 1st embodiment has matrix resin 10, film basic unit 11, self-healing layer 12.
Film basic unit 11 is one-body molded with the state and the matrix resin 10 that are attached with predetermined decorative layer.Film basic unit 11 is made of PET (polyethylene terephthalate, PETG) resin or extendible resin such as Merlon (polycarbonate) resin, PMMA (acrylic, acrylic compounds) resin.
Even if self-healing layer 12 is the layers that have been implemented the Surface Machining of the temporary transient impaired self-healing property that also can get back to original state.Self-healing layer 12 includes the resin of the polyester with elastic force (polyester) class as rubber and the resinoid coating of ganoid silicon (silicon) is constituted by coating.
Fig. 2 is the figure of the manufacture method of explanation the 1st embodiment.With reference to Fig. 2, make the casting of electronic device that constitutes by resin by injection molding.
At first, shown in Fig. 2 (a), between fixed mould 100 and moveable die 200, dispose films 300 along fixed mould 100.Fixed mould 100 and moveable die 200 become the space of casting of electronic device shape with fixed mould 100 and moveable die 200 locked modes the time.In addition, moveable die 200 moves to the direction of fixed mould 100.In addition, moveable die 200 is formed with the nozzle 210 that is used to inject the resin after the heating.
Next, shown in Fig. 2 (b), fixed mould 100 and moveable die 200 are carried out locked mode, inject the matrix resin 10 after the heating from the space that 210 pairs at nozzle becomes the casting of electronic device shape.Then, cooling is injected into the matrix resin 10 in the space.Thus, can obtain film 300 and matrix resin 10 integrated casting of electronic device.
Next, shown in Fig. 2 (c), moveable die 200 is separated from fixed mould 100, with film 300 and matrix resin 10 one-body molded casting of electronic device from taking out between fixed mould 100 and the moveable die 200.Then, the burr around the casting of electronic device of removing one-body molded.Thus, can obtain the casting of electronic device of desired shape.
In the present embodiment, when the mode that is positioned at fixed mould 100 sides with self-healing layer 12 during, can obtain to have from the teeth outwards as shown in Figure 1 the casting of electronic device of self-healing layer 12 with film 300 is configured on the fixed mould 100 and moulding is above-mentioned casting of electronic device.In addition, when the mode that decorative layer is set with the side that does not form self-healing layer 12 in film basic unit 11 forms film 300, because decorative layer and casting of electronic device are adjacent to, therefore, this decorative layer can not float from casting of electronic device, and can keep the attractive in appearance of casting of electronic device surface by self-healing layer 12.
(the 2nd embodiment)
Fig. 3 is the partial cross section figure by the casting of electronic device of the manufacture method manufacturing of the 2nd embodiment.With reference to Fig. 3, the casting of electronic device of the manufacture method manufacturing by the 2nd embodiment has matrix resin 10, self-healing layer 12.Matrix resin 10, self-healing layer 12 are by constituting with the same material of the matrix resin 10 of the casting of electronic device that constitutes the manufacture method manufacturing by the 1st embodiment, self-healing layer 12.
Fig. 4 is the figure of the manufacture method of explanation the 2nd embodiment.With reference to Fig. 4, the casting of electronic device of the manufacture method manufacturing by the 2nd embodiment owing to similarly make by injection molding with the manufacture method of the 1st embodiment illustrated in fig. 2, is that the center describes with the difference therefore.
At first, shown in Fig. 4 (a), between fixed mould 100 and moveable die 200, dispose films 300 along fixed mould 100.The 2nd embodiment is different with the 1st embodiment, for the film basic unit 11 that will constitute film 300 after moulding peels off from casting of electronic device, and film 300 is twined by roller.
In addition, in the present embodiment, shown in Fig. 4 (b),, therefore on fixed mould 100, the hole is set, attracts air from the hole, make film 300 along fixed mould 100 configurations by this attraction owing to be constituted as by roller stretch wrap film 300.
Next, same with first embodiment, shown in Fig. 4 (b), fixed mould 100 and moveable die 200 are carried out locked mode, and inject the matrix resin 10 after the heating from the space that 210 pairs at nozzle becomes the casting of electronic device shape.Thus, the film 300 that disposes along fixed mould 100 is adjacent to along fixed mould 100.Then, cooling is injected into the matrix resin 10 in the space.Thus, can obtain film 300 and matrix resin 10 integrated casting of electronic device.
Next, shown in Fig. 4 (c), moveable die 200 is separated from fixed mould 100, peeled off the film basic unit 11 that constitutes film 300 from film 300 and matrix resin 10 by one-body molded casting of electronic device, will peel off casting of electronic device after this film basic unit 11 from taking out between fixed mould 100 and the moveable die 200.Then, the burr around the casting of electronic device of removing one-body molded.Thus, can obtain the casting of electronic device of desired shape.
In the present embodiment, when the mode that is positioned at moveable die 200 sides with self-healing layer 12 is configured in the above-mentioned casting of electronic device of fixed mould 100 and moulding with film 300, can obtain to have from the teeth outwards as shown in Figure 3 the casting of electronic device of self-healing layer 12.In addition, when the mode that decorative layer is set with moveable die 200 1 sides at self-healing layer 12 formed film 300, this decorative layer was covered by self-healing layer 12, therefore can keep the attractive in appearance of casting of electronic device surface.
In addition, in the above-described embodiment, though with 100 as fixed mould, be illustrated as moveable die with 200, also can with 100 as moveable die, with 200 as fixed mould.But, from the viewpoint of the position skew that prevents film 300, preferably as above-mentioned embodiment with 100 as fixed mould, with 200 as moveable die.
Part or all of above-mentioned embodiment can be put down in writing as following remarks, but is not limited to this.
(remarks 1)
A kind of manufacture method of housing is characterized in that, comprises following operation:
The film that will have the self-healing layer is configured between the 1st mould and the 2nd mould, and wherein, As time goes on described self-healing layer can repair the scar on surface;
Spray case material, bonding described film and described case material by the nozzle formed space to the time that is formed on described the 2nd mould with described the 1st mould and the 2nd mould locked mode.
(remarks 2)
Manufacture method as remarks 1 described housing is characterized in that,
The mode that is positioned at described the 1st die side with described self-healing layer disposes described film.
(remarks 3)
Manufacture method as remarks 1 or remarks 2 described housings is characterized in that,
Described the 2nd die side at described film is provided with decorative layer, and described decorative layer adds the surface of described case material to be decorated.
(remarks 4)
Manufacture method as remarks 1 described housing is characterized in that,
The mode that is positioned at described the 2nd die side with described self-healing layer disposes described film.
(remarks 5)
Manufacture method as remarks 4 described housings is characterized in that, also comprises:
Remain in the operation that mode on the described case material is peeled off described film with described self-healing layer.
(remarks 6)
Manufacture method as remarks 4 or remarks 5 described housings is characterized in that,
Described the 2nd die side at described self-healing layer is provided with decorative layer, and described decorative layer adds the surface of described case material to be decorated.
(remarks 7)
A kind of housing with surface of self-healing property is characterized in that,
The film and the case material that will have the self-healing layer are one-body molded, and wherein, As time goes on described self-healing layer can repair the scar on surface.
(remarks 8)
A kind of electronic equipment with housing, wherein, described housing has the surface of self-healing property, and described electronic equipment is characterised in that,
The film and the case material that will have the self-healing layer are one-body molded, and wherein, As time goes on described self-healing layer can repair the scar on surface.
Claims (8)
1. the manufacture method of a housing is characterized in that, comprises following operation:
The film that will have the self-healing layer is configured between the 1st mould and the 2nd mould, and wherein, As time goes on described self-healing layer can repair the scar on surface;
Spray case material, bonding described film and described case material by the nozzle formed space to the time that is formed on described the 2nd mould with described the 1st mould and described the 2nd mould locked mode.
2. the manufacture method of housing as claimed in claim 1 is characterized in that,
The mode that is positioned at described the 1st die side with described self-healing layer disposes described film.
3. the manufacture method of housing as claimed in claim 1 is characterized in that,
Described the 2nd die side at described film is provided with decorative layer, and described decorative layer adds the surface of described case material to be decorated.
4. the manufacture method of housing as claimed in claim 1 is characterized in that,
The mode that is positioned at described the 2nd die side with described self-healing layer disposes described film.
5. the manufacture method of housing as claimed in claim 4 is characterized in that, also comprises:
Remain in the operation that mode on the described case material is peeled off described film with described self-healing layer.
6. the manufacture method of housing as claimed in claim 4 is characterized in that,
Described the 2nd die side at described self-healing layer is provided with decorative layer, and described decorative layer adds the surface of described case material to be decorated.
7. the housing with surface of self-healing property is characterized in that,
The film and the case material that will have the self-healing layer are one-body molded, and wherein, As time goes on described self-healing layer can repair the scar on surface.
8. electronic equipment with housing, wherein, described housing has the surface of self-healing property, and described electronic equipment is characterised in that,
The film and the case material that will have the self-healing layer are one-body molded, and wherein, As time goes on described self-healing layer can repair the scar on surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-226665 | 2009-09-30 | ||
| JP2009226665A JP2011077266A (en) | 2009-09-30 | 2009-09-30 | Method for manufacturing cabinet, cabinet, and electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102029682A true CN102029682A (en) | 2011-04-27 |
| CN102029682B CN102029682B (en) | 2015-06-17 |
Family
ID=43883394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010290467.6A Active CN102029682B (en) | 2009-09-30 | 2010-09-20 | Housing, production method therefor and electronic device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2011077266A (en) |
| CN (1) | CN102029682B (en) |
| HK (1) | HK1157282A1 (en) |
| TW (1) | TW201111149A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104203530A (en) * | 2012-04-19 | 2014-12-10 | 东海兴业株式会社 | Composite molding and method for producing same |
| CN110802868A (en) * | 2019-11-27 | 2020-02-18 | 江苏新迈机械有限公司 | Method for smoothing and opening mold |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3205055A1 (en) * | 1982-02-12 | 1983-08-18 | Ver Glaswerke Gmbh | Mirror, in particular for vehicles |
| EP0252207A2 (en) * | 1986-07-10 | 1988-01-13 | Asahi Glass Company Ltd. | Process for the production of a glazing product |
| JPH01176531A (en) * | 1988-01-06 | 1989-07-12 | Dainippon Printing Co Ltd | Manufacture of molding having protective layer |
| EP1059123A2 (en) * | 1999-06-08 | 2000-12-13 | Shimano Inc. | Coated parts |
| CN1474742A (en) * | 2000-09-18 | 2004-02-11 | 电子设备屏蔽公司 | Multi-layered structures and method for manufacturing multi-layered structures |
| CN1886260A (en) * | 2003-11-28 | 2006-12-27 | 大日本印刷株式会社 | Decorating sheet, decorated resin molded article and method for production thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4173937B2 (en) * | 1999-06-25 | 2008-10-29 | 吉田プラ工業株式会社 | Housing case |
| JP2005150668A (en) * | 2003-10-23 | 2005-06-09 | Sony Corp | Electronic apparatus cabinet and electronic apparatus |
| JP5539605B2 (en) * | 2006-04-19 | 2014-07-02 | 株式会社ダイセル | Active energy ray-curable coating agent and use thereof |
| JP2008094038A (en) * | 2006-10-13 | 2008-04-24 | Nissha Printing Co Ltd | Mold for in-mold decoration, apparatus for in-mold decoration, and manufacturing method of in-mold decoration product |
| JP5189854B2 (en) * | 2008-02-19 | 2013-04-24 | ポリマテック株式会社 | Decorative sheet and decorative molded body |
| JP2011005766A (en) * | 2009-06-26 | 2011-01-13 | Konica Minolta Holdings Inc | Laminate with self-repairable layer, and molding |
-
2009
- 2009-09-30 JP JP2009226665A patent/JP2011077266A/en active Pending
-
2010
- 2010-09-20 CN CN201010290467.6A patent/CN102029682B/en active Active
- 2010-09-28 TW TW99132756A patent/TW201111149A/en unknown
-
2011
- 2011-10-26 HK HK11111515.0A patent/HK1157282A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3205055A1 (en) * | 1982-02-12 | 1983-08-18 | Ver Glaswerke Gmbh | Mirror, in particular for vehicles |
| EP0252207A2 (en) * | 1986-07-10 | 1988-01-13 | Asahi Glass Company Ltd. | Process for the production of a glazing product |
| JPH01176531A (en) * | 1988-01-06 | 1989-07-12 | Dainippon Printing Co Ltd | Manufacture of molding having protective layer |
| EP1059123A2 (en) * | 1999-06-08 | 2000-12-13 | Shimano Inc. | Coated parts |
| CN1474742A (en) * | 2000-09-18 | 2004-02-11 | 电子设备屏蔽公司 | Multi-layered structures and method for manufacturing multi-layered structures |
| CN1886260A (en) * | 2003-11-28 | 2006-12-27 | 大日本印刷株式会社 | Decorating sheet, decorated resin molded article and method for production thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104203530A (en) * | 2012-04-19 | 2014-12-10 | 东海兴业株式会社 | Composite molding and method for producing same |
| CN104203530B (en) * | 2012-04-19 | 2016-02-24 | 东海兴业株式会社 | Composite shaped body and the method for the manufacture of this composite shaped body |
| US9482441B2 (en) | 2012-04-19 | 2016-11-01 | Tokai Kogyo Co., Ltd. | Composite molded body and method for manufacturing same |
| CN110802868A (en) * | 2019-11-27 | 2020-02-18 | 江苏新迈机械有限公司 | Method for smoothing and opening mold |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102029682B (en) | 2015-06-17 |
| JP2011077266A (en) | 2011-04-14 |
| TW201111149A (en) | 2011-04-01 |
| HK1157282A1 (en) | 2012-06-29 |
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