JP2011077266A - Method for manufacturing cabinet, cabinet, and electronic apparatus - Google Patents

Method for manufacturing cabinet, cabinet, and electronic apparatus Download PDF

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JP2011077266A
JP2011077266A JP2009226665A JP2009226665A JP2011077266A JP 2011077266 A JP2011077266 A JP 2011077266A JP 2009226665 A JP2009226665 A JP 2009226665A JP 2009226665 A JP2009226665 A JP 2009226665A JP 2011077266 A JP2011077266 A JP 2011077266A
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self
healing
film
manufacturing
cabinet
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Toshisato Kamio
俊聡 神尾
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NEC Embedded Products Ltd
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NEC Embedded Products Ltd
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Priority to JP2009226665A priority Critical patent/JP2011077266A/en
Priority to CN201010290467.6A priority patent/CN102029682B/en
Priority to TW99132756A priority patent/TW201111149A/en
Publication of JP2011077266A publication Critical patent/JP2011077266A/en
Priority to HK11111515.0A priority patent/HK1157282A1/en
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  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing an electronic apparatus cabinet which has a flat face of a given area and is subjected to surface processing of self-healing properties, and for manufacturing a cabinet subjected to surface processing of the self-healing properties, the cabinet subjected to surface processing of the self-healing properties, and an electronic apparatus having the cabinet subjected to surface processing of the self-healing properties. <P>SOLUTION: A film having a self-healing layer which can recover a flaw of a surface when time elapses is disposed between a fixed die and a movable die, and a cabinet material is injected from a nozzle formed in the movable die into an opening gap formed between the fixed die and the movable die, thereby manufacturing the cabinet having the surface of the self-healing properties. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、自己治癒性の表面加工を施した筐体を製造する方法、自己治癒性の表面加工を施された筐体、および自己治癒性の表面加工を施された筐体を有する電子機器に関する。   The present invention relates to a method for manufacturing a case subjected to self-healing surface processing, a case subjected to self-healing surface processing, and an electronic device having the case subjected to self-healing surface processing. About.

近年、ノート型パーソナルコンピュータや携帯電話、ＰＤＡ(Personal Digital Assistant)、携帯型ゲーム機器など、ユーザが携帯して使用する電子機器の普及が進み、ユーザがかかる電子機器を携帯して外出する機会が増えている。   In recent years, electronic devices that users carry and use, such as notebook personal computers, mobile phones, PDAs (Personal Digital Assistants), and portable game devices, have become widespread, and users have the opportunity to go out with such electronic devices. is increasing.

かかる電子機器は、携帯するときにはユーザの持つ鞄に収容される。鞄には鍵や筆記具なども併せて収容されることが多い。そのため、電子機器の表面が鞄の内壁や他の収容物との摩擦によって傷つくことがある。また、かかる電子機器は外出時に使用されるため、安定した設置ができないことがあり、落下や外物との衝突などによって表面に傷がつく場合がある。電子機器表面に傷がつくと、電子機器の美観を損ねるため、ユーザの満足度が減少し、好ましくない。   Such an electronic device is accommodated in a user's bag when carrying it. Keys often contain keys and writing utensils. For this reason, the surface of the electronic device may be damaged by friction with the inner wall of the bag or other contained items. In addition, since such electronic devices are used when going out, stable installation may not be possible, and the surface may be damaged by dropping or collision with an external object. If the surface of the electronic device is damaged, the aesthetics of the electronic device are impaired, and the satisfaction of the user is reduced, which is not preferable.

特許文献１には、自己治癒性塗料を塗布した塗装部品が記載されている。これによると、傷などがついても、傷つき部分が自己治癒され、表面の塗膜が再生される。このため、傷がついてもその傷が残らなくなり、結果的に傷つきにくくなる。   Patent Document 1 describes a coated part to which a self-healing paint is applied. According to this, even if there is a scratch or the like, the damaged portion is self-healed and the coating film on the surface is regenerated. For this reason, even if there is a flaw, the flaw does not remain, and as a result, it becomes difficult to be damaged.

特開２０００−３４２１２７号公報JP 2000-342127 A

特許文献１に記載された部品は、表面に塗布された自己治癒性塗料によって傷が自己治癒されるため、表面が傷つきにくく、美観を維持することができる。   The parts described in Patent Document 1 are self-healing by the self-healing paint applied to the surface, so that the surface is difficult to be damaged and the appearance can be maintained.

しかし、自転車部品や釣り用品といった小型かつ複雑な形状を有する部品に適用することを目的とする特許文献１に記載の技術は、電子機器筐体に適用することは、以下のとおり困難である。   However, it is difficult to apply the technique described in Patent Document 1 that is intended to be applied to a part having a small and complicated shape such as a bicycle part or fishing gear to an electronic device casing as follows.

電子機器筐体の天板や底板といった所定の面積の平坦面では、塗装表面に異物があると美観を損なうため、除去するのが好ましい。しかし、塗装自体が自己治癒性を有していて動きやすいため、一般的な塗装の異物除去に使用される研磨機を使用しても、適切に研磨することができない。つまり、表面に異物があるときに修正できないため、塗装の歩留まりが悪化する。   It is preferable to remove a flat surface having a predetermined area, such as a top plate or a bottom plate of an electronic device casing, since foreign objects are damaged if there are foreign objects on the coating surface. However, since the coating itself has a self-healing property and is easy to move, it cannot be properly polished even if a polishing machine that is used to remove foreign matter from a general coating is used. That is, since it cannot correct when there is a foreign substance on the surface, the yield of coating deteriorates.

そこで、本発明は、所定の面積の平坦面を有し、自己治癒性の表面加工を施した電子機器筐体を効率的に製造する、自己治癒性の表面加工を施した筐体を製造する方法、自己治癒性の表面加工を施された筐体、および自己治癒性の表面加工を施された筐体を有する電子機器を提供することを目的とする。   Therefore, the present invention manufactures a housing with a self-healing surface treatment that efficiently manufactures an electronic device housing having a flat surface with a predetermined area and subjected to a self-healing surface processing. It is an object to provide a method, a case subjected to a self-healing surface treatment, and an electronic device having the case subjected to a self-healing surface treatment.

本発明の自己治癒性の表面を有する筐体の製造方法は、時間が経過すると表面の傷を修復可能な自己治癒層を有するフィルムを、固定金型と可動金型との間に配置し、固定金型と可動金型との間の形成される空隙に可動金型に形成されたノズルより筐体材料を射出することを特徴とする。   The method of manufacturing a housing having a self-healing surface according to the present invention includes disposing a film having a self-healing layer capable of repairing a surface scratch over time between a fixed mold and a movable mold, The housing material is injected from a nozzle formed in the movable mold into a gap formed between the fixed mold and the movable mold.

本発明の自己治癒性の表面を有する筐体は、時間が経過すると表面の傷を修復可能な自己治癒層を有するフィルムとともに一体成型されたことを特徴とする。   The housing having a self-healing surface of the present invention is characterized in that it is integrally formed with a film having a self-healing layer capable of repairing a scratch on the surface over time.

本発明の自己治癒性の表面を有する電子機器は、時間が経過すると表面の傷を修復可能な自己治癒層を有するフィルムとともに一体成型された筐体を有することを特徴とする。   An electronic device having a self-healing surface according to the present invention is characterized by having a housing integrally formed with a film having a self-healing layer capable of repairing a surface scratch over time.

本発明によれば、所定の面積の平坦面を有し、自己治癒性の表面加工を施した電子機器筐体を効率的に製造する、自己治癒性の表面加工を施した筐体を製造する方法、自己治癒性の表面加工を施された筐体、および自己治癒性の表面加工を施された筐体を有する電子機器を提供できる。   According to the present invention, a housing with a self-healing surface processing is manufactured, which efficiently manufactures an electronic device housing having a flat surface with a predetermined area and subjected to a self-healing surface processing. There can be provided a method, a case subjected to a self-healing surface treatment, and an electronic device having the case subjected to a self-healing surface treatment.

本発明の第１の実施形態の製造方法により製造される電子機器筐体の部分断面図である。It is a fragmentary sectional view of the electronic device housing | casing manufactured by the manufacturing method of the 1st Embodiment of this invention. 本発明の第１の実施形態の製造方法を説明する図である。It is a figure explaining the manufacturing method of the 1st Embodiment of this invention. 本発明の第２の実施形態の製造方法により製造される電子機器筐体の部分断面図である。It is a fragmentary sectional view of the electronic device housing | casing manufactured by the manufacturing method of the 2nd Embodiment of this invention. 本発明の第２の実施形態の製造方法を説明する図である。It is a figure explaining the manufacturing method of the 2nd Embodiment of this invention.

以下、図面を参照して本発明を実施するための形態について詳細に説明する。本発明の第１の実施形態は、自己治癒性の表面加工を施したフィルムを樹脂と一体成型して成る電子機器筐体の製造方法である。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. 1st Embodiment of this invention is a manufacturing method of the electronic device housing | casing formed by integrally molding the film which gave the surface treatment of self-healing with resin.

図１は、本発明の第１の実施形態の製造方法により製造される電子機器筐体の部分断面図である。図１を参照すると、本発明の第１の実施形態の製造方法により製造される電子機器筐体は、本体樹脂１０、フィルム基層１１、および自己治癒層１２を有する。   FIG. 1 is a partial cross-sectional view of an electronic device casing manufactured by the manufacturing method according to the first embodiment of the present invention. Referring to FIG. 1, the electronic device casing manufactured by the manufacturing method according to the first embodiment of the present invention has a main body resin 10, a film base layer 11, and a self-healing layer 12.

本体樹脂１０は、電子機器筐体の形状を構成する樹脂部材であり、ＰＬＡ（ポリ乳酸）、ＡＢＳ(アクロニトリル−ブタジエン−スチレン)、ＰＣ(ポリカーボネート)、ＰＣ/ＡＢＳアロイなどの樹脂を射出成型することにより構成可能である。   The main body resin 10 is a resin member that forms the shape of the electronic device casing, and is made by injection molding a resin such as PLA (polylactic acid), ABS (acrylonitrile-butadiene-styrene), PC (polycarbonate), PC / ABS alloy. This can be configured.

フィルム基層１１は、所定の加飾層が付着された状態で本体樹脂１０と一体に成型される。フィルム基層１１は、具体的にはＰＥＴ（ポリエチレンテレフタレート）樹脂やポリカーボネート樹脂、ＰＭＭＡ(アクリル)などの延伸可能な樹脂素材で構成可能である。   The film base layer 11 is molded integrally with the main body resin 10 with a predetermined decoration layer attached thereto. Specifically, the film base layer 11 can be made of a stretchable resin material such as PET (polyethylene terephthalate) resin, polycarbonate resin, or PMMA (acrylic).

自己治癒層１２は、一旦傷がついても元に戻る自己治癒性の表面加工がなされた層である。自己治癒層１２は、ゴムのような弾力を持たせたポリエステル系の樹脂と表面を滑りやすくしたシリコーン系樹脂とを均一な高分子とした塗料を塗布することにより構成可能である。   The self-healing layer 12 is a layer that has been subjected to a self-healing surface treatment that returns to its original state once it is damaged. The self-healing layer 12 can be configured by applying a coating made of a uniform polymer of a polyester resin having elasticity such as rubber and a silicone resin having a slippery surface.

図２は、本発明の第１の実施形態の製造方法を説明する図である。図２を参照すると、樹脂から成る電子機器筐体が射出成型によって製造される。図２（ａ）では、固定金型１００と可動金型２００との間で、固定金型１００に沿ってフィルム３００が配置されている。固定金型１００と可動金型２００とは、組み合わせたときに電子機器筐体の形状となる空隙を形成するようになっており、可動金型２００が移動可能に構成されている。また、可動金型２００には、加熱した樹脂を注入するためのノズル２１０が形成されている。フィルム３００は、図１において説明したフィルム基層１１と自己治癒層１２とから形成されている。図２（ａ）において、フィルム３００は固定金型１００に密着している。   FIG. 2 is a diagram for explaining the manufacturing method according to the first embodiment of the present invention. Referring to FIG. 2, an electronic device casing made of resin is manufactured by injection molding. In FIG. 2A, the film 300 is disposed along the fixed mold 100 between the fixed mold 100 and the movable mold 200. The fixed mold 100 and the movable mold 200 are configured so as to form a gap that becomes the shape of the electronic device casing when combined, and the movable mold 200 is configured to be movable. The movable mold 200 is formed with a nozzle 210 for injecting heated resin. The film 300 is formed of the film base layer 11 and the self-healing layer 12 described in FIG. In FIG. 2A, the film 300 is in close contact with the fixed mold 100.

図２（ｂ）では、固定金型１００と可動金型２００とが組み合わされ、ノズル２１０から加熱した本体樹脂１０が注入されている。図２（ｃ）では、可動金型２００が固定金型から離され、フィルム３００と一体に本体樹脂１０により成型された電子機器筐体が取り出し可能となっている。   In FIG. 2B, the fixed mold 100 and the movable mold 200 are combined, and the heated main body resin 10 is injected from the nozzle 210. In FIG. 2 (c), the movable mold 200 is separated from the fixed mold, and the electronic device casing molded with the main body resin 10 integrally with the film 300 can be taken out.

本実施形態において、自己治癒層１２が固定金型１００に面するようにフィルム３００を配置して電子機器筐体を成型すると、自己治癒層１２を表面に有する図１の電子機器筐体を得ることができる。また、フィルム基層１１の自己治癒層１２が形成されていない側に加飾層を設けるようにすると、加飾層と電子機器筐体とが密接に構成されるため、電子機器から浮き上がることなく一体となった図柄を表現しつつ自己治癒層１２によって美観を維持することができる。   In this embodiment, when the electronic device casing is molded by arranging the film 300 so that the self-healing layer 12 faces the fixed mold 100, the electronic device casing of FIG. 1 having the self-healing layer 12 on the surface is obtained. be able to. In addition, when the decorative layer is provided on the side of the film base layer 11 where the self-healing layer 12 is not formed, the decorative layer and the electronic device casing are closely configured, so that the single layer does not float from the electronic device. The aesthetic appearance can be maintained by the self-healing layer 12 while expressing the resulting pattern.

図３は、本発明の第２の実施形態の製造方法により製造される電子機器筐体の部分断面図である。図３を参照すると、本発明の第２の実施形態の製造方法により製造される電子機器筐体は、本体樹脂２０および自己治癒層２１を有する。本体樹脂２０および自己治癒層２１は、本発明の第１の実施形態の製造方法により製造される電子機器筐体を構成する本体樹脂１０および自己治癒層１２とそれぞれ同様であるため、説明を省略する。   FIG. 3 is a partial cross-sectional view of an electronic device casing manufactured by the manufacturing method according to the second embodiment of the present invention. Referring to FIG. 3, the electronic device casing manufactured by the manufacturing method according to the second embodiment of the present invention has a main body resin 20 and a self-healing layer 21. The main body resin 20 and the self-healing layer 21 are the same as the main body resin 10 and the self-healing layer 12 constituting the electronic device casing manufactured by the manufacturing method according to the first embodiment of the present invention, and thus the description thereof is omitted. To do.

図４は、本発明の第２の実施形態の製造方法を説明する図である。図４を参照すると、図２で説明した本発明の第１の実施形態の製造方法と同様に、樹脂から成る電子機器筐体が射出成型によって製造されるので、相違点を中心に説明する。図４（ａ）では、固定金型１００と可動金型２００との間で、固定金型１００に沿ってフィルム３００が配置されている。本実施形態では、第１の実施形態と異なり、フィルム３００は成型後に電子機器筐体から剥離されるため、巻き取るように構成できる。   FIG. 4 is a diagram for explaining a manufacturing method according to the second embodiment of the present invention. Referring to FIG. 4, since the electronic device casing made of resin is manufactured by injection molding as in the manufacturing method of the first embodiment of the present invention described in FIG. In FIG. 4A, the film 300 is disposed along the fixed mold 100 between the fixed mold 100 and the movable mold 200. In the present embodiment, unlike the first embodiment, since the film 300 is peeled off from the electronic device casing after being molded, it can be configured to be wound up.

図４（ｃ）では、可動金型２００が固定金型から離され、一体に成型された後に本体樹脂１０からフィルム３００が剥離された電子機器筐体が、取り出し可能となっている。本実施形態において、自己治癒層１２がフィルム基層１１よりも可動金型２００側になるようにフィルム３００を配置して電子機器筐体を成型すると、自己治癒層１２を表面に有する図３の電子機器筐体を得ることができる。また、自己治癒層１２のさらに可動金型２００側に加飾層を設けるようにすると、電子機器筐体の加飾層が自己治癒層１２によって覆われるため、美観を維持することができて好適である。   In FIG. 4C, the electronic device casing in which the movable mold 200 is separated from the fixed mold and integrally molded and the film 300 is peeled off from the main body resin 10 can be taken out. In the present embodiment, when the electronic device casing is molded by arranging the film 300 so that the self-healing layer 12 is closer to the movable mold 200 than the film base layer 11, the electronic of FIG. 3 having the self-healing layer 12 on the surface. A device housing can be obtained. In addition, if a decorative layer is provided on the movable mold 200 side of the self-healing layer 12, the decorative layer of the electronic device casing is covered with the self-healing layer 12, and thus it is possible to maintain the aesthetic appearance. It is.

１０、２０ 本体樹脂
１１ フィルム基層
１２、２１ 自己治癒層
１００ 固定金型
２００ 可動金型
２１０ ノズル
３００ フィルム 10, 20 Main body resin 11 Film base layer 12, 21 Self-healing layer 100 Fixed mold 200 Movable mold 210 Nozzle 300 Film

Claims (7)

時間が経過すると表面の傷を修復可能な自己治癒層を有するフィルムを、固定金型と可動金型との間に配置し、
前記固定金型と前記可動金型との間の形成される空隙に前記可動金型に形成されたノズルより筐体材料を射出することを特徴とする、自己治癒性の表面を有する筐体の製造方法。 A film having a self-healing layer capable of repairing scratches on the surface over time is placed between a fixed mold and a movable mold,
A housing material having a self-healing surface, characterized in that housing material is injected from a nozzle formed in the movable mold into a gap formed between the fixed mold and the movable mold. Production method. 前記自己治癒層が、前記フィルムに対して前記固定金型側になるように前記フィルムを配置することを特徴とする、請求項１に記載の筐体の製造方法。   The method for manufacturing a housing according to claim 1, wherein the film is arranged so that the self-healing layer is on the fixed mold side with respect to the film. 前記フィルムの前記可動金型側に、前記筐体材料の表面に装飾を加える加飾層が設けられていることを特徴とする、請求項１または２に記載の筐体の製造方法。   The method for manufacturing a casing according to claim 1, wherein a decoration layer for adding decoration to the surface of the casing material is provided on the movable mold side of the film. 前記自己治癒層が、前記フィルムに対して前記可動金型側になるように前記フィルムを配置し、前記筐体材料を射出した後に、前記自己治癒層が前記筐体材料に残るように前記フィルムを剥離することを特徴とする、請求項１に記載の筐体の製造方法。   The film is arranged so that the self-healing layer remains on the housing material after the film is disposed so that the self-healing layer is on the movable mold side with respect to the film and the housing material is injected. The method for manufacturing a casing according to claim 1, wherein the casing is peeled off. 前記自己治癒層の前記可動金型側に前記筐体材料の表面に装飾を加える加飾層が設けられていることを特徴とする、請求項３または４に記載の筐体の製造方法。   The method for manufacturing a casing according to claim 3, wherein a decoration layer for adding decoration to the surface of the casing material is provided on the movable mold side of the self-healing layer. 時間が経過すると表面の傷を修復可能な自己治癒層を有するフィルムとともに一体成型されたことを特徴とする、自己治癒性の表面を有する筐体。   A housing having a self-healing surface, which is integrally formed with a film having a self-healing layer capable of repairing surface scratches over time. 時間が経過すると表面の傷を修復可能な自己治癒層を有するフィルムとともに一体成型されたことを特徴とする、自己治癒性の表面を有する筐体を有する電子機器。   An electronic device having a housing having a self-healing surface, which is integrally formed with a film having a self-healing layer capable of repairing a surface scratch over time.
JP2009226665A 2009-09-30 2009-09-30 Method for manufacturing cabinet, cabinet, and electronic apparatus Pending JP2011077266A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009226665A JP2011077266A (en) 2009-09-30 2009-09-30 Method for manufacturing cabinet, cabinet, and electronic apparatus
CN201010290467.6A CN102029682B (en) 2009-09-30 2010-09-20 Housing, production method therefor and electronic device
TW99132756A TW201111149A (en) 2009-09-30 2010-09-28 Method of fabricating frame, frame, and electronic machine
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