CN102027605A - Device comprising a multilayer board and light-emitting diodes - Google Patents

Device comprising a multilayer board and light-emitting diodes Download PDF

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Publication number
CN102027605A
CN102027605A CN2009801147532A CN200980114753A CN102027605A CN 102027605 A CN102027605 A CN 102027605A CN 2009801147532 A CN2009801147532 A CN 2009801147532A CN 200980114753 A CN200980114753 A CN 200980114753A CN 102027605 A CN102027605 A CN 102027605A
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CN
China
Prior art keywords
plate
layer
diode
light
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801147532A
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Chinese (zh)
Inventor
C·贝歇尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3A Composites International AG
Original Assignee
Alcan Technology and Management Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan Technology and Management Ltd filed Critical Alcan Technology and Management Ltd
Publication of CN102027605A publication Critical patent/CN102027605A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

The invention relates to a multilayer composite for power and/or signal supply comprising a multilayer board (21) and light-emitting diodes (30) that are arranged thereon and connected to a power conductor. Said multilayer board (21) comprises a plurality of layers (22) which are produced of metal, preferably aluminum or an aluminum alloy, and which are arranged at both sides of a plastic center layer (24) and that are covered by a cover layer (26) which is produced o corresponding material. The diodes (30) are arranged in respective recesses (28) of the board (21) are connected to the electroconductive metal layers (22) of the board via a plurality of metal layers (32) and plastic layers (36) that extend between them. The multilayer composite has at least three, preferably four, electroconductive layers (22, 32) that are insulated from each other by respective plastic layers (24, 36).

Description

Device with multi-layer sheet and light-emitting diode
Technical field
The present invention relates to a kind of layered composite that electric current supply and/or signal are supplied with that is used for of the preamble according to claim 1, this layered composite has plate and is arranged in the light-emitting diode that is connected with power supply on this plate, and wherein this plate has a plurality of layers.
Background technology
EP 1 423 891 B1 disclose a kind of layered composite with the adapter in the opening that will be installed in sandwich plate.This opening runs through sandwich plate, and this sandwich plate comprises intermediate insulating layer, goes up the lower conductiving layer of conductive layer and insulating barrier below.Adapter comprises the housing with upper case portion and lower house part, has guide hole in one in these two parts, and having pilot pin in these two parts another, pilot pin and guide hole adapt, and adapter has conductive foil between top and lower part.This conductive foil also has guide hole, and these guide holes allow passing through of pilot pins and this conductive foil to remain in the tram between top and the lower part; This conductive foil provides some and stretches out to produce first pin and second pin that stable electrical is connected with last conductive layer, and this second pin is assemblied in the bottom and stretches out, so that be electrically connected with the lower floor generation.This adapter can comprise light-emitting diode.
From WO 20,06/,128 447 A1, can learn metal fabric and the layout of this fabric on building with light source.The light source carrier container is integrated in this fabric and makes that need not the separate light source carrier container just can take out light source carrier and light source carrier is put into once more from this fabric.Alternatively, the light source carrier container can be fixed on fabric or other hanger; So light source carrier can be fixed on this light source carrier container place.The preferred clip that uses.
Known from DE 40 39 034 A1, the size of common giant display and therefore its noticeable property be subjected to and the cost relative restrictions.For this reason, giant display have by use the window of regular arrangement or window group facade at least a portion and be assemblied in the light source that is assigned to each window or window group in the building or on the building and provide and remedy, described window or window group are used as picture point, and described light source comes optionally switch by means of remote control equipment.
Summary of the invention
At the novel display unit of recognizing that inventor's purpose provides a kind of under these true situations---especially can be used in the building---as the layered composite product to be used as illuminator and/or Information repeater system or sensing system.
The instruction guiding of independent claims solves this task; Dependent claims provides favourable expansion scheme.In addition, all combinations of at least two in the disclosed feature all fall within the scope of the present invention in specification, accompanying drawing and/or claims.For given specified scope, the value that is positioned at described border also should be disclosed as limiting value and can use arbitrarily.
According to the present invention, multi-layer sheet comprises a plurality of by metal, the layer especially made by aluminum or aluminum alloy, and these layers are arranged in by covering by another intermediate layer or by the cover layer that the corresponding insulation material is made on---for example rigid plastics, the especially thermoplastic---both sides in the intermediate layer that plastics are made and on the other hand.
---preferably a plurality of---depressions that according to the present invention, multi-layer sheet should comprise at least one wherein are furnished with diode respectively in these depressions of plate.Conductive metal layer is connected the diode body of these diodes by the layer of being made by for example thermoplastics that comprises a plurality of layers that are made of metal and extend between these layers with---being made by aluminum or aluminum alloy---.
In another way, diode can be arranged on multiple-plate surface or the surface, and controlled function and electric current supply and voltage are supplied with and can be intercepted by at least one conductive layer and correspondingly by at least one other layer carrying-off.
Plate can be made by multilayer sandwich, described multilayer sandwich by at least three, four conductive layers (for example by metal, especially make as the light metal of aluminium) and the electric insulation layer (as being made by the plastics of being mentioned) between these conductive layers constitute ideally, the supporting mass that described plate can be used as electronic component---for example integrated circuit (IC), LED (light emitting diode (light-emitting diode)), female type connector or transducer---.
The typical thickness of described conductive layer from 20 nanometers that are used for chemistry or physical deposition layer to the 200 μ m that are used for metallic film.Can also insert the conductive plastics layer as conductive layer.---for example polyethylene or polypropylene, polyvinyl chloride, the polyamide etc.---layer of making or electric insulation layer of film can have the thickness of 7 to 300 μ m for example and above (up to 1000 μ m) as by polyolefin.
The conductive layer of plate is used as bus system and/or voltage is supplied with.Can at random make programmable large-area monitor or light-emitting area thus.
In a special configuration, on the tectal exposed surface of plate, be provided for connecting layer trace as the parts of diode and so on; Described parts as diode and so on are installed on the corresponding layer trace.
If diode is arranged in the depression, in order to guarantee the expectation contact in the plate, the layer that is made of metal of the diode body that is then inserted according to the present invention must align on the cross section with the layer that is made of metal of plate.The lower limb of the diode body that is inserted in addition, should be positioned on the pantostrat that is made of metal of plate.This has been turned out to be advantageously, and the lens top strides across the diode body, and the lens edge on this lens top protrudes in the diode body from the side and places the installation site of the adjacent cover layer of plate at this.Also advantageously, for better processing, join on the lens top from the outside with cramp bar, this cramp bar preferably extends along the axis of diode or diode body, and comprises fixed disk to be used to be installed to the lens top in order to connect diode/diode body.
In another configuration of theme of the present invention, the lower limb of the diode body that is inserted is positioned on the continuous semitransparent layer of plate in addition; Thus, the bottom that diode can transmitting plate is luminous.
In the scope of the invention, also there is the sheet plate, in the sheet face of sheet plate, is furnished with a plurality of being used for/has the depression of light-emitting diode.What leave each designer for is, for the layout of these depressions is selected special pattern.
In the sheet plate that is shaped in box-like mode, the box wall of sheet plate comprises a plurality of being used for/have depression of light-emitting diode.Another invention flexible program of sheet plate comprises many picture groups case, and every picture group case is made of the depression that the plurality purpose is used for/has light-emitting diode.In the scope of the invention, also there is sheet plate with wavy vertical section.
Particularly importantly, sheet plate according to the present invention is used for wall; Also comprise different patterns here.
In addition, by means of the coupling of socket and to holding of transducer also be possible.Parts onboard/and plate between location and interconnection technique (sealing) especially for example can be undertaken by friction welding (FW), thermoplasticity or thermosetting injection mo(u)lding or other joining technique.Possible application is present in following field: building (for example medium facade, inside and outside illumination), transportation (for example traffic guidance system, street and tunnel illumination, train and the illumination of travelling), industry (especially machine illumination, light barrier system, stiffening system), safe practice (3D light barrier system) and display application (direction board, interactive direction board, advertisement plane etc.).
Description of drawings
Other advantage of the present invention, feature and detail provide from following description of preferred embodiments and by means of accompanying drawing; Wherein
Fig. 1 illustrates three vertical views that are arranged in a light-emitting diode in the line according to prior art;
Fig. 2 illustrates the end view that is arranged in the device of following support plate according to having of Fig. 1;
Fig. 3 illustrates the cross section of passing multilayer circuit board, and this multilayer circuit board has and is arranged in its lip-deep layer elements that is used for light-emitting diode;
Fig. 4 illustrates the multiple-plate side cross-sectional, view with the depression that is used to hold light-emitting diode;
Fig. 5 illustrates the end view of another multiple-plate fragment;
Fig. 6 illustrates the side cross-sectional, view as the light-emitting diode of insertion element;
Fig. 7 illustrates the corresponding end view with light-emitting diode of the plate that is associated with Fig. 6;
Fig. 8,9 is illustrated in two diverse locations of light-emitting diode after it is inserted in the plate of describing among Fig. 7,
Figure 10 illustrates the vertical view in the cross section of Fig. 9;
Figure 11 illustrates the diagram of the plate of design in another way corresponding to the view in Fig. 8,9;
Figure 12 illustrates has the other view as the plate of blank that is almost square profile;
Figure 13 illustrates four other views of the production form of the plate that is equipped with light-emitting diode, and described plate is from the blank of Figure 12;
Figure 14 illustrates the other view of the three dimensional panel with box-like configuration;
Figure 15 and 16 illustrates two other views of difform two dimensional panel;
Figure 17 illustrates the sketch map that is used for producing with five steps the process of plate;
Figure 18 illustrates the other view of the building with plate of being installed, and these buttresses are made according to Figure 17;
Figure 19 illustrates the front view of the building with the plate that designs by different way with respect to Figure 18;
Figure 20 illustrates the amplification cross section of Figure 19.
Embodiment
From Fig. 1, can learn in 2 the sketch map having on the wire harness (Strang) 12 of two leads 14,15 Center Gap n mutually to be approximately the position of three light-emitting diodes 10 of 350mm that this two line leads 14,15 end at Connection Element 16,16a at two ends.The center of Connection Element 16,16a and nearest light-emitting diode 10 is the interval n of 250mm at a distance of here 1The length a of light-emitting diode 10 here is 15.5mm, and its height i is 7.5mm.
Wire harness 12 is placed on the support plate 17 that thickness common on the market is h according to Fig. 2, and this support plate 17 is made of two light metal plates 19 on the both sides that are fixed on plastic plate 18.
Here for example for the circuit board 20 of 10mm has the two-layer light metal plate 22 that is parallel to each other, described light metal plate 22 is by having the thickness h that is about 0.5mm here respectively for the thickness h that shows in Fig. 3 1Aluminum or aluminum alloy make, between these two light metal plates 22, be furnished with the thickness h of making by PE (polyethylene) 2The intermediate layer 24 that is about these two light metal plates 22 of isolation of 0.2mm here.Each outwards covers the thickness h of cover layer 26 by another polymeric layer as cover layer 26 by the aluminium sheet 22 that Al 99 forms here 3Measure respectively and be about 4.4mm.Circuit board 20 unshowned length and width in Fig. 3 add up to for example about 300mm and 400mm.
On the exposed surface 27 of cover layer 26,, can see being used for connecting as light-emitting diode, being layer trace of conduction of the parts of LED (light-emitting diode) and so at 29 places.These parts pass through---can not see in Fig. 3---, and lead is connected with the aluminium lamination 22 of conduction.
With respect to the two-tier circuit plate, the advantage of such circuit board 20 especially:
● by the little radiation of holding wire (the feed-in lead/return conductor of loop region);
● by the little radiation of electric power system;
● little common mode current.
With respect to six layers or more multi-layered, the shortcoming of four-layer circuit board 20 is:
● by the higher radiation of holding wire (thick dielectric);
● the higher coupling between the holding wire (thick dielectric);
● under the situation of X-Y design, the higher coupling between holding wire and VCC.
Plate 21 shown in the part for example is used to hold from the unit of Fig. 3 and at the light-emitting diode 30 of these unit and has depression 28, the width d of these depressions 28 in Fig. 4 1Corresponding to the diameter d of light-emitting diode 30, wherein plate 21 is made of four aluminium laminations 22 and the PE layer 24 or the PE cover layer 26 that cover these aluminium laminations 22 respectively in both sides.For this reason, Fig. 7 illustrates, the degree of depth i of depression 28 1Will sink in this depression 28 and will be fixed in the height i of the diode body 31 in this depression 28 corresponding to light-emitting diode 30.
The plate 21 of Fig. 5 provides three PE layers 24 and two PE cover layers 26, lays four aluminium laminations 22 between these PE layers 24 and PE cover layer 26 mutually insulated.The depression 28 of the blind hole shape that is used for diode body 31 here is not shown; To this especially with reference to Fig. 7 to 9.
The diode body 31 of the light-emitting diode 30 of Fig. 6 is h by four thickness 1 Conduction aluminium lamination 32 and four thickness be h 3 Insulation PE layer 36 combine.The lower limb of this diode body 31 is determined by aluminium lamination 32 and the top edge 35 of this diode body 31 is determined by PE layer 36.Lay the lens 40 of the anti-UV of scattering on PE layer 36, these lens 40 have on the cross section towards its edge 42 curved surfaces 39; The diameter d of these lens 40 2Greater than the length or the diameter d of diode body 31, make between diode body 31 and this lens edge 42, to have outstanding outstanding tolerance (Kragma β) k.In addition, in Fig. 6, in the inner space of diode body 31, symbolically described to have the lens 40 of six RGB LED 37 and the other view of four-wire system bus/driver IC 38.
In Fig. 7, the lens of light-emitting diode 30 top 40 is engaged to along on the fixed disk 44 of the cramp bar 46 of its axis M extension, and just because of this, light-emitting diode 30 can be easily inserted in the depression 28 of plate 21 according to Fig. 8.In Fig. 9, cramp bar 46 breaks away from from light-emitting diode 30, and light-emitting diode 30 sealed layer 48 in the zone of depression 28 surrounds, between sealing layer 48 also is set at plate 21 according to Fig. 9,10 surface 27 and the bottom surface of giving prominence on lens top 40.Fig. 8,9 clear and definite in addition, in the installation site, the layer 22 and 24,26 of plate 21 and semiconductor body 31 respectively aspect the material corresponding layer 32 and 36 align.
In Figure 11, described to have the plate 21 of bottom semi-transparent overlays 23 a, wherein this cover layer 23 and diode 30 aBe inserted into plate 21 a Respective recesses 28 in diode body 31 a Lower limb 34 connect.Diode 30 aIt is luminous to see through this cover layer 23.
Can learn that from Figure 12 profile is approximately the sheet plate 50 that the foursquare length of side is z, this sheet plate 50 is equipped with the light-emitting diode 30 of different pattern according to Figure 13 b, for example be shaped as the light-emitting diode 30 of " F " bPerhaps be equipped with four lines or the parallel light-emitting diode 30 of six row bThe plate 50 on right side in Figure 13 aBe transformed in vertical view to the substrate of U-shaped, that is to say, at this plate 50 aSituation under, middle band is partly removed.This plate 50 a34 light-emitting diodes 30 are equipped with b
Figure 14 shows the plate 52 that is designed to box, and this plate 52 has the light-emitting diode 30 that is arranged on the box wall 54 in the inboard bExcept that this box 52, plate 50 shown in Figure 15 b, this plate 50 bThe vertical section be bent to S shape and be equipped with 54 light-emitting diodes 30 b
The plate 50 of the rectangular profile of Figure 16 cThree zones 56 are provided, and each zone has 36 light-emitting diodes 30 respectively b
Figure 17 shows the rectangular slab 50 with length of side y, z dIn first step A, during manufacture process, introduce 12 depressions 28 a, then in these depressions 28 aIn---step B---insert light-emitting diode 30 bAnd therefore form version 50 is installed eIn step C, version 50 is being installed eWire harness (Ausflussstrang) 58 is flowed out in last installation.Then, at step D, according to regulation according to Figure 15, plate 50 eOn the vertical section, be formed S shape.
Symbolism ground expression building 60 in Figure 18,64 arranged beneath have plate 50 on the roof on this building facade 62 eIn order to observe better, only in this Figure 18, describe circuit board 50 eIn three.
Building 60 at Figure 19 a Facade 62 on, it is that 1150mm and width f are the plate 51 of 850mm that length e is installed, this plate 51 provide 300 have a square profile hold breach 70, here the length of side of square profile is about 15mm, each holds breach 70 and is used for a light-emitting diode 30 with square profile cAs especially from learning Figure 20, these hold breach with grid-like pattern mutually respectively separation c be that 50mm ground is arranged.In addition, area of the pattern is set to the long limit 51 with plate 51 aSeparation q be 75mm and with the longitudinal edge 51 of plate 51 bDistance is q at interval 1Be 100mm.

Claims (19)

1. be used for the layered composite that electric current supply and/or signal are supplied with, this layered composite has plate and is arranged in the light-emitting diode that is connected with power supply on this plate, and wherein this plate has a plurality of layers,
It is characterized in that,
This multi-layer sheet (21,21 a, 50,50 aTo 50 e, 51,52) comprise a plurality of layers of making by metal, preferred aluminum or aluminum alloy (22), these layers (22) are arranged in the both sides in the intermediate layer (24) that is made of plastics and are covered by another intermediate layer or the cover layer (26) made by respective material on the other hand.
2. according to the device of claim 1, it is characterized in that, be arranged in plate (21,21 a, 50,50 aTo 50 e, 51,52) depression (28,28 a) in diode (30,30 a, 30 b, 30 c) by comprising the diode body (31,31 of a plurality of layers (32) that are made of metal and the layer (36) that is made of plastics that between these layers (32), extends a) be connected with the conductive layer that is made of metal (22) of this plate.
3. according to the device of claim 1 or 2, it is characterized in that, at least three, preferred four layer (24,36) and conductive layers (22,32) of mutually insulated by being made of plastics respectively are set.
4. according to the device of claim 3, it is characterized in that layer (24,36) is formed by thermoplastics.
5. according to the device of claim 3 or 4, it is characterized in that, the exposed surface (27) of cover layer (26) be provided be used for connecting as layer trace (29) of the conduction of the parts of diode (30) (Fig. 3).
6. according to the device of one of claim 1 to 5, it is characterized in that the diode body (31,31 that is inserted a) the layer that is made of metal (32) and plate (21,21 a, 50,50 aTo 50 a, 51,52) the layer that is made of metal (22) alignment.
7. according to the device of one of claim 1 to 6, it is characterized in that the lower limb (34) of the semiconductor body that is inserted (31) is placed on plate (21,50,50 aTo 50 e, 51) the pantostrat that is made of metal (22) go up (Fig. 8).
8. according to the device of one of claim 1 to 6, it is characterized in that the semiconductor body (31 that is inserted a) lower limb (34) be placed on plate (21 a) continuous semitransparent layer (23) go up (Figure 12).
9. according to the device of one of claim 1 to 8, it is characterized in that lens tops (40) stride across diode body (31,31 a), the lens edge (42) on these lens tops (40) exceeds the diode body in the side.
10. according to the device of claim 9, it is characterized in that lens edge (42) are placed on the adjacent cover layer (26).
11. the device according to claim 9 or 10 is characterized in that, cramp bar (46) is joined to from the outside on the lens tops (40).
12. the device according to claim 11 is characterized in that, cramp bar (46) extends along the axis (M) of diode (30) or diode body (31).
13. the device according to claim 11 or 12 is characterized in that, cramp bar (46) comprises the fixed disk (44) that is used to place on the lens tops (40).
14., it is characterized in that sheet plate (50,50 according to claim 1 to 13 device one of at least aTo 50 e, 51,52), in the sheet surface of sheet plate, be furnished with a plurality of being used for/have light-emitting diode (30,30 aTo 30 c) depression (28,28 a).
15. the device according to claim 14 is characterized in that, the box wall (54) that sheet plate (52) is formed box-like and sheet plate comprises a plurality of being used for/have light-emitting diode (30 b) depression (28,28 a) (Figure 14).
16. the device according to claim 14 is characterized in that, sheet plate (50 c) comprising a plurality of groups that constitute by pattern (56), described pattern is respectively by a plurality of being used for/have light-emitting diode (30 b) depression (28,28 a) formation (Figure 16).
17., it is characterized in that sheet plate (50 according to the device of claim 16 b, 50 e) wavy vertical section.
18., it is characterized in that sheet plate (50 according to claim 1 to 14 device one of at least e, 51) be fixed on the wall surface (62).
19., it is characterized in that the feature that can from specification and/or accompanying drawing, learn that at least one is other according to claim 1 to 18 device one of at least.
CN2009801147532A 2008-04-25 2009-04-14 Device comprising a multilayer board and light-emitting diodes Pending CN102027605A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008021014.5 2008-04-25
DE102008021014A DE102008021014A1 (en) 2008-04-25 2008-04-25 Device with a multilayer plate and light-emitting diodes
PCT/EP2009/002711 WO2009129947A1 (en) 2008-04-25 2009-04-14 Device comprising a multilayer board and light-emitting diodes

Publications (1)

Publication Number Publication Date
CN102027605A true CN102027605A (en) 2011-04-20

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EP (1) EP2272103A1 (en)
JP (1) JP2011519155A (en)
KR (1) KR20110038608A (en)
CN (1) CN102027605A (en)
DE (1) DE102008021014A1 (en)
TW (1) TW201009775A (en)
WO (1) WO2009129947A1 (en)

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TW200810145A (en) 2006-08-04 2008-02-16 Chiang Cheng Ting A lighting structure with light emitting diodes and the method thereof

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CN105789938A (en) * 2014-12-23 2016-07-20 中兴通讯股份有限公司 Internal power supply method for rack, bus power supply board and communication equipment
CN105789938B (en) * 2014-12-23 2020-08-04 南京中兴软件有限责任公司 Rack internal power supply method, bus type power supply board and communication equipment
CN108700284A (en) * 2016-01-11 2018-10-23 莱德爱邦德国际公司 Power supply module
CN108700284B (en) * 2016-01-11 2021-01-01 莱德爱邦德国际股份有限公司 Power supply module

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KR20110038608A (en) 2011-04-14
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EP2272103A1 (en) 2011-01-12
WO2009129947A1 (en) 2009-10-29
JP2011519155A (en) 2011-06-30

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