CN102024729A - Bidirectional transmission wafer box mechanism - Google Patents
Bidirectional transmission wafer box mechanism Download PDFInfo
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- CN102024729A CN102024729A CN 201010284589 CN201010284589A CN102024729A CN 102024729 A CN102024729 A CN 102024729A CN 201010284589 CN201010284589 CN 201010284589 CN 201010284589 A CN201010284589 A CN 201010284589A CN 102024729 A CN102024729 A CN 102024729A
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- wafer
- catch
- wafer box
- synchronous pulley
- blocking piece
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Abstract
The invention relates to relevant fields of gummed developing and semiconductor wafer processing, in particular to a bidirectional transmission wafer box mechanism which is used for a gummed developing device, a single-chip wet processing device, and the like for obtaining evenly-distributed photoresist and photoresist graphs on a semiconductor wafer and solves the problems that when entering and exiting a wafer box, the wafer only can carry out unidirectional movement to influence production capacity of a whole machine, and the like in the prior art. The bidirectional transmission wafer box mechanism is provided with a wafer box, blocking piece rotating rods, a synchronous pulley, a synchronous belt and a 180-degree swing cylinder, wherein the four blocking piece rotating rods are symmetrically arranged in the wafer box, the lower end of each blocking piece rotating rod is connected with the synchronous pulley, two blocking piece rotating rods which are respectively positioned on inlets of both sides of the wafer box are in one group, and the two blocking piece rotating rods of each group are connected with the 180-degree swing cylinder through the synchronous pulley and the synchronous belt. Due to the adoption of the invention, the wafer bilaterally enters and exits the wafer box, and the fetching and delivering modes of the traditional wafers of the gummed developing device on the wafer box are broken though, the transporting process of a robot and intermediate links are reduced and the efficiency is improved.
Description
Technical field
The present invention relates to that gluing develops and the association area of semiconductor wafer processing, be specially a kind of bi-directional wafer sheet case structure, be used for the glue-spreading development equipment, monolithic wet processing apparatus of the uniform photoresist of acquisition and photoresist figure on semiconductor wafer etc.
Background technology
At present, the gluing of advanced technology development (TRACK) equipment mainly is made of three kinds of chunks such as loading and unloading chunk, technology chunk, interface chunks, and wherein: the loading and unloading chunk is mainly by magazine, box station robot (or claiming CS-R) etc. form up and down; The technology chunk mainly contain cover be coated with unit (or claim COT/BAC/TAC) and/or developing cell (or claiming DEV), technology robot (or claiming PS-R), process heat treating column (or claiming OVEN RACK) waits composition, has loaded cold dish (or claiming CP), heat dish (or claiming HP and HHP), tackify unit (or claiming AD), compound hot dish, centering unit, conversion equipment (TP) etc. in the process heat treating column; The interface chunk mainly is made up of interface input and output material carrier (or claiming IFS), interface machine people's (or claiming IF-R), limit portion exposure device (or claiming WEE), input and output material buffer storage (or claiming IFB), conversion equipment (TP) etc.
Wafer is sent to the centering unit or the intermediate carrier of technology chunk by box station robot from the wafer case of loading and unloading chunk, delivers to each technique unit by the technology robot again; Wafer after PROCESS FOR TREATMENT is delivered on the slide holder of another equipment by the interface machine people by IFS, TP that the technology robot is sent to the interface chunk again.Traditional wafer can only be done one-way movement at the turnover film magazine, particularly in interface chunk part, as the delivery time that the film magazine of transfer certainly will strengthen robot, influences the production capacity of complete machine.
Summary of the invention
The object of the present invention is to provide a kind of bi-directional sheet case structure, wafer can only be done one-way movement at the turnover film magazine in the solution prior art, influences the problems such as production capacity of complete machine.
Technical scheme of the present invention is:
A kind of bi-directional sheet case structure, this mechanism is provided with film magazine, catch bull stick, synchronous pulley, synchronous band, 180 ° of oscillating cylinders, and symmetry is installed four catch bull sticks in the film magazine, and each catch bull stick lower end is connected with synchronous pulley; Wherein, two catch bull sticks that lay respectively at film magazine two side-entrances are one group, and two catch bull sticks of each group are connected with oscillating cylinder with being with synchronously by synchronous pulley.
Described bi-directional sheet case structure, oscillating cylinder are 180 ° of oscillating cylinders, adopt 180 ° of oscillating cylinders of compressed air-driven, and 180 ° of oscillating cylinders drive is with two synchronous pulleys that drive a group to do 180 ° of rotations synchronously, and the catch bull stick is done 180 ° of rotations simultaneously.
Described bi-directional sheet case structure, the catch bull stick is the structure that a side has opening, and two catch bull sticks of each group are symmetrical arranged, and opening is relative.
Described bi-directional sheet case structure, two catch bull sticks of film magazine two side-entrances, synchronous pulley, synchronous band constitute an integral body with 180 ° of oscillating cylinders.
Advantage of the present invention and beneficial effect are:
1, because the requirement of some special process, wafer will be sent to another equipment from an equipment, and traditional mode is to install overhead traveling crane in factory building additional, or with artificial mode.The big line equipment that also has adopts the interface chunk, wherein will include input and output material buffer storage (IFB), optics trimming device (WEE) etc.All be in the past by technology robot (PSR) with wafer handling to conversion equipment (TP), send it to correlation module by interface machine people (or claim IF-R) again.Using the present invention can directly have the technology robot that this device is arrived in wafer handling, and the effect of this device is to substitute input and output material buffer storage (IFB) and conversion equipment (TP).
What 2, wafer of the present invention was deposited employing at film magazine is two-way turnover, has broken through traditional the fetch and deliver mode of wafer on film magazine of glue-spreading development equipment, reduces the handling process and the intermediate link of robot, raises the efficiency, and the minimizing process improves the credit rating of finished product.
3, the sheet case structure of the two-way transmission wafer of the present invention leap that brought device structure, this device structure has satisfied the production requirement of the noble and unsullied clean quality gluing developing process of large-scale high production capacity.
4, structural device of the present invention not only can be applied to glue-spreading development equipment, and can use widely on the equipment such as monolithic wet processing apparatus, and extremely strong versatility is arranged.
Description of drawings
Fig. 1 (a)-(b) is a device structure schematic diagram of the present invention.Wherein, Fig. 1 (a) is a cutaway view; Fig. 1 (b) is a catch bull stick schematic diagram.
Fig. 2 (a)-(b) is a motion principle schematic diagram of the present invention.Wherein, Fig. 2 (a) is that the wafer of a direction enters the film magazine process; Fig. 2 (b) enters the film magazine process for the wafer of another direction.
Fig. 3 is a stereogram of the present invention.
Among the figure, 1, film magazine; 2, catch bull stick; 3, wafer (wafer); 4,180 ° of oscillating cylinders; 5, be with synchronously; 6, synchronous pulley; 7 openings.
Embodiment
Below in conjunction with accompanying drawing the present invention is described in detail.
As Fig. 1 (a)-Fig. 1 (b), Fig. 2 (a)-Fig. 2 (b) and shown in Figure 3, this mechanism is provided with film magazine 1, catch bull stick 2, synchronous pulley 6, is with 5,180 ° of oscillating cylinders 4 etc. synchronously, and concrete structure is as follows:
Symmetry is installed four catch bull sticks 2 in the film magazine, and each catch bull stick 2 lower end is connected with synchronous pulley 6; Wherein, two the catch bull sticks 2 that lay respectively at 1 liang of side-entrance of film magazine are one group, two catch bull sticks of each group successively by synchronous pulley 6 be with 5 to be connected synchronously with 180 ° of oscillating cylinders 4.The present invention adopts 180 ° of oscillating cylinders 4 of compressed air-driven, 180 ° of oscillating cylinders 4 drive synchronously does 180 ° of rotations with 5 two synchronous pulleys 6 that drive a group, because synchronous pulley 6 links together with catch bull stick 2, so catch bull stick 2 is also done 180 ° of rotations simultaneously.Shown in Fig. 1 (b), catch bull stick 2 is the structure that a side has opening 7, and opening 7 is a plurality of, and two catch bull sticks 2 of each group are symmetrical arranged, and opening 7 is relative, is used to place wafer 3.Two catch bull sticks 2 of 1 liang of side-entrance of film magazine, synchronous pulley 6, be with 5 and 180 ° of oscillating cylinders 4 to constitute an integral body synchronously.
When driving catch bull stick 2,180 ° of oscillating cylinders of a side 4 do 180 ° of rotations, opposite side is motionless, at this moment wafer 3 enters from a motionless side, catch bull stick 2 openings one side of one side of rotating turns to the back side, catch bull stick 2 is opening one lateral edges and wafer 3 edges are tangent that wafer is limited in the film magazine center not, shown in Fig. 2 (a), so just finish the process that a direction wafer 3 transmits to film magazine 1.Otherwise, shown in Fig. 2 (b), promptly finish the transmission of another direction.Thereby it can be applied to ask for something has in the equipment of particular wafer storage.
Wafer takes out from film magazine 1 by box station robot (CS-R), be sent to centering unit (CA), by technology robot (PS-R) wafer 3 is delivered to each technique unit after taking out among the CA again, as CP, SPIN, HP, HHP, WEE etc., when delivering to interface input and output material carrier (IFS) unit, PS-R sends into wafer 3 from film magazine 1 one sides, film magazine 1 is finished above-mentioned a series of actions, technology robot (IF-R) is taken out wafer 3 and is sent to mask aligner by film magazine 1, the wafer 3 of finishing photoetching is taken out by IF-R puts back to film magazine 1, film magazine 1 finish one with above-mentioned opposite course of action, by PS-R wafer is sent into the CA unit again, CS-R puts back to film magazine with the wafer taking-up and finishes whole technology.
Above process route illustrates equipment mechanism of the present invention and transmission technology as an example, and the actual process route may be different.Because the glue-spreading development equipment type selecting and the technology difference of each semiconductor factory, device structure that the present invention is mentioned and machining process route are one of schemes that addresses this problem.
The present invention not only is suitable for the process equipment of gluing and development hybrid process, also is suitable for multiple road equipment, cleaning equipment, etching apparatus of the multiple road equipment of single coating technique, single developing process or the like.
Claims (4)
1. bi-directional sheet case structure is characterized in that: this mechanism is provided with film magazine, catch bull stick, synchronous pulley, band, 180 ° of oscillating cylinders synchronously, and symmetry is installed four catch bull sticks in the film magazine, and each catch bull stick lower end is connected with synchronous pulley; Wherein, two catch bull sticks that lay respectively at film magazine two side-entrances are one group, and two catch bull sticks of each group are connected with oscillating cylinder with being with synchronously by synchronous pulley.
2. according to the described bi-directional sheet of claim 1 case structure, it is characterized in that: oscillating cylinder is 180 ° of oscillating cylinders, adopt 180 ° of oscillating cylinders of compressed air-driven, 180 ° of oscillating cylinders drive 180 ° of rotations of two synchronous pulleys dos of one group of band driving synchronously, and the catch bull stick is done 180 ° of rotations simultaneously.
3. according to the described bi-directional sheet of claim 1 case structure, it is characterized in that: the catch bull stick is the structure that a side has opening, and two catch bull sticks of each group are symmetrical arranged, and opening is relative.
4. according to the described bi-directional sheet of claim 1 case structure, it is characterized in that: two catch bull sticks of film magazine two side-entrances, synchronous pulley, synchronous band constitute an integral body with 180 ° of oscillating cylinders.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010102845894A CN102024729B (en) | 2010-09-17 | 2010-09-17 | Bidirectional transmission wafer box mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010102845894A CN102024729B (en) | 2010-09-17 | 2010-09-17 | Bidirectional transmission wafer box mechanism |
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CN102024729A true CN102024729A (en) | 2011-04-20 |
CN102024729B CN102024729B (en) | 2012-06-27 |
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CN2010102845894A Expired - Fee Related CN102024729B (en) | 2010-09-17 | 2010-09-17 | Bidirectional transmission wafer box mechanism |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103681424A (en) * | 2013-12-03 | 2014-03-26 | 北京七星华创电子股份有限公司 | Rotating mechanism for steering silicon chip basket |
CN103681423A (en) * | 2013-12-03 | 2014-03-26 | 北京七星华创电子股份有限公司 | 90-degree rotating mechanism for transmitting silicon wafer baskets |
CN103715120A (en) * | 2012-10-09 | 2014-04-09 | 沈阳芯源微电子设备有限公司 | Front-open type wafer box |
WO2015062212A1 (en) * | 2013-10-30 | 2015-05-07 | 沈阳芯源微电子设备有限公司 | Coat processing modular structure and layout method |
CN106558520A (en) * | 2015-09-29 | 2017-04-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission system and chip transmission method |
CN106743667A (en) * | 2017-02-13 | 2017-05-31 | 新昌县众成实业有限公司 | A kind of single channel bidirectional transfer bogie of hospital's logistics system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1183580A (en) * | 1996-11-21 | 1998-06-03 | 三星电子株式会社 | Developing device for semiconductor device fabrication and its controlling method |
CN101436563A (en) * | 2007-11-16 | 2009-05-20 | 沈阳芯源微电子设备有限公司 | Self-centering mechanism for semiconductor chip |
-
2010
- 2010-09-17 CN CN2010102845894A patent/CN102024729B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1183580A (en) * | 1996-11-21 | 1998-06-03 | 三星电子株式会社 | Developing device for semiconductor device fabrication and its controlling method |
CN101436563A (en) * | 2007-11-16 | 2009-05-20 | 沈阳芯源微电子设备有限公司 | Self-centering mechanism for semiconductor chip |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103715120A (en) * | 2012-10-09 | 2014-04-09 | 沈阳芯源微电子设备有限公司 | Front-open type wafer box |
WO2015062212A1 (en) * | 2013-10-30 | 2015-05-07 | 沈阳芯源微电子设备有限公司 | Coat processing modular structure and layout method |
CN103681424A (en) * | 2013-12-03 | 2014-03-26 | 北京七星华创电子股份有限公司 | Rotating mechanism for steering silicon chip basket |
CN103681423A (en) * | 2013-12-03 | 2014-03-26 | 北京七星华创电子股份有限公司 | 90-degree rotating mechanism for transmitting silicon wafer baskets |
CN103681424B (en) * | 2013-12-03 | 2016-03-30 | 北京七星华创电子股份有限公司 | A kind of rotating mechanism for silicon chip flower basket is turned to |
CN103681423B (en) * | 2013-12-03 | 2016-06-22 | 北京七星华创电子股份有限公司 | 90 ° of rotating mechanisms of transmission silicon chip flower basket |
CN106558520A (en) * | 2015-09-29 | 2017-04-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission system and chip transmission method |
CN106743667A (en) * | 2017-02-13 | 2017-05-31 | 新昌县众成实业有限公司 | A kind of single channel bidirectional transfer bogie of hospital's logistics system |
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CN102024729B (en) | 2012-06-27 |
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Granted publication date: 20120627 Termination date: 20170917 |