CN102021358A - Copper alloy material - Google Patents
Copper alloy material Download PDFInfo
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- CN102021358A CN102021358A CN 201010618107 CN201010618107A CN102021358A CN 102021358 A CN102021358 A CN 102021358A CN 201010618107 CN201010618107 CN 201010618107 CN 201010618107 A CN201010618107 A CN 201010618107A CN 102021358 A CN102021358 A CN 102021358A
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- alloy material
- molybdenum
- chromium
- iron
- nickel
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Abstract
The invention takes copper as a basis material so as to keep that the alloy material has the basic thermal conductivity and chemical stability of a copper material. The alloy material is formed by doping at least two of iron, chromium, nickel and molybdenum so as to properly improve the melting point of the alloy material. In addition, the copper alloy material has the advantages of good thermal conductivity and low cost.
Description
Technical field
The present invention relates to a kind of alloy material, specially refer to a kind of high-melting-point, high thermal conductivity
And the good Cu alloy material of chemical stability.
Background technology
The metal fine copper has good thermal conductivity and good chemical stability, is widely used in various occasions.But need the higher special occasions of temperature (as welding joint material, radiating pipe, sheet material etc.) at some, because the fusing point of copper is lower, pure copper material can not finely meet the demands.Existing material is difficult to satisfy high heat conduction and high-melting-point requirement simultaneously, and the applicant has developed a kind of Cu alloy material for this reason, and the existing higher melt of this Cu alloy material has high thermal conductivity again, and has good chemical stability.
Summary of the invention
The problem that this product solved is that at the deficiency of above-mentioned technology, providing a kind of existing higher melt has high thermal conductivity again, and has the Cu alloy material of good chemical stability.
The technical scheme that the present invention is adopted for its problem of solution is: a kind of alloy material, its copper content be greater than 86 ﹪, and add wherein at least two kinds of iron, chromium, nickel, molybdenum and form.
Technique scheme also has the following technical scheme of improving: described iron, chromium, nickel, molybdenum resultant are 0.1 ﹪～14 ﹪; Nickel content is 0.1 ﹪～6 ﹪; Iron, chromium, molybdenum resultant are 3 ﹪～7 ﹪.
The invention has the beneficial effects as follows: the present invention is base mateiral with copper, has basic thermal conductivity of copper product and chemical stability to keep alloy material; Alloy material is with at least wherein two kinds of doping of iron, chromium, nickel, molybdenum, with suitable raising alloy material fusing point and thermal conductivity and low-cost advantage are preferably arranged.
Embodiment
Example 1: a kind of Cu alloy material, it consists of cupric 91.5 ﹪, iron 2 ﹪, molybdenum 3.5 ﹪, nickel 3 ﹪.
Example 2: a kind of Cu alloy material, it consists of cupric 94.5 ﹪, iron 1 ﹪, molybdenum 4.5 ﹪.
Example 3: a kind of Cu alloy material, it consists of cupric 91 ﹪, molybdenum 2 ﹪, chromium 4 ﹪, nickel 1 ﹪.
Example 4: a kind of Cu alloy material, it consists of cupric 91 ﹪, molybdenum 2 ﹪, chromium 2 ﹪, nickel 5 ﹪.
Example 5: a kind of Cu alloy material, it consists of cupric 94 ﹪, chromium 3 ﹪, molybdenum 0.5 ﹪, nickel 2.5 ﹪.
Example 6: a kind of Cu alloy material, it consists of cupric 95.5 ﹪, iron 0.5 ﹪, 2 molybdenum ﹪, nickel 2 ﹪.
Example 7: a kind of Cu alloy material, it consists of cupric 95 ﹪, iron 4 ﹪, chromium 1 ﹪.
Example 8: a kind of Cu alloy material, it consists of cupric 95 ﹪, iron 1 ﹪, chromium 4 ﹪.
Claims (4)
1. Cu alloy material, the copper content that it is characterized in that alloy material be greater than 86 ﹪, and add wherein at least two kinds of iron, chromium, nickel, molybdenum and form.
2. Cu alloy material according to claim 1 is characterized in that iron, chromium, nickel, molybdenum resultant are 0.1 ﹪～14 ﹪.
3. Cu alloy material according to claim 2 is characterized in that nickel content is 0.1 ﹪～6 ﹪.
4. Cu alloy material according to claim 2 is characterized in that iron, chromium, molybdenum resultant are 3 ﹪～7 ﹪.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010618107 CN102021358A (en) | 2010-12-31 | 2010-12-31 | Copper alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010618107 CN102021358A (en) | 2010-12-31 | 2010-12-31 | Copper alloy material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102021358A true CN102021358A (en) | 2011-04-20 |
Family
ID=43863133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010618107 Pending CN102021358A (en) | 2010-12-31 | 2010-12-31 | Copper alloy material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102021358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107604199A (en) * | 2017-08-30 | 2018-01-19 | 西安理工大学 | A kind of preparation method of Cu Cr Fe vacuum contact materials |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1626692A (en) * | 2003-12-12 | 2005-06-15 | 中国科学院金属研究所 | Copper, iron and chrome ternary copper base alloy |
| CN1678765A (en) * | 2002-09-04 | 2005-10-05 | Dept株式会社 | Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part |
-
2010
- 2010-12-31 CN CN 201010618107 patent/CN102021358A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1678765A (en) * | 2002-09-04 | 2005-10-05 | Dept株式会社 | Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part |
| CN1626692A (en) * | 2003-12-12 | 2005-06-15 | 中国科学院金属研究所 | Copper, iron and chrome ternary copper base alloy |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107604199A (en) * | 2017-08-30 | 2018-01-19 | 西安理工大学 | A kind of preparation method of Cu Cr Fe vacuum contact materials |
| CN107604199B (en) * | 2017-08-30 | 2019-11-22 | 西安理工大学 | A kind of preparation method of Cu-Cr-Fe vacuum contact material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110420 |