CN102012590B - FFS type TFT-LCD array substrate and manufacturing method thereof - Google Patents

FFS type TFT-LCD array substrate and manufacturing method thereof Download PDF

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CN102012590B
CN102012590B CN2009100919994A CN200910091999A CN102012590B CN 102012590 B CN102012590 B CN 102012590B CN 2009100919994 A CN2009100919994 A CN 2009100919994A CN 200910091999 A CN200910091999 A CN 200910091999A CN 102012590 B CN102012590 B CN 102012590B
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black matrix
electrode
common electrode
thin film
formed
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CN2009100919994A
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CN102012590A (en
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金原奭
金永珉
金馝奭
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Abstract

The present invention relates to a FFS type TFT-LCD array substrate and a manufacturing method thereof, the array substrate comprises grid wires and data lines arranged on the substrate and defining a pixel area in which a pixel electrode, a thin film transistor, and a common electrode forming an edge electric field together with the pixel electrode are formed. The array substrate further comprises a black matrix prepared by metal thin film materials, and the black matrix is connected with the common electrode. The manufacturing method comprises forming the figures of the grid wires, the datawires, the pixel electrode and the thin film transistor; forming the figures of the common electrode and the black matrix which is prepared by metal thin film materials and connected with the common electrode. According to the invention, the figure of the black matrix is arranged on the array substrate and the black matrix is connected with the common electrode, which makes the black matrix blocka light leak area effectively, and serve as a connection bus of the common electrode. The invention can effectively solve the problems of high production cost of present structure and the technical defect of the delay of the common electrode.

Description

FFS型TFT-LCD阵列基板及其制造方法 FFS type TFT-LCD array substrate and manufacturing method

技术领域 FIELD

[0001] 本发明涉及一种薄膜晶体管液晶显示器及其制造方法,尤其是一种FFS型TFT-IXD阵列基板及其制造方法。 [0001] The present invention relates to a thin film transistor liquid crystal display and a manufacturing method, particularly to an FFS type TFT-IXD array substrate manufacturing method thereof.

背景技术 Background technique

[0002]在薄膜晶体管液晶显示器(Thin Film Transistor Liquid CrystalDisplay,简称TFT-LCD)产品中,边缘场开关技术(Fringe Field Switching,简称FFS)是最近几年出现的可以改善LCD画质的技术之一,能同时实现高穿透性与大视角等要求。 [0002] In the TFT LCD (Thin Film Transistor Liquid CrystalDisplay, referred to as TFT-LCD) products, fringe field switching technology (Fringe Field Switching, referred to as FFS) one can improve the image quality of LCD technology emerged in recent years can simultaneously achieve high penetration with a large viewing angle and other requirements. 目前,现有技术FFS型TFT-LCD的主体结构包括对盒在一起并将液晶夹设其间的阵列基板和彩膜基板,阵列基板上形成有栅线、数据线、像素电极、薄膜晶体管和条状结构的公共电极,彩膜基板上形成有彩色树脂图形和黑矩阵图形,黑矩阵图形主要用于遮挡漏光区域。 Currently, the prior art FFS type TFT-LCD to the cartridge body structure includes a liquid crystal sandwiched together and gate lines are formed on the array substrate and the color filter substrate, the array substrate therebetween, data lines, pixel electrodes, thin film transistors and strips a common electrode structure formed on the color filter substrate and the pattern color resin black matrix pattern, a black matrix for blocking light leakage area is mainly graphics.

[0003] 早期的FFS型TFT-IXD结构中,彩膜基板上黑矩阵图形通常采用树脂材料制备,黑矩阵宽度的设计主要考虑阵列基板上数据线的宽度。 [0003] Early FFS type TFT-IXD structure, color filter black matrix pattern on the substrate is typically prepared using a resin material, the width of the black matrix design consideration primarily on the width of the data line of the array substrate. 随着开口率要求的不断提高,数据线的宽度变窄,树脂材料的黑矩阵逐渐成为阻碍开口率增加的主要因素。 With the increasing requirements of the aperture ratio, the width of the data line is narrowed, the resin black matrix material become a major factor in hindering the increase in aperture ratio. 为提高开口率,现有技术提出了一种采用金属材料制备黑矩阵图形的技术方案,虽然可以减小黑矩阵宽度,但对于FFS型工作模式,金属黑矩阵会产生电场扭曲现象,影响TFT-IXD的显示质量。 To improve the aperture ratio, the prior art proposes a technical solution for black matrix pattern of a metal material, while the width of the black matrix can be reduced, but the mode of the FFS type, a metal black matrix produces an electric field distortions affect TFT- IXD of display quality. 为克服电场扭曲现象,现有技术提出了一种将彩膜基板上黑矩阵与阵列基板上公共电极电连接的解决方案,具体地做法是:在制备彩膜基板和阵列基板时,分别在覆盖层上开设过孔形成传输点(transfer dot),通过传输点将彩膜基板上黑矩阵与阵列基板上公共电极导通。 To overcome electric field distortions, the prior art proposes a solution to the common electrode on the black matrix on the color filter substrate and the array substrate are connected, in particular approach is: In preparing the array substrate and the color filter substrate, respectively, in the cover defines upper layer via hole is formed transmission point (transfer dot), turned on by the common electrode on the black matrix array substrate and the color filter substrate transfer point.

[0004] 实际使用表明,该解决方案不仅存在生产成本高的缺陷,而且还存在公共电极延迟等缺陷。 [0004] The actual use show that not only the solution of high cost of production defects, but also there is a common electrode delay defects. 由于传输点制作需要增加薄膜构图的生产设备,需要增加工艺流程,因此造成生产成本增加。 Since the need to increase the transmission point making patterned film production equipment, the process needs to be increased, thus resulting in increased production costs. 由于公共电极和黑矩阵分别位于不同的基板上,且通过传输点连接,因此这种结构形式造成了公共电极的严重延迟,在诸如大尺寸显示和液晶电视等领域中无法使用。 Since the common electrode and the black matrix are on different substrates, respectively, and connected by a transmission point, so this structure resulted in a significant delay in the common electrode can not be used in the field of large-sized display such as a liquid crystal television and the like.

发明内容 SUMMARY

[0005] 本发明的目的是提供一种FFS型TFT-IXD阵列基板及其制造方法,有效解决现有结构生产成本高和公共电极延迟的技术缺陷。 [0005] The object of the present invention is to provide a FFS type TFT-IXD array substrate and a manufacturing method, an effective solution to the existing structure of high production costs and technical drawbacks common electrode delay.

[0006] 为实现上述目的,本发明提供了一种FFS型TFT-IXD阵列基板,包括形成在基板上并限定了像素区域的栅线和数据线,所述像素区域内形成有像素电极、薄膜晶体管和与所述像素电极形成边缘电场的公共电极,还包括由金属薄膜材料制备的黑矩阵,所述黑矩阵与所述公共电极连接。 [0006] To achieve the above object, the present invention provides an FFS type TFT-IXD array substrate, comprising forming on a substrate and defines a pixel region of the gate lines and data lines, pixel electrodes are formed in the pixel region, a thin film transistor and a common electrode are formed with the pixel electrode fringe electric field, further comprising a black matrix produced from a metal thin film material, the black matrix and the common electrode.

[0007] 所述薄膜晶体管包括栅电极、有源层、源电极和漏电极,所述栅电极与栅线连接, 并形成在基板上;栅绝缘层形成在栅线和栅电极上并覆盖整个基板;包括半导体层和掺杂半导体层的有源层形成在栅绝缘层上并位于栅电极的上方;像素电极形成在栅绝缘层上并位于像素区域内;源电极的一端位于有源层上,另一端与数据线连接,漏电极的一端位于有源层上,另一端与像素电极连接,源电极与漏电极之间形成TFT沟道区域;钝化层形成在上 [0007] The thin film transistor includes a gate electrode, an active layer, a source electrode and a drain electrode, the gate electrode and the gate line, and formed on the substrate; a gate insulating layer formed on the gate line and the gate electrode and covering the entire a substrate; a semiconductor layer and a doped semiconductor layer of the active layer is formed on the gate insulating layer and located above the gate electrode; a pixel electrode formed on the gate insulating layer and within the pixel region; a source electrode located on the end of the active layer and the other end connected to the data line, a drain electrode on the active layer located at one end and the other end connected to the pixel electrode, the TFT channel region formed between the source electrode and the drain electrode; passivation layer is formed on the

4述构图上并覆盖整个基板。 4 covers the entire substrate and said patterned.

[0008] 所述公共电极为数个依次排列的电极条并形成在所述钝化层上,所述黑矩阵形成在上述构图上。 [0008] The common electrode are sequentially arranged in a number of electrode strips and is formed on the passivation layer, the black matrix is ​​formed on the patterned. 进一步地,所述公共电极和黑矩阵由采用普通掩模板的二次构图工艺或采用半色调或灰色调掩模板的一次构图工艺形成。 Further, the common electrode and the black matrix is ​​formed by the secondary patterning process using a common mask or using a half-tone or gray tone mask patterning process template.

[0009] 所述黑矩阵形成在所述钝化层上,所述公共电极为数个依次排列的电极条并形成在上述构图上。 [0009] The black matrix is ​​formed on the passivation layer, said common electrode are sequentially arranged in a number of electrode strips and is formed on the patterned. 进一步地,所述黑矩阵和公共电极由采用普通掩模板的二次构图工艺形成。 Further, the black matrix and the common electrode is formed by patterning process using a secondary normal mask.

[0010] 在上述技术方案基础上,所述黑矩阵位于所述栅线和/或数据线的上方。 [0010] Based on the foregoing technical solution, the black matrix is ​​positioned above the gate lines and / or data lines.

[0011] 所述黑矩阵位于所述薄膜晶体管的上方。 The [0011] black matrix positioned over the thin film transistor.

[0012] 所述黑矩阵表面设置有防反射层。 The [0012] surface of the black matrix is ​​provided with an antireflection layer.

[0013] 为实现上述目的,本发明还提供了一种FFS型TFT-IXD阵列基板制造方法,包括: [0013] To achieve the above object, the present invention also provides an FFS type TFT-IXD array substrate manufacturing method, comprising:

[0014] 在基板上形成包括栅线、数据线、像素电极和薄膜晶体管的图形; [0014] forming a gate pattern including lines, data lines, pixel electrodes and thin film transistors on a substrate;

[0015] 在完成前述步骤的基板上形成包括公共电极和黑矩阵的图形,所述黑矩阵与所述公共电极连接。 [0015] The pattern comprises forming a black matrix and a common electrode on the substrate of the previous step, the black matrix and the common electrode.

[0016] 所述在基板上形成包括栅线、数据线、像素电极和薄膜晶体管的图形包括: [0016] The pattern comprises forming a gate line, a data line, a pixel electrode and a thin film transistor on a substrate comprising:

[0017] 在基板上沉积栅金属薄膜,通过构图工艺形成包括栅线和栅电极的图形; [0017] depositing a gate metal film on a substrate, forming a pattern including a gate line and a gate electrode through a patterning process;

[0018] 在完成前述步骤的基板上依次沉积栅绝缘层、半导体薄膜和掺杂半导体薄膜,通过构图工艺形成包括有源层的图形,有源层包括半导体层和掺杂半导体层,形成在栅绝缘层上并位于栅电极的上方; [0018] sequentially depositing a gate insulating layer on the substrate after the previous step, the semiconductor film and the doped semiconductor film are formed by a patterning process including an active layer pattern, the active layer comprises a semiconductor layer and a doped semiconductor layer formed on the gate and positioned on the insulating layer above the gate electrode;

[0019] 在完成前述步骤的基板上沉积透明导电薄膜,通过构图工艺形成包括像素电极的图形; [0019] depositing a transparent conductive thin film on the substrate after the step of forming a pattern including the pixel electrode through a patterning process;

[0020] 在完成前述步骤的基板上沉积源漏金属薄膜,通过构图工艺形成包括数据线、源电极、漏电极和TFT沟道区域的图形,所述源电极的一端位于有源层上,另一端与数据线连接,所述漏电极的一端位于有源层上,另一端与像素电极直接连接,所述源电极与漏电极之间形成TFT沟道区域。 [0020] The source-drain metal deposition film on the substrate of the previous step, comprising forming a data line, a source electrode, the drain electrode and the channel region of TFT pattern, one end of the source electrode on the active layer by a patterning process, other One end is connected to the data line, the drain electrode located on the end of the active layer, and the other end is directly connected to the pixel electrode, the TFT channel region formed between the source electrode and the drain electrode.

[0021] 在上述技术方案基础上,所述形成包括公共电极和黑矩阵的图形包括: [0021] Based on the foregoing technical solution, said pattern comprising forming a common electrode and a black matrix comprising:

[0022] 在完成前述步骤的基板上沉积钝化层和透明导电薄膜,采用普通掩模板通过构图工艺形成包括公共电极的图形,所述公共电极为数个依次排列的电极条; [0022] deposited on the substrate after the step of passivation layer and a transparent conductive thin film, with a normal mask pattern includes a common electrode is formed through a patterning process, the common electrode several electrode strips arranged in a sequence;

[0023] 在完成前述步骤的基板上沉积黑矩阵金属薄膜,采用普通掩模板通过构图工艺形成包括黑矩阵的图形,所述黑矩阵与公共电极连接。 [0023] deposited on the substrate after the step of the black matrix metal thin film, with a normal mask pattern comprises a black matrix formed by a patterning process, the black matrix and the common electrode.

[0024] 在上述技术方案基础上,所述形成包括公共电极和黑矩阵的图形包括: [0024] Based on the foregoing technical solution, said pattern comprising forming a common electrode and a black matrix comprising:

[0025] 在完成前述步骤的基板上首先沉积钝化层,然后连续沉积透明导电薄膜和黑矩阵金属薄膜; [0025] The first passivation layer is deposited on the substrate in the previous step, and continuously depositing a transparent conductive metal thin films and the black matrix;

[0026] 在黑矩阵金属薄膜上涂覆一层光刻胶; [0026] The metal thin film on the black matrix layer of photoresist is coated;

[0027] 采用半色调或灰色调掩模板对光刻胶进行曝光,显影后使光刻胶形成光刻胶完全保留区域、光刻胶完全去除区域和光刻胶部分保留区域。 [0027] The half-tone mask or a gray-tone photoresist is exposed after development of the photoresist to form a photoresist completely-retained region, the photoresist is completely removed and a photoresist portion area reserved area. 其中光刻胶完全保留区域对应于黑矩阵图形所在区域,光刻胶部分保留区域对应于公共电极图形所在区域,光刻胶完全去除区域对应于上述图形以外的区域; Wherein the photoresist region corresponding to the completely-retained Area black matrix pattern, the photoresist region corresponding to the portion reserved region where the common electrode pattern, the photoresist is completely removed outside the region corresponding to the pattern of the region;

[0028] 通过第一次刻蚀工艺刻蚀掉光刻胶完全去除区域的黑矩阵金属薄膜和透明导电薄膜,形成包括黑矩阵的图形;[0029] 通过灰化工艺去除光刻胶部分保留区域的光刻胶,暴露出该区域的黑矩阵金属薄膜; [0028] The photoresist is completely removed out of the black matrix and a transparent conductive metal thin film region by etching the first etching process, comprising forming a black matrix pattern; [0029] Reserved portions of the photoresist is removed by an ashing process region photoresist, exposing the black matrix region of the metal thin film;

[0030] 通过第二次刻蚀工艺完全刻蚀掉光刻胶部分保留区域的黑矩阵金属薄膜,形成包括公共电极的图形; [0030] etched away portions of the black matrix metal thin film photoresist reserved areas by a second etching process, forming a pattern including a common electrode;

[0031] 剥离剩余的光刻胶。 [0031] The remaining photoresist is stripped.

[0032] 在上述技术方案基础上,所述形成包括公共电极和黑矩阵的图形包括: [0032] Based on the foregoing technical solution, said pattern comprising forming a common electrode and a black matrix comprising:

[0033] 在完成前述步骤的基板上沉积钝化层和黑矩阵金属薄膜,采用普通掩模板通过构图工艺形成包括黑矩阵的图形; [0033] depositing a passivation layer and the black matrix metal thin film on the substrate of the previous step, with a normal mask pattern comprises a black matrix formed by a patterning process;

[0034] 在完成前述步骤的基板上沉积透明导电薄膜,采用普通掩模板通过构图工艺形成包括公共电极的图形,所述公共电极为数个依次排列的电极条,所述公共电极与黑矩阵连接。 [0034] deposited on the substrate after the step of transparent conductive thin film, with a normal mask pattern includes a common electrode is formed through a patterning process, the common electrode several electrode strips arranged in a sequence, the common electrode is connected to the black matrix.

[0035] 本发明提供了一种FFS型TFT-IXD阵列基板及其制造方法,通过将黑矩阵图形设置在阵列基板上,且黑矩阵与公共电极连接,使黑矩阵不仅有效遮挡漏光区域,而且作为公共电极的连接总线,有效解决了现有结构生产成本高和公共电极延迟的技术缺陷。 [0035] The present invention provides an FFS type TFT-IXD array substrate and a manufacturing method provided by the black matrix pattern on the array substrate, and a black matrix and a common electrode, a black matrix so that not only effectively block light leakage area, and a common electrode connected to a bus, an effective solution to the existing structures of high production costs and technical drawbacks common electrode delay. 由于金属薄膜材料的黑矩阵形成在栅线、数据线、源电极和漏电极的上方,因此可以有效减小黑矩阵宽度,提高开口率。 Since the metal thin film material of the black matrix formed over the gate line, a data line, a source electrode and a drain electrode, it is possible to effectively reduce the width of the black matrix, improving the aperture ratio. 由于黑矩阵和公共电极均设置在阵列基板上且直接连接,因此完全消除了现有结构存在的公共电极延迟的缺陷,可以广泛应用于大尺寸显示和液晶电视等领域。 Since the black matrix and a common electrode are provided on the array substrate and is directly connected, thus completely eliminating the delay of the common electrode drawbacks of the prior structures, it can be widely used in large-sized display and a liquid crystal television. 由于在阵列基板上制备黑矩阵图形可以采用现有工艺设备和工艺流程,不需要增加额外的生产设备,同时减少了在彩膜基板上制备黑矩阵图形的设备和工艺,因此本发明有效降低了生产成本。 Since the preparation of the black matrix pattern on the array substrate may be employed conventional process equipment and process, no additional equipment, while reducing equipment and process for preparing the black matrix pattern on a color filter substrate, the present invention effectively reduces Cost of production.

附图说明 BRIEF DESCRIPTION

[0036] 图1为本发明FFS型TFT-IXD阵列基板第一实施例的平面图; [0036] FIG. 1 is a plan view of the FFS type TFT-IXD array substrate of the first embodiment of the present invention;

[0037] 图2为图1中Al-Al向的剖面图; [0037] FIG. 2 is a sectional view of the Al-Al of FIG. 1;

[0038] 图3为图1中Bl-Bl向的剖面图; [0038] FIG. 3 is a cross-sectional view of the FIG Bl-Bl 1;

[0039] 图4为本发明FFS型TFT-IXD阵列基板第一实施例第一次构图工艺后的平面图; [0039] FIG. 4 is a plan view of the first embodiment after the patterning process of the first embodiment of the FFS type TFT-IXD array substrate of the invention;

[0040] 图5为图4中A2-A2向的剖面图; [0040] FIG. 5 is a sectional view of the A2-A2 of FIG. 4;

[0041] 图6为本发明FFS型TFT-IXD阵列基板第一实施例第二次构图工艺后的平面图; [0041] FIG. 6 is a plan view of an embodiment of a second patterning process a first embodiment of the FFS type TFT-IXD array substrate of the invention;

[0042] 图7为图6中A3-A3向的剖面图; [0042] FIG. 7 is a sectional view in the A3-A3 of FIG. 6;

[0043] 图8为本发明FFS型TFT-IXD阵列基板第一实施例第三次构图工艺后的平面图; [0043] FIG 8 is a plan view of a first embodiment of the third embodiment patterning process FFS type TFT-IXD array substrate of the invention;

[0044] 图9为图8中A4-A4向的剖面图; [0044] FIG. 9 is a sectional view of FIG. 8 of the A4-A4;

[0045] 图10为图8中B4-B4向的剖面图; [0045] FIG. 10 is a sectional view taken along the B4-B4 of FIG 8;

[0046] 图11为本发明FFS型TFT-IXD阵列基板第一实施例第四次构图工艺后的平面图; [0046] FIG 11 a plan view of the embodiment of the present fourth patterning process of the first embodiment of the FFS type TFT-IXD array substrate of the invention;

[0047] 图12为图11中A5-A5向的剖面图; [0047] FIG. 12 is a sectional view taken along the A5-A5 of FIG 11;

[0048] 图13为图11中B5-B5向的剖面图; [0048] FIG. 13 is a sectional view of the B5-B5 of FIG. 11;

[0049] 图14为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺后的平面图; [0049] FIG. 14 is a plan view of the fifth embodiment after the patterning process of the first embodiment of the FFS type TFT-IXD array substrate of the invention;

[0050] 图15为图14中A6-A6向的剖面图; [0050] FIG. 15 is a sectional view taken along the A6-A6 of FIG 14;

[0051] 图16为图14中B6-B6向的剖面图; [0051] FIG. 16 is a sectional view of the B6-B6 of FIG. 14;

[0052] 图17为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺中光刻胶曝光显影后B6-B6向的剖面图; [0052] FIG. 17 is a sectional view of the fifth embodiment photoresist patterning process to exposure and development B6-B6 of the first embodiment of the FFS type TFT-IXD array substrate of the invention;

[0053] 图18为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺中第一次刻蚀工艺后B6-B6向的剖面图; [0053] FIG. 18 is a sectional view of the fifth embodiment of the first patterning process, an etching process B6-B6 of the first embodiment of the FFS type TFT-IXD array substrate of the invention;

[0054] 图19为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺中灰化工艺后B6-B6向的剖面图; [0054] FIG. 19 is a sectional view of a fifth patterning process after ashing process B6-B6 of the first embodiment of the FFS type TFT-IXD array substrate of the invention;

[0055] 图20为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺中第二次刻蚀工艺后B6-B6向的剖面图; [0055] FIG. 20 is a sectional view of the fifth embodiment of the second patterning process B6-B6 etching process to a first embodiment of the FFS type TFT-IXD array substrate of the invention;

[0056] 图21为本发明FFS型TFT-IXD阵列基板第二实施例的平面图; [0056] FIG 21 a plan view of the second embodiment of the FFS TFT-IXD array substrate of the present invention;

[0057] 图22为图21中Cl-Cl向的剖面图; [0057] FIG. 22 is a cross-sectional view of FIG Cl-Cl to 21;

[0058] 图23为图21中Dl-Dl向的剖面图; [0058] FIG. 23 is a cross-sectional view of FIG Dl-Dl to 21;

[0059] 图M为本发明FFS型TFT-IXD阵列基板制造方法的流程图; [0059] FIG M flowchart of a method for producing the present FFS type TFT-IXD of the invention, an array substrate;

[0060] 图25为本发明FFS型TFT-IXD阵列基板制造方法第一实施例的流程图; [0060] FIG. 25 FFS type TFT-IXD array substrate manufacturing method of the first embodiment of the present invention, a flow diagram;

[0061] 图沈为本发明FFS型TFT-IXD阵列基板制造方法第二实施例的流程图; [0061] FIG sink flowchart of a second embodiment of the present embodiment of the FFS type TFT-IXD of the array substrate manufacturing method of the invention;

[0062] 图27为本发明FFS型TFT-IXD阵列基板制造方法第三实施例的流程图。 [0062] FIG. 27 is a flowchart of the FFS type TFT-IXD array substrate manufacturing method of the third embodiment of the present invention. 附图标记说明: REFERENCE NUMERALS:

[0063] 1-基板; 2-栅电极; 3-栅绝缘层; [0063] 1- substrate; 2- a gate electrode; 3- gate insulating layer;

[0064] 4-半导体层; 5-掺杂半导体层;6-源电极; [0064] 4- semiconductor layer; 5- doped semiconductor layer; 6- source electrode;

[0065] 7-漏电极; 8-钝化层; 9-黑矩阵; [0065] 7- drain electrode; 8- passivation layer; 9- black matrix;

[0066] 11-栅线; 12-数据线; 13-像素电极; [0066] 11- gate line; 12- a data line; 13- pixel electrode;

[0067] 14-公共电极;。 [0067] 14- common electrode;. 20-光刻胶; 21-透明导电薄膜; The photoresist 20; 21 a transparent conductive film;

[0068] 22-黑矩阵金属薄膜。 [0068] 22- black matrix metal thin film.

具体实施方式 Detailed ways

[0069] 下面通过附图和实施例,对本发明的技术方案做进一步的详细描述。 [0069] The following drawings and embodiments, detailed description of the further aspect of the present invention. 附图中各层薄膜厚度和区域大小形状不反映FFS型TFT-LCD阵列基板的真实比例,目的只是示意说明本发明内容。 And drawing the film thickness of each layer does not reflect the real shape of the area size ratio FFS type TFT-LCD array substrate, an object of the present invention is described only schematically.

[0070] 图1为本发明FFS型TFT-IXD阵列基板第一实施例的平面图,所反映的是一个像素单元的结构,图2为图1中Al-Al向的剖面图,图3为图1中Bl-Bl向的剖面图。 Plan view of a first embodiment of the FFS type TFT-IXD array substrate [0070] FIG. 1 of the present invention, is reflected in the structure of one pixel unit of FIG. 2 is a sectional view of the Al-Al 1, and FIG. 3 is a diagram sectional view of the 1 Bl-Bl. 如图1〜图3所示,本发明FFS型TFT-IXD阵列基板的主体结构包括形成在基板1上的栅线11、 数据线12、像素电极13、公共电极14、黑矩阵9和薄膜晶体管,栅线11和数据线12定义了像素区域,像素电极13、公共电极14和薄膜晶体管形成在像素区域内,栅线11用于向薄膜晶体管提供开启信号或关断信号,数据线12用于向像素电极13提供数据信号,公共电极14 为数个依次排列的电极条,用于与像素电极13形成边缘电场,由金属薄膜材料制备的黑矩阵9形成在栅线11、数据线12和薄膜晶体管的上方,并与公共电极14连接,不仅用于遮挡漏光区域,而且作为公共电极14的连接总线。 1 ~ FIG. 3, the main structure of the FFS type TFT-IXD of the present invention comprises an array substrate 12, pixel electrodes 13, common electrode 14, the black matrix 9 and a thin film transistor formed on the substrate 1, a gate line 11, data line , the gate line 11 and data line 12 defines a pixel region, the pixel electrode 13, common electrode 14 and a thin film transistor formed in the pixel region, the gate line 11 for providing a signal to the thin film transistor is turned on or off signal, a data line 12 supplying data signals to the pixel electrodes 13, the common electrode 14 are sequentially arranged in a number of electrode strips, a pixel electrode fringe electric field 13 is formed, a metal thin film material is prepared from the black matrix 9 is formed on the gate lines 11, data lines 12 and the thin film transistor above, and connected to the common electrode 14, not only for blocking light leakage area, and as a common electrode connected to bus 14. 具体地,本发明FFS型TFT-IXD阵列基板包括形成在基板1上的栅线11和栅电极2,栅电极2与栅线11连接;栅绝缘层3形成在栅线11和栅电极2上并覆盖整个基板1 ;有源层(包括半导体层4和掺杂半导体层幻形成在栅绝缘层3上并位于栅电极2的上方;像素电极13形成在栅绝缘层3上并位于像素区域内; 源电极6的一端位于有源层上,另一端与数据线12连接,漏电极7的一端位于有源层上,另一端与像素电极13连接,源电极6与漏电极7之间形成TFT沟道区域,TFT沟道区域的掺杂半导体层5被完全刻蚀掉,并刻蚀掉部分厚度的半导体层4,使TFT沟道区域的半导体层4 暴露出来;钝化层8形成在上述构图上并覆盖整个基板1 ;公共电极14形成在钝化层8上; 黑矩阵9形成在上述构图上并位于栅线11、数据线12和薄膜晶体管的上方,同时与公共电极14直接连接。 In particular, the present invention is the FFS type TFT-IXD array substrate comprising forming on a substrate a gate line 11 and the gate electrode 2, the gate electrode 2 and gate line 11; a gate insulating layer 3 is formed on the gate line 11 and the gate electrode 2 and covering the entire substrate 1; an active layer (semiconductor layer comprising a doped semiconductor layer 4 and the phantom is formed over the gate insulating layer on the gate electrode 2 and 3; and the pixel electrode 13 is formed on the gate insulating layer and within the pixel area 3 ; end of source electrode 6 is positioned on the active layer, the data line 12 and the other end connected to one end of the drain electrode 7 is located on the active layer, and the other end is connected to the pixel electrode 13, the source electrode 6 is formed between the TFT and the drain electrode 7 the channel region, the doped semiconductor layer of the TFT channel region 5 is completely etched away portions and etched away to a thickness of the semiconductor layer 4, the semiconductor layer of the TFT channel region 4 exposed; passivation layer 8 is formed in the above patterned on the substrate 1 and covers the whole; common electrode 14 is formed on the passivation layer 8; black matrix 9 is formed above the data line 12 and the thin film transistor is patterned and positioned on the gate line 11, while 14 is directly connected to the common electrode.

[0071] 图4〜图13为本发明FFS型TFT-IXD阵列基板第一实施例制造过程的示意图, 可进一步说明本发明的技术方案,以下说明中,本发明所称的构图工艺包括光刻胶涂覆、掩模、曝光、刻蚀和光刻胶剥离等工艺,光刻胶以正性光刻胶为例。 [0071] FIG. 4 ~ Fig. 13 is a schematic diagram of the manufacturing process of a first embodiment of the FFS type TFT-IXD array substrate of the invention, further technical solutions of the present invention, the following description, the present invention is referred to a photolithographic patterning process comprising adhesive coating, masking, exposing, etching and a photoresist peeling process, photoresist is a positive photoresist as an example.

[0072] 图4为本发明FFS型TFT-IXD阵列基板第一实施例第一次构图工艺后的平面图, 所反映的是一个像素单元的结构,图5为图4中A2-A2向的剖面图。 [0072] FIG. 4 is FFS type TFT-IXD plan view of an array substrate according to a first patterning process a first embodiment the cross section A2-A2 of FIG. 4 the invention, as reflected in the structure of one pixel unit of FIG. 5 is Fig. 首先采用磁控溅射或热蒸发的方法,在基板1 (如玻璃基板或石英基板)上沉积栅金属薄膜,采用普通掩模板通过构图工艺形成包括栅线11和栅电极2的图形,栅电极2与栅线11连接,如图4和图5所 Firstly, a magnetron sputtering method or a thermal evaporation, depositing a gate metal film on the substrate 1 (such as a glass substrate or a quartz substrate), using a common mask is formed, a gate electrode pattern including the gate line 11 and the gate electrode 2 through a patterning process 11 is connected to the gate line 2, 4 and 5

7J\ ο 7J \ ο

[0073] 图6为本发明FFS型TFT-IXD阵列基板第一实施例第二次构图工艺后的平面图, 所反映的是一个像素单元的结构,图7为图6中A3-A3向的剖面图。 [0073] FIG. 6 is a FFS type TFT-IXD plan view of an array substrate according to a first embodiment of the second patterning process sectional view in FIG. 6 A3-A3 of the invention, as reflected in the structure of one pixel unit of FIG. 7 Fig. 在完成上述图4所示构图的基板上,采用等离子体增强化学气相沉积(简称PECVD)方法依次沉积栅绝缘层、半导体薄膜和掺杂半导体薄膜,采用普通掩模板通过构图工艺形成包括有源层的图形,有源层包括半导体层4和掺杂半导体层5,形成在栅绝缘层上并位于栅电极2的上方,如图6和图7所示。 In the above FIG. 4 patterned on the substrate using a plasma enhanced chemical vapor deposition (abbreviated PECVD) sequentially depositing a gate insulating layer, a semiconductor film and the doped semiconductor film, using a common mask is formed by a patterning process including an active layer pattern, the active layer 4 and the semiconductor layer comprising a doped semiconductor layer 5, formed over the gate insulating layer and the gate electrode 2, 6 and 7.

[0074] 图8为本发明FFS型TFT-IXD阵列基板第一实施例第三次构图工艺后的平面图, 所反映的是一个像素单元的结构,图9为图8中A4-A4向的剖面图,图10为图8中B4-B4 向的剖面图。 [0074] FIG 8 is a plan view of a first embodiment of a third patterning process embodiment of the FFS type TFT-IXD array substrate of the invention, as reflected in the structure of one pixel unit of FIG. 9 is a cross-sectional view in FIG. 8 A4-A4 of the FIG, 10 is a sectional view in FIG. 8 B4-B4 direction. 在完成上述图6所示构图的基板上,采用磁控溅射或热蒸发的方法沉积透明导电薄膜,采用普通掩模板通过构图工艺在像素区域内形成包括像素电极13的图形,如图8〜图10所示。 On completion of the patterned substrate shown in FIG. 6, magnetron sputtering or thermal evaporation method of depositing a transparent conductive film, is formed with a normal mask pattern including a pixel electrode in the pixel region 13 by a patterning process, as shown in FIG 8~ 10 shown in FIG.

[0075] 图11为本发明FFS型TFT-IXD阵列基板第一实施例第四次构图工艺后的平面图, 所反映的是一个像素单元的结构,图12为图11中A5-A5向的剖面图,图13为图11中B5-B5 向的剖面图。 [0075] Figure 11 present the FFS type TFT-IXD plan view of an array substrate patterning process of the first embodiment of the fourth embodiment in cross-sectional view of FIG. 11 A5-A5 to the invention, as reflected in the structure of a pixel unit, FIG. 12 FIG, 13 is a cross-sectional B5-B5 in FIG. 11 to FIG. 在完成上述图8所示构图的基板上,采用磁控溅射或热蒸发的方法沉积源漏金属薄膜,采用普通掩模板通过构图工艺形成包括数据线12、源电极6、漏电极7和TFT沟道区域的图形,如图11〜图13所示。 In the above FIG. 8 patterned on the substrate using a magnetron sputtering method or a thermal evaporation deposition source drain metal film 12 is formed using a common mask, a source electrode 6, the drain line includes a data electrode by a patterning process and the TFT 7 as shown in the graphics of the channel region, as shown in FIG. 11~ 13. 本次构图工艺后,源电极6的一端位于有源层上,另一端与数据线12连接,漏电极7的一端位于有源层上,另一端与像素电极13直接连接,源电极6与漏电极7之间形成TFT沟道区域,TFT沟道区域的掺杂半导体层5被完全刻蚀掉, 并刻蚀掉部分厚度的半导体层4,使TFT沟道区域的半导体层4暴露出来。 After the patterning process, an end of the source electrode 6 is located on the active layer, the data line 12 and the other end connected to one end of the drain electrode 7 is located on the active layer, and the other end is directly connected to the pixel electrode 13, source electrode 6 and the drain a channel region formed between the TFT electrode 7, the doped semiconductor layer of the TFT channel region 5 is completely etched away portions and etched away to a thickness of the semiconductor layer 4, the semiconductor layer of the TFT channel region 4 exposed.

[0076] 图14为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺后的平面图, 所反映的是一个像素单元的结构,图15为图14中A6-A6向的剖面图,图16为图14中B6-B6 向的剖面图。 [0076] FIG. 14 is FFS type TFT-IXD plan view of an array substrate of the fifth embodiment of the first patterning process sectional views in FIG. 14 A6-A6 of the invention, as reflected in the structure of a pixel unit, 15 is FIG, 16 is a cross-sectional view in FIG. 14 to the B6-B6. 在完成上述图11所示构图的基板上,采用PECVD方法沉积钝化层8,钝化层8覆盖整个基板1。 Patterned on the substrate as shown in the above FIG 11, a passivation layer is deposited using a PECVD method 8, a passivation layer 8 covering the entire substrate 1. 之后采用磁控溅射或热蒸发的方法沉积透明导电薄膜,采用普通掩模板通过构图工艺形成包括公共电极14的图形,如图14〜图16所示。 After magnetron sputtering or thermal evaporation method of depositing a transparent conductive thin film, with a normal mask pattern includes a common electrode 14 is formed through a patterning process, as shown in FIG. 14~ 16 shown in FIG. 像素区域内的公共电极14为数个平行且依次排列的电极条,用于与像素电极13形成边缘电场,数个电极条的端部搭设在栅线11上,同时数据线12上方也形成有公共电极14。 A common electrode in the pixel region 14 and a number of parallel electrode strips arranged sequentially, for forming the pixel electrode fringe electric field 13, an end portion of a plurality of electrode strips on the erection of the gate line 11, while above the data line 12 is also formed with a common electrode 14. [0077] 最后,在完成上述图14所示构图的基板上,采用磁控溅射或热蒸发的方法沉积黑矩阵金属薄膜,黑矩阵金属薄膜可以采用Mo、Al、Ti、Cr、Ta、Cu或AlNd等金属。 [0077] Finally, as shown in the above FIG patterned on a substrate, magnetron sputtering or thermal evaporation method of a metal thin film 14 is deposited a black matrix, the black matrix using a metal thin film may be Mo, Al, Ti, Cr, Ta, Cu AlNd, or other metal. 通过构图工艺形成包括黑矩阵9的图形,且黑矩阵9与公共电极14直接连接,完成第六次构图工艺, 如图1〜图3所示。 Is formed by patterning the black matrix 9 and the black matrix 914 is directly connected with the common electrode, the sixth patterning process is completed, as shown in FIG. 1 ~ 3. 本次构图工艺后,黑矩阵9形成在栅线11、数据线12、源电极6和漏电极7的上方,由于电极条结构的公共电极14搭设在栅线11上,因此栅线11上方的黑矩阵9 压设在数个电极条上,实现黑矩阵9与公共电极14的直接连接,使黑矩阵9不仅有效遮挡漏光区域,而且作为公共电极14的连接总线。 After the patterning process, the black matrix 9 is formed over the gate line 11, data line 12, the source electrode 6 and drain electrode 7, since the common electrode bar structure 14 to extend over the gate line 11, the top gate line 11 and therefore of the the black matrix 9 is pressed a plurality of electrodes disposed on the article, to achieve 9 directly connected to the common electrode 14 of the black matrix of the black matrix blocking light leakage region 9 is not only effective, but also as a common electrode connected to bus 14. 本次构图工艺中,由于公共电极为透明导电薄膜材料,黑矩阵为金属薄膜材料,通过选择刻蚀金属薄膜速率高而刻蚀透明导电薄膜速率低的刻蚀液即可实现本次构图过程。 The patterning process, since the common electrode is a transparent conductive film material, the black matrix material is a metal thin film, a metal thin film by selecting a high etch rate and low etching rate of the transparent conductive film The etching solution can be achieved in this patterning process.

[0078] 实际应用中,由于本实施例黑矩阵为金属材料,为防止黑矩阵产生的光反射,可以在黑矩阵表面涂覆一层防反射层。 [0078] In practice, since the embodiment of the present embodiment the black matrix material is a metal, a black matrix to prevent light generated by reflection, anti-reflection layer may be a layer of the black matrix surface coating. 需要说明的是,图1所示结构只是本实施例FFS型TFT-LCD阵列基板的结构形式之一,根据本实施例的设计思想,还存在相应的结构变形。 Incidentally, the configuration shown in FIG. 1 embodiment only one structure FFS type TFT-LCD array substrate according to the present embodiment, according to the design concept of the present embodiment, there is also a corresponding structural deformation. 例如,在本实施例技术方案中,黑矩阵图形可以只设置在栅线上方,其他位置(如数据线和薄膜晶体管等位置)上方不设置黑矩阵,而这些位置由彩膜基板上对应位置的黑矩阵遮挡。 For example, in this embodiment aspect, a black matrix pattern may be provided only on the gate line direction, the other position (e.g., data lines and thin film transistor position) above is not provided a black matrix, and these positions correspond to positions of the color filter substrate The black matrix block. 黑矩阵图形可以只设置在数据线上方,其他位置(如栅线和薄膜晶体管等位置)上方不设置黑矩阵,而这些位置由彩膜基板上对应位置的黑矩阵遮挡,此时电极条结构的公共电极可以通过连接条相互连接,并与黑矩阵连接。 Black matrix pattern may be provided only above the data line, another location (e.g., a thin film transistor and the gate line position) above the black matrix is ​​not provided, and these positions correspond to the position of the substrate on the color filter black matrix blocked, then the electrode bar structure the common electrode may be interconnected by a connecting bar, and is connected to the black matrix. 再如,黑矩阵图形可以只设置在栅线和数据线上方,其他位置(如薄膜晶体管等位置)上方不设置黑矩阵,而这些位置由彩膜基板上对应位置的黑矩阵遮挡。 Again, the black matrix pattern may be provided only in the side of the gate lines and the data lines, other locations (e.g., a thin film transistor position) above the black matrix is ​​not provided, and these positions correspond to the position of the substrate on the color filter black matrix occlusion.

[0079] 进一步地,图4〜图16所示制备流程也只是本实施例FFS型TFT-IXD阵列基板的制造方法之一,实际应用中可以通过增加或减少构图工艺形成新的制备流程。 [0079] Further, the flow shown in FIG. 4 ~ 16 FIG prepared just one method of the present embodiment for producing the FFS type TFT-IXD array substrate embodiments, the practical application of the new process of preparation can be formed by increasing or decreasing the patterning process. 例如,第五次构图工艺可以采用半色调或灰色调掩模板通过一次构图工艺同时形成公共电极和黑矩阵图形。 For example, the patterning process may fifth gray tone or half-tone mask and forming a common electrode while the black matrix pattern by a patterning process employed. 下面简单说明该制备过程。 The preparation is briefly described below.

[0080] 图17为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺中光刻胶曝光显影后B6-B6向的剖面图。 [0080] FIG. 17 is a sectional view B6-B6 to the fifth embodiment after the photoresist patterning process, exposing and developing a first embodiment of the FFS type TFT-IXD array substrate of the invention. 首先采用PECVD方法沉积钝化层8,然后采用磁控溅射或热蒸发的方法连续沉积透明导电薄膜21和黑矩阵金属薄膜22。 First passivation layer is deposited using a PECVD method 8, and then magnetron sputtering method or a thermal evaporation continuously depositing a transparent conductive metal film 21 and the black matrix film 22. 在黑矩阵金属薄膜22上涂覆一层光刻胶20,采用半色调或灰色调掩模板对光刻胶20进行曝光,显影后使光刻胶20 形成未曝光区域A(光刻胶完全保留区域)、完全曝光区域B(光刻胶完全去除区域)和部分曝光区域C(光刻胶部分保留区域),如图17所示。 The black matrix 22 is coated on the metal thin film layer of photoresist 20, semi-tone or gray tone mask for exposing the photoresist 20, the photoresist 20 is formed after development the unexposed area A (photoresist completely-retained region), totally exposed region B (area of ​​the photoresist is completely removed) and partially exposed region C (region photoresist portion remains), shown in Figure 17. 其中未曝光区域A对应于黑矩阵图形所在区域,部分曝光区域C对应于公共电极图形所在区域,完全曝光区域B对应于上述图形以外的区域,未曝光区域A光刻胶的厚度大于部分曝光区域C光刻胶的厚度。 Wherein the unexposed region corresponding to the black matrix pattern A Area, partially exposed region C corresponds to a region where the common electrode pattern, the region other than the pattern B corresponds to the fully exposed areas, unexposed areas A resist thickness greater than the partially exposed region C photoresist thickness.

[0081] 图18为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺中第一次刻蚀工艺后B6-B6向的剖面图。 [0081] FIG. 18 is a sectional view of a fifth embodiment of the first patterning process B6-B6 after the etching process to a first embodiment of the FFS type TFT-IXD array substrate of the invention. 通过第一次刻蚀工艺刻蚀掉完全曝光区域B的黑矩阵金属薄膜22和透明导电薄膜21,形成包括黑矩阵9的图形,如图18所示。 Etched away by the etching process completely exposed first region B of the black matrix 22 and a transparent conductive metal thin film 21, comprising forming a black matrix pattern 9, as shown in Fig.

[0082] 图19为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺中灰化工艺后B6-B6向的剖面图。 [0082] FIG. 19 is a sectional B6-B6 of the fifth embodiment after the patterning process of the first embodiment in an ashing process FFS type TFT-IXD array substrate disclosure. 通过灰化工艺,去除部分曝光区域C的光刻胶,暴露出该区域的黑矩阵金属薄膜22,如图19所示。 By an ashing process, removing portions of the photoresist exposed region C to expose the metal thin film of the black matrix region 22, as shown in Fig.

[0083] 图20为本发明FFS型TFT-IXD阵列基板第一实施例第五次构图工艺中第二次刻蚀工艺后B6-B6向的剖面图。 [0083] FIG. FIG. 20 is a sectional B6-B6 to the fifth embodiment after the patterning process, a second etching process of the first embodiment of the FFS type TFT-IXD array substrate of the invention. 通过第二次刻蚀工艺完全刻蚀掉部分曝光区域C的黑矩阵金 By the second etching process etched away partially exposed region C of the black matrix gold

9属薄膜22,形成包括公共电极14的图形,如图20所示。 9 22 metal thin film, comprising forming a common electrode pattern 14, as shown in Fig.

[0084] 最后剥离剩余的光刻胶,完成本发明TFT-LCD阵列基板第一实施例第五次构图工艺,如图3所示。 [0084] Finally, the remaining photoresist is stripped to complete the TFT-LCD array substrate of the fifth embodiment of the present invention patterning process a first embodiment, as shown in FIG.

[0085] 图21为本发明FFS型TFT-IXD阵列基板第二实施例的平面图,所反映的是一个像素单元的结构,图22为图21中Cl-Cl向的剖面图,图23为图21中Dl-Dl向的剖面图。 [0085] FIG 21 a plan view of the second embodiment of the FFS TFT-IXD array substrate of the present invention, is reflected in the structure of one pixel unit, to FIG. 22 is a sectional view in FIG. 21 Cl-Cl, FIG 23 is 21 is a sectional view of the Dl-Dl. 如图21〜图23所示,本实施例是前述第一实施例的一种结构变形,主体结构与前述第一实施例基本相同,所不同的是,本实施例公共电极位于黑矩阵之上,即电极条结构的公共电极搭设在黑矩阵上,实现公共电极与黑矩阵的直接连接。 FIG 21~ 23, the structure of the present embodiment is a modification of the foregoing first embodiment, the main structure substantially the same as the foregoing first embodiment, except that the present embodiment over the embodiment of the common electrode on the black matrix , i.e., the common electrode bar structure erection on the black matrix, a common electrode and a direct connection of the black matrix. 本实施例制备过程也与前述第一实施例的制备过程基本相同,所不同的是,本实施例在钝化层上先形成黑矩阵图形,之后再形成公共电极图形,且公共电极与黑矩阵连接。 Preparation process of the present embodiment is also substantially the same as the embodiment of the preparation process of the first embodiment, except that the present embodiment first black matrix pattern is formed on the passivation layer, and then after a common electrode pattern is formed, the black matrix and the common electrode connection. 同样地,本实施例黑矩阵表面上可以涂覆有防反射层,黑矩阵图形可以只设置在栅线、数据线或栅线和数据线上方,这里不再赘述。 Similarly, the present embodiment may be coated with anti-reflection layer on the surface of the black matrix embodiment, black matrix pattern may be provided only on the gate line, data line or gate line and the data line side, it will not be repeated here.

[0086] 本发明提供了一种FFS型TFT-IXD阵列基板,通过将黑矩阵图形设置在阵列基板上,且黑矩阵与公共电极连接,使黑矩阵不仅有效遮挡漏光区域,而且作为公共电极的连接总线,有效解决了现有结构生产成本高和公共电极延迟的技术缺陷。 [0086] The present invention provides an FFS type TFT-IXD array substrate, is provided by the black matrix pattern on the array substrate, and a common electrode connected to the black matrix, the black matrix so that not only effectively block light leakage area, and a common electrode bus connection, an effective solution to the existing structures of high production costs and technical drawbacks common electrode delay. 由于金属薄膜材料的黑矩阵形成在栅线、数据线、源电极和漏电极的上方,因此可以有效减小黑矩阵宽度,提高开口率。 Since the metal thin film material of the black matrix formed over the gate line, a data line, a source electrode and a drain electrode, it is possible to effectively reduce the width of the black matrix, improving the aperture ratio. 由于黑矩阵和公共电极均设置在阵列基板上且直接连接,因此完全消除了现有结构存在的公共电极延迟的缺陷,可以广泛应用于大尺寸显示和液晶电视等领域。 Since the black matrix and a common electrode are provided on the array substrate and is directly connected, thus completely eliminating the delay of the common electrode drawbacks of the prior structures, it can be widely used in large-sized display and a liquid crystal television.

[0087] 图M为本发明FFS型TFT-IXD阵列基板制造方法的流程图,包括: [0087] FIG M flowchart present FFS type TFT-IXD array substrate manufacturing method of the present invention, comprising:

[0088] 步骤1、在基板上形成包括栅线、数据线、像素电极和薄膜晶体管的图形; [0088] Step 1, a pattern including a gate line, a data line, a pixel electrode and a thin film transistor on a substrate;

[0089] 步骤2、在完成前述步骤的基板上形成包括公共电极和黑矩阵的图形,所述黑矩阵与所述公共电极连接。 [0089] Step 2, a pattern including a common electrode and a black matrix on the substrate of the previous step, the black matrix and the common electrode.

[0090] 本发明提供了一种FFS型TFT-IXD阵列基板制造方法,通过将黑矩阵图形形成在阵列基板上,且黑矩阵与公共电极连接,使黑矩阵不仅有效遮挡漏光区域,而且作为公共电极的连接总线,有效解决了现有结构生产成本高和公共电极延迟的技术缺陷。 [0090] The present invention provides an FFS type TFT-IXD array substrate manufacturing method, by the black matrix pattern is formed on the array substrate, and a black matrix and a common electrode connected to the black matrix blocking light leakage area is not only effective, but also as a public electrodes connected to a bus, an effective solution to the existing structures of high production costs and technical drawbacks common electrode delay. 由于在阵列基板上制备黑矩阵图形可以采用现有工艺设备和工艺流程,不需要增加额外的生产设备, 同时减少了在彩膜基板上制备黑矩阵图形的设备和工艺,因此本发明有效降低了生产成本。 Since the preparation of the black matrix pattern on the array substrate may be employed conventional process equipment and process, no additional equipment, while reducing equipment and process for preparing the black matrix pattern on a color filter substrate, the present invention effectively reduces Cost of production.

[0091] 在图M所示技术方案中,步骤1具体包括: [0091] In the solution shown in FIG M, step 1 comprises:

[0092] 步骤11、在基板上沉积栅金属薄膜,通过构图工艺形成包括栅线和栅电极的图形; [0092] Step 11, depositing a gate metal film on a substrate, forming a pattern including a gate line and a gate electrode through a patterning process;

[0093] 步骤12、在完成前述步骤的基板上依次沉积栅绝缘层、半导体薄膜和掺杂半导体薄膜,通过构图工艺形成包括有源层的图形,有源层包括半导体层和掺杂半导体层,形成在栅绝缘层上并位于栅电极的上方; [0093] Step 12, the previous step on the substrate sequentially depositing a gate insulating layer, a semiconductor film and the doped semiconductor film, forming an active layer pattern, a semiconductor layer and an active layer comprising a doped semiconductor layer by a patterning process comprising, It is formed on the gate insulating layer above the gate electrode and the;

[0094] 步骤13、在完成前述步骤的基板上沉积透明导电薄膜,通过构图工艺形成包括像素电极的图形; [0094] Step 13, a transparent conductive thin film is deposited on the substrate after the step of forming a pattern including the pixel electrode through a patterning process;

[0095] 步骤14、在完成前述步骤的基板上沉积源漏金属薄膜,通过构图工艺形成包括数据线、源电极、漏电极和TFT沟道区域的图形,所述源电极的一端位于有源层上,另一端与数据线连接,所述漏电极的一端位于有源层上,另一端与像素电极直接连接,所述源电极与漏电极之间形成TFT沟道区域。 [0095] Step 14, the source drain metal film is deposited on the substrate in the previous step, is formed by a patterning process including a data line, the source electrode, the drain electrode and the channel region of the TFT pattern, the source electrode is located on one end of the active layer and the other end is connected to the data line, the drain electrode located on the end of the active layer, and the other end is directly connected to the pixel electrode, the TFT channel region formed between the source electrode and the drain electrode. [0096] 上述制备过程已在前述图4〜图13所示技术方案中详细介绍,这里不再赘述。 [0096] The preparation process is described in detail in the technical solution shown in FIG. 13 in FIG. 4 ~ omitted here.

[0097] 图25为本发明FFS型TFT-IXD阵列基板制造方法第一实施例的流程图,在图M 所示技术方案中,步骤2包括: [0097] FIG. 25 is a flowchart of the FFS type TFT-IXD array substrate manufacturing method of the first embodiment of the present invention, in the solution shown in FIG M, step 2 comprises:

[0098] 步骤211、在完成前述步骤的基板上沉积钝化层和透明导电薄膜,采用普通掩模板通过构图工艺形成包括公共电极的图形,所述公共电极为数个依次排列的电极条; [0098] Step 211 is deposited on the substrate after the step of passivation layer and a transparent conductive thin film, with a normal mask pattern includes a common electrode is formed through a patterning process, the common electrode several electrode strips arranged in a sequence;

[0099] 步骤212、在完成前述步骤的基板上沉积黑矩阵金属薄膜,采用普通掩模板通过构图工艺形成包括黑矩阵的图形,所述黑矩阵与公共电极连接。 [0099] Step 212 is deposited on the substrate after the step of the black matrix metal thin film, with a normal mask pattern comprises a black matrix formed by a patterning process, the black matrix and the common electrode.

[0100] 本实施例是一种采用二次构图工艺形成黑矩阵和公共电极图形的技术方案,且黑矩阵位于公共电极上方,该制备过程已在前述图14〜图16所示技术方案中详细介绍。 [0100] The present embodiment is an embodiment using the second patterning process for forming a black matrix and a common electrode pattern aspect, a black matrix and a common electrode located above, the preparation process is the solution shown in detail in FIG. 16 of the preceding figures 14~ introduction.

[0101] 图沈为本发明FFS型TFT-IXD阵列基板制造方法第二实施例的流程图,在图M 所示技术方案中,步骤2包括: : [0101] FIG sink flowchart of a second embodiment of the present embodiment of the FFS type TFT-IXD of the method of manufacturing the array substrate shown in FIG M aspect, the invention includes the step 2,

[0102] 步骤221、在完成前述步骤的基板上首先沉积钝化层,然后连续沉积透明导电薄膜和黑矩阵金属薄膜; [0102] Step 221, on the substrate of the previous step is first passivation layer is deposited, and then depositing a continuous transparent conductive thin film and the metal thin film black matrix;

[0103] 步骤222、在黑矩阵金属薄膜上涂覆一层光刻胶; [0103] Step 222, the metal thin film on the black matrix layer of photoresist is coated;

[0104] 步骤223、采用半色调或灰色调掩模板对光刻胶进行曝光,显影后使光刻胶形成光刻胶完全保留区域,光刻胶完全去除区域和光刻胶部分保留区域;其中光刻胶完全保留区域对应于黑矩阵图形所在区域,光刻胶部分保留区域对应于公共电极图形所在区域,光刻胶完全去除区域对应于上述图形以外的区域; [0104] Step 223, using the gray-tone or half-tone mask for exposing photoresist, the photoresist after development to form a photoresist completely-retained region, the photoresist is completely removed and a photoresist portion reserved area region; wherein photoresist completely-retained region corresponding to the black matrix pattern area, part of the photoresist corresponding to the area reserved region where the common electrode pattern, the photoresist is completely removed outside the region corresponding to the pattern of the region;

[0105] 步骤224、通过第一次刻蚀工艺刻蚀掉光刻胶完全去除区域的黑矩阵金属薄膜和透明导电薄膜,形成包括黑矩阵的图形; [0105] Step 224, by a first etching process to etch away the photoresist film is completely removed and the metal black matrix region of the transparent conductive film, comprising forming a black matrix pattern;

[0106] 步骤225、通过灰化工艺去除光刻胶部分保留区域的光刻胶,暴露出该区域的黑矩阵金属薄膜; [0106] Step 225, the photoresist is removed portion of the photoresist region is retained by an ashing process to expose the metal thin film of the black matrix region;

[0107] 步骤226、通过第二次刻蚀工艺完全刻蚀掉光刻胶部分保留区域的黑矩阵金属薄膜,形成包括公共电极的图形; [0107] Step 226, by a second etching process etched away portions of the black matrix metal thin film photoresist reserved areas, including a common electrode pattern is formed;

[0108] 步骤227、剥离剩余的光刻胶。 [0108] Step 227, the remaining photoresist is stripped.

[0109] 本实施例是一种采用一次构图工艺同时形成黑矩阵和公共电极图形的技术方案, 且黑矩阵位于公共电极上方,该制备过程已在前述图17〜图20所示技术方案中详细介绍。 [0109] The present embodiment is a patterning process simultaneously formed using a black matrix and a common electrode pattern aspect, a black matrix and a common electrode located above, the preparation process is the solution shown in the detail in FIG. 17~ 20 introduction.

[0110] 图27为本发明FFS型TFT-IXD阵列基板制造方法第三实施例的流程图,在图M 所示技术方案中,步骤2包括: : [0110] FIG 27 a flow chart of the FFS type TFT-IXD array substrate manufacturing method of the third embodiment shown in FIG M aspect, the present invention comprises a step 2,

[0111] 步骤231、在完成前述步骤的基板上沉积钝化层和黑矩阵金属薄膜,采用普通掩模板通过构图工艺形成包括黑矩阵的图形; [0111] Step 231, the black matrix and the passivation layer is deposited metal film on the substrate of the previous step, with a normal mask pattern comprises a black matrix formed by a patterning process;

[0112] 步骤232、在完成前述步骤的基板上沉积透明导电薄膜,采用普通掩模板通过构图工艺形成包括公共电极的图形,所述公共电极为数个依次排列的电极条,所述公共电极与黑矩阵连接。 [0112] Step 232 is deposited on the substrate after the step of transparent conductive thin film, with a normal mask pattern includes a common electrode is formed through a patterning process, the common electrode several electrode strips arranged in a sequence, the common electrode and the black matrix connections.

[0113] 本实施例是一种采用二次构图工艺形成黑矩阵和公共电极图形的技术方案,且公共电极位于黑矩阵上方。 [0113] The present embodiment is an embodiment using the second patterning process for forming a black matrix and a common electrode pattern technical solution, and the common electrode is positioned above the black matrix.

[0114] 在前述实施例技术方案基础上,由于本发明黑矩阵为金属材料,为防止黑矩阵产生的光反射,可以在步骤2之后增加在黑矩阵表面涂覆一层防反射层的步骤。 [0114] On the basis of the technical solution of the embodiment, since the black matrix of the present invention is a metal material, to prevent reflection of light produced by the black matrix, one can increase the anti-reflection layer on the black matrix surface coating step after step 2.

[0115] 最后应说明的是:以上发明仅用以说明本发明的技术方案而非限制,尽管参照较佳发明对本发明进行了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的精神和范围。 [0115] Finally, it should be noted that: The above invention is intended to illustrate and not limit the present invention, although the present invention has been described in detail with reference to the preferred invention, those of ordinary skill in the art should be understood that the techniques of the present invention program modifications or equivalent replacements without departing from the spirit and scope of the technical solutions of the present invention.

Claims (12)

1. 一种FFS型TFT-IXD阵列基板,包括形成在基板上并限定了像素区域的栅线和数据线,所述像素区域内形成有像素电极、薄膜晶体管和与所述像素电极形成边缘电场的公共电极,其特征在于,还包括由金属薄膜材料制备的黑矩阵,所述黑矩阵与所述公共电极连接;其中,所述薄膜晶体管包括栅电极、有源层、源电极和漏电极,所述栅电极与栅线连接, 并形成在基板上;栅绝缘层形成在栅线和栅电极上并覆盖整个基板;包括半导体层和掺杂半导体层的有源层形成在栅绝缘层上并位于栅电极的上方;像素电极形成在栅绝缘层上并位于像素区域内;源电极的一端位于有源层上,另一端与数据线连接,漏电极的一端位于有源层上,另一端与像素电极连接,源电极与漏电极之间形成TFT沟道区域;钝化层形成在上述构图上并覆盖整个基板。 A FFS type TFT-IXD array substrate, comprising forming on a substrate and defines a pixel region of the gate lines and data lines, pixel electrodes are formed in the pixel region, a thin film transistor formed with the pixel electrode fringe electric field a common electrode, characterized by further comprising a black matrix produced from a metal thin film material, the black matrix and the common electrode; wherein the thin film transistor includes a gate electrode, an active layer, a source electrode and a drain electrode, the gate electrode and the gate line, and formed on the substrate; a gate insulating layer formed on the gate line and the gate electrode and covering the entire substrate; comprises a semiconductor layer and a doped semiconductor layer of the active layer is formed on the gate insulating layer and located above the gate electrode; a pixel electrode formed on the gate insulating layer and within the pixel region; a source electrode located on the end of the active layer, the data line and the other end connected to one end of the drain electrode located on the active layer, and the other end a pixel electrode connected to TFT channel region formed between the source electrode and the drain electrode; a passivation layer formed on the patterned and covers the entire substrate.
2.根据权利要求1所述的FFS型TFT-LCD阵列基板,其特征在于,所述公共电极为数个依次排列的电极条并形成在所述钝化层上,所述黑矩阵形成在上述构图上。 The FFS type TFT-LCD array substrate according to claim 1, wherein the common electrode are sequentially arranged in a number of electrode strips and is formed on the passivation layer, the black matrix formed in the patterning on.
3.根据权利要求2所述的FFS型TFT-LCD阵列基板,其特征在于,所述公共电极和黑矩阵由采用普通掩模板的二次构图工艺或采用半色调或灰色调掩模板的一次构图工艺形成。 The FFS type TFT-LCD array substrate according to claim 2, wherein the common electrode and the black matrix by the second patterning process using a common mask or patterning using a half-tone or gray-tone mask of processes.
4.根据权利要求1所述的FFS型TFT-LCD阵列基板,其特征在于,所述黑矩阵形成在所述钝化层上,所述公共电极为数个依次排列的电极条并形成在上述构图上。 The FFS type TFT-LCD array substrate according to claim 1, wherein the black matrix is ​​formed on the passivation layer, said common electrode is a stripe electrode several sequentially arranged and formed in the patterning on.
5.根据权利要求4所述的FFS型TFT-LCD阵列基板,其特征在于,所述黑矩阵和公共电极由采用普通掩模板的二次构图工艺形成。 The FFS type TFT-LCD array substrate according to claim 4, wherein said black matrix and a common electrode formed from a secondary patterning process using a normal mask.
6.根据权利要求1〜5中任一权利要求所述的FFS型TFT-LCD阵列基板,其特征在于, 所述黑矩阵位于所述栅线和/或数据线的上方。 6. FFS type TFT-LCD array substrate according to any one of claims 1 ~ 5 claim, wherein the black matrix is ​​positioned above the gate lines and / or data lines.
7.根据权利要求6所述的FFS型TFT-LCD阵列基板,其特征在于,所述黑矩阵位于所述薄膜晶体管的上方。 7. FFS type TFT-LCD array substrate according to claim 6, wherein the black matrix is ​​located above the thin film transistor.
8.根据权利要求6所述的FFS型TFT-LCD阵列基板,其特征在于,所述黑矩阵表面设置有防反射层。 8. The FFS type TFT-LCD array substrate according to claim 6, characterized in that the black matrix surface with an antireflection layer.
9. 一种FFS型TFT-IXD阵列基板制造方法,其特征在于,包括:在基板上形成包括栅线、数据线、像素电极和薄膜晶体管的图形;在完成前述步骤的基板上形成包括公共电极和黑矩阵的图形,所述黑矩阵与所述公共电极连接;其中,所述在基板上形成包括栅线、数据线、像素电极和薄膜晶体管的图形包括:在基板上沉积栅金属薄膜,通过构图工艺形成包括栅线和栅电极的图形;在完成前述步骤的基板上依次沉积栅绝缘层、半导体薄膜和掺杂半导体薄膜,通过构图工艺形成包括有源层的图形,有源层包括半导体层和掺杂半导体层,形成在栅绝缘层上并位于栅电极的上方;在完成前述步骤的基板上沉积透明导电薄膜,通过构图工艺形成包括像素电极的图形;在完成前述步骤的基板上沉积源漏金属薄膜,通过构图工艺形成包括数据线、源电极、 漏电极和TFT沟 A FFS type TFT-IXD array substrate manufacturing method, characterized by comprising: forming a pattern comprising the gate line, a data line, a pixel electrode and a thin film transistor on a substrate; forming a common electrode on a substrate comprising the previous step and the black matrix pattern, the black matrix and the common electrode; wherein said forming comprises a gate line on a substrate, the graphic data line, a pixel electrode and a thin film transistor comprising: depositing a gate metal film on a substrate, by patterning process comprises forming a pattern of a gate line and a gate electrode; on the substrate of the previous step sequentially depositing the gate insulating layer, a semiconductor film and the doped semiconductor film, forming an active layer pattern, a semiconductor layer including an active layer by a patterning process comprising and a doped semiconductor layer formed on the gate insulating layer and above the gate electrode; depositing a transparent conductive thin film on the substrate after the step of forming a pattern including the pixel electrode through a patterning process; deposition source on the substrate after the step of drain metal film, comprising forming a data line, a source electrode, a drain electrode by a patterning process and the TFT groove 区域的图形,所述源电极的一端位于有源层上,另一端与数据线连接,所述漏电极的一端位于有源层上,另一端与像素电极直接连接,所述源电极与漏电极之间形成TFT沟道区域。 Graphics area, located on one end of the source electrode on the active layer, and the other end is connected to the data line, the drain electrode located on the end of the active layer, and the other end is directly connected to the pixel electrode, the source electrode and the drain electrode a channel region formed between the TFT.
10.根据权利要求9所述的FFS型TFT-LCD阵列基板制造方法,其特征在于,所述形成包括公共电极和黑矩阵的图形包括:在完成前述步骤的基板上沉积钝化层和透明导电薄膜,采用普通掩模板通过构图工艺形成包括公共电极的图形,所述公共电极为数个依次排列的电极条;在完成前述步骤的基板上沉积黑矩阵金属薄膜,采用普通掩模板通过构图工艺形成包括黑矩阵的图形,所述黑矩阵与公共电极连接。 10. FFS type TFT-LCD array substrate manufacturing method according to claim 9, wherein the pattern includes a common electrode and forming the black matrix comprising: depositing a passivation layer and a transparent conductive substrate on completion of the previous step It is formed by a patterning process comprising depositing a metal black matrix film on the substrate of the previous step, using a common mask; film, using a common mask pattern is formed by a patterning process includes a common electrode, the common electrode several electrode strips arranged in a sequence pattern of black matrix, the black matrix is ​​connected to the common electrode.
11.根据权利要求9所述的FFS型TFT-LCD阵列基板制造方法,其特征在于,所述形成包括公共电极和黑矩阵的图形包括:在完成前述步骤的基板上首先沉积钝化层,然后连续沉积透明导电薄膜和黑矩阵金属薄膜;在黑矩阵金属薄膜上涂覆一层光刻胶;采用半色调或灰色调掩模板对光刻胶进行曝光,显影后使光刻胶形成光刻胶完全保留区域、光刻胶完全去除区域和光刻胶部分保留区域;其中光刻胶完全保留区域对应于黑矩阵图形所在区域,光刻胶部分保留区域对应于公共电极图形所在区域,光刻胶完全去除区域对应于上述图形以外的区域;通过第一次刻蚀工艺刻蚀掉光刻胶完全去除区域的黑矩阵金属薄膜和透明导电薄膜, 形成包括黑矩阵的图形;通过灰化工艺去除光刻胶部分保留区域的光刻胶,暴露出该区域的黑矩阵金属薄膜;通过第二次刻蚀工艺完全刻 11. FFS type TFT-LCD array substrate manufacturing method according to claim 9, wherein the pattern includes a common electrode and forming the black matrix comprises: on the substrate after the step of depositing a first passivation layer, and then continuously depositing a transparent conductive thin film and the metal thin film black matrix; metal thin film on the black matrix layer of photoresist is coated; semi-tone mask or a gray-tone photoresist is exposed after development of the photoresist to form a photoresist completely-retained region, the photoresist is completely removed and a photoresist portion reserved area region; wherein the photoresist region corresponding to the completely-retained area black matrix pattern, the photoresist region corresponding to the portion retained area common electrode pattern, the photoresist completely removed region corresponds to a region other than the pattern; the photoresist is completely removed out of the black matrix and a transparent conductive metal thin film region by etching the first etching process, forming a black matrix pattern comprises; removing light by an ashing process engraved rubber section retained regions of the photoresist, exposing the black matrix region of the metal thin film; cut entirely by a second etching process 掉光刻胶部分保留区域的黑矩阵金属薄膜,形成包括公共电极的图形;剥离剩余的光刻胶。 The photoresist region out of the black matrix portion to retain the metal thin film, comprising forming a common electrode pattern; stripping of the remaining photoresist.
12.根据权利要求9所述的FFS型TFT-LCD阵列基板制造方法,其特征在于,所述形成包括公共电极和黑矩阵的图形包括:在完成前述步骤的基板上沉积钝化层和黑矩阵金属薄膜,采用普通掩模板通过构图工艺形成包括黑矩阵的图形;在完成前述步骤的基板上沉积透明导电薄膜,采用普通掩模板通过构图工艺形成包括公共电极的图形,所述公共电极为数个依次排列的电极条,所述公共电极与黑矩阵连接。 12. FFS type TFT-LCD array substrate manufacturing method according to claim 9, wherein the pattern includes a common electrode and forming the black matrix comprises: depositing on the substrate after the step of passivation layer and the black matrix a metal thin film, with a normal mask pattern comprises a black matrix formed by a patterning process; depositing a transparent conductive film on the substrate of the previous step, with a normal mask pattern includes a common electrode is formed through a patterning process, the common electrode sequentially into several electrode strips arranged in the common electrode is connected to the black matrix.
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