CN102011942A - LED encapsulation structure - Google Patents
LED encapsulation structure Download PDFInfo
- Publication number
- CN102011942A CN102011942A CN2009100186620A CN200910018662A CN102011942A CN 102011942 A CN102011942 A CN 102011942A CN 2009100186620 A CN2009100186620 A CN 2009100186620A CN 200910018662 A CN200910018662 A CN 200910018662A CN 102011942 A CN102011942 A CN 102011942A
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- frame body
- led
- electrode
- wafer
- encapsulation structure
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Abstract
The invention provides a light emitting diode (LED) encapsulation structure. The structure is characterized by comprising a frame body made of metal, wherein threads for mounting and fixing are formed on the outer circumference of the frame body; a pit for accommodating a wafer is formed on the top of the frame body; the wall of the pit forms a reflecting surface; an electrode with an insulating layer is fixed inside the frame body; and the upper end of the electrode is connected with the wafer, and the lower end of the electrode is positioned outside the frame body to serve as a lead wire. The LED encapsulation structure has the advantages of good heat radiation effect, long service life and high lighting effect; and the preparation process of the structure is easy to operate, and has high reliability. The whole encapsulation structure is encapsulated by metals, and the encapsulated LED is directly arranged on an aluminum substrate and other metal substrates, LED street lamp metal plates/printed circuit boards (PCB) and the like through the threads on the outer circumference of the frame body, and can better radiate heat. The electrode lead wire is covered, so the structure has an attractive appearance.
Description
(1) technical field
The present invention relates to LED, particularly a kind of LED encapsulating structure.
(2) background technology
At present, existing LED encapsulating structure heat dispersion is not good, has shortened its service life, adds shortcomings such as complicated, that profile is attractive in appearance inadequately are installed, and impels a kind of more senior LED encapsulating structure of people's exploratory development.
(3) summary of the invention
The present invention is in order to remedy the deficiencies in the prior art, and the LED encapsulating structure of a kind of perfect heat-dissipating, easy for installation, good looking appearance is provided.
The present invention is achieved through the following technical solutions:
LED encapsulating structure of the present invention, its special character is: comprise metal frame body, the outer circumference surface of frame body is provided with the screw thread that is used to install and fix,. the top of frame body is provided with the pit of built-in wafer, the hole wall of pit constitutes reflecting surface, the internal fixation of frame body has the electrode of tape insulation layer, electrode upper end connecting wafer, and it is outer as lead-in wire that the lower end is positioned at frame body.
The invention has the beneficial effects as follows, good heat dissipation, long service life, light efficiency height, and its preparation technology's operation is simple relatively, reliability is high.This encapsulating structure all adopts Metal Packaging to become, and the screw thread of the LED after the encapsulation by the frame body excircle can directly install on the metal substrate such as aluminium base, and LED street lamp metal polar plate/pcb board etc., can better dispel the heat.Contact conductor is covered, good looking appearance.
(4) description of drawings
Fig. 1 is a vertical section of the present invention schematic diagram.Fig. 2 is the schematic top plan view of Fig. 1.
Among the figure, 1 lead-in wire, 2 insulating barriers, 3 insulating barriers, 4 frame bodies, 5 reflectings surface, 6 screw threads, 7 pits.
(5) specific embodiment
Accompanying drawing is a kind of specific embodiment of the present invention.
LED encapsulating structure of the present invention, comprise metal frame body 4, the outer circumference surface of frame body is provided with the screw thread 6 that is used to install and fix,. the top of frame body is provided with the pit 7 of built-in wafer, the hole wall of pit constitutes reflecting surface 5, the internal fixation of frame body has the electrode of tape insulation layer 2,3, electrode upper end connecting wafer, and it is outer as lead-in wire 1 that the lower end is positioned at frame body.
LED encapsulating structure of the present invention, lead-in wire 1 is two or more; The insulating barrier 2 general high temperature setting glues that use; Insulating barrier 3 general polytetrafluoroethylene (PTFE) or the nylon of using; Frame body uses metal materials such as red copper, brass, aluminium; Reflecting surface requires design according to LED optics.This LED encapsulating structure surface is a metal, with LED wafer contact-making surface be metal; The fixing full screw thread by self of this LED encapsulating structure is finished, and has adopted thread forms to be connected with heat dispersion heat sink, directly can heat conduction; The bolt end face is placed the outer lead electrode, and lead goes between below in the above, is convenient to wiring, installation and covering contact conductor, increases the aesthetic property of light fixture; Can directly be encapsulated on aluminium or other metal substrate, form a plurality of LED group encapsulates; Except that lead wire insulation, framework all adopts metal to make.
This LED encapsulating structure, the frame body electroplate is to obtain technological feasibility and reverberation requirement.Also can be in the chip placed side, lead-in wire upper end and reflecting surface be silver-plated, coating such as other plating nickel on surface or other are anti-oxidation, corrosion.Except that necessary electrode dielectric layer, all constitute, so be called accurate all-metal great power LED framework by metal.
Claims (1)
1. LED encapsulating structure, it is characterized in that: comprise metal frame body (4), the outer circumference surface of frame body is provided with the screw thread (6) that is used to install and fix,. the top of frame body is provided with the pit of built-in wafer (7), the hole wall of pit constitutes reflecting surface (5), the internal fixation of frame body has the electrode of tape insulation layer (2), (3), electrode upper end connecting wafer, and it is outer as lead-in wire (1) that the lower end is positioned at frame body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100186620A CN102011942A (en) | 2009-09-09 | 2009-09-09 | LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100186620A CN102011942A (en) | 2009-09-09 | 2009-09-09 | LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102011942A true CN102011942A (en) | 2011-04-13 |
Family
ID=43842218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100186620A Pending CN102011942A (en) | 2009-09-09 | 2009-09-09 | LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102011942A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103883918A (en) * | 2012-12-20 | 2014-06-25 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode light source device and lamp bar with same |
| CN104995504A (en) * | 2013-02-15 | 2015-10-21 | 株式会社岛津制作所 | Discharge ionization current detector |
-
2009
- 2009-09-09 CN CN2009100186620A patent/CN102011942A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103883918A (en) * | 2012-12-20 | 2014-06-25 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode light source device and lamp bar with same |
| CN104995504A (en) * | 2013-02-15 | 2015-10-21 | 株式会社岛津制作所 | Discharge ionization current detector |
| CN104995504B (en) * | 2013-02-15 | 2017-10-13 | 株式会社岛津制作所 | Discharge Ionization Current Detector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110413 |