CN101996986B - 色温可调的白光发光二极管封装物 - Google Patents
色温可调的白光发光二极管封装物 Download PDFInfo
- Publication number
- CN101996986B CN101996986B CN2010100045945A CN201010004594A CN101996986B CN 101996986 B CN101996986 B CN 101996986B CN 2010100045945 A CN2010100045945 A CN 2010100045945A CN 201010004594 A CN201010004594 A CN 201010004594A CN 101996986 B CN101996986 B CN 101996986B
- Authority
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- China
- Prior art keywords
- light
- emitting diode
- white light
- colour temperature
- blue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 239000008393 encapsulating agent Substances 0.000 claims description 48
- 238000004806 packaging method and process Methods 0.000 claims description 35
- 238000000576 coating method Methods 0.000 claims description 34
- 239000011248 coating agent Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 26
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- 241001025261 Neoraja caerulea Species 0.000 description 52
- 230000002596 correlated effect Effects 0.000 description 10
- 230000005457 Black-body radiation Effects 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
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- 238000002474 experimental method Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GCAAQROFKRZNKT-UHFFFAOYSA-N [Tb].[Ce] Chemical compound [Tb].[Ce] GCAAQROFKRZNKT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/540,145 | 2009-08-12 | ||
US12/540,145 US20110037081A1 (en) | 2009-08-12 | 2009-08-12 | White light-emitting diode packages with tunable color temperature |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101996986A CN101996986A (zh) | 2011-03-30 |
CN101996986B true CN101996986B (zh) | 2012-10-24 |
Family
ID=43588072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010100045945A Expired - Fee Related CN101996986B (zh) | 2009-08-12 | 2010-01-19 | 色温可调的白光发光二极管封装物 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110037081A1 (zh) |
CN (1) | CN101996986B (zh) |
TW (1) | TW201106460A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105679916A (zh) * | 2015-12-24 | 2016-06-15 | 中山大学 | 一种色温可调发光装置 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384654B (zh) * | 2009-07-31 | 2013-02-01 | Univ Nat Taiwan Science Tech | 色溫可調之白光發光裝置 |
US20120081033A1 (en) * | 2010-10-01 | 2012-04-05 | Edison Opto Corporation | White light emitting diode |
TWI476961B (zh) * | 2010-10-12 | 2015-03-11 | 友達光電股份有限公司 | 發光二極體裝置 |
CN102734647B (zh) * | 2011-04-01 | 2015-07-29 | 亿光电子(中国)有限公司 | 白光照明系统 |
US8552439B2 (en) * | 2011-04-07 | 2013-10-08 | Himax Display, Inc. | Light-emitting diode package |
JP5373859B2 (ja) * | 2011-07-05 | 2013-12-18 | デクセリアルズ株式会社 | 照明装置 |
CN202384331U (zh) * | 2011-10-09 | 2012-08-15 | 九江正展光电有限公司 | 混光发光二极管封装结构 |
TW201318222A (zh) * | 2011-10-27 | 2013-05-01 | Hon Hai Prec Ind Co Ltd | 發光二極體裝置 |
CN103094263A (zh) * | 2011-10-28 | 2013-05-08 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管装置 |
TWI508332B (zh) * | 2011-11-09 | 2015-11-11 | Au Optronics Corp | 發光光源及其顯示面板 |
CN103367597A (zh) * | 2012-03-29 | 2013-10-23 | 常熟卓辉光电科技有限公司 | 一种led光源 |
CN103545300B (zh) * | 2012-07-09 | 2016-07-06 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
JP6098010B2 (ja) * | 2013-02-07 | 2017-03-22 | 徳島県 | 家禽飼育方法 |
KR102112638B1 (ko) * | 2014-02-07 | 2020-05-19 | 삼성디스플레이 주식회사 | 표시 장치 |
JP2016219519A (ja) * | 2015-05-18 | 2016-12-22 | サンケン電気株式会社 | 発光装置 |
DE202015105686U1 (de) * | 2015-10-26 | 2017-01-27 | Tridonic Gmbh & Co Kg | Weißes Licht abstrahlendes LED-Modul |
US9560714B1 (en) | 2016-02-25 | 2017-01-31 | Morten Hjerde | Color temperature adjustable, LED based, white light source |
JP6917179B2 (ja) * | 2017-04-18 | 2021-08-11 | スタンレー電気株式会社 | 白色発光装置 |
CN110556054A (zh) * | 2018-05-31 | 2019-12-10 | 青岛海信电器股份有限公司 | 柔性Micro LED显示装置 |
TWI692865B (zh) * | 2018-11-21 | 2020-05-01 | 友達光電股份有限公司 | 顯示裝置 |
HUE063704T2 (hu) * | 2019-01-21 | 2024-01-28 | Signify Holding Bv | Hangolható színû izzólámpa |
CN113497012B (zh) * | 2020-03-20 | 2024-02-23 | 海迪科(南通)光电科技有限公司 | 一种类太阳光谱封装结构及其制备方法 |
CN111653555A (zh) * | 2020-05-25 | 2020-09-11 | 中山市木林森电子有限公司 | 一种全光谱led光源及其制作方法 |
CN114607983A (zh) * | 2022-03-11 | 2022-06-10 | 厦门普为光电科技有限公司 | 具高显色性的照明装置及提升照明装置显色性的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2696134Y (zh) * | 2004-05-24 | 2005-04-27 | 葛世潮 | 色温可调的白光发光二极管 |
CN101482235A (zh) * | 2009-01-22 | 2009-07-15 | 深圳市聚飞光电有限公司 | 色温可调整的高显色led灯及其制造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
-
2009
- 2009-08-12 US US12/540,145 patent/US20110037081A1/en not_active Abandoned
-
2010
- 2010-01-07 TW TW099100229A patent/TW201106460A/zh unknown
- 2010-01-19 CN CN2010100045945A patent/CN101996986B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2696134Y (zh) * | 2004-05-24 | 2005-04-27 | 葛世潮 | 色温可调的白光发光二极管 |
CN101482235A (zh) * | 2009-01-22 | 2009-07-15 | 深圳市聚飞光电有限公司 | 色温可调整的高显色led灯及其制造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105679916A (zh) * | 2015-12-24 | 2016-06-15 | 中山大学 | 一种色温可调发光装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101996986A (zh) | 2011-03-30 |
US20110037081A1 (en) | 2011-02-17 |
TW201106460A (en) | 2011-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CI01 | Correction of invention patent gazette |
Correction item: First inventor Correct: Guo Wuzheng False: Guo Wuquan Number: 43 Volume: 28 |
|
CI03 | Correction of invention patent |
Correction item: First inventor Correct: Guo Wuzheng False: Guo Wuquan Number: 43 Page: The title page Volume: 28 |
|
ERR | Gazette correction |
Free format text: CORRECT: THE FIRST INVENTOR; FROM: GUO WUQUAN TO: GUO WUZHENG |
|
RECT | Rectification | ||
ASS | Succession or assignment of patent right |
Owner name: XUMING PHOTOELECTRICITY INC. Effective date: 20131230 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131230 Address after: Hsinchu City, Taiwan, China Patentee after: Caiyu Science-Technology Co., Ltd. Patentee after: Xuming Photoelectricity Inc. Address before: Hsinchu City, Taiwan, China Patentee before: Caiyu Science-Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121024 Termination date: 20170119 |