CN101984371A - Method for reducing electrocorrosion of liquid crystal display module - Google Patents
Method for reducing electrocorrosion of liquid crystal display module Download PDFInfo
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- CN101984371A CN101984371A CN 201010261857 CN201010261857A CN101984371A CN 101984371 A CN101984371 A CN 101984371A CN 201010261857 CN201010261857 CN 201010261857 CN 201010261857 A CN201010261857 A CN 201010261857A CN 101984371 A CN101984371 A CN 101984371A
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Abstract
The invention provides a method for reducing the electrocorrosion of a liquid crystal display (LCD) module. The invention aims to solve the defect that the display of the existing LCD module is often broken. The method specifically comprises the following steps: binding a chip on the surface of a step formed by the upper and lower substrates of an LCD; then preparing a coating layer with ultraviolet curing glue on the surface of the chip and the surface close to the chip, of the indium tin oxide electric lead, curing the coating layer; and encapsulating the obtained LCD module. The method of the invention utilizes the step formed by the upper and lower substrates of the LCD module to specially prepare one coating layer so that the possibility that water vapor and ions enter from the surface of glass and contact with the indium tin oxide electric lead is reduced; and the ultraviolet curing glue with short curing time, good compactability and low hygroscopicity is selected, thus effectively reducing the possibility of electrocorrosion of the LCD module in the encapsulating and using processes and increasing the yield and reliability of the LCD modules obtained by batch production.
Description
Technical field
The present invention relates to a kind of production method of LCD, relate in particular to the production method of the liquid crystal display module in a kind of LCD.
Background technology
Monochrome liquid crystal display module [LCM-Liquid Crystal Display Module], usually fixed on the surface that is positioned at low substrate of LCD device 2 with chip 3 by direct nation, be on the step surface 21 shown in Figure 1, and the mode that is electrically connected with conductive lead wire 5 realizations encapsulates, it is COG-Chip on Glass packaged type, chip 3 is connected with flexible circuit board (being called for short FPC) 7, specifically sees figures.1.and.2.Aforementioned conductive lead wire 5 is generally formed by metal indium-stannic oxide [ITO].The COG packaged type can reduce the volume of whole liquid crystal display device module greatly, and be easy to produce in enormous quantities, be particularly useful for the LCD [LCD-Liquid Crystal Display] that consumer electronics product is used, as portable type electronic products such as mobile phone, PDA, and will be the main connected mode of chip and LCD from now on.
The liquid crystal display device module of above-mentioned mode of production gained and LCD in use the phenomenon that displaying contents lacks stroke occurs through regular meeting, make the defective products rate improve, or reliability of products descend.
Existing applicant finds that the immediate cause that above-mentioned phenomenon occurs is: tin indium oxide conductive lead wire 5 is in encapsulation and use; often having corrosion phenomenon takes place; cause tin indium oxide conductive lead wire broken string; thereby the defective products rate occurring improves or reliability decrease; aforementioned defective products rate is generally: about 1%～5%, and along with the product passing of service time, bad phenomenon can not stop to occur; bad ratio also can be more and more higher, and therefore the many factories in the industry lose huge.
Further analyze; this corrosion is actually electrocorrosion; as the liquid crystal display device module and the lcd products of aforementioned technology encapsulation are done hot and humid experiment: will show that normal LCM powers up driving; the chip 3 tin indium oxide conductive lead wire on every side that is positioned at glass surface does not apply any glue-line; promptly do not do any protection; after LCM energising shows, under 60 ℃, 90%RH environmental baseline, do the environmental reliability test.Find in the test phenomenon that opens circuit to have occurred showing at experience a period of time sample.The product that this demonstration is opened circuit is examined under a microscope, find that the phenomenon of galvanic corrosion in various degree appears in the tin indium oxide conductive lead wire that is connected with chip around the chip 3, and idol has the phenomenon of broken string to occur, Fig. 3 is the conductive lead wire galvanic corrosion picture of examining under a microscope, Fig. 4 is the electrocorrosion synoptic diagram, occurs lead-in wire fracture 9 on partial oxidation indium tin conductive lead wire 5.
The mechanism of production of above-mentioned electrocorrosion phenomenon is: the tin indium oxide conductive lead wire belongs to the conductive lead wire that Sn mixes, and Sn and oxygen room have good electric conductivity as alms giver's N type oxide semiconductor; The distance between centers of tracks that each conductive lead wire of tin indium oxide is adjacent is very little, usually between 0.01mm～0.03mm; And liquid crystal display device module of producing with the COG packaged type and lcd products are in process of production, because the tin indium oxide conductive lead wire around the chip is to expose in the external world, be easy to suffer the pollution of ion, in addition, the relative humidity on tin indium oxide conductive lead wire surface is generally also non-constant, and the surface is planar water steam easily.And liquid crystal display device module and lcd products are in procedure for displaying, can there be voltage difference on two adjacent tin indium oxide conductive lead wires, if have moisture content and ion to exist between the conductive lead wire, will be under effect of electric field, produce faint electric current, thereby make tin indium oxide conductive lead wire generation redox reaction, so just cause the generation of electrocorrosion phenomenon especially easily.
In the technology of the existing liquid crystal display device module of producing with the COG packaged type; though use glue is also arranged; but has only the report that uses silica gel; because the silica gel permeability rate is high; it is just kept apart dust and product, water vapor and product can not be kept apart, thereby not reach protection at the special anti-electrocorrosion of the tin indium oxide conductive lead wire of chip and chip periphery; when therefore producing in batches, the quality of product is difficult to control.
Summary of the invention
The purpose of this invention is to provide a kind of method that reduces the electrocorrosion of liquid crystal display module, be intended to solve in production of existing liquid crystal display module or the use, electrocorrosion takes place easily, cause product the defective that opens circuit often to occur showing.
The present invention is achieved in that a kind of method that reduces the electrocorrosion of liquid crystal display module, specifically comprises the following steps:
1.1 chip nation is fixed on the ledge surface that is positioned at the formation of LCD upper and lower base plate;
It is characterized in that:
1.2 on described chip and tin indium oxide conductive lead wire surface on every side thereof, use ultraviolet curing glue, make a coating film layer;
1.3 in 5～120 minutes time, the described rete that is coated with is solidified;
1.4 the liquid crystal display module of encapsulation gained.
Further, for improving the effect of anti-electrocorrosion, in step 1.2, the water-intake rate of selected ultraviolet curing glue should be less than 2.5%, the specific insulation after solidifying should be greater than 3E+15 ohmcm, hardness less than 100 Shao Shi D; In step 1.3, make after the described curing to be coated with that thicknesses of layers is controlled at be in 0.1～3mm millimeter.
The method of reduction liquid crystal display module provided by the present invention electrocorrosion, because the step that utilizes liquid crystal display module upper and lower base plate to form, chip after nation is fixed and tin indium oxide conductive lead wire surface on every side thereof, made a coating film layer immediately targetedly separately, reduce the chance that enters of water vapour and ion, especially select for use set time short, compactness is good, the ultraviolet curing glue that water absorptivity is low, can effectively reduce the liquid crystal display module in encapsulation, the chance of electrocorrosion takes place in the use, thereby improves the yield rate and the reliability of the liquid crystal display module of producing in batches.
Description of drawings
Fig. 1 is existing liquid crystal display device module vertical section structure synoptic diagram;
Fig. 2 is existing liquid crystal display device module cross-sectional structure synoptic diagram;
Fig. 3 is existing liquid crystal display device module tin indium oxide conductive lead wire electrocorrosion displaing micro picture;
Fig. 4 is existing liquid crystal display device module tin indium oxide conductive lead wire electrocorrosion synoptic diagram;
Fig. 5 is a liquid crystal display device module vertical section structure synoptic diagram of the present invention;
Fig. 6 is the method for making technological process sketch of liquid crystal display device module of the present invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Referring to Fig. 5 and Fig. 6, the method for reduction liquid crystal display module provided by the invention electrocorrosion specifically comprises the following steps:
At first chip 3 nations are fixed on the ledge surface 21 that is positioned at LCD upper substrate 1, infrabasal plate 2 formation; Chip after again nation being decided and tin indium oxide conductive lead wire surface on every side thereof, use set time short, compactness is good, the ultraviolet curing glue that water absorptivity is low, such as: the A-202 type ultraviolet curing glue that can directly select Japanese ponding company for use, make a coating film layer 6 separately, this is coated with rete and is coated in chip and tin indium oxide conductive lead wire surface on every side thereof, avoid or reduce the chance that impurity such as steam, ion enters in the liquid crystal display module made, the LCD use, the qualities such as reliability of manufactured goods are provided;
The principle of work of ultraviolet curing glue is: the light trigger in the glue (photosensitizer) absorbs ultraviolet under ultraviolet irradiation after, produce living radical or kation, trigger monomer polymerization, molecule crosslinked and connect Zhi Huaxue reaction, it is solid-state that bonding agent is converted into by liquid state in the several seconds kind.The present invention makes full use of the feature performance benefit of ultraviolet curing glue: promptly quick solidifying, pollution-free, with the bonding strength height of glass, good weatherability, for a long time use not flavescence, compactness is good, water permeability is low.
Aforementioned making is coated with the process of rete and also should tries one's best fast, generally should the described rete that is coated be solidified in 5～120 minutes time; And then row is with the liquid crystal display module of common packaging technology encapsulation gained.
In the practice, as the water-intake rate of selected ultraviolet curing glue specific insulation less than 2.5%, after solidifying greater than 3E+15 ohmcm, hardness during less than 100 Shao Shi D, in the batch process of liquid crystal display device module of producing with the COG packaged type and lcd products, the bad ratio of product can reduce significantly, and fraction defective can be controlled in 0.01%; After the curing to be coated with that thicknesses of layers generally is controlled at be in 0.1～3 millimeter, product reliability in use also is able to obvious raising.
Claims (3)
1. a method that reduces the electrocorrosion of liquid crystal display module specifically comprises the following steps:
1.1 chip nation is fixed on the ledge surface that is positioned at the formation of LCD upper and lower base plate;
It is characterized in that:
1.2 on described chip and tin indium oxide conductive lead wire surface on every side thereof, use ultraviolet curing glue, make a coating film layer;
1.3 in 5 minutes～120 minutes clock times, the described rete that is coated with is solidified;
1.4 the liquid crystal display module of encapsulation gained.
2. the method for reduction liquid crystal display module according to claim 1 electrocorrosion, it is characterized in that: in step 1.2, the water-intake rate of described ultraviolet curing glue should be less than 2.5%, the specific insulation after solidifying should be greater than 3E+15 ohm cubic centimetre, hardness greater than 60 Shao Shi D.
3. the method for reduction liquid crystal display module according to claim 1 electrocorrosion is characterized in that: in step 1.3, the thicknesses of layers that is coated with after the described curing is 0.1～3 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102618570A CN101984371B (en) | 2010-08-24 | 2010-08-24 | Method for reducing electric corrosion of liquid crystal display module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102618570A CN101984371B (en) | 2010-08-24 | 2010-08-24 | Method for reducing electric corrosion of liquid crystal display module |
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| Publication Number | Publication Date |
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| CN101984371A true CN101984371A (en) | 2011-03-09 |
| CN101984371B CN101984371B (en) | 2012-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102618570A Expired - Fee Related CN101984371B (en) | 2010-08-24 | 2010-08-24 | Method for reducing electric corrosion of liquid crystal display module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407428A (en) * | 2018-12-29 | 2019-03-01 | 武汉华星光电技术有限公司 | Display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07188593A (en) * | 1993-12-27 | 1995-07-25 | Fuji Titan Kogyo Kk | Electrically-conductive coating material |
| CN1151027A (en) * | 1994-12-15 | 1997-06-04 | 夏普公司 | Liquid crystal display panel and liquid crystal display apparatus |
| CN1160864A (en) * | 1995-03-01 | 1997-10-01 | 松下电器产业株式会社 | Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display |
| US5978058A (en) * | 1997-08-22 | 1999-11-02 | Frontec Incorporated | Thin film transistor liquid crystal display with a silicide layer formed inside a contact hole and fabricating process therefor |
| CN1872931A (en) * | 2005-05-31 | 2006-12-06 | 北京联合钛得胶粘剂有限公司 | Ultraviolet solidified adhesive in use for sticking metal pin in liquid crystal display |
-
2010
- 2010-08-24 CN CN2010102618570A patent/CN101984371B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07188593A (en) * | 1993-12-27 | 1995-07-25 | Fuji Titan Kogyo Kk | Electrically-conductive coating material |
| CN1151027A (en) * | 1994-12-15 | 1997-06-04 | 夏普公司 | Liquid crystal display panel and liquid crystal display apparatus |
| CN1160864A (en) * | 1995-03-01 | 1997-10-01 | 松下电器产业株式会社 | Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display |
| US5978058A (en) * | 1997-08-22 | 1999-11-02 | Frontec Incorporated | Thin film transistor liquid crystal display with a silicide layer formed inside a contact hole and fabricating process therefor |
| CN1872931A (en) * | 2005-05-31 | 2006-12-06 | 北京联合钛得胶粘剂有限公司 | Ultraviolet solidified adhesive in use for sticking metal pin in liquid crystal display |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407428A (en) * | 2018-12-29 | 2019-03-01 | 武汉华星光电技术有限公司 | Display device |
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| CN101984371B (en) | 2012-05-30 |
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Owner name: HUANGSHAN CHINA DISPLAY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHINA SHENZHEN DISPLAY TECHNOLOGY CO., LTD. Effective date: 20141106 |
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