CN101979204A - Indirect-heating braze-welding method for packaging shell with thermal sensitive element - Google Patents
Indirect-heating braze-welding method for packaging shell with thermal sensitive element Download PDFInfo
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- CN101979204A CN101979204A CN 201010528022 CN201010528022A CN101979204A CN 101979204 A CN101979204 A CN 101979204A CN 201010528022 CN201010528022 CN 201010528022 CN 201010528022 A CN201010528022 A CN 201010528022A CN 101979204 A CN101979204 A CN 101979204A
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Abstract
The invention discloses an indirect-heating braze-welding method for packaging a shell package with a thermal sensitive element, which relates to the braze-welding method for packaging the shell with the thermal sensitive element and aims to solve the problems of damage to the thermal sensitive element in an integral heating method and the high equipment cost and complexity of a local heating method in the conventional braze-welding method. The method comprises the following steps of: placing a strip-like thermal conducting piece between the packaging surfaces of the shell in a way that one end of the thermal conducting piece is flush with the lateral surface of the shell, filling a brazing filler metal between the thermal conducting piece and the packaging surfaces of the shell, heating the other end of the thermal conducting piece with flame to a temperature which is higher than the melting point of the brazing filler metal of 20t o 50 DEG C, and preserving the heat for 5 to 30 seconds to finish packaging the shell. The method can be used for the packaging welding of the shell with the thermal sensitive element or the welding of structural components with complex structures.
Description
Technical field
The present invention relates to contain the method for welding of the housing encapsulation of temperature-sensitive element.
Background technology
Temperature-sensitive element is made into various packing forms usually and forms heat-sensitive sensor, and it is widely used at numerous areas such as space development, marine explorations.Temperature-sensitive element housing encapsulation has methods such as fluid sealant filling or coating, the sealing of rubber washer mechanical fasteners, welding, wherein Han Jie method mechanical strength height, good sealing effect usually.In containing the metal shell soldering encapsulation process of temperature-sensitive element, require the bulk temperature of shell structure low on the one hand, avoid damage to temperature-sensitive element; On the other hand, operating temperature has determined that the solder fusing point can not be low excessively, and this requires the joint to reach certain brazing temperature, realizes that reliable soldering connects, thereby obtains higher bonding strength, good air-tightness.
Existing soldering mode of heating has overall heating means and local heating means, overall heating means such as wherein thermal source heating, salt bath heating, metal bath heating, electric furnace heating, gas phase heating and infrared heating will cause damage to temperature-sensitive element, therefore are not suitable for the housing encapsulation that contains temperature-sensitive element; And local heat method equipment such as electron beam, laser are high, method is complicated.
Summary of the invention
The present invention is that overall heating means can cause damage to temperature-sensitive element in the existing method for welding in order to solve, and local heat method equipment is high, the method complicated problems, and the indirect method for welding of the housing encapsulation that contains temperature-sensitive element is provided.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of the present invention carries out according to the following steps: the conducting strip that, with the surface to be welded of housing encapsulation place and thick 0.1mm～1.0mm, length is 20mm～100mm is removed surface film oxide with the abrasive paper for metallograph polishing, and then cleans with acetone; Two, the conducting strip with step 1 is placed between the housing encapsulating face, makes an end of conducting strip concordant with the side of housing, and adds solder between conducting strip and housing encapsulating face, obtains fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 3N～5N, being heated to temperature at the other end of conducting strip with thermal source then is the temperature that is higher than 20 ℃～50 ℃ of the fusing points of solder, keep 5s～30s, remove the not conducting strip between the housing encapsulating face then, finish the encapsulation of housing.
When the material of the housing described in the step 1 was the T2 red copper, the conducting strip described in the step 1 was the T2 red copper, and the solder described in the step 2 is Sn-Pb solder, Sn-Bi solder, Sn-Pb-Bi solder or Sn-Ag-Cu solder.
When the case material described in the step 1 was commercial-purity aluminium, the conducting strip described in the step 1 was the fine aluminium thin slice, and the solder described in the step 2 is an Al-Si solder paillon foil;
When the case material described in the step 1 was mild steel, the conducting strip described in the step 1 was the T2 red copper, and the solder described in the step 2 is Ag-Cu-Zn-Sn solder or Ag-Cu solder.
The adding mode of the solder described in the step 2 is: after thickness is 0.1mm～corresponding brazing flux of 0.2mm solder foil surfaces brushing, place between conducting strip and the housing mother metal surface to be welded; Perhaps utilize binding agent that the powder solder is modulated to paste, be coated between conducting strip and the housing encapsulating face, the coat thickness of solder is 0.1mm～0.2mm; Perhaps powder solder fusion cooling back line is cut into the solder sheet, again with abrasive paper for metallograph polish to thickness be 0.1mm～0.2mm, after the corresponding brazing flux of solder sheet external coating, be layered between conducting strip and the housing encapsulating face.
The indirect method for welding that contains the housing encapsulation of temperature-sensitive element of the present invention, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.Method of the present invention need not special expensive equipment, method is simple, cost is low.The material that the present invention works as housing is the T2 red copper, and when solder was the Sn-Pb solder, the shear strength of soldering housing housed joint was 45MPa～55MPa; When the material of housing is the T2 red copper, when solder was the Sn-Bi solder, the shear strength of soldering housing housed joint was 25MPa～30MPa; When the material of housing is the T2 red copper, when solder was the Sn-Pb-Bi solder, the shear strength of soldering housing housed joint was 35MPa～45MPa; When the material of housing is the T2 red copper, when solder was the Sn-Ag-Cu solder, the shear strength of soldering housing housed joint was 45MPa～55MPa.When case material is a commercial-purity aluminium, when solder was the Al-Si solder, the shear strength of soldering housing housed joint was 110MPa～150MPa; When case material is a Q235 mild steel, when solder was the Ag-Cu-Zn solder, the shear strength of soldering housing housed joint was 150MPa～200MPa; When case material is a Q235 mild steel, when solder was the Ag-Cu solder, the shear strength of soldering housing housed joint was 135MPa～190MPa.Can be used for containing the encapsulation of the housing of temperature-sensitive element,, when being difficult for welding, also can adopt this method when complex-shaped by welding structure spare.
Description of drawings
Fig. 1 is the fitting joint schematic diagram of the specific embodiment one, and 1 is housing, and 2 is solder, and 3 is conducting strip; 4 is thermal source; The sem photograph of the housed joint that Fig. 2 finishes for the specific embodiment 14.Fig. 3 is a brazed seam partial enlarged drawing among Fig. 2.
The specific embodiment
The specific embodiment one: the indirect method for welding of the housing encapsulation that contains temperature-sensitive element of (referring to Fig. 1) present embodiment carries out according to the following steps: the conducting strip that, with the surface to be welded of housing encapsulation place and thick 0.1mm～1.0mm, length is 20mm～100mm is removed surface film oxide with the abrasive paper for metallograph polishing, and then cleans with acetone; Two, the conducting strip with step 1 is placed between the housing encapsulating face, makes an end of conducting strip concordant with the side of housing, and adds solder between conducting strip and housing encapsulating face, obtains fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 3N～5N, being heated to temperature at the other end of conducting strip with thermal source then is the temperature that is higher than 20 ℃～50 ℃ of the fusing points of solder, keep 5s～30s, remove the not conducting strip between the housing encapsulating face then, finish the encapsulation of housing.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of present embodiment, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.The method of present embodiment need not special expensive equipment, method is simple, cost is low.The material that present embodiment is worked as housing is the T2 red copper, and when solder was the Sn-Pb solder, the shear strength of soldering housing housed joint was 45MPa～55MPa; When the material of housing is the T2 red copper, when solder was the Sn-Bi solder, the shear strength of soldering housing housed joint was 25MPa～30MPa; When the material of housing is the T2 red copper, when solder was the Sn-Pb-Bi solder, the shear strength of soldering housing housed joint was 35MPa～45MPa; When the material of housing is the T2 red copper, when solder was the Sn-Ag-Cu solder, the shear strength of soldering housing housed joint was 45MPa～55MPa.When case material is a commercial-purity aluminium, when solder was the Al-Si solder, the shear strength of soldering housing housed joint was 110MPa～150MPa; When case material is a Q235 mild steel, when solder was the Ag-Cu-Zn solder, the shear strength of soldering housing housed joint was 150MPa～200MPa; When case material is a Q235 mild steel, when solder was the Ag-Cu solder, the shear strength of soldering housing housed joint was 135MPa～190MPa.
The specific embodiment two: what present embodiment and the specific embodiment one were different is: when the material of the housing described in the step 11 is the T2 red copper, conducting strip 3 described in the step 1 is the T2 red copper, and the solder 2 described in the step 2 is Sn-Pb solder, Sn-Bi solder, Sn-Pb-Bi solder or Sn-Ag-Cu solder.Other is identical with the specific embodiment one.
The specific embodiment three: what present embodiment and the specific embodiment one were different is: when the material of the housing described in the step 11 is commercial-purity aluminium, conducting strip 3 described in the step 1 also is the fine aluminium sheet, solder 2 described in the step 2 is the Al-Si solder, and other is identical with the specific embodiment one.
The specific embodiment four: what present embodiment and the specific embodiment one were different is: when the material of the housing described in the step 11 is mild steel, conducting strip 3 described in the step 1 is the T2 red copper, and the solder 2 described in the step 2 is Ag-Cu-Zn-Sn solder or Ag-Cu solder.Other is identical with the specific embodiment one.
The specific embodiment five: what present embodiment was different with one of specific embodiment one to four is: the adding mode of the solder described in the step 2 is: after thickness is 0.1mm～corresponding brazing flux of 0.2mm solder paillon foil 2 external coatings, place between conducting strip 3 and housing 1 surface to be welded; Perhaps utilize binding agent that the powder solder is modulated to paste, be coated between conducting strip 3 and housing 1 encapsulating face, the coat thickness of solder is 0.1mm～0.2mm; Perhaps powder solder fusion cooling back line is cut into the solder sheet, again with abrasive paper for metallograph polish to thickness be 0.1mm～0.2mm, in being layered between conducting strip 3 and housing 1 encapsulating face after the corresponding brazing flux of solder sheet 2 external coatings.Other is identical with one of specific embodiment one to four.
The specific embodiment six: what present embodiment was different with one of specific embodiment one to four is: the adding mode of the solder described in the step 2 is: after thickness is the corresponding brazing flux of 0.15mm solder paillon foil 2 external coatings, place between conducting strip 3 and housing 1 surface to be welded; Perhaps utilize binding agent that the powder solder is modulated to paste, be coated between conducting strip 3 and housing 1 encapsulating face, the coat thickness of solder is 0.15mm; Perhaps powder solder fusion cooling back line is cut into the solder sheet, again with abrasive paper for metallograph polish to thickness be 0.15mm, in being layered between conducting strip 3 and housing 1 encapsulating face after the corresponding brazing flux of solder sheet 2 external coatings.Other is identical with one of specific embodiment one to four.
The specific embodiment seven: what present embodiment was different with one of specific embodiment one to six is: the thickness of conducting strip 3 is that 0.4mm～0.7mm, length are 25mm～90mm in the step 1.Other is identical with one of specific embodiment one to six.
The specific embodiment eight: what present embodiment was different with one of specific embodiment one to six is: the thickness of conducting strip 3 is that 0.5mm, length are 50mm in the step 1.Other is identical with one of specific embodiment one to six.
The specific embodiment nine: what present embodiment was different with one of specific embodiment one to eight is: the pressure that in the step 3 fitting joint is applied 3N～5N.Other is identical with one of specific embodiment one to eight.
The specific embodiment ten: what present embodiment was different with one of specific embodiment one to eight is: the pressure that in the step 3 fitting joint is applied 4N.Other is identical with one of specific embodiment one to eight.
The specific embodiment 11: what present embodiment was different with one of specific embodiment one to ten is: being heated to temperature at the other end of conducting strip 3 with thermal source 4 in the step 3 is the temperature that is higher than 22 ℃～48 ℃ of the fusing points of solder 2, keeps 8s～28s.Other is identical with one of specific embodiment one to ten.
The specific embodiment 12: what present embodiment was different with one of specific embodiment one to ten is: being heated to temperature at the other end of conducting strip 3 with thermal source 4 in the step 3 is the temperature that is higher than 35 ℃ of the fusing points of solder 2, keeps 15s.Other is identical with one of specific embodiment one to ten.
The specific embodiment 13: the indirect method for welding of the housing encapsulation that contains temperature-sensitive element of (referring to Fig. 1) present embodiment carries out according to the following steps: one, surface to be welded and the thickness with 1 encapsulation place of T2 red copper housing is that 0.4mm, length are No. 600 abrasive paper for metallograph polishings of T2 red copper conducting strip 3 usefulness of 50mm, and then cleans with acetone; Two, the conducting strip 3 with step 1 is placed between housing 1 encapsulating face, make an end of conducting strip 2 concordant with the side of housing 1, and between conducting strip 3 and housing 1 encapsulating face the assembling thick 0.2mm Sn-Pb solder paillon foil 2, at solder foil surfaces brushing tin-based solder binding agent Flux-5, thereby obtain fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 5N, and being heated to temperature at the other end of conducting strip 3 with thermal source 4 then is 230 ℃, keeps 10s, removes the not conducting strip between the housing encapsulating face 2 then, finishes the encapsulation of T2 red copper housing.
Tin-based solder binding agent Flux-5 described in the present embodiment step 2 is that Shenzhen yttrium tomahawk reaches company's production, contains brazing flux among the tin-based solder binding agent Flux-5.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of present embodiment, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.Method of the present invention need not special installation, simple, the easy realization of method.The shear strength of the soldering housing housed joint of present embodiment is 51.5MPa.
The specific embodiment 14: the indirect method for welding of the housing encapsulation that contains temperature-sensitive element of (referring to Fig. 1) present embodiment carries out according to the following steps: one, surface to be welded usefulness and the thickness with 1 encapsulation place of T2 red copper housing is that 0.3mm, length are No. 600 abrasive paper for metallograph polishings of T2 red copper conducting strip 3 usefulness of 90mm, and then cleans with acetone; Two, the conducting strip 3 with step 1 is placed between housing 1 encapsulating face, make an end of conducting strip 3 concordant with the side of housing 1, utilize the Flux-5 binding agent to be adjusted to paste in Sn-Bi solder powder 2, be coated between conducting strip 3 and housing 1 encapsulating face, the coat thickness of solder is that 0.18mm obtains fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 4N, and being heated to temperature at the other end of conducting strip 2 with thermal source 4 then is 160 ℃, keeps 20s, removes the not conducting strip between the housing encapsulating face then, finishes the encapsulation of T2 red copper housing.
The sem photograph of the housed joint that present embodiment is finished as shown in Figure 2, as can be seen from the figure, the indirect soldered fitting is made up of mother metal/brazed seam/conducting strip/brazed seam/several parts such as mother metal, and two brazed seams realize that respectively housing and conducting strip, conducting strip are connected with soldering between the housing; Weld defects such as gas enclosure, slag inclusion, pore are considerably less in the brazed seam, realized that high-air-tightness, high compactness connect.
Fig. 3 is a soldered seam partial enlarged drawing among Fig. 2, as seen from the figure, brazed seam/parent material interface has formed the excellent metallurgical combination, formed close-connected soldered fitting, brazed seam is filled fine and close, weld defect is considerably less, and except reaching certain intensity, the air-tightness of welding point and compactness all obtain good assurance.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of present embodiment, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.Method of the present invention need not special installation, simple, the easy realization of method.The shear strength of the soldering housing housed joint of present embodiment is 28.7MPa.
The specific embodiment 15: the indirect method for welding of the housing encapsulation that contains temperature-sensitive element of (referring to Fig. 1) present embodiment carries out according to the following steps: one, surface to be welded usefulness and the thickness with 1 encapsulation place of T2 red copper housing is that 0.7mm, length are No. 600 abrasive paper for metallograph polishings of T2 red copper conducting strip 3 usefulness of 50mm, and then cleans with acetone; Two, the conducting strip 3 with step 1 is placed between housing 1 encapsulating face, make an end of conducting strip 3 concordant with the side of housing 1, with the fusion of Sn-Pb-Bi solder, cooling back line cuts into paillon foil, again with paillon foil with the 800# abrasive paper for metallograph polish to thickness be 0.2mm, again paillon foil solder 2 is layered on conducting strip 3 and housing 1 encapsulating face, solder foil surfaces brushing tin-based solder binding agent Flux-5, thus obtain fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 4N, and being heated to temperature at the other end of conducting strip 3 with thermal source 4 then is 130 ℃ temperature, keeps 20s, and the conducting strip between the housing encapsulating face is not finished the encapsulation of T2 red copper housing then.
Tin-based solder binding agent Flux-5 described in the present embodiment step 2 is that Shenzhen yttrium tomahawk reaches company's production, contains brazing flux among the tin-based solder binding agent Flux-5, and the effect of brazing flux is to remove oxide-film.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of this enforcement, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.The method of present embodiment need not special installation, simple, the easy realization of method.The shear strength of the soldering housing housed joint of present embodiment is 39.5MPa.
The specific embodiment 16: the indirect method for welding of the housing encapsulation that contains temperature-sensitive element of (referring to Fig. 1) present embodiment carries out according to the following steps: one, surface to be welded usefulness and the thickness with 1 encapsulation place of T2 red copper housing is that 0.6mm, length are No. 600 abrasive paper for metallograph polishings of T2 red copper conducting strip 3 usefulness of 60mm, and then cleans with acetone; Two, the conducting strip 3 with step 1 is placed between housing 1 encapsulating face, make an end of conducting strip 3 concordant with the side of housing 1, the Sn-Ag-Cu solder paillon foil 2 of thick 0.2mm is layered between conducting strip 3 and housing 1 encapsulating face, solder foil surfaces brushing Flux-5 binding agent, thus obtain fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 5N, and being heated to temperature at the other end of conducting strip with thermal source then is 250 ℃ temperature, keeps 9s, removes the not conducting strip between the housing encapsulating face then, finishes the encapsulation of T2 red copper housing.
Tin-based solder binding agent Flux-5 described in the present embodiment step 2 is that Shenzhen yttrium tomahawk reaches company's production, contains brazing flux among the tin-based solder binding agent Flux-5, and the effect of brazing flux is to remove oxide-film.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of present embodiment, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.The method of present embodiment need not special installation, simple, the easy realization of method.The shear strength of the soldering housing housed joint of present embodiment is 48MPa.
The specific embodiment 17: the indirect method for welding of the housing encapsulation that contains temperature-sensitive element of (referring to Fig. 1) present embodiment carries out according to the following steps: one, surface to be welded usefulness and the thickness with 1 encapsulation place of commercial-purity aluminium housing is that 0.5mm, length are No. 600 abrasive paper for metallograph polishings of fine aluminium conducting strip 3 usefulness of 50mm, and then cleans with acetone; Two, the conducting strip 3 with step 1 is placed between housing 1 encapsulating face, make an end of conducting strip 3 concordant with the side of housing 1, Al-Si solder paillon foil 2 external coating NOCOLOK brazing fluxes with thick 0.2mm are layered on it between conducting strip 3 and housing 1 encapsulating face afterwards, obtain fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 5N, and being heated to temperature at the other end of conducting strip 3 with thermal source 4 then is 550 ℃, keeps 15s, removes the not conducting strip between the housing encapsulating face then, finishes the encapsulation of aluminium mass shell body.
NOCOLOK brazing flux described in the present embodiment step 2 is the commercially available prod.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of present embodiment, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.Method of the present invention need not special installation, simple, the easy realization of method.The shear strength of the soldering housing housed joint of present embodiment is 93MPa.Method of the present invention is not only applicable to contain the soldering connection of temperature-sensitive element housing encapsulating structure, is applicable to that the soldering of the material that does not contain temperature-sensitive element connects yet.
The specific embodiment 18: the indirect method for welding of the housing encapsulation that contains temperature-sensitive element of (referring to Fig. 1) present embodiment can also carry out according to the following steps: one, surface to be welded usefulness and the thickness with 1 encapsulation place of Q235 mild steel housing is that 0.5mm, length are No. 600 abrasive paper for metallograph polishings of T2 red copper conducting strip 3 usefulness of 40mm, and then cleans with acetone; Two, the conducting strip 3 with step 1 is placed between housing 1 encapsulating face, make an end of conducting strip 3 concordant with the side of housing 1, with the fusion of Ag-Cu-Zn-Sn solder, cooling back line cuts into paillon foil, again with paillon foil with the 800# abrasive paper for metallograph polish to thickness be 0.25mm, at solder foil surfaces brushing brazing flux QJ102, again paillon foil solder 2 is layered between conducting strip 3 and housing 1 encapsulating face; Three, the fitting joint that step 2 is obtained applies the pressure of 5N, is heated to 700 ℃ temperature at the other end of conducting strip with thermal source then, keeps 25s, removes the not conducting strip between the housing encapsulating face then, finishes the encapsulation of mild steel housing.
Brazing flux QJ102 described in the present embodiment step 2 is the commercially available prod.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of present embodiment, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.The method of present embodiment need not special installation, simple, the easy realization of method.The shear strength of the soldering housing housed joint that present embodiment obtains is 182MPa.
The specific embodiment 19: the indirect method for welding of the housing encapsulation that contains temperature-sensitive element of (referring to Fig. 1) present embodiment can also carry out according to the following steps: one, surface to be welded usefulness and the thickness with 1 encapsulation place of Q235 mild steel housing is that 1mm, length are No. 600 abrasive paper for metallograph polishings of T2 red copper conducting strip 3 usefulness of 50mm, and then cleans with acetone; Two, the conducting strip 3 with step 1 is placed between the housing encapsulating face, make an end of conducting strip 3 concordant with the side of housing 1, thickness is that the Ag-Cu paillon foil solder 2 usefulness acetone of 0.2mm clean, is layered between conducting strip 3 and housing 1 encapsulating face after the external coating brazing flux QJ102, obtain fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 5N, is heated to 800 ℃ temperature at the other end of conducting strip with thermal source then, keeps 20s, removes the not conducting strip between the housing encapsulating face then, finishes the encapsulation of mild steel housing.
Brazing flux QJ102 described in the present embodiment step 2 is the commercially available prod.
The indirect method for welding of the housing encapsulation that contains temperature-sensitive element of present embodiment, by hot transmission method, conducting strip is heated, to add Btu utilization conducting strip importing soldering position heats solder, make the encapsulation place local heat of housing, realize higher brazing temperature having guaranteed bonding strength, air-tightness at the soldering position; By conducting strip being imported within a certain period of time the control of calorie value and heated part, make heated part temperature strictness be limited near the narrower scope brazing temperature, avoid in the soldering heating process damage to temperature-sensitive element.The method of present embodiment need not special installation, simple, the easy realization of method.The shear strength of the soldering housing housed joint that present embodiment obtains is 155MPa.
Claims (10)
1. the indirect method for welding that contains the housing encapsulation of temperature-sensitive element, the indirect method for welding that it is characterized in that containing the housing encapsulation of temperature-sensitive element carries out according to the following steps: one, be that 0.1mm～1.0mm, length are that the conducting strip (3) of 20mm～100mm is removed surface film oxide with the abrasive paper for metallograph polishing with the surface to be welded of housing (1) encapsulation place and thickness, and then clean with acetone; Two, the conducting strip (3) with step 1 is placed between housing (1) encapsulating face, makes an end of conducting strip (3) concordant with the side of housing (1), and adds solder (2) between conducting strip (3) and housing (1) encapsulating face, obtains fitting joint; Three, the fitting joint that step 2 is obtained applies the pressure of 3N～5N, being heated to temperature at the other end of conducting strip with thermal source (4) then is the temperature that is higher than 20 ℃～50 ℃ of solder fusing points, keep 5s～30s, remove the not conducting strip between the housing encapsulating face then, finish the encapsulation of housing.
2. the indirect method for welding that contains the housing encapsulation of temperature-sensitive element according to claim 1, it is characterized in that the material when the housing (1) described in the step 1 is the T2 red copper, conducting strip described in the step 1 (3) is the T2 red copper, and the solder described in the step 2 (2) is Sn-Pb solder, Sn-Bi solder, Sn-Pb-Bi solder or Sn-Ag-Cu solder.
3. the indirect method for welding that contains the housing encapsulation of temperature-sensitive element according to claim 1, it is characterized in that the material when the housing (1) described in the step 1 is a commercial-purity aluminium, conducting strip described in the step 1 (3) is the fine aluminium sheet also, and the solder described in the step 2 (2) is the Al-Si solder.
4. the indirect method for welding that contains the housing encapsulation of temperature-sensitive element according to claim 1, it is characterized in that the material when the housing (1) described in the step 1 is a mild steel, conducting strip described in the step 1 (3) is the T2 red copper, and the solder described in the step 2 (2) is Ag-Cu-Zn-Sn solder or Ag-Cu solder.
5. according to claim 1,2, the 3 or 4 described indirect method for welding that contain the housing encapsulation of temperature-sensitive element, the adding mode that it is characterized in that the solder described in the step 2 is: after thickness is 0.1mm～corresponding brazing flux of 0.2mm solder paillon foil (2) external coating, place between conducting strip (3) and housing (1) surface to be welded; Perhaps utilize binding agent that powder solder (2) is modulated to paste, be coated between conducting strip (3) and housing (1) encapsulating face, the coat thickness of solder (2) is 0.1mm～0.2mm; Perhaps powder solder fusion cooling back line is cut into the solder sheet, again with abrasive paper for metallograph polish to thickness be 0.1mm～0.2mm, in being layered on after the corresponding brazing flux of solder sheet (2) external coating between conducting strip (3) and housing (1) encapsulating face.
6. according to claim 1,2, the 3 or 4 described indirect method for welding that contain the housing encapsulation of temperature-sensitive element, the thickness that it is characterized in that conducting strip in the step 1 (3) is that 0.4mm～0.7mm, length are 25mm～90mm.
7. according to claim 1,2, the 3 or 4 described indirect method for welding that contain the housing encapsulation of temperature-sensitive element, the thickness that it is characterized in that conducting strip in the step 1 (3) is that 0.5mm, length are 50mm.
8. according to claim 1,2, the 3 or 4 described indirect method for welding that contain the housing encapsulation of temperature-sensitive element, it is characterized in that in the step 3 fitting joint being applied the pressure of 3N～5N.
9. according to claim 1,2, the 3 or 4 described indirect method for welding that contain the housing encapsulation of temperature-sensitive element, it is characterized in that the other end at conducting strip (3) is heated to temperature for being higher than the temperature of 22 ℃～48 ℃ of solder (2) fusing points with thermal source (4) in the step 3, keep 8s～28s.
10. according to claim 1,2, the 3 or 4 described indirect method for welding that contain the housing encapsulation of temperature-sensitive element, it is characterized in that the other end at conducting strip (3) is heated to temperature for being higher than the temperature of 35 ℃ of solder (2) fusing points with thermal source (4) in the step 3, keep 15s.
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| CN111702272A (en) * | 2020-06-17 | 2020-09-25 | 江西洪都航空工业集团有限责任公司 | Flame brazing welding method for copper-steel dissimilar metal |
| CN112317900A (en) * | 2019-08-05 | 2021-02-05 | 苹果公司 | Selective welding using photon welding technology |
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| CN111702272A (en) * | 2020-06-17 | 2020-09-25 | 江西洪都航空工业集团有限责任公司 | Flame brazing welding method for copper-steel dissimilar metal |
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