CN101965102A - Circuit board module - Google Patents
Circuit board module Download PDFInfo
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- CN101965102A CN101965102A CN 201010287675 CN201010287675A CN101965102A CN 101965102 A CN101965102 A CN 101965102A CN 201010287675 CN201010287675 CN 201010287675 CN 201010287675 A CN201010287675 A CN 201010287675A CN 101965102 A CN101965102 A CN 101965102A
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Abstract
The invention relates to a circuit board module comprising a flex type circuit board, a core circuit board and a conductive connecting material, wherein the flex type circuit board comprises a flexible substrate, a plurality of first terminals and at least one detection structure; the terminals and the detection structures are arranged in the flexible substrate; the detection structure comprises a first positioning piece and a first detection mad; the core circuit board comprises a substrate, a plurality of second terminals and at least one detection pattern; the second terminals and the detection patterns are arranged on the substrate; the detection pattern comprises a second positioning piece and a second detection mad; the first terminals are overlapped on the second terminals when the first positioning piece is overlapped on the second positioning piece; and the conductive connecting materials are connected among the first terminals and the second terminals and arranged between the first positioning piece and the second positioning piece.
Description
Technical field
The invention relates to a kind of circuit board, and particularly relevant for a kind of circuit board module.
Background technology
At LCD (Liquid Crystal Display now, LCD) in the manufacture process, transistor (TFT) array substrate (transistor array substrate) generally all is to utilize aeolotropic conductive (Anisotropic Conductive Film, ACF) connect soft circuit board (flexible circuit board), and aeolotropic conductive need pass through the pressing flow process usually, could bind transistor (TFT) array substrate and soft circuit board, and allow transistor (TFT) array substrate and soft circuit board electrically connect.
Carry out before the above-mentioned pressing flow process, can proofread and correct press table earlier usually, confirm that press table can normally carry out just beginning the production lcd products after the pressing flow process.In the process of above-mentioned correction, at first, the two terminal of transistor (TFT) array substrate and soft circuit board is aimed at.Whether whether fully carrying out on time, the staff adjusts the position of soft circuit board earlier with the operate in manual mode press table, and inspect the two the telltale mark overlapping of transistor (TFT) array substrate and soft circuit board, aim at the terminal of judging the two.
Then, press table carries out pressing, so that transistor (TFT) array substrate connects soft circuit board.After carrying out pressing, the staff can check once more whether the two terminal of transistor (TFT) array substrate and soft circuit board is still aimed at, and whether test transistor array base palte and the soft circuit board electric signal between the two can normally transmit, to judge the parameter of press table further, for example pressing time, temperature and pressure, whether need adjust, allow press table can normally carry out the pressing flow process.
Summary of the invention
The invention provides a kind of circuit board module, it comprises detection architecture and the check pattern with aligning and measuring ability.
The present invention proposes a kind of circuit board module, comprises a soft circuit board, a core circuit plate and a conductive connecting material.Soft circuit board comprises a flexible base plate, a plurality of the first terminal and at least one detection architecture.Flexible base plate has a upper surface respect to one another and a lower surface.These the first terminals and detection architecture all are configured in the flexible base plate.Detection architecture comprises one first keeper and one first detecting pad.Upper surface exposes first detecting pad, and lower surface exposes these the first terminals.The core circuit plate comprises a substrate, a plurality of second terminal and at least one check pattern.These second terminals and check pattern all are configured on the plane of substrate.Check pattern comprises one second keeper and one second detecting pad.When first keeper was overlapped in second keeper, these the first terminals were overlapped in these second terminals.Conductive connecting material is connected between these the first terminals and these second terminals, and is configured between first keeper and second keeper.
In an embodiment of the present invention, above-mentioned conductive connecting material is an aeolotropic conductive.
In an embodiment of the present invention, above-mentioned core circuit plate is transistor (TFT) array substrate or printed circuit board (PCB).
In an embodiment of the present invention, above-mentioned flexible base plate has light transmission.
In an embodiment of the present invention, the quantity of above-mentioned detection architecture is a plurality of, and the quantity of check pattern is a plurality of.These the first terminals are wherein between two detection architecture, and these second terminals are wherein between two check pattern.
In an embodiment of the present invention, above-mentioned first keeper electrically connects first detecting pad, and second keeper electrically connects second detecting pad.Lower surface exposes first keeper, and first keeper electrically connects second keeper via conductive connecting material.
In an embodiment of the present invention, above-mentioned detection architecture also comprises at least one assist location part.Assist location part position and does not connect first keeper by first keeper.
In an embodiment of the present invention, above-mentioned check pattern also comprises at least one assist location part, and assist location part position is by second keeper, and the assist location part does not connect second keeper.
In an embodiment of the present invention, above-mentioned first keeper and first detecting pad are electrically insulated, and second keeper electrically connects second detecting pad.
In an embodiment of the present invention, above-mentioned detection architecture also comprises a connection pad (pad), and connection pad is exposed to lower surface, and electrically connects first detecting pad.
In an embodiment of the present invention, the shape of above-mentioned connection pad is essentially the U font, and connection pad is around first keeper.The bearing of trend of two ends of connection pad is towards second detecting pad.
In an embodiment of the present invention, above-mentioned second keeper and second detecting pad are electrically insulated, and first keeper electrically connects first detecting pad.
In an embodiment of the present invention, above-mentioned check pattern also comprises a connection pad.Connection pad electrically connects second detecting pad.
In an embodiment of the present invention, the shape of above-mentioned connection pad is essentially the U font, and connection pad is around second keeper, and the bearing of trend of two ends of connection pad is towards first detecting pad.
Based on above-mentioned, when first keeper is overlapped in second keeper, the first terminal of soft circuit board also is overlapped in second terminal of core circuit plate respectively, therefore first keeper and second keeper the two can be used as in order to allow the first terminal aim at the telltale mark of second terminal.Secondly, the staff can come the testing circuit plate module from first detecting pad and second detecting pad, whether aims at second terminal to find the first terminal, and confirms whether need adjust the parameter of press table.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A be first embodiment of the invention circuit board module its assembly not in conjunction with before schematic top plan view.
Figure 1B is the schematic top plan view of circuit board module after its assembly combination among Figure 1A.
The generalized section that Fig. 1 C forms for I-I section along the line among Figure 1B.
The generalized section that Fig. 1 D forms for II-II section along the line among Figure 1B.
Fig. 2 A be second embodiment of the invention circuit board module its assembly not in conjunction with before schematic top plan view.
Fig. 2 B is the schematic top plan view of circuit board module after its assembly combination among Fig. 2 A.
The generalized section that Fig. 2 C forms for III-III section along the line among Fig. 2 B.
Fig. 3 A be third embodiment of the invention circuit board module its assembly not in conjunction with before schematic top plan view.
Fig. 3 B is the schematic top plan view of circuit board module after its assembly combination among Fig. 3 A.
The generalized section that Fig. 3 C forms for V-V section along the line among Fig. 3 B.
Fig. 4 A be fourth embodiment of the invention circuit board module its assembly not in conjunction with before schematic top plan view.
Fig. 4 B is the schematic top plan view of circuit board module after its assembly combination among Fig. 4 A.
The generalized section that Fig. 4 C forms for VI-VI section along the line among Fig. 4 B.
Embodiment
Figure 1A be first embodiment of the invention circuit board module its assembly not in conjunction with before schematic top plan view, and Figure 1B be among Figure 1A circuit board module its assembly in conjunction with after schematic top plan view.See also Figure 1A and Figure 1B, circuit board module 100 comprises a soft circuit board 110 and a core circuit plate 120, and wherein soft circuit board 110 is connected in core circuit plate 120 (shown in Figure 1B), and can electrically conduct with core circuit plate 120.
Each detection architecture 116 comprises one first detecting pad 116a and one first keeper 116b.The first keeper 116b electrically connects the first detecting pad 116a, for example detection architecture 116 can also comprise a wiring 116c, and wiring 116c is connected between the first detecting pad 116a and the first keeper 116b, so that the first keeper 116b is electrically connected the first detecting pad 116a.But, in other embodiments, the first detecting pad 116a also can directly connect the first keeper 116b, and does not need wiring 116c to electrically connect the first keeper 116b indirectly.
These check pattern 126 electrically connect these detection architecture 116 respectively, so each check pattern 126 can corresponding one of them detection architecture 116, and the two quantity of check pattern 126 and detection architecture 116 can equate.Because soft circuit board 110 included detection architecture 116 can only be one, therefore, in other embodiments, core circuit plate 120 included check pattern 126 can only be one also.So the quantity of the check pattern 126 among Figure 1A and Figure 1B is only for illustrating, and non-limiting the present invention.
Each check pattern 126 comprises one second keeper 126b and one second detecting pad 126a, and the second keeper 126b electrically connects the second detecting pad 126a.For example, check pattern 126 can also comprise a wiring 126c, and wiring 126c is connected between the second detecting pad 126a and the second keeper 126b, so that the second keeper 126b electrically connects the second detecting pad 126a.But, in other embodiments, the second detecting pad 126a can directly connect the second keeper 126b, and does not need wiring 126c to electrically connect the second keeper 126b indirectly.
The generalized section that Fig. 1 C forms for I-I section along the line among Figure 1B.See also Figure 1B and Fig. 1 C, flexible base plate 112 has a upper surface 112a respect to one another and a lower surface 112b, and wherein upper surface 112a exposes these first detecting pads 116a, and lower surface 112b exposes these first keepers 116b.With after core circuit plate 120 combines, the first keeper 116b can electrically connect the second keeper 126b at soft circuit board 110.
Specifically, circuit board module 100 also comprises a conductive connecting material 130, and conductive connecting material 130 is connected between soft circuit board 110 and the core circuit plate 120, and is configured between the first keeper 116b and the second keeper 126b.Conductive connecting material 130 for example is aeolotropic conductive or other conducting polymer composite, and these first keepers 116b can electrically connect these second keepers 126b via conductive connecting material 130.
When conductive connecting material 130 was aeolotropic conductive, conductive connecting material 130 comprised that many conducting particless 132 and stick together body (adhesive) 134, and wherein these conducting particless 132 are distributed in and stick together in the body 134, and sticked together body 134 and can be insulator.In addition, conductive connecting material 130 can bind between soft circuit board 110 and core circuit plate 120 through the pressing flow process.
When carrying out above-mentioned pressing flow process, these conductive connecting materials 130 can be oppressed with core circuit plate 120 by soft circuit board 110, to such an extent as to some conducting particless 132 can the soft circuit board 110 of contact and core circuit plates 120.When these first keepers 116b was overlapped in these second keepers 126b respectively, some conducting particless 132 can contact the first keeper 116b and the second keeper 126b simultaneously, allowed the first keeper 116b and the second keeper 126b electrically conduct.So, these first keepers 116b can electrically connect these second keepers 126b via the conducting particles in the conductive connecting material 130 132.
Because the first keeper 116b electrically connects the first detecting pad 116a, and the second keeper 126b electrically connects the second detecting pad 126a, therefore, when the first keeper 116b electrically connected the second keeper 126b via conductive connecting material 130, these first detecting pads 116a also can electrically connect these second detecting pads 126a respectively.That is to say that each first detecting pad 116a can electrically conduct by the second detecting pad 126a pairing with it.
The generalized section that Fig. 1 D forms for II-II section along the line among Figure 1B.See also Figure 1B and Fig. 1 D, the lower surface 112b of flexible base plate 112 exposes these the first terminals 114, and at soft circuit board 110 with after core circuit plate 120 combines, conductive connecting material 130 is connected between these the first terminals 114 and these second terminals 124, allows the first terminal 114 and electrically connect second terminal 124 through the conducting particles 132 in the conductive connecting material 130.
Specifically, when these first keepers 116b was overlapped in these second keepers 126b respectively, these the first terminals 114 also can be overlapped in these second terminals 124, shown in Figure 1B and Fig. 1 D.So, after carrying out the pressing flow process, by conductive connecting material 130, not only these first keepers 116b can electrically connect with the second keeper 126b respectively, and these the first terminals 114 also can electrically connect with second terminal 124 respectively simultaneously.
Hence one can see that, the staff can be according to the overlapping of the first keeper 116b and the second keeper 126b, the first terminal 114 allow these the first terminals 114 aim at these second terminals 124 respectively, so that can electrically connect second terminal 124 via conductive connecting material 130.Therefore, the two can be used as the first keeper 116b and the second keeper 126b in order to allowing these the first terminals 114 aim at the telltale mark of these second terminals 124 respectively, and then helps the staff to judge whether the first terminal 114 aims at second terminal 124.
In addition, when these first keepers 116b is overlapped in these second keepers 126b respectively, the first keeper 116b can see through conductive connecting material 130 and electrically connect the second keeper 126b, to such an extent as to each first detecting pad 116a can electrically conduct by the second detecting pad 126a pairing with it.Therefore, in carrying out the pressing flow process, can measure the resistance value between each first detecting pad 116a and its pairing second detecting pad 126a simultaneously, find in real time whether the first terminal 114 aims at second terminal 124, and according to this resistance value, confirm whether need adjust the parameter of press table immediately, for example pressing time, temperature and pressure.
Particularly, when the resistance value between each first detecting pad 116a of measurement and its pairing second detecting pad 126a, if each first detecting pad 116a second detecting pad 126a pairing with it electrically conducts, then represent the first terminal 114 alignings second terminal 124, and the parameter of press table need not adjust on the whole; Otherwise,, represent that then the first terminal 114 may not aim at second terminal 124, or the parameter of press table need adjust if each first detecting pad 116a second detecting pad 126a pairing with it does not electrically conduct.
What deserves to be mentioned is, from Figure 1A and Figure 1B, with regard to outward appearance, the two shape of the first keeper 116b and the second keeper 126b is all circle in fact, but in other embodiments, the two shape of the first keeper 116b and the second keeper 126b in fact also can be shapes such as rectangle, triangle or star, so the two shape of the first keeper 116b shown in Figure 1A and Figure 1B and the second keeper 126b is only for illustrating, and non-limiting the present invention.
Fig. 2 A be second embodiment of the invention circuit board module its assembly not in conjunction with before schematic top plan view, and Fig. 2 B be among Fig. 2 A circuit board module its assembly in conjunction with after schematic top plan view.See also Fig. 2 A and Fig. 2 B, the circuit board module 200 of present embodiment comprises a soft circuit board 210 and a core circuit plate 220, and soft circuit board 210 combines with core circuit plate 220.Soft circuit board 210 comprises a flexible base plate 112, a plurality of the first terminal 114 and at least one detection architecture 216, and core circuit plate 220 comprises a substrate 122, a plurality of second terminal 124 and at least one check pattern 226.
The circuit board module 200 of present embodiment is similar to the circuit board module 100 of first embodiment, but the difference of the two is: with regard to structure, detection architecture 216 is different from detection architecture 116, and check pattern 226 is different from check pattern 126.For the description that makes circuit board module 200 is succinct, below only introduce the two technical characterictic of detection architecture 216 and check pattern 226.
In a second embodiment, each detection architecture 216 comprises one first detecting pad 116a, a wiring 116c, one first keeper 216b and a plurality of assist location part 216d, and each check pattern 226 comprises one second detecting pad 126a, a wiring 126c, one second keeper 226b and a plurality of assist location part 226d, wherein the first keeper 216b and the second keeper 226b are same as the first keeper 116b and the second keeper 126b among first embodiment substantially respectively, and only the two difference only is the difference of shape.From outward appearance, the two shape of the first keeper 216b and the second keeper 226b is all rectangle in fact.
The first detecting pad 116a, wiring 116c and the first keeper 216b three's configuration relation is identical with the detection architecture 116 of first embodiment, and the second detecting pad 126a, wiring 126c and the second keeper 226b three's configuration relation also the check pattern 126 with first embodiment is identical, no longer repeat to introduce the two arrangement of components relation of detection architecture 216 and check pattern 226 below therefore.
In same detection architecture 216, each assist location part 216d position is therein by one first keeper 216b, and do not connect the first keeper 216b, and each first keeper 216b can be situated between adjacent two assist location part 216d.Similar in appearance to detection architecture 216, in same check pattern 226, assist location part 226d is configured on the planar S 1 of substrate 122, and each assist location part 226d position is therein by one second keeper 226b, and do not connect these second keepers 226b, wherein each second keeper 226b can the position between adjacent two assist location part 226d.
In addition, in the present embodiment, two assist location part 216d and one first keeper 216b can be combined into a cross telltale mark that is positioned at soft circuit board 210, and two assist location part 226d and one second keeper 226b can be combined into the cross telltale mark that another is positioned at core circuit plate 220, shown in Fig. 2 A.When the cross telltale mark that is positioned at soft circuit board 210 overlapped with the cross telltale mark that is positioned at core circuit plate 220, these the first terminals 114 also can be overlapped in these second terminals 124, shown in Fig. 2 B.
The generalized section that Fig. 2 C forms for III-III section along the line among Fig. 2 B.See also Fig. 2 B and Fig. 2 C, circuit board module 200 also comprises a conductive connecting material 130, and conductive connecting material 130 is connected between soft circuit board 210 and the core circuit plate 220.
Because each assist location part 216d does not connect the first keeper 216b, each assist location part 226d does not connect these second keepers 226b, be that the assist location part 216d and the first keeper 216b are electrically insulated, the assist location part 226d and the second keeper 226b are electrically insulated, even therefore assist location part 216d electrically connects assist location part 226d, the first keeper 216b can't electrically connect the second keeper 226b from assist location part 216d, 226d.
In a second embodiment, the two effect, effect and advantage of detection architecture 216 and check pattern 226 is all identical with first embodiment, be that the staff utilizes detection architecture 216 and check pattern 226 to judge whether the first terminal 114 aims at second terminal 124, and the mode of confirming whether need to adjust the press table parameter is all identical with first embodiment, so no longer repeat to give unnecessary details.
Fig. 3 A be third embodiment of the invention circuit board module its assembly not in conjunction with before schematic top plan view, Fig. 3 B be among Fig. 3 A circuit board module its assembly in conjunction with after schematic top plan view.See also Fig. 3 A and Fig. 3 B, the circuit board module 400 of the 3rd embodiment comprises a soft circuit board 410 and a core circuit plate 120, and soft circuit board 410 combines with core circuit plate 120.
Each detection architecture 416 comprises one first detecting pad 116a, a wiring 116c, one first keeper 416b and a connection pad 416d.In same detection architecture 416, connection pad 416d electrically connects the first detecting pad 116a, and for example wiring 116c can be connected between the first detecting pad 116a and the connection pad 416d, so that connection pad 416d electrically connects the first detecting pad 116a.But, in other embodiments, the first detecting pad 116a can be directly connected in connection pad 416d, and does not need wiring 116c to be electrically connected at connection pad 416d indirectly.
In the 3rd embodiment, the shape of these connection pads 416d is essentially the U font, and the bearing of trend of two ends of connection pad 416d is towards the second detecting pad 126a.That is to say that the breach of these U font connection pads 416d is all towards the second detecting pad 126a on opposite, shown in Fig. 3 A and Fig. 3 B.In addition, each connection pad 416d is around one of them first keeper 416b, but any first keeper 416b of the neither connection of these connection pads 416d, and promptly these first keeper 416b and these first detecting pads 116a are electrically insulated.
The generalized section that Fig. 3 C forms for V-V section along the line among Fig. 3 B.See also Fig. 3 B and Fig. 3 C, circuit board module 400 also comprises a conductive connecting material 130, and conductive connecting material 130 is connected between soft circuit board 410 and the core circuit plate 120.These connection pads 416d all is exposed to the lower surface 112b of flexible base plate 112, and conductive connecting material 130 is attached to these connection pads 416d.
When these first keepers 416b is overlapped in these second keepers 126b respectively, these the first terminals 114 also can be overlapped in these second terminals 124 (shown in Fig. 3 A and Fig. 3 B), and the first keeper 416b can see through the conducting particles 132 in the conductive connecting material 130 and electrically connect the second keeper 126b.Because the first keeper 416b and the first detecting pad 116a are electrically insulated, and the second keeper 126b electrically connects the second detecting pad 126a, even therefore the first keeper 416b electrically connects the second keeper 126b, the first detecting pad 116a and the second detecting pad 126a not necessarily can electrically conduct.
When these first keepers 416b was overlapped in these second keepers 126b respectively, under normal situation, these connection pads 416d can't be overlapped in these second keepers 126b.Unless the first keeper 416b and the second keeper 126b relative position between the two seriously is offset, to such an extent as to these the first terminals 114 are not aimed at these second terminals 124 fully.
At this moment, at least one connection pad 416d can overlap with one of them second keeper 126b, and electrically connects the second keeper 126b through conductive connecting material 130.Because connection pad 416d electrically connects the first detecting pad 116a, therefore, in case the words that the connection pad 416d and the second keeper 126b overlap, then connection pad 416d can see through conductive connecting material 130 and electrically connect the second keeper 126b, to such an extent as to the first detecting pad 116a can electrically conduct with the second detecting pad 126a.
Hence one can see that, and in carrying out the pressing flow process, the staff can measure the resistance value between each first detecting pad 116a and its pairing second detecting pad 126a, whether aims at second terminal 124 to judge the first terminal 114.If find that according to above-mentioned resistance value the first detecting pad 116a and the second detecting pad 126a electrically conduct, expression the first terminal 114 is not aimed at second terminal 124 fully.At this moment, the staff need adjust press table, to revise the relative position between soft circuit board 410 and the core circuit plate 120, impels in next pressing flow process, and the first terminal 114 can be aimed at second terminal 124.
Fig. 4 A be fourth embodiment of the invention circuit board module its assembly not in conjunction with before schematic top plan view, Fig. 4 B be among Fig. 4 A circuit board module its assembly in conjunction with after schematic top plan view.See also Fig. 4 A and Fig. 4 B, the circuit board module 500 of the 4th embodiment comprises a soft circuit board 110 and a core circuit plate 520, and soft circuit board 110 combines with core circuit plate 520.
Hold above-mentionedly, circuit board module 500 is similar to the circuit board module 100 of first embodiment, and the two all comprises soft circuit board 110, and only the difference of the two is: core circuit plate 520 is different from the core circuit plate 120 of first embodiment.For the description that makes circuit board module 500 is succinct, below only introduce the technical characterictic that core circuit plate 520 is different from first embodiment.As for soft circuit board 110, then no longer repeat to give unnecessary details.
Each check pattern 526 comprises one second detecting pad 126a, a wiring 126c, one second keeper 526b and a connection pad 526d.In same check pattern 526, connection pad 526d electrically connects the second detecting pad 126a, and for example wiring 126c can be connected between the second detecting pad 126a and the connection pad 526d, so that connection pad 526d electrically connects the second detecting pad 126a.But, in other embodiments, the second detecting pad 126a can be directly connected in connection pad 526d, and does not need wiring 126c to be electrically connected at connection pad 526d indirectly.
In the 4th embodiment, the shape of these connection pads 526d is essentially the U font, and the bearing of trend of two ends of connection pad 526d is towards the first detecting pad 116a.That is to say that the breach of the connection pad 526d of these U fonts is all towards the first detecting pad 116a on opposite, shown in Fig. 4 A and Fig. 4 B.In addition, each connection pad 526d is around one of them second keeper 526b, but any second keeper 526b of the neither connection of these connection pads 526d, and promptly these second keeper 526b and these second detecting pads 126a are electrically insulated.
The generalized section that Fig. 4 C forms for VI-VI section along the line among Fig. 4 B.See also Fig. 4 B and Fig. 4 C, circuit board module 500 also comprises a conductive connecting material 130, and conductive connecting material 130 is connected between soft circuit board 110 and the core circuit plate 520, and is attached to these connection pads 526d.
When these first keepers 116b is overlapped in these second keepers 526b respectively, these the first terminals 114 also can be overlapped in these second terminals 124 (shown in Fig. 4 A and Fig. 4 B), and the first keeper 116b can see through the conducting particles 132 in the conductive connecting material 130 and electrically connect the second keeper 526b.Because the second keeper 526b and the second detecting pad 126a are electrically insulated, and the first keeper 116b electrically connects the first detecting pad 116a, even therefore the first keeper 116b electrically connects the second keeper 526b, the first detecting pad 116a can not necessarily can electrically conduct with the second detecting pad 126a.
When these first keepers 116b was overlapped in these second keepers 526b respectively, under normal situation, these first keepers 116b can't be overlapped in these connection pads 526d.Unless the first keeper 116b and the second keeper 526b relative position between the two seriously is offset, to such an extent as to these the first terminals 114 are not aimed at these second terminals 124 fully.
At this moment, at least one connection pad 526d can overlap with one of them first keeper 116b, and electrically connects the first keeper 116b through conductive connecting material 130.Because connection pad 526d electrically connects the second detecting pad 126a, therefore, in case the words that the connection pad 526d and the first keeper 116b overlap, then connection pad 526d can see through conductive connecting material 130 and electrically connect the first keeper 116b, to such an extent as to the first detecting pad 116a can electrically conduct with the second detecting pad 126a.
Hence one can see that, and in carrying out the pressing flow process, the staff can measure the resistance value between each first detecting pad 116a and its pairing second detecting pad 126a, whether aims at second terminal 124 to judge the first terminal 114.In the 4th embodiment, the mode that the staff utilizes above-mentioned resistance value to judge whether these the first terminals 114 aim at these second terminals 124 is identical with the 3rd embodiment, so no longer repeat to give unnecessary details.
In sum, when first keeper is overlapped in second keeper, the first terminal of soft circuit board also is overlapped in second terminal of core circuit plate respectively, therefore first keeper and second keeper the two can be used as in order to allow the first terminal aim at the telltale mark of second terminal, and the staff can judge whether the first terminal aims at second terminal according to the overlapping of first keeper and second keeper.
Secondly, in the pressing flow process, no matter be that first keeper and first detecting pad are electrically insulated, second keeper and second detecting pad electrically connect; Or, second keeper and second detecting pad are electrically insulated, first keeper and first detecting pad electrically connect, the staff can find in real time whether the first terminal aims at second terminal from first detecting pad and the resistance value between second detecting pad, and confirms whether need adjust the parameter of press table immediately.
Moreover, when first keeper and the electric connection of first detecting pad, and second keeper and second detecting pad are when electrically connecting, after circuit board module is finished, can utilize measurement boards such as avometer to measure resistance value between first detecting pad and second detecting pad, with the circuit board module after having checked, whether its first terminal correctly electrically connects second terminal.By this, the staff can confirm whether normal operation of press table, to adjust or to keep in repair unusual press table, reduces the quantity of the circuit board module that needs rework (rework) or scrap.
In addition, when the resistance value that measures between first detecting pad and second detecting pad, measurement platform can only use two probes (probe) to measure, so measurement platform do not need to use many probes, can the testing circuit plate module.Because measurement platform can only use two probes to measure, therefore as long as the distance between these two probes can be adjusted, measurement platform can measure the circuit board module of various different sizes.So, the circuit board module of different size can be shared a measurement platform.
Though the present invention with previous embodiment openly as above, so it is not in order to limiting the present invention, anyly has the knack of alike skill person, and without departing from the spirit and scope of the present invention, institute does to change and the equivalence replacement of retouching, and still is in the scope of patent protection of the present invention.
Claims (11)
1. a circuit board module is characterized in that, comprising:
One soft circuit board, comprise a flexible base plate, a plurality of the first terminal and at least one detection architecture, this flexible base plate has a upper surface respect to one another and a lower surface, those the first terminals and this detection architecture all are configured in this flexible base plate, this detection architecture comprises one first keeper and one first detecting pad, this upper surface exposes this first detecting pad, and this lower surface exposes those the first terminals;
One core circuit plate, comprise a substrate, a plurality of second terminal and at least one check pattern, those second terminals and this check pattern all are configured on the plane of this substrate, this check pattern comprises one second keeper and one second detecting pad, when this first keeper was overlapped in this second keeper, those the first terminals were overlapped in those second terminals; And
One conductive connecting material is connected between those the first terminals and those second terminals, and is configured between this first keeper and this second keeper.
2. circuit board module as claimed in claim 1 is characterized in that, this conductive connecting material is an aeolotropic conductive.
3. circuit board module as claimed in claim 1 is characterized in that, this core circuit plate is transistor (TFT) array substrate or printed circuit board (PCB).
4. circuit board module as claimed in claim 1, wherein this flexible base plate has light transmission.
5. circuit board module as claimed in claim 1 is characterized in that, the quantity of this detection architecture is a plurality of, and the quantity of this check pattern is a plurality of, and those the first terminals are wherein between two detection architecture, and those second terminals are wherein between two check pattern.
6. circuit board module as claimed in claim 1, it is characterized in that, this first keeper electrically connects this first detecting pad, and this second keeper electrically connects this second detecting pad, this lower surface exposes this first keeper, and this first keeper electrically connects this second keeper via this conductive connecting material.
7. circuit board module as claimed in claim 6 is characterized in that,
This detection architecture also comprises at least one assist location part, and this assist location part position and does not connect this first keeper by this first keeper, perhaps
This check pattern also comprises at least one assist location part, and this assist location part position is by this second keeper, and this assist location part does not connect this second keeper.
8. circuit board module as claimed in claim 1 is characterized in that, this first keeper and this first detecting pad are electrically insulated, and this second keeper electrically connects this second detecting pad.
9. circuit board module as claimed in claim 8, it is characterized in that, this detection architecture also comprises a connection pad, this connection pad is exposed to this lower surface, and electrically connect this first detecting pad, the shape of this connection pad is essentially the U font, and this connection pad is around this first keeper, and the bearing of trend of two ends of this connection pad is towards this second detecting pad.
10. circuit board module as claimed in claim 1 is characterized in that, this second keeper and this second detecting pad are electrically insulated, and this first keeper electrically connects this first detecting pad.
11. circuit board module as claimed in claim 10, it is characterized in that, this check pattern also comprises a connection pad, this connection pad electrically connects this second detecting pad, the shape of this connection pad is essentially the U font, and this connection pad is around this second keeper, and the bearing of trend of two ends of this connection pad is towards this first detecting pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102876750A CN101965102B (en) | 2010-09-17 | 2010-09-17 | Circuit board module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102876750A CN101965102B (en) | 2010-09-17 | 2010-09-17 | Circuit board module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101965102A true CN101965102A (en) | 2011-02-02 |
| CN101965102B CN101965102B (en) | 2012-02-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102876750A Expired - Fee Related CN101965102B (en) | 2010-09-17 | 2010-09-17 | Circuit board module |
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| Country | Link |
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| CN (1) | CN101965102B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105337063A (en) * | 2014-08-15 | 2016-02-17 | 宏达国际电子股份有限公司 | Electronic assembly |
| CN106093750A (en) * | 2016-06-17 | 2016-11-09 | 深圳市燕麦科技股份有限公司 | Switching circuit board and switching device for circuit board testing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004031555A (en) * | 2002-06-25 | 2004-01-29 | Nec Corp | Circuit board device and connection method between substrates |
| CN1756457A (en) * | 2004-09-28 | 2006-04-05 | 精工爱普生株式会社 | Mounting structure mounting substrate, electro-optical device, and electronic apparatus |
| CN1937886A (en) * | 2005-09-20 | 2007-03-28 | 陈文祺 | High-layer circuit board and its manufacturing method |
-
2010
- 2010-09-17 CN CN2010102876750A patent/CN101965102B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004031555A (en) * | 2002-06-25 | 2004-01-29 | Nec Corp | Circuit board device and connection method between substrates |
| CN1756457A (en) * | 2004-09-28 | 2006-04-05 | 精工爱普生株式会社 | Mounting structure mounting substrate, electro-optical device, and electronic apparatus |
| CN1937886A (en) * | 2005-09-20 | 2007-03-28 | 陈文祺 | High-layer circuit board and its manufacturing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105337063A (en) * | 2014-08-15 | 2016-02-17 | 宏达国际电子股份有限公司 | Electronic assembly |
| CN106093750A (en) * | 2016-06-17 | 2016-11-09 | 深圳市燕麦科技股份有限公司 | Switching circuit board and switching device for circuit board testing |
| CN106093750B (en) * | 2016-06-17 | 2018-12-18 | 深圳市燕麦科技股份有限公司 | Switching circuit board and switching device for circuit board testing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101965102B (en) | 2012-02-15 |
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