CN101961919B - 一种预浸料模压复合材料成型工艺 - Google Patents
一种预浸料模压复合材料成型工艺 Download PDFInfo
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- CN101961919B CN101961919B CN 201010265595 CN201010265595A CN101961919B CN 101961919 B CN101961919 B CN 101961919B CN 201010265595 CN201010265595 CN 201010265595 CN 201010265595 A CN201010265595 A CN 201010265595A CN 101961919 B CN101961919 B CN 101961919B
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- composite
- diaphragm
- prepreg
- surface diaphragm
- prepreg fabric
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Abstract
Description
复合材料表面伤痕 | 表面无伤痕 |
复合材料表面黑边 | 表面黑边≤1mm |
复合材料表面2×2mm黑点密度 | 表面2×2mm黑点密度≤1个/每平方米 |
复合材料表面色差 | 无色差 |
复合材料表面纤维残留 | 无残留纤维 |
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CN 201010265595 CN101961919B (zh) | 2010-08-27 | 2010-08-27 | 一种预浸料模压复合材料成型工艺 |
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CN 201010265595 CN101961919B (zh) | 2010-08-27 | 2010-08-27 | 一种预浸料模压复合材料成型工艺 |
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CN101961919A CN101961919A (zh) | 2011-02-02 |
CN101961919B true CN101961919B (zh) | 2013-06-12 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105196564B (zh) * | 2015-09-14 | 2018-07-31 | 江苏金风科技有限公司 | 手糊成型方法 |
US10406794B2 (en) * | 2016-09-16 | 2019-09-10 | GM Global Technology Operations LLC | Method for improvement of weatherability of open air processed composites |
CN108068228B (zh) * | 2016-11-17 | 2021-05-25 | 洛阳尖端技术研究院 | 用于预浸料试制的辅助装置及预浸料的试制方法 |
CN108407332B (zh) * | 2018-03-23 | 2020-05-12 | 航天材料及工艺研究所 | 一种复合材料网格蒙皮结构件模压成型方法 |
CN110774623A (zh) * | 2019-10-30 | 2020-02-11 | 武汉格罗夫氢能汽车有限公司 | 一种氢能汽车的简单造型碳纤维复合材料制件的制作方法 |
CN112223784A (zh) * | 2020-09-25 | 2021-01-15 | 上海市富力达科技股份有限公司 | 一种碳纤维环氧树脂薄板及其制备方法 |
CN113050736B (zh) * | 2021-06-02 | 2021-09-03 | 成都飞机工业(集团)有限责任公司 | 一种自动铺丝预浸料硬挺度检测方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1910037A (zh) * | 2004-01-14 | 2007-02-07 | 通用电气公司 | 由基材和在任一侧上的至少一个覆盖层制成的多层产品;该多层产品的制造方法及着色的多层产品和使多层产品着色的方法 |
CN101611097A (zh) * | 2006-12-22 | 2009-12-23 | 美凯威奇兄弟有限责任两合公司 | 用于纤维-塑料复合材料的表面涂布的聚合物膜 |
CN101691065A (zh) * | 2009-10-14 | 2010-04-07 | 上海理工大学 | 碳纤维复合材料假脚的成型工艺 |
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JPS5610425A (en) * | 1979-07-06 | 1981-02-02 | Matsushita Electric Works Ltd | Manufacture of laminated board |
JPS57125038A (en) * | 1981-01-27 | 1982-08-04 | Shin Kobe Electric Machinery | Manufacture of laminated board for pasting |
JP3907631B2 (ja) * | 2004-03-09 | 2007-04-18 | 株式会社ジャムコ | 熱硬化型frpの製造方法 |
US20050255311A1 (en) * | 2004-04-23 | 2005-11-17 | Formella Stephen C | Hybrid composite product and system |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1910037A (zh) * | 2004-01-14 | 2007-02-07 | 通用电气公司 | 由基材和在任一侧上的至少一个覆盖层制成的多层产品;该多层产品的制造方法及着色的多层产品和使多层产品着色的方法 |
CN101611097A (zh) * | 2006-12-22 | 2009-12-23 | 美凯威奇兄弟有限责任两合公司 | 用于纤维-塑料复合材料的表面涂布的聚合物膜 |
CN101691065A (zh) * | 2009-10-14 | 2010-04-07 | 上海理工大学 | 碳纤维复合材料假脚的成型工艺 |
Non-Patent Citations (2)
Title |
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JP昭56-10425A 1981.02.02 |
JP昭57-125038A 1982.08.04 |
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Inventor after: Luo Jianlan Inventor after: Zhu Jiaqiang Inventor after: Sun Hao Inventor after: Wang Ming Inventor after: Zhou Xinle Inventor before: Luo Jianlan Inventor before: Zhu Jiaqiang Inventor before: Sun Hao Inventor before: Zhao Pengfei Inventor before: Wang Ming Inventor before: Zhou Xinle |
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Free format text: CORRECT: INVENTOR; FROM: LUO JIANLAN ZHU JIAQIANG SUN HAO ZHAO PENGFEI WANG MING ZHOU XINYUE TO: LUO JIANLAN ZHU JIAQIANG SUN HAO WANG MING ZHOU XINYUE |
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Owner name: SHANGHAI JINFEI NEW MATERIAL TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHANGHAI CEDAR COMPOSITES TECHNOLOGY CO., LTD. Effective date: 20150826 Owner name: SHANGHAI CEDAR COMPOSITES TECHNOLOGY CO., LTD. Effective date: 20150826 |
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Effective date of registration: 20150826 Address after: 201306 Shanghai, Nanhui, new town, Hong Kong Road, No. 1758, room, building 1, room A-503 Patentee after: SHANGHAI CEDAR COMPOSITES TECHNOLOGY CO. LTD. Patentee after: Shanghai Cedar Composites Technology Co., Ltd. Address before: 201108 Shanghai, Cao Cao Road, No. 13, No. 1, building C1, floor 2, building F1, No. 14, building 1, Minhang District Patentee before: Shanghai Cedar Composites Technology Co., Ltd. |
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Address after: 201306 Shanghai, Nanhui, new town, Hong Kong Road, No. 1758, room, building 1, room A-503 Patentee after: Shanghai Jin Fei Polytron Technologies Inc. Patentee after: Shanghai Cedar Composites Technology Co., Ltd. Address before: 201306 Shanghai, Nanhui, new town, Hong Kong Road, No. 1758, room, building 1, room A-503 Patentee before: SHANGHAI CEDAR COMPOSITES TECHNOLOGY CO. LTD. Patentee before: Shanghai Cedar Composites Technology Co., Ltd. |
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