CN101958258B - Ball filling device and method - Google Patents

Abstract

The invention provides a ball filling device (10). The said device (10) is used to fill the conductivity ball (B) in multi openning (111) at the state of mounting mask (110) with multi openning (111) for arranging conductivity ball (B) on baseplate (100) above the baseplate (100). The said device comprises a number of headers (21a, 21b) of a number of groups (Bg1, Bg2) of conductivity balls on many part of the surface (110a) of the mask (110), which keep respectively independent, and header moving mechanism (30) for making the headers (21a, 21b) moving to make a number of groups (Bg1, Bg2) of conductivity balls move on the surface (110a) of the mask (110).

Description

Ball filling device and method

The application is to be that on 07 12nd, 2007, application number are 200710129442.6, denomination of invention is dividing an application of ball filling device and method the applying date.

Technical field

The present invention relates to a kind of ball filling device and method that adopts when being adapted at being configured in conductive ball on the assigned position of substrate.

Background technology

In order when semiconductor device is installed, to obtain electrical connection, adopted the conductive ball of solder ball etc.In international publication number WO2006/004000, disclose under the state that mask is arranged on the substrate device of filled conductive property ball in a plurality of openings of mask as the device of on the substrate of semiconductor crystal wafer etc., arranging conductive ball.This filling device has to mask side head outstanding, that have scraper plate.This head remains on the group of conductive ball in the regional area of mask surface through around being rotated with the perpendicular axle of mask.This filling device makes the head rotation on one side, Yi Bian this vertical axle is moved along the surface of mask, thus the conductive ball that will be maintained in the above-mentioned zone is filled in a plurality of openings of mask successively.

The filling device that adopts international publication number WO2006/004000 to be put down in writing remains under the state in the localized area of mask surface in the group with conductive ball, and head moves on mask.Thus, the conductive ball that remains in the above-mentioned zone is filled in a plurality of openings of mask successively.Therefore, adopt this filling device, even the negligible amounts of conductive ball also can improve the density of conductive ball in the zone, filled conductive property ball in the opening of the mask of the part of therefore also can be expeditiously passing through to this zone.In addition, compare with on whole mask, evenly keeping the situation of conductive ball, the amount that should remain on the conductive ball in the localized area of mask surface is considerably less.Therefore, can reduce conductive ball, reduce the loss of the conductive ball that causes by filling because of on mask, moving the quantity that possibly sustain damage.

In order on substrate, to arrange conductive ball, need make head pass through the lip-deep whole zone that should carry conductive ball of mask.Therefore, on 1 substrate, arrange conductive ball and need the time to a certain degree.Seek a kind of can be with arranging the needed time of conductive ball the method that (below be called the productive temp time) shortens on 1 substrate.

1 method that reduces the filling error incidence of conductive ball is not have to omit ground the lip-deep whole zone that should carry conductive ball of mask is covered.In international publication number WO2006/004000, disclose the method that mode that an a kind of part of track of the zone with the group that keeping conductive ball repeats moves head.But the mode that repeats owing to the part with regional track moves head, and has prolonged the productive temp time.

Summary of the invention

A mode of the present invention is: a kind of device (ball filling device); Be arranged under the state on the substrate will having the mask that is used for conductive ball is configured in a plurality of openings (little opening, through hole) on the substrate; Filled conductive property ball in a plurality of openings; This device comprises a plurality of heads and head moving mechanism (head mobile unit, head mobile device), and this head is used for the group that on a plurality of parts of mask surface, keeps a plurality of independently conductive balls respectively; Head moving mechanism is used to make a plurality of heads to move, so that the group of a plurality of conductive balls moves on mask surface.

1 method that shortens the productive temp time is to improve the translational speed of head.But, when having improved the translational speed of head, have the generation rate of the opening of filled conductive property ball not, promptly fill the tendency that the error incidence rises.Fill error incidence this point from reducing, not as the preferred method that reduces the head translational speed.

As the another kind of method that shortens the productive temp time, considered to maintain regional such method of the group of conductive ball with the part of comparing enlarged head, promptly enlarge mask surface in the past.The width that is the track (through band) that passes through through enlarged head shortens the productive temp time method.But, when having enlarged the group that maintains conductive ball regional,, then might make and fill the error incidence and raise if the amount of the conductive ball that remains on this intra-zone is increased.Because the area in zone is with square expansion through bandwidth, when the amount that therefore will make the conductive ball of per unit area is constant, the amount of conductive ball at least need with square quantity increase.

And when having enlarged region area, conductive ball is higher to be multilayer at above-below direction or to be the probability that the state of heap exists.Therefore, in being distributed in the zone, help to the little opening (perforate) of the mask that has a due proportion of of conductive ball in the amount of the conductive ball of filling might reduce.From reduce filling error incidence this point, hope to keep the area in zone of conductive ball less.In order to reduce the fault rate that comprises damage conductive ball etc., also hope to keep the area in zone of conductive ball less.

Adopt this ball filling device; The group that on a plurality of parts of mask surface, is keeping a plurality of independently (demarcate, distinguish) conductive ball through a plurality of head respectively; And a plurality of heads are moved through head moving mechanism, make the group of a plurality of conductive balls on mask surface, move.Adopt this ball filling device; Not enlarged head process track (through band) width but through increasing the number of head, just can not enlarge each through the width of band with narrow state, or make each narrowed width shorten the productive temp time through band.Therefore, the increase of head dimensions can be suppressed, and the increase of regional area (below the be called moving zone) area of the group that maintains conductive ball of mask surface can be suppressed.Can realize shortening the productive temp time simultaneously and suppress the purpose that moving region area increases.Also can seek to realize simultaneously shortening the purpose of productive temp time and the loss late that reduces conductive ball.Adopt this ball filling device, can select to reduce the head translational speed and replace the shortening productive temp time.Though define the shortening amount of productive temp time, the reduction amount of head translational speed, also can shorten the productive temp time simultaneously and reduce the head translational speed.Therefore, also can further reduce filling error incidence.

In this ball filling device, preferably further has ball supply establishment.This ball supply establishment is used for each head through a plurality of heads to group's supply conductive ball of separately conductive ball.Through ball supply establishment, can the amount by the conductive ball that each head kept be remained on the efficiently amount of filled conductive property ball.The consumption of ball is not defined as in all heads (all moving zones that are made up of a plurality of heads) all identical.In this case, ball supply establishment preferably can pass through each head supply conductive ball in each moving zone independently.Ball supply establishment also can have a plurality of spherical tanks corresponding respectively with a plurality of heads.In this case, can be from a plurality of spherical tanks respectively to a plurality of head supply conductive balls.In addition, also can make ball supply establishment supply with conductive ball to a plurality of heads from 1 spherical tank.

When a plurality of heads are moved with identical speed, preferably make a plurality of nose shapes identical, and a plurality of heads are synchronously moved by head moving mechanism.When ball is sprinkled into, can be used at least a portion general (communization) of a plurality of heads being carried out device driven (motor or workbench etc.) basically.These a plurality of heads move on 2 dimensional planes.Therefore, can simplify the structure of head moving mechanism.The shape of a plurality of heads is had nothing in common with each other, also can make each head carry out different motions in addition.

One example of head moving mechanism is: keep a plurality of heads side by side along the 1st direction, and make the 2nd direction that their edges and the 1st direction are intersected carry out back and forth movement, and each end of these a plurality of heads back and forth movement of the 2nd direction on the edge is moved along the 1st direction.A plurality of heads are synchronously moved along the 2nd direction.Therefore, it is general along the device (motor or workbench etc.) that the 2nd direction moves to be used in a plurality of heads.Each end through making a plurality of heads back and forth movement of the 2nd direction on the edge carries out identical moving along the 1st direction, can further make a plurality of heads on the 1st direction, also carry out same moved further.It is general along the device (motor or workbench etc.) that the 1st direction moves to be used in a plurality of heads.On the other hand, carry out opposite moving along the 1st direction, a plurality of heads are moved symmetrically through each end that makes a plurality of heads back and forth movement of the 2nd direction on the edge.

Another example of head moving mechanism is: keep a plurality of heads side by side along the 1st direction; And make them carry out back and forth movement, and make each end edge of these a plurality of heads back and forth movement of the 1st direction carry out identical moving with the 2nd direction that the 1st direction is intersected on the edge along the 1st direction.It is another example that a plurality of heads are synchronized with the movement along the 1st and the 2nd direction respectively.It is general to be used in the device (motor or workbench etc.) that a plurality of heads move.

When considering the easy degree of supply conductive ball in each head, preferably the ball consumption (consumption rate) in each head is approximate.When substrate is the flat circle shape; Keep a plurality of heads side by side with edge the 1st direction; And make the 2nd direction that their edges and the 1st direction are intersected carry out back and forth movement; And make each end of these a plurality of heads back and forth movement of the 2nd direction carry out identical or opposite mobile phase ratio along the 1st direction on the edge; Keeping a plurality of heads side by side along the 1st direction; And make them carry out back and forth movement along the 1st direction, and make each end edge of these a plurality of heads back and forth movement of the 1st direction carry out identical this mode that moves with the 2nd direction that the 1st direction is intersected on the edge, make the ball consumption (because of conductive ball being packed into the consumption (consumption rate) of the conductive ball that produces in the opening of mask) in each head approximate more easily.

Under the situation that two head are synchronously moved along the 1st and the 2nd direction, when being discoideus, the interval of two head is preferably the half the of substrate diameter at substrate.In addition; Under the situation that two head are synchronously moved along the 1st and the 2nd direction; When substrate is square tabular or rectangular plate shape, Yi Bian two head preferably with certain configuration side by side abreast of substrate, and make two head be spaced apart the half the of the above-mentioned length of side.At substrate is when having long limit and minor face square tabular, two head more preferably with the minor face configuration side by side abreast of substrate, and make the bond length that is spaced apart aforesaid substrate half the of two head.

The structure that freely changes the interval of head adjacent each other also is effective.Therefore, in this ball filling device, the head rest supporting mechanism such, that supporting a plurality of heads (head rest supporting unit, head support device) that preferably further has the variable spaced of head adjacent each other.Through head moving mechanism head rest supporting mechanism is moved, thus can simplified structure.In addition, through designing the head rest supporting mechanism of above-mentioned that kind, can the interval of head adjacent each other be changed to desired value in view of the size of the substrate that has disposed conductive ball and shape etc.

In this ball filling device; Also has the head rest supporting mechanism of supporting a plurality of heads, moving it by head moving mechanism; A plurality of heads comprise the 1st head adjacent each other and the 2nd head, also can head rest supporting mechanism be made have pedestal, the structure of guide rail and retainer.This guide rail is arranged on the pedestal, is slidably supporting the 2nd head, to change the interval of the 2nd head and the 1st head; This retainer is fixed with respect to the slip of pedestal the 2nd head.

Adopt this ball filling device, can the interval of the 1st head and the 2nd head be changed to desired interval in view of the size of the substrate that has disposed conductive ball and shape etc.And, remain under the state at desired interval at interval the 1st head and the 2nd head, can the 1st head and the 2nd head be moved by head moving mechanism and through head rest supporting mechanism, and conductive ball is configured on the substrate through mask.In addition, adopt this ball filling device, also can make structure with the interval of manual change the 1st head and the 2nd head.Through the head rest supporting mechanism of above-mentioned that kind is set, a kind of ball filling device that does not use variable spaced motor etc., simply constructed, the 1st head and the 2nd head can be provided.

In above-mentioned filling device, head rest supporting mechanism is moved by head travel mechanism, is preferably supporting a plurality of heads, and a plurality of heads are rotated around the axis vertical with mask respectively.Preferably each head has respectively through being that the center is rotated with vertical axis; And from be positioned at mask surface and with vertical axis be central circular moving zone around compile the mechanism of conductive ball towards this moving zone, and will move the surface portion that the zone forms the mask of the group that maintains conductive ball.Such head rest supporting mechanism can form moving the zone independently a plurality of or circle that difference is different.Therefore circular moving zone can not have the advantage of the moving direction that can select moving zone arbitrarily owing to moving direction makes the ability generation quality of compiling or keeping ball.

Other type of the present invention has ball maintaining body and travel mechanism for being arranged under the state on the substrate to the device (ball filling device) of a plurality of opening filled conductive property balls will having the mask that is used for conductive ball is configured in a plurality of openings (little opening, through hole) on the substrate.The ball maintaining body be used to form a plurality of that on the surface of mask, move, maintain the moving zone of the group of a plurality of independently conductive balls respectively; Travel mechanism is used to make the ball maintaining body to move.Because this device is divided into a plurality of moving zones and moves the surface that has covered mask through making, therefore can suppress to move the region area increase, and can seek the shortening of productive temp time.

In this ball filling device, preferably further has the ball supply establishment that is used for respectively to the inside in a plurality of moving zones supply conductive ball.Intention reduce the area in moving zone and suppress to remain on the conductive ball in the moving zone amount increase or when reducing the amount of conductive ball, because (because of filled conductive property ball in opening produces) consumption of conductive ball aggravates the change of the amount of conductive ball easily.Even filling ball in the opening of mask and cause the conductive ball in a plurality of moving zones produce to consume; Rely on ball supply establishment supply conductive ball in a plurality of moving zones, can be thereby also in a plurality of moving zones, respectively conductive ball is maintained by the amount of in the opening of mask, filling expeditiously.Ball supply establishment preferably can supply with the ball of the amount that has nothing in common with each other in each moving zone.In a plurality of independently moving zones, the consumption rate of conductive ball possibly have nothing in common with each other, but operates through above-mentioned suchly, can in a plurality of moving zones, remain (keeping) an amount of ball.

1 mode of the device that is used for filling ball that the present invention contained has a plurality of heads and a plurality of axle for the ball maintaining body.A plurality of heads are used for respectively conductive ball being enclosed into the inside in a plurality of moving zones; A plurality of axles are used to make a plurality of heads to be connected with travel mechanism respectively.The ball maintaining body preferably has the ball supply passageway.This ball supply passageway passes a plurality of axle separately, be used for to enclose by each head into each inner conductive ball that imports in a plurality of moving zones.

Ball supply establishment is preferably to each inner supply conductive ball in a plurality of moving zones, has the zone of conductive ball and do not have the zone of conductive ball with formation.In the zone that has conductive ball with not exist the area limit of conductive ball partly to make conductive ball be the part of one deck.When conductive ball was opening through mask of the part of one deck, filled conductive property ball was most effective in the opening of mask.Therefore, there is the zone of conductive ball and do not have the ball supply establishment of mode supply conductive ball in the zone of conductive ball through being provided with, expeditiously filled conductive property ball in the opening of mask with formation.

In this case, ball supply establishment can be the mode of mode supply conductive ball in each moving zone of 1/10～2/3 with respect to the ratio of the area in moving zone with the area in the zone that has conductive ball more preferably.Under the situation the area in the zone that has conductive ball is in 1/10～2/3 scope with respect to the ratio of the area in moving zone in; The conductive ball that has formed well in the inside in moving zone is the part of one deck; When the opening of moving zone passage mask, filled conductive property ball in the opening of mask expeditiously.

Be used for the device of filling ball at this, the shape in a plurality of moving zones can be identical, also can be different.When the shape in a plurality of moving zones is identical; Preferably utilize the ball maintaining body to make a plurality of moving zones form the form of arranging along the 1st direction; Travel mechanism makes identical moving regional edge of these shapes and the 2nd direction that the 1st direction is intersected carry out back and forth movement, and each end of these moving zone back and forth movements of the 2nd direction on the edge is moved along the 1st direction.Select the track that can shorten so a plurality of moving zones of productive temp time easily.And, because a plurality of moving area synchronized ground is moved along the 2nd direction, therefore can simplify the structure that is used to make the device (motor or workbench etc.) that the ball maintaining body moves along the 2nd direction.

When the shape in a plurality of moving zones is identical; Also can utilize the ball maintaining body to make a plurality of moving zones form the form of arranging along the 1st direction; Travel mechanism makes the identical moving zone of these shapes carry out back and forth movement along the 1st direction, and makes each end edge of these moving zone back and forth movements of the 1st direction on the edge carry out identical moving with the 2nd direction that the 1st direction is intersected.Operate like this, also select the track that can shorten so a plurality of moving zones of productive temp time easily.At this moment; Because a plurality of moving zones, can be simplified the structure that is used to make the device (motor or workbench etc.) that the ball maintaining body moves along the 1st direction and is used to make the device (motor or workbench etc.) that the ball maintaining body moves along the 2nd direction respectively along the same moved further of the 1st and the 2nd directions.

When substrate is the flat circle shape; Make the identical moving zone of a plurality of shapes carry out back and forth movement along the 1st direction; And identical moving carried out with the 2nd direction that the 1st direction is intersected in each end edge of these a plurality of moving zones back and forth movement of the 1st direction on the edge, thereby can make the ball consumption (because of conductive ball being packed into the consumption of the conductive ball that produces in the opening of mask) in each moving zone approximate respectively.At this moment, the operation of supply ball is more or less freely in each moving zone.

Other type of the present invention is the ball carring device that has the device that is used for filling ball of above-mentioned that kind and under the state that mask is arranged on the substrate, keep the device of mask.Ball carring device also can be the device that has the objective table that for example supporting substrate, be used on substrate, applying the solder flux printing equipment of solder flux and transmit objective table etc., and in a series of operation, ball is arranged on the substrate.

Other type of the present invention is for through being used for being arranged under the state on the substrate method of on substrate, carrying conductive ball to the device (ball filling device) of a plurality of opening filled conductive property balls will having the mask that is used for conductive ball is configured in a plurality of openings on the substrate.Filling device has ball maintaining body and travel mechanism.The ball maintaining body is used on a plurality of parts on the surface of mask, forming a plurality of moving zones that maintain the group of a plurality of independently conductive balls respectively; Travel mechanism is used to make the ball maintaining body to move, so that the group of a plurality of conductive balls moves on the surface of mask.This method comprises following operation.

(a) by the ball maintaining body a plurality of independently conductive ball group is remained on respectively in a plurality of zones of mask surface.

(b) by head moving mechanism the ball maintaining body is moved, make that the part of the track in each moving zone repeats in each zone that each moving zone is passed through, at each regional boundary, the part of the track in different moving zones repeats mutually.

Adopt this method, moved with the mode of the track repetition in this moving zone in 1 moving zone, only the part of the track in mutually different moving zone is repeated at these regional boundarys.In the method, mark off main zone of being responsible for filling, each zone in a plurality of moving zones.With respect to the part of the track in mutually different moving zone being repeated all the time on one side; On the whole plane of mask, move such method on one side; Through being divided into main zone of being responsible for filling, each zone in a plurality of moving zones; Owing to can shorten the displacement separately in a plurality of moving zones, therefore can shorten the productive temp time effectively.

When a plurality of moving region shapes were identical, in the method, operation (b) (mobile process) preferably included following operation.

(b11) keep a plurality of identical shaped moving zones side by side along the 1st direction, and make the 2nd direction that their edges and the 1st direction are intersected carry out back and forth movement.

(b12) each end of the back and forth movement of the 2nd direction makes a plurality of identical shaped moving zones move along the 1st directions on the edge.

In addition, when a plurality of moving region shapes were identical, in this ball mounting method, operation (b) (mobile process) also can comprise following operation.

(b21) keep a plurality of identical shaped moving zones side by side along the 1st direction, and make them carry out back and forth movement along the 1st direction.

(b22) each end of the back and forth movement of the 1st direction makes a plurality of identical shaped moving regional edges carry out identical moving with the 2nd direction that the 1st direction is intersected on the edge.

The ball maintaining body has a plurality of heads and a plurality of axle.A plurality of heads are used for the group of conductive ball is enclosed respectively into the inside in a plurality of moving zones; A plurality of axles are used to make a plurality of heads to be connected with travel mechanism respectively.When the variable spaced of head adjacent each other, this method also may further include following operation.

Through changing the interval of head adjacent each other, the interval in moving zone adjacent each other is set at setting.

In this case, (b) operation (mobile process) preferably includes following operation.

(b ') makes the interval in moving zone adjacent each other remain setting, and a plurality of moving zones are moved by this way, thus make in each moving zone in each zone of process, part of the track in each moving zone repeats; At each regional boundary, the part of the track in different moving zones repeats mutually.

Other type of the present invention is for through being used for being arranged under the state on the substrate method of on substrate, carrying conductive ball to the device (filling device) of a plurality of opening filled conductive property balls will having the mask that is used for conductive ball is configured in a plurality of openings on the substrate.Filling device has ball maintaining body and travel mechanism.The ball maintaining body is used on the part of mask surface, forming the moving zone of the group that maintains conductive ball; Travel mechanism is used to make the ball maintaining body to move.A plurality of openings of mask have to be dispersed into a plurality of opening groups that rectangular mode is provided with.This method comprises following operation.

(c) remain in the moving zone of mask surface by the group of ball maintaining body conductive ball.

(d) by travel mechanism the ball maintaining body is moved; Thereby comprising several being arranged in a plurality of fill areas a string opening group, parallel to each other respectively; The regional mode that repeats with at least a portion of its track is moved; And the zone is moved through what fill area adjacent each other was coupled together regionally, so that between fill area adjacent each other, form moving regional unsanctioned empty band between fill area adjacent each other.

Printed wiring boards (printed circuit board) etc. are for being equipped with the substrate of a plurality of semiconductor chips (semiconductor device) with rectangular or array-like.In such substrate, a plurality of electrodes have a plurality of electrode groups that the mode of rectangular to be dispersed into (array-like) is provided with.Therefore in order on such substrate, to dispose conductive ball, a plurality of openings of mask and a plurality of electrodes of substrate have a plurality of opening groups that the mode of rectangular to be dispersed into (array-like) is provided with accordingly.

Therefore, under these circumstances, in a plurality of fill areas of the opening group that comprises several a string arrangements respectively, a plurality of openings need be set and filled conductive property ball in each opening.On the other hand, between fill area adjacent each other, there is not opening, do not need filled conductive property ball.In order to shorten the productive temp time, preferred moving zone is omitted as far as possible and is not needed the zone (empty band) of filled conductive property ball, and on mask, moves expeditiously.

Adopt this method, in the fill area, the regional mode that repeats with at least a portion of its track is moved.In addition, between fill area adjacent each other, zone passage is moved regionally with what fill area adjacent each other coupled together, so that between fill area adjacent each other, form moving regional unsanctioned empty band.Therefore, adopt this method, compare, can shorten the productive temp time with the method that the zone is moved with the mode that contains empty band.

In the method; At the ball maintaining body is when being used to form the member in a plurality of moving zones, and preferably in (c) (maintenance operation), the group with a plurality of conductive balls remains in a plurality of moving zone of mask surface by the ball maintaining body; In (d) operation (mobile process); Make the interval in a plurality of moving zones remain setting, and the mode that each moving zone is repeated with at least a portion of track in the fill area respectively moves, move to adjacent fill area through join domain.

Other type of the present invention is for through being used for being arranged under the state on the substrate device (filling device) to a plurality of opening filled conductive property balls, the method for on substrate, carrying conductive ball will having the mask that is used for conductive ball is configured in a plurality of openings on the substrate.Filling device has ball maintaining body, travel mechanism and ball supply establishment.The ball maintaining body is used on the part of mask surface, forming the moving zone of the group that maintains conductive ball; Travel mechanism is used to make the ball maintaining body to move; Ball supply establishment is used for the group's supply conductive ball through the electrical ball of ball maintaining body guide.This method comprises following operation.

(e) group of conductive ball is remained on the operation in the moving zone of mask surface by the ball maintaining body.

(f) by travel mechanism the ball maintaining body is moved, thus the operation that the zone is moved.

(g) by ball supply establishment to moving intra-zone supply conductive ball, have the zone of conductive ball and do not have the operation in the zone of conductive ball with formation.

Because through the supply conductive ball, form the zone that has conductive ball and the zone that does not have conductive ball, be the part of one deck and formed conductive ball in moving regional inside, so filled conductive property ball in the opening of mask expeditiously.

In the method, in (g) operation (supply operation), preferably with respect to the ratio of the area in moving zone 1/10～2/3 mode supply conductive ball with the area in the zone that has conductive ball.Because in the inside in moving zone, having formed conductive ball well is the part of one deck, when the opening of moving zone passage mask, filled conductive property ball in the opening of mask more expeditiously.

In the method; At the ball maintaining body is the mechanism that is used to form a plurality of moving zones; And have the group that is used for a plurality of independently conductive balls enclose respectively at a plurality of heads of the inside in a plurality of moving zones when being used to make a plurality of that a plurality of heads are connected with travel mechanism respectively, preferably in (e) (maintenance operation), the group with a plurality of conductive balls remains in a plurality of moving zone of mask surface with the ball maintaining body; In (f) operation (mobile process); By travel mechanism the ball maintaining body is moved, thereby a plurality of moving zones are moved, in (g) operation (supply operation); Utilize ball supply establishment respectively to the inside in a plurality of moving zones supply conductive ball, have the zone of conductive ball and do not have the zone of conductive ball with formation.

Description of drawings

Fig. 1 is the vertical view of an example of expression ball carring device of the present invention.

Fig. 2 is the vertical view of schematic configuration of the ball filling device of expression the 1st execution mode of the present invention.

Fig. 3 is the cutaway view of the ball filling device of Fig. 2.

Fig. 4 is the cutaway view of the 1st modified example of the ball filling device of presentation graphs 2.

Fig. 5 is the cutaway view of the 2nd modified example of the ball filling device of presentation graphs 2.

Fig. 6 is the cutaway view of the 3rd modified example of the ball filling device of presentation graphs 2.

Fig. 7 is the cutaway view of the part of expression ball maintaining body.

Fig. 8 is a perspective view of representing the structure of two head from the top.

Fig. 9 is the figure that is used to explain the 1st example of the track that moves the zone, is the figure of expression original position.

Figure 10 is the figure of the 1st example that is used to explain the track in moving zone, is the figure of the track of expression when making the zone move to the interstage.

Figure 11 is the figure of the 1st example that is used to explain the track in moving zone, is the figure of the track of expression when making the zone move to final stage.

Figure 12 is the figure of the 1st example of the track of selecting the moving zone of the side track of representing moving zone.

Figure 13 is the figure of the 1st example of the part of the track that amplified moving zone (through the band) track of representing moving zone.

Figure 14 is the figure that is used to explain the 2nd example of the track that moves the zone, is the figure of expression original position.

Figure 15 is the figure of the 2nd example that is used to explain the track in moving zone, is the figure of the track of expression when making the zone move to the interstage.

Figure 16 is the figure of the 2nd example that is used to explain the track in moving zone, is the figure of the track of expression when making the zone move to final stage.

Figure 17 is the figure that is used to explain the 3rd example of the track that moves the zone.

Figure 18 is the figure that the 3rd a routine side of the track in the moving zone of expression moves the track (through band) in zone.

Figure 19 is the flow chart of an example of expression ball filling device control method.

Figure 20 is the vertical view of schematic configuration of the ball filling device of expression the 2nd execution mode of the present invention.

Figure 21 is a part and the end view represented that removes the ball filling device of Figure 20.

Embodiment

In Fig. 1, represented an example of ball carring device of the present invention with vertical view.Ball carring device 1 is also referred to as the ball fitting machine, is the device that is used on the assigned position of substrate 100, arranging conductive ball.In the present example, with the semiconductor crystal wafer of 8 inches of nominals or 12 inches as substrate 100.In addition, substrate 100 is not defined as semiconductor crystal wafer.Substrate also can be the printed wiring board (printed circuit board (PCB)) that for example comprises the rectangle that semi-conductive semiconductor mounting substrate (semiconductor mounting substrate) or multilager base plate etc. are installed.

Be equipped on conductive ball on the substrate 100 and play the effect of electrode etc., for example diameter is below the 1mm, and specifically diameter is about 10～500 μ m.Conductive ball comprises the ball of metal ball, the ball that also has ceramic or plastic balls such as solder ball (ball argentiferous (Ag) and copper (Cu) etc., that main component is made up of tin (Sn)), gold or silver having been implemented processing such as conductivity plating.In the present example, be that solder ball about 90 μ m is as conductive ball with straight line.

This ball carring device 1 has XYZ θ objective table 2, charging/device for discharging 3, prealignment device 4, apparatus for correcting 5, solder flux printing equipment (flux coating device) 6, ball filling device 10 and objective table conveyer 7.XYZ θ objective table 2 is used to be provided with the wafer of having corrected silicon wafer warpage through methods such as decompression attractions; Charging/device for discharging 3 is used for loading (supply) and unloading (accommodating) wafer 100 with respect to this objective table 2; Prealignment device 4 is used for inching is carried out in the position of wafer 100; Apparatus for correcting 5 is used to correct the warpage of wafer 100; Solder flux printing equipment 6 is used on wafer 100, applying solder flux; Ball filling device 10 is used for conductive ball being arranged (carry, dispose) at wafer 100 through mask 110; Objective table conveyer 7 has X axle workbench, Y axle workbench, Z axle workbench and θ workbench.Prealignment device 4, charging/device for discharging 3, apparatus for correcting 5, solder flux printing equipment 6 and ball filling device 10 dispose along directions X side by side.Be supported at wafer 100 under the state on the upper surface (in the present example for X-Y plane) of objective table 2, this wafer 100 moves between apparatus for correcting 5, solder flux printing equipment 6 and ball filling device 10 through objective table conveyer 7.In addition, the method that wafer 100 is remained on the objective table 2 is not limited to decompression absorption, also can be the such mode of electrostatic chuck, in addition also can be also with these two kinds of methods.

In Fig. 2, represented the schematic configuration of the ball filling device of the 1st execution mode of the present invention with vertical view.In Fig. 3, represented the schematic configuration of the ball filling device of Fig. 2 with cutaway view.

Ball filling device 10 is used for being arranged under the state on this wafer 100 a plurality of openings that conductive ball are filled into mask 110 will having the mask 110 that is used for conductive ball is configured in a plurality of openings on the wafer 100.A plurality of openings of mask 110 are used for each conductive ball is configured in the assigned position of substrate (wafer) 100, and the diameter of opening is corresponding with the size of conductive ball.

The control part 50 that ball filling device 10 comprises ball maintaining body 20, is used to the mobile device (travel mechanism) 30 that ball maintaining body 20 is moved, the ball feeding device (the ball feed mechanism below is called the ball device for supplying) 40 that is used for the supply conductive ball and ball maintaining body 20, mobile device 30 and ball device for supplying 40 are controlled.Ball maintaining body 20 be used to form at least 1 independent parts, for example two independent parts A1 and A2 (below be called moving zone; With reference to Fig. 3), 110a is last moves at surface, the for example upper surface (being X-Y plane in the present example) of mask 110 respectively for two moving regional A1 and A2.Ball device for supplying 40 is supply conductive ball in two moving regional A1 and A2 respectively.

Two moving regional A1 that form by ball maintaining body 20 and A2 be used for two independently the group of conductive ball remain on respectively mask 110 surface (upper surface) 110a difference in the localities.As be used for two independently the group of conductive ball remain on two of upper surface 110a moving regional A1 of mask 110 and the ball maintaining bodies 20 on the A2 respectively; Can enumerate example with two head (distributor) 21a and 21b; In the present example, two head 21a and 21b are by 35 supportings of head supporting arrangement (head rest supporting mechanism).In addition, also Be Controlled portion 50 controls of the action of head support device 35.

The mobile device (mobile unit, head mobile device, head mobile unit, head moving mechanism) 30 that is used to make the ball maintaining body 20 that comprises head 21a and 21b to move has X axle workbench 31x, a pair of Y axle workbench 31y ₁And 31y ₂ X axle workbench 31x has motor 32x, a pair of Y axle workbench 31y ₁And 31y ₂Has motor 32y respectively ₁And 32y ₂ X axle workbench 31x is with across a pair of Y axle workbench 31y ₁And 31y ₂Mode be configured.Head support device 35 moves by X axle workbench 31x, and X axle workbench 31x is by Y axle workbench 31y ₁And 31y ₂Move, thereby the ball maintaining body 20 that comprises head 21a and 21b is moved to any direction of 2 dimension directions on the surperficial 110a of mask 110 through head support device 35.

Head support device 35 has the X axle workbench 36x that extends, changes the distance between two head 21a and the 21b along directions X ₁And 36x ₂Head is with X axle workbench 36x ₁And 36x ₂Have motor respectively, can make head 21a and 21b with arbitrary speed or synchronously to the same direction of directions X, or move with the different directions of arbitrary speed to directions X.

In addition, head support device 35 has head with Z axle workbench 36z ₁And 36z ₂Head is with Z axle workbench 36z ₁And 36z ₂Has motor respectively.Therefore, two head 21a and 21b can change height in the state lower edge Z direction (being above-below direction in the present example) that is arranged in arbitrary interval on the directions X (the 1st direction).

In addition, head support device 35 has motor 37a and 37b and axle (axle) 38a and the 38b of two head rotation usefulness.Axle 38a and 38b extend along the Z direction, are used for respectively motor 37a and 37b being connected with head 21a and 21b.Motor 37a and 37b are bearing in head respectively with X axle workbench 36x ₁And 36x ₂On.Therefore, head support device 35 is supporting two head 21a and 21b respectively, and, head 21a and 21b are rotated around axle 38a and 38b respectively.In the present example, the central axis of these two axle 38a and 38b becomes the rotation of head 21a and 21b (axis vertical with mask 110) P1 and P2 respectively, and head 21a and 21b are that the center is rotated (rotation) with vertical axis P1 and P2 respectively.Ball maintaining body 20 with two head 21a and 21b is bearing on the head mobile device 30 through head support device 35 in a movable manner.

The head of head support device 35 that is supporting ball maintaining body 20 is with X axle workbench 36x ₁And 36x ₂Be installed in through metal parts 33 on the X axle workbench 31x of mobile device 30.Therefore, the two head 21a and the 21b that are supported on the head support device 35 move, and make the group of two conductive balls synchronously move at the upper surface 110a of mask 110 upper edge directions X and/or Y direction.In more detail, in the present example, head 21a and 21b fix through the interval of 35 pairs of directions Xs of head support device on upper surface 110A (X-Y plane) or make it become variable state, utilize mobile device 30 synchronously to move along the Y direction simultaneously.Below, in the present example, mobile device 30 is called the head mobile device.

As shown in Figure 3, on ball maintaining body 20, be equipped with ball device for supplying 40.This ball device for supplying 40 is used for difference supply conductive ball in two that form respectively through two head 21a and 21b moving regional A1 and A2.Ball device for supplying 40 has 1 spherical tank 41 and the support unit 42z that is supporting this spherical tank 41.Ball device for supplying 40 synchronously moves through support unit 42z and ball maintaining body 20.

Ball device for supplying 40 is to the inside of two head 21a and 21b filled conductive property ball.In the present example, the inside of axle 38a and 38b is hollow state, is inserted with respectively in the upper end of each 38a and 38b from spherical tank 41 extended flexible pipe 43a and 43b.Thus, be used for that craniad the inside of 21a and 21b, path (ball supply passageway) 49a that promptly supplies with ball by the moving regional A1 and the A2 of this two head 21a and 21b defined and 49b are made up of flexible pipe 43a and 43b and axle 38a and 38b respectively from spherical tank 41. Axle 38a and 38b play the effect of the rotating shaft of head 21a and 21b respectively, and become the part of ball supply passageway 49a and 49b.In this ball device for supplying 40, can in two moving regional A1 and A2, supply with conductive ball through two head 21a and 21b respectively.By the group supply conductive ball of ball device for supplying 40 to two conductive balls.

In addition, in above-mentioned ball device for supplying 40, be in two moving regional A1 and A2, to replenish conductive ball, but the ball device for supplying is not limited thereto from 1 spherical tank.In Fig. 4, represented the modified example of ball device for supplying with cutaway view.As shown in Figure 4, ball device for supplying 40 also can have respectively and two moving regional A1 and corresponding spherical tank 41a of A2 and 41b. Spherical tank 41a and 41b are supported parts 42z respectively ₁And 42z ₂Supporting.

For any ball device for supplying, all hope to be controlled to and to supply with ball independently or with the different moment respectively for each moving regional A1 and A2.Also can the ball device for supplying be controlled to the ball of each moving regional A1 and A2 being supplied with simultaneously same amount.

In addition, in above-mentioned head support device 35, has head with X axle workbench 36x ₁And 36x ₂, this X axle workbench 36x ₁And 36x ₂Has motor, to change the distance between two head 21a and the 21b.For can be located at structure on the head support device, be used to change distance between two head 21a and the 21b between the structure of distance do not limit.

In Fig. 5, represented the another modified example of ball filling device with partial sectional view.This ball filling device 10 is particularly suitable for when on discoideus wafer 100, carrying conductive ball, using.As after state, have in ball filling device 10 interval with two head 21a and 21b be made as diameter length half the of wafer 100 sometimes, and keeping this spacing ground carries (configuration) conductive ball on wafer 100 situation.The wafer 100 that major part is equipped with conductive ball is 8 inches or 12 inches.Therefore, hope can change to the interval of two head 21a and 21b 4 inches and 6 inches these two kinds of intervals.In ball filling device shown in Figure 5 10, can be manually will change to 4 inches and 6 inches these two kinds of intervals along the 1st head 21a adjacent each other of directions X setting and the interval of the 2nd head 21b.

In ball filling device shown in Figure 5 10, head support device 35 has pedestal 81, pair of guide rails 82 and retainer 83.Pair of guide rails 82 is located on this pedestal 81, is slidably supporting the 2nd head 21b, to change the interval of the 2nd head 21b and the 1st head 21a; 83 couples the 2nd head 21b of retainer fix with respect to the slip of pedestal 81.The 1st head 21a, electronic and 37a, and axle 38a etc. be fixed on the pedestal 81 through supporting member 89a.The 2nd head 21b, motor 37b, and axle 38b etc. through supporting member 89b, and on directions X, can be supported slidably by the guide rail 82 that is located on the pedestal 81.

Retainer 83 has two screw 84a and 84b that are located on the pedestal 81 and is used for supporting member 89b is fixed on the screw (bolt) 85 on the pedestal 81.Supporting member 89b through clamping screw 85 is screwed among screw 84a or the 84b, the 2nd head 21b is fixed with respect to the position of pedestal 81.In the present example, through screw 85 is screwed among the 1st screw 84a, make the interval (directions X) of the 1st head 21a and the 2nd head 21b remain on 4 inches.Through screw 85 is screwed among the 2nd screw 84b, make the interval (directions X) of the 1st head 21a and the 2nd head 21b remain on 6 inches.In addition, in the present example, screw is made as two, and the interval that can set is made as two, but also can increases the space-number that to set through the number that increases screw.

In Fig. 6, represented the another modified example of ball filling device with partial sectional view.This ball filling device 10 also can use when on the semiconductor crystal wafer 100 of flat circle shape, carrying conductive ball.Be particularly suitable for when on the wafer 100 of planar rectangular shape, carrying conductive ball, using.With printed wiring board 100 during as substrate, as after state, the interval of two head 21a and 21b is made as bond length half the of printed wiring board 100, and is keeping this spacing ground and on printed wiring board 100, carry (configuration) conductive ball.Different with semiconductor crystal wafer etc., the size of printed wiring board 100 that is equipped with conductive ball is varied.Therefore, preferably can the interval of two head 21a and 21b be changed to continuously the mode of arbitrary interval.In ball filling device shown in Figure 6 10, can be manually will change to the arbitrary interval in the prescribed limit along the 1st head 21a adjacent each other of directions X setting and the interval of the 2nd head 21b.

The retainer 83 that ball filling device 10 shown in Figure 6 is had comprises handle 86, through handle 86 is adjusted to latched position, the 2nd head 21b is fixed with respect to the slip of pedestal 81.In addition, remove the position, the 2nd head 21b can be slided with respect to pedestal 81 through handle 86 lock-bits being put revolve to turn 90 degrees to adjust to.

Therefore, the 2nd head 21b is slided with respect to pedestal 81, can change to arbitrary interval with manual interval with the 1st head 21a and the 2nd head 21b through handle 86 being adjusted to the releasing position.Afterwards, through handle 86 is adjusted to latched position, can make the interval of the 1st head 21a and the 2nd head 21b remain arbitrary interval.

Ball filling device 10 shown in Figure 6 also comprises the ruler 87 that is installed on the supporting member 89a and is installed in the pointer 88 on the supporting member 89b.In this ball filling device 10, on one side the position of pointer 88 indicating graduation chis 87 is confirmed, the 2nd head 21b is slided on one side with respect to pedestal 81, thereby can be easily the interval of the 1st head 21a and the 2nd head 21b be set at desired value.

Fig. 5 and ball filling device 10 shown in Figure 6 can omit the motor and the workbench at the interval that is used to change head 21a and 21b.Can provide a kind of interval that can easily change the 1st head 21a and the 2nd head 21b, simple structure and cheap ball filling device.In addition, in Fig. 5 and example shown in Figure 6, make the structure that the 2nd head 21b is slided with respect to pedestal 81, but also can make the structure that the 1st head 21a and/or the 2nd head 21b are slided with respect to pedestal 81.

Turn back to Fig. 2, to ball maintaining body 20, mobile device 30, head support device 35, and the X axle workbench 36x of the control part (control unit, control device) 50 controlled of ball device for supplying 40 and ball maintaining body 20 ₁And 36x ₂, Z axle workbench 36z ₁And 36z ₂, motor 37a and the 37b of head rotation usefulness, the X axle workbench 31x of head mobile device 30, Y axle workbench 31y ₁And 31y ₂Deng being connected, and connect into all can be with respect to the state of transmitting-receiving control information between these each parts, and the action of these each parts is controlled.

This control part 50 has the 1st function (ball maintenance function) 91.Mask 110 is being arranged under the state on the wafer 100, the 1st function 91 through two head 21a and 21b with two independently the group of conductive ball remain on respectively on two the moving regional A1 and A2 of a part of upper surface 110a of mask 110.In addition, this control part 50 has the 2nd function (locomotive function, moving regional locomotive function, head locomotive function) 92.The mode that the 2nd function 92 repeats with the part of the track of each moving regional A1 and A2 and the part of the track of different mutually moving regional A1 and A2 repeats moves two moving regional A1 and A2.More particularly; The 2nd function 92 is such function: through mobile device 30; Two head 21a and 21b are moved by this way: the part of the track of each moving regional A1 and A2 repeats in each zone that each moving regional A1 and A2 is passed through, and the part of the track in different moving zones repeats mutually in each regional boundary.

And 50 pairs of this control parts are from device for supplying 40 and through head 21a and 21b and the amount of the ball of group's supply of conductive ball is also controlled.This control part 50 has the 3rd function (ball makeup function) 93.The 3rd function 93 is passed through ball device for supplying 40 respectively to two inside supply conductive balls that move regional A1 and A2, and has formed zone that has conductive ball and the zone that does not have conductive ball.

This control part 50 also can double as for to making the function that whole ball carring device 1 is controlled, promptly to objective table 2, and the control part controlled of device 3,4,5 and 6.To objective table 2, and the control part controlled of device 3,4,5 and 6 also can be another parts of opening in 50 minutes with this control part.The major part of control part 50 constitutes with computer or microcomputer.Control part 50 comprises memory, in this memory, accommodates the program 50p of control usefulness.The program 50p of control usefulness comprises the program that is used for the program that the action of ball maintaining body 20 (head 21a and 21b) is controlled and is used for the action of ball device for supplying 40 is controlled.That is, the program 50p of control usefulness comprises and is used for the track (mobile alignment) of head 21a and 21b and the program controlled of supply ball in 21a and the 21b (supply constantly and increment) craniad.Program (program product) 50p of control usefulness provides with the mode that is recorded on the suitable recording medium such as ROM.The tiny balls loading attachment 1 of this example also can be controlled by computer internets such as LAN with the ball filling device 10 of this example, also can program 50p be provided by the server on the Internet etc.

In Fig. 7, represented the state that head 21a and 21b are moved with cutaway view on mask.In Fig. 8, represented the structure of two head 21a and 21b from upper perspective.

Mask 110 has a plurality of openings 111.The size of these a plurality of openings 111 is fit to small conductive ball B is inserted wherein one by one.Wafer 100 contains a plurality of semiconductor device usually, and in order conductive ball B to be configured in regularly on the assigned position of these semiconductor device, a plurality of openings 111 of mask 110 form the design (pattern) with repetition.The a plurality of openings 111 that are located on the mask 110 also are known as little opening, perforate, pattern hole etc.In addition, also these openings 111 are referred to as patterns of openings etc. sometimes.This mask 110 is fixed on the mask frame with the state that has been applied in tension force to a certain degree (tensile force), and masked holding device 11 (with reference to Fig. 1) keeps.In the present example; Mask 110 forms that to be used for diameter be that the conductive ball B of 90 μ m carries the structure on wafer 100; Mask thickness is about 50 μ m, and diameter is that the hole 111 about 100 μ m is opened in and is formed at the electrode 101 corresponding positions on the wafer 100.The openend in hole 111 also can chamfering.

In the present example, be used for to the structure of the two head 21a of a plurality of openings 111 filled conductive property ball B of mask 110 and 21b identical in fact.Head 21a and 21b have the discoid lower surface of scraping board support 61a and 61b and scraping board support 61a and 61b certainly respectively towards the upper surface 110a of mask 110 outstanding 12 groups of scraper plate 62a and 62b.The center of scraping board support 61a and 61b is connected with above-mentioned axle 38a and 38b respectively.This 38a and 38b are to extending with mask 110 vertical directions.

Head 21a and 21b drive scraping board support 61a and 61b through above-mentioned motor 37a and 37b respectively, make to scrape board support 61a and 61b sees from the top to rotation counterclockwise around axle 38a and 38b.In this head 21a and 21b, motor 37a and 37b become respectively drive scrape board support 61a and 61b, make scrape board support 61a and 61b along the upper surface 110a of mask 110 around mechanism that axle 38a and 38b are rotated. Axle 38a and 38b drive along the upper surface 110a of mask 110 through head mobile device 30 respectively and any direction on X-Y plane moves.Therefore, on one side head 21a and 21b can be rotated, drive and on the upper surface 110a of mask 110, move along any track Yi Bian pass through head mobile device 30 respectively.In addition, the direction of rotation of head (sense of rotation of head) also can be to be seen as clockwise direction from the top.The direction of rotation with head be made as from above when being seen as clockwise direction, scraper plate is configured to the state of mirror image switch.

Scraper plate 62a and 62b are so long as more mildly contact with the upper surface 110a of mask 110, and the member that can the ball B on the upper surface 110a be swept together gets final product.Be preferably, scraper plate 62a and 62b have in case ball B is inserted in the opening 111 just can not be with the flexible member of its degree that scrapes.As an example of such scraper plate, can enumerate out with the mode that contacts with the upper surface 110a of mask 110 crooked the such elastic component of rubber slab or the sponge of line, such shape of contacting with the upper surface 110a of mask 110, extend to the countless line of the degree that contacts with the upper surface 110a of mask 110 etc.

In the present example, head 21a and 21b are the structure that many superfine lines of boundling are used as scraper plate 62a and 62b, have adopted 12 groups of scraper plates, and through its two ends are riveted, this scraper plate plays the function of 1 scraper plate.The integral body of 12 groups of scraper plate 62a and 62b forms the U font respectively; With around the interior round A1 of rotating shaft 38a and 38b concentric circles and the A2; Equidistant with all in a circumferential direction, the counter clockwise direction straight-line extension of the tangential direction of interior round A1 in edge and A2 is to cylindrical C1 and C2.

Therefore; Under the upper surface 110a state of contact of scraper plate 62a and 62b and mask 110; Head 21a and 21b are seen from the top when counterclockwise being rotated, be in ball B on the direct of travel (direction of rotation) of scraper plate 62a and 62b and pushed away by circle A1 and A2 in two respectively and catch up with.Therefore, remain in ball B on the upper surface 110a of mask 110 circle A1 or A2 in two and move, and the inside of circle A1 or A2 in concentrating on.

That is, in the ball maintaining body 20 that has adopted this head 21a and 21b, two moving regional A1 and A2 on the variant part of the upper surface 110a that interior round A1 and A2 and the Bg1 of group and the Bg2 that are used for conductive ball remain on mask 110 are corresponding. Scraper plate 62a and 62b become ball are trapped among the mechanism among moving regional A1 and the A2.In the present example, the shapes of two moving regional A1 and A2 are identical in fact, and these two moving regional A1 and A2 and head 21a and 21b one coexist mobile on the mask 110.

In addition, in the present example, moving regional A1 and A2 are in respectively on the upper surface 110a of mask 110, become being the moving zone of central circular with mask 110 vertical axis P1 and P2 ( axle 38a and 38b). Scraper plate 62a and 62b are respectively around being rotated with mask 110 vertical axis P1 and P2 ( axle 38a and 38b); Thereby become driven region A1 and A2 around compile the mechanism of conductive ball B, and make independently two parts of the upper surface 110a of mask 110, promptly maintain the independently Bg1 of group and the Bg2 of two each and every one conductive balls respectively among moving regional A1 and the A2.And, through the rotation of head 21a and 21b, conductive ball B can not concentrated on the interior round A1 and A2 as moving zone on loss ground respectively from cylindrical C1 and C2 as the periphery that moves regional A1 and A2 by head 21a and 21b.

In Fig. 7 and Fig. 8, interior circle (moving zone) A1 and A2 and cylindrical C1 and C2 are the circles of imagination or design.Make through head mobile device 30 on head 21a and 21b the upper surface 110a while rotating when moving, on the interior round A1 at the center that remain on the mask 110, the conductive ball B of the surplus in the scope of interior round A1 and A2 and cylindrical C1 and C2 is concentrated on head 21a and 21b respectively and the direction of A2 at mask 110.

In head 21a and 21b, multiple scraper plate 62a and 62b have been disposed along direction of rotation (direct of travel) respectively.Therefore, through moving of head 21a and 21b, on interior round A1 that the conductive ball B that overflows from interior round A1 and A2 is concentrated in one by one move the destination and the direction of A2.Therefore, in the moving regional A1 of the circle around the pivot of head 21a and 21b and A2, maintain the Bg1 of group and the Bg2 of the conductive ball that constitutes by a plurality of conductive ball B respectively.When head 21a and 21b moved, circular moving regional A1 and A2 moved, and remained on wherein that the Bg1 of group and the Bg2 of conductive ball also move and make.And, remain on circular moving regional A1 and the conductive ball B among the A2 and be packed into successively in the opening 111 of mask 110.

In addition, the conductive ball B that remains among moving regional A1 and the A2 is consumed because of being packed in the opening 111.Therefore, based on the ball amount that consumes, ball B is dropped into (supply, supply) in moving regional A1 and A2 from ball device for supplying 40.According to the ball consumption of unit interval, supply with ball B at interval with official hour, exist an amount of ball B in regional A1 and the A2 all the time thereby can make.Through ball device for supplying 40, can keep the Bg1 of group of the conductive ball among moving regional A1 and the A2 and the density of Bg2, cause in opening 111 the not situation of filling ball B thereby can suppress reduction because of the interior ball density in moving zone.

As shown in Figure 7, when regional A1 and A2 are moved, there are area E 1 and area E 2 in the inside of moving regional A1 and moving regional A2 respectively.In area E 1, there is conductive ball B; In area E 2, there is not conductive ball.In the area E that has conductive ball B 1 with do not exist the boundary section of the area E 2 of conductive ball B to form the part that conductive ball B is one deck (part that exists with one deck) E.At conductive ball B is among the part E of one deck, is not defined as conductive ball B and will be paved with one deck, and also can there be density in conductive ball B sometimes, and the major part of conductive ball B can overlappingly not be a multilayer basically, and exists with not range upon range of state.

Moving regional A1 and A2 under inner separately conductive ball B state pockety, coexist with head 21a and 21b one and to move on the mask 110.When conductive ball B is opening 111 through mask 110 of the part E of one deck, conductive ball B by peak efficiency be packed in the opening 111 of mask 110.The part that conductive ball B consumes because of filling is easy to replenished by the part of the conductive ball B that exists with multilayer or range upon range of state.Therefore, preferably forming conductive ball B with the inside at moving regional A1 and A2 is the mode of the part E of one deck, and self-adding device 40 is supply conductive ball B in each moving regional A1 and A2.

When the amount of the conductive ball B in moving regional A1 and A2 is very few,, do not exist the area E 2 of ball B bigger, can become the reason that causes filling error with respect to the area E that has ball B 1.The area E that will be fit to fill in order to follow moving of moving regional A1 and A2 guarantees to be suitable area, hopes in the area E that has ball B 1 with range upon range of state savings ball to a certain degree.

On the other hand, when the amount of the conductive ball B in moving regional A1 and A2 was too much, conductive ball B is easy to automated regional A1 and A2 is interior to outer loss, and reduced the utilization ratio of conductive ball B.And in moving regional A1 and A2, conductive ball B exists with range upon range of state basically, is difficult in moving regional A1 and A2, form the area E 2 that does not have ball B.Therefore, in limiting area, exist and interfere each other between a large amount of ball B and the ball B and make ball blocked, be easy to stymy B and rely on and freely fall and be packed in the opening 111, can become and produce the reason of filling error.

When increasing the area in moving zone, need in moving zone, there be a large amount of balls accordingly with its area.But it is very difficult in than large tracts of land, keeping a large amount of balls equably, is difficult to keep the area E that has ball B 1 bigger, and makes the covering of moving zone be scheduled to the zone of wanting filling ball.And even enlarge moving zone, enlarge the part E that conductive ball B exists with one deck neither be so easy.Exist the motion of scraper plate to be difficult to be passed to the ball that moves regional central part, or ball is easy to various factorss such as range upon range of.With respect to this, become the zonule through moving Region Segmentation, can amount that move the conductive ball in the zone be maintained suitable scope, thereby can stably form area E.Be provided with a plurality of moving whens zone, because of the moving state of each moving regional A1 and A2 etc., consumption of the ball among each moving regional A1 and the A2 might produce other change.But, this change can through by ball device for supplying 40 respectively to each moving regional A1 and A2 independently the supply ball be able to solve.

The suitable amount of conductive ball B in moving regional A1 and the A2 is the scope of 1/4 α～10 α with respect to conductive ball B with the datum quantity α that one deck covers the area of moving regional A1 and A2 equably for example preferably, is more preferably the scope of 1/4 α～3 α.In existing with the ratio that is defined as existing area in the process that conductive ball B moves in moving regional A1 and A2 than (having the ratio of the area E 1 of conductive ball B) when recording and narrating with respect to the area of moving regional A1 and A2; There is preferably 1/10～2/3 scope of ratio, is more preferably 1/5～2/5 scope.This exists more effective when adopting a plurality of heads (a plurality of moving zone) than not only, and is also effective when adopting single head (1 moving zone).

Owing to can carry out the supposition of summary to the minimizing of the ball in moving regional A1 and the A2, therefore can infer from ball device for supplying 40 continuously or intermittentlies and supply with ball B based on this.In addition, in this filling device 10, be used for concentrating on all the time in the area of circular moving regional A1 and this qualification of A2 to the ball B that opening 111 is filled.Therefore, through the state that concentrates on the conductive ball B in moving regional A1 and the A2 is kept watch on, also can subtend opening 111 in the situation of filling ball B control.Optical pickocff that ball density to moving regional A1 and A2 detects also can be set respectively keeping watch on the state of ball in ball maintaining body 20 (for example head 21a and 21b), or carry out the supply control of ball.

At the filling device 10 that adopts this example conductive ball B is arranged in 100 last times of wafer; In order to reduce the filling error incidence of conductive ball B, need not have the whole zone that should carry conductive ball B among the upper surface 110a that omits ground coverage mask 110 (below be called be sprinkled into the zone) D.To fill the error incidence in order further reducing, preferably through the whole regional mode more than 1 time that is sprinkled into region D head 21a and 21b to be moved with moving regional A1 and A2.

In the present example, control part 50 has such three functions: a function is through mobile device 30 and head support device 35, keeps two head 21a and 21b side by side along directions X (the 1st direction); A function is to make the moving regional A1 and the A2 that are formed by two head 21a and 21b carry out back and forth movement along directions X; Another function is to make the moving regional A1 that formed by two head 21a and 21b and A2 at each end along the back and forth movement of directions X, and the edge intersects the Y direction (the 2nd direction) of (being quadrature in the present example) and carries out identical moving with directions X.In addition, also can make control part 50 have such three functions: a function is by mobile device 30 and head support device 35, keeps two head 21a and 21b side by side along directions X (the 1st direction); Function is to make the moving regional A1 and the A2 edge that are formed by two head 21a and 21b intersect the Y direction (the 2nd direction) of (being quadrature in the present example) with directions X to carry out back and forth movement; Another function is to make the moving regional A1 that formed by two head 21a and 21b and A2 at each end along the back and forth movement of Y direction, carries out identical or opposite moving along directions X.

Therefore; Filling device 10 according to this example; Two moving regional A1 and A2 are moved by this way: the part of the track T1 of (side) moving regional A1 repeats; And the part of the track T2 of (the opposing party) moving regional A2 repeats, and the part of these two track T1 and T2 repeats.In addition; Can make regional A1 and A2 in certain zone so that 1 moving zone for example the mode that repeats of the track of moving regional A1 move; Just in the boundary of moving regional A1 and region covered that A2 distinguishes, these two moving regional A1 and A2 are moved with the mode of the part repetition of the track of different mutually moving regional A1 and A2.

In addition, moving regional A1 and A2 form respectively and head 21a and the concentric round shape of 21b, but are not identical sizes.But,, represent moving of moving regional A1 and A2 and head 21a and 21b with common track later on for the ease of explanation.In addition; In this manual; For the motion track of moving regional A1 and A2, only do not represent moving of its center, move and trace or path (through being with) of the width that forms at the upper surface 110a of mask 110 but represented to have by moving regional A1 and A2.And the track of moving regional A1 and A2 is not although being known as the trace that stays owing to the such result of filled conductive property ball B in the opening 111 of mask 110 on the physics, can represent any vestige at the upper surface 110a of mask 110 yet.

And, in the present example, adopted profile than these two moving regional A1 and big head 21a and the 21b of A2 in order to form moving regional A1 and A2.Therefore, the minimum value at the interval of moving regional A1 and moving regional A2 receives the influence of the size of head 21a and 21b.The minimum spacing that the distance of moving regional A1 and moving regional A2 determines greater than the size by head 21a and 21b.Therefore, when the direction of edge and moving direction quadrature was arranged head 21a and 21b, the adjacent track of moving regional A1 and A2 did not repeat.On the other hand, tilt with respect to moving direction, can dwindle the actual range of moving regional A1 and A2, the part of the track of adjacent moving regional A1 and A2 is repeated through the arrangement that makes head 21a and 21b.

An example of in Fig. 9～Figure 11, having represented the track in two moving zones.In Figure 12, from the said example of Fig. 9～Figure 11, select out the track in a moving zone and represented Fig. 9～example shown in Figure 11.In Figure 13, amplified the track (through band) in moving zone and represented Fig. 9～example shown in Figure 11.In addition, in Fig. 9～Figure 11, the inboard of circle D becomes the zone that is sprinkled into that disposes many openings 111, becomes each end of the back and forth movement of moving regional A1 and A2 on the cylindrical Dout.The interval of interior circle D and cylindrical Dout is equivalent to the radius of each moving regional A1 and A2.

Adopt Fig. 9～example shown in Figure 11, head 21a and 21b move, and make the moving regional A1 that is formed by head 21a cover the regional a1 in the center O left side of wafer 100, the regional a2 on the center O right side of the moving regional A2 covering wafer 100 that is formed by head 21b.In regional a1, head 21a moves with the mode of the part repetition of the track T1 of moving regional A1.In regional a2, head 21b moves with the mode of the part repetition of the track T2 of moving regional A2.In the boundary section as the center O of passing through wafer 100 of the boundary of regional a1 and a2, this two head 21a and 21b move with the mode that track T1 and the T2 of moving regional A1 and A2 repeats.

Specifically, ground carries ball B on wafer 100 as following.At first, the center of head 21a and 21b is made as the distance of the radius that is equivalent to circular wafers 100 along the interval of directions X.And, make the interval of regional A1 and A2 remain setting (value that is equivalent to the radius of circular wafers 100), and the Bg1 of group and the Bg2 of conductive ball remained on respectively among moving regional A1 and the A2.Afterwards; Remain setting at the interval that will move regional A1 and A2, promptly be equivalent under the state of value of radius of wafer 100; Route (track) along being stored in advance among the program 50p makes regional A1 and A2 carry out back and forth movement along directions X respectively, and carries out identical moving at each end (on the circumference of the cylindrical Dout in the outside of interior circle (being sprinkled into the zone) D) of the back and forth movement that carries out along directions X along the Y direction.As a whole, make head 21a and 21b separately the zigzag track in an edge advance, an edge Y direction moves to another distolateral (another among Fig. 9～Figure 11 is distolateral) from one distolateral (upper side Fig. 9～Figure 11) of wafer 100.At this moment; In each regional a1 and a2; A plurality of moving regional A1 and A2 are moved by this way: the track T1 of each moving regional A1 and A2 and the part of T2 repeat, and in the boundary of each regional a1 and a2, the track T1 of mutually different moving regional A1 and A2 and the part of T2 repeat.

In Figure 13, illustrated the situation that a part at the track T1 of last moving regional A1 of boundary (border region) b3 of regional a1 and a2 and A2 and T2 repeats.In Figure 13, the moving as the motion of representing track T1 and T2 and with the chain-dotted line of band arrow of center of each moving regional A1 and A2 represented.In addition, represented that with solid line each moving regional A1 and A2 carry out the scope of fold return motion on boundary b3, promptly 1 track amount is sprinkled into the zone.

Under the situation of this example, make each moving regional A1 and A2 roughly repeat 50% mode and move with adjacent track.Therefore, when for example moving regional A1 turned back at boundary b3 place, the amount of the radius of moving regional A1 was moved in the below of the middle mind-set figure of moving regional A1, the band shape through round 3 times of width that formed radius be sprinkled into zone (1 track amount be sprinkled into zone).The solid line of band arrow is represented the situation that the boundary of moving the track T1 when moving regional A1 and turn back at the center of moving regional A1 overlaps one by one.In Figure 13, overlapping for each moving regional A1 among part (boundary section) b3 that representes to turn back and A2 selects the round action (action of turning back) of 2 each moving regional A1 and A2 and representes.

In Figure 13, the track T1 of moving regional A1 roughly repeats 50% in regional b1.The track T2 of moving regional A2 roughly repeats 50% in regional b2.The track T1 of moving regional A1 roughly repeats 50% with the track T2 of moving regional A2 in regional b3.Therefore, when being conceived to be sprinkled into region D, the repetition rate of track roughly becomes 100%, and arbitrary moving regional A1 and A2 be certain position through being sprinkled into region D 2 times at least.

The motion of head 21a and 21b is very simple in this example.And, because the zigzag scope of moving that head 21a and 21b carry out along directions X is restricted to roughly half the scope (zone) a1 and the a2 of wafer 100 respectively, therefore can shorten the productive temp time.

And; Adopt this example; Owing to ball consumption and depletion rate (because of conductive ball being packed into the consumption and the depletion rate of the conductive ball that produces in the opening of mask) among moving regional A1 and the A2 are basic identical, therefore the operation of supply conductive ball B is comparatively simple in each moving regional A1 and A2.Therefore, it is more or less freely having the area E 1 of conductive ball B with formation and do not exist the mode of the area E 2 of conductive ball B that the supply of conductive ball is controlled.

That is, under the situation of this example, between once the coming and going of moving regional A1 and A2, be sprinkled into the shape symmetry in the zone of ball, area is identical.Therefore, ball consumption and the depletion rate among moving regional A1 and the A2 is basic identical.Therefore; Even with of the ball such fairly simple control of the identical moment, also can there be the area E 1 of conductive ball B and do not exist the mode of the area E 2 of conductive ball B to keep the ball amount in moving regional A1 and the A2 with formation to moving regional A1 and A2 supply same amount.This example is particularly suitable for the situation of the flat circle shape substrate that semiconductor crystal wafer is such as substrate.

When the planar rectangular shape substrate that printed wiring board is such is used as substrate, in order further to shorten the productive temp time, the less mode of number of times of the direction conversion on each end of preferred back and forth movement.Therefore, when on the substrate of planar rectangular shape, carrying ball, the minor face of preferred two head and substrate is configuration side by side abreast, the interval of two head is made as half of bond length of substrate, and two head are moved along long side direction.

In Figure 14～Figure 16, represented another example of the track in two moving zones.This example is particularly suitable for the situation of the planar rectangular shape substrate that printed wiring board is such as substrate.Mark C among the figure is the center of printed wiring board 100.In addition, in Figure 14～Figure 16, inboard rectangle D becomes the zone that is sprinkled into that disposes many openings 111, becomes each end of the back and forth movement of moving regional A1 and A2 on the rectangle Dout in the outside of inboard rectangle (being sprinkled into the zone) D.The interval of the inboard rectangle D and the rectangle Dout in the outside is equivalent to the radius of each moving regional A1 and A2.

In the example of Figure 14～Figure 16; Head 21a and 21b move along the route (track) that is stored in advance among the program 50p; Make regional a1 on the left of the center C of the moving regional A1 covered substrate 100 that forms by head 21a, the regional a2 on the center C right side of the moving regional A2 covered substrate 100 that forms by head 21b.In regional a1, head 21a moves with the mode of the part repetition of the track T1 of moving regional A1.In addition, in regional a2, head 21b moves with the mode of the part repetition of the track T2 of moving regional A2.And in the boundary section of the center C of passing through substrate 100 of the boundary that becomes regional a1 and a2, this two head 21a and 21b move with the mode that track T1 and the T2 of moving regional A1 and A2 repeats.Head 21a begins to move to the left along directions X from the boundary section through substrate 100 center C.Head 21b begins to move to the left along directions X from the right end portion of substrate 100, and the final boundary section that arrives through the center C of substrate 100.In addition, in this example, the motion of head 21a and 21b is also very simple, has shortened the productive temp time effectively.

In Figure 17, represented another different example of the track in two moving zones.Figure 18 is that track (through the band) T1 that selects out the moving regional A1 of a side among Figure 17 representes example shown in Figure 17.This example be adapted to printed wiring board (printed circuit board (PCB)) etc., after carry or carried and use when carrying conductive ball on the such substrate of a plurality of chips.

In such substrate 100 such as printed wiring board (printed circuit board), a plurality of semiconductor chips (semiconductor device) are installed with rectangular or array-like.Therefore, a plurality of electrodes comprise a plurality of electrode groups (electrode pattern) that the mode of rectangular to be dispersed into (array-like) is provided with.Because a plurality of openings 111 of mask 110 are corresponding with a plurality of electrodes of substrate 100; Therefore when on such substrate 100, carrying conductive ball B, a plurality of openings 111 of mask 110 comprise a plurality of opening groups (patterns of openings) that the mode of rectangular to be dispersed into (array-like) is provided with.For example when to be provided with the such substrate 100 of 48 a plurality of like this electrode groups altogether with 8 row 6 row ground on, carrying conductive ball B, adopted with 8 row, 6 row be provided with the mask 110 (with reference to Figure 17) of a plurality of opening group M.

In the method, in each row, will comprise 3 and follow zone that direction (left and right directions, directions X) is arranged in a string opening group M as 1 fill area (being sprinkled into the zone) D.That is, this mask 110 comprises that 8 row, 2 row amount to 16 fill area D.In addition, in the method, make the moving regional A1 that is formed by head 21a cover the regional a1 of 8 fill area D that comprise the left side, the moving regional A2 covering that is formed by head 21b comprises the regional a2 of 8 fill area D on right side.Also can list to set and comprise 8 fill area D that are arranged in a string opening group M along column direction (Y direction) at each.

But, in a plurality of fill area D, comprise a plurality of openings 111, and in the clearance D n of fill area D adjacent each other, opening 111 be not set.Therefore, in order to shorten the productive temp time, preferably moving regional A1 and A2 have saved the zone (empty band, the non-region D n that is sprinkled into) that does not need filled conductive property ball B as far as possible, and on mask 110, move expeditiously.

In the method, make the interval of regional A1 and A2 remain setting, it is mobile along left and right directions (directions X) to make each moving regional A1 on the D of fill area, repeat 100% mode with its track respectively.When D has area to a certain degree in the fill area, also can replace moving regional A1 and A2 to come and go 1 time mode, and come and go for several times with about 50% repetition rate, the result obtains 100% repetition rate.And; Between fill area D adjacent each other; Regional A1 and A2 are moved, to have formed between fill area D adjacent each other moving regional A1 and empty band Dn that A2 did not pass through through the Dc ground, zone (connecting area) that fill area adjacent each other is coupled together at the end that it carries out back and forth movement.The integral body of moving regional A1 and A2 is respectively from upper side side shifting downwards, repeats 100% the mode fill area D through the amount of 8 row with its track simultaneously, turns back to initial position to upper side ground through connecting area Dc from lower side afterwards.Adopt this method, disperse, and the surface of mask 110 is provided with under the situation of empty band Dn, can shorten the productive temp time in the layout of a plurality of opening group M.

The example of the example of Fig. 9～Figure 11, the example of Figure 14～Figure 16, Figure 17 can adopt Fig. 3 or filling device 10 shown in Figure 4 to implement respectively.In addition, can not change, therefore can adopt Fig. 5 or filling device 10 shown in Figure 6 to implement respectively yet owing in the process that is sprinkled into, move the interval (interval of head 21a and 21b) of regional A1 and A2.With respect to wafer, the size of printed wiring board 100 is varied.Therefore, when on printed wiring board 100, carrying conductive ball (under the situation of the example of Figure 14～Figure 16 or the example of Figure 17 etc.), the filling device shown in Figure 6 10 that can set the head spacing arbitrarily is more suitable.

In addition, the example of Figure 14～Figure 16 is not only applicable to the substrate of the such planar rectangular shape of printed wiring board, goes for discoideus substrates such as wafer yet.In addition, in the filling device 10 of Fig. 3 or this example shown in Figure 4, also can in being sprinkled into process, utilize head with X axle workbench 36x ₁And 36x ₂Change the distance of two head 21a and 21b.Adopt such device, also can in the interval (interval of head 21a and 21b) that changes moving regional A1 and A2, regional A1 and A2 ( head 21a and 21b) be moved from the inboard, lateral or from the inboard laterally, and ball is carried on substrate.In this case, for track T1 and the T2 of moving regional A1 and A2, near the central authorities of substrate 100 (near or the center C of center O) become original position (starting point) or final position (terminal points) of two moving regional A1 and A2.

In addition, track T1 and the T2 of moving regional A1 and A2 are not limited thereto.Can not be divided into regional a1 and a2 yet, and will be sprinkled into the region D covering through two perhaps more moving regional moving with moving the zone of moving in the zone.For example, can make with the mode that tilts etc. under the adjacent state of regional A1 and A2, oneself left side that is sprinkled into the directions X of region D moves to the right side to make them.Along the position of moving regional A1 of directions X transposing and A2, or the interval of moving regional A1 of adjustment and A2 and, make that the track of track and adjacent moving regional A2 of moving regional A1 is overlapping, thereby also can guarantee the repetition rate of track along the displacement of directions X.But, with ground as above-mentioned by moving regional A1 and A2 covers different regional a1 respectively and the situation of a2 is compared, it is elongated along the displacement of directions X to move regional A1 and A2.

In these examples, all be that regional A1 and A2 are moved being sprinkled on the whole zone of region D by this way: track T1 and track T1 that next time passes through or T2 repeat 50%, and track T2 repeats 50% with track T1 that passes through or T2 next time.Therefore, respectively through the zone of 1 time (amounting to 2 times), can cover the whole zone that is sprinkled into region D through 2 times zone, moving regional A1 and A2 through 2 times zone, moving regional A2 by moving regional A1.In addition, in cylindrical (rectangle in the outside) Dout, moving regional A1 or moving regional A2 are through 1 time.In addition, among the program 50p in being stored in the control part 50 that filling device 10 is controlled, the concrete form of track T1 that moves regional A1 and A2 and T2 is made data such as proper functions or list to be provided.

For the omission that suppresses in the patterns of openings of mask 110, to fill, hope to improve the repetition rate of track.On the other hand, when having improved the repetition rate of track, be used for to 1 wafer arrangement needed time of conductive ball (productive temp time) elongated.In addition, when the repetition rate of track was higher, the consumption of conductive ball in the unit interval reduced, and in the long period, the probability that conductive ball sustains damage rises at moving region memory in conductivity club.Therefore, preferably moving regional A1 and A2 move with the mode of repetition rate in 10%～98% scope of the track of the integral body that formed by track T1 and T2.More preferably the scope of repetition rate is 30%～95%.Repetition rate is that 40%～90% track is the track that is used to make the best that regional A1 and A2 move.

Cross when slow in the translational speed of moving regional A1 and A2 (in the present example, in fact with the translational speed synonym of head 21a and 21b), the productive temp time becomes long.On the other hand, when the translational speed of moving regional A1 and A2 was too fast, moving regional A1 and A2 can not fall into the probability that the mode of the opening 111 of mask 110 passes through with ball B and raise.Therefore, the scope of the preferred 2～120mm/s of translational speed of moving regional A1 and A2, the more preferably scope of 5～80mm/s.In the filling device 10 of this example, the translational speed of head 21a and 21b is controlled in 20～80mm/s.

Moving regional A1 and A2 can diminish, but when it was too small, the productive temp time can be elongated once again.Therefore, more than the preferred 10mm of diameter of the moving regional A1 of circle and A2.On the other hand; When moving regional A1 and A2 were excessive, the mobile meeting of the ball b in moving regional A1 and the A2 became insufficient, and the density unevenness that remains on the ball B in moving regional A1 and the A2 can become big; As above-mentioned, according to circumstances possibly can't form good electrical conductivity ball B be 1 layer part E.Therefore, below the preferred 100mm of diameter of the moving regional A1 of circle and A2.Circular moving regional A1 and the preferred scope of diameter of A2 are 20～60mm.Keeping the suitable area (optimum radius of moving regional A1 and A2) of ball B and moving regional A1 that moves simultaneously and A2 according to the repetition rate of translational speed, track T1 and the T2 of moving regional A1 and A2, be sprinkled into the condition of the diameter of condition, conductive ball B, the shape of mask 110 (density of the opening 111 of mask 110 etc.) and change.If the diameter of conductive ball B is that the example of the best of head 21a and 21b is for can form moving regional A1 and the A2 that diameter is the circle of 10～100mm about 10～500 μ m on mask.For example, in the filling device 10 of this example, select circular moving regional A1 and the diameter of A2 to be about 40mm such head 21a and 21b.

Under the situation that forms moving regional A1 and A2 by head 21a and 21b; Cross when low in the rotary speed of head 21a and 21b; Because the ball B's in moving regional A1 and the A2 is mobile insufficient, ball B reduces with the area of the area E that 1 layer state exists, and therefore produces the possibility rising that ball B fills error.Therefore, more than the preferred 10rpm of the rotary speed of head 21a and 21b.On the other hand, when the rotary speed of head 21a and 21b was too fast, because the translational speed of ball B accelerates, ball B can not fall into opening 111 and the probability that passes through raises, and therefore at this moment, produced the possibility that ball B fills error and also can raise.Therefore, below the preferred 120rpm of the rotary speed of head 21a and 21b.The scope of the rotary speed of head 21a and 21b is 30～90rpm more preferably.

In the program in being stored in the control part 50 that filling device 10 is controlled, data such as proper functions or list are made in the concrete action of head 21a and 21b to be provided.In the filling device 10 of this example, the rotating speed of head 21a and 21b is controlled at 45rpm respectively by program.

In Figure 19, with flowcharting one example of manufacturing approach of ball filling device.In step 201, substrate (wafer) 100 and mask 110 are set.In step 202, two independently moving regional A1 and A2 on the upper surface 110a of mask 110, have been formed by two head 21a and 21b.And, keep function 91 with two independently among two the independently moving regional A1 and A2 of the part of the Bg1 of group and the upper surface 110a that Bg2 remains on mask 110 respectively of conductive ball through ball.In step 203; Through locomotive function 92 two moving regional A1 and A2 are moved (moving) by this way on regional a1 and a2: the track T1 of each moving regional A1 and A2 and the part of T2 repeat; And on regional a1 and a2, the track T1 of mutually different moving regional A1 and A2 and the part of T2 repeat.Thus, two moving regional A1 and A2 cover the whole zone that is sprinkled into region D with the repetition rate of regulation.

In step 204; Two are moved regional A1 and A2 (two states that move regional A1 and A2 no show terminal point) in moving process; In step 205, produced when the needing of inside supply (replenishing) the conductive ball B of moving regional A1 and A2; Can be through ball makeup function 93 in step 206, from ball device for supplying 40 supply (replenishing) conductive ball B and the Bg1 of group of the electrical ball of guide and the Bg2 through the ball supply passageway 49a that comprises a 38a and 38b and 49b and moving regional A1 and A2.At this moment, the difference supply conductive ball in the inside of moving regional A1 and A2, and formed area E 1 that has conductive ball and the area E 2 that does not have conductive ball.In step 204, two moving regional A1 and A2 move to terminal point, then end task.

At the upper surface of wafer 100, the solder flux of using with the patterns of openings silk screen printing soldering accordingly of mask 110 in advance.Therefore, the conductive ball B that is packed in the opening 111 closely contacts with solder flux, and is temporarily fixed on the assigned position of wafer 100.Afterwards, the wafer 100 that has carried conductive ball B is through known reflow process.Thus, ball B is fixed on the wafer 100.

As above-mentioned; Adopt the filling device 10 of this example; Through ball maintaining body 20, on the upper surface 110a of mask 110, form two independently moving regional A1 and A2, and independently the Bg1 of group and the Bg2 of conductive ball remain on respectively on these two moving regional A1 and the A2 with two; Under this state, ball maintaining body 20 is moved through mobile device 30.Therefore, and make 1 moving regional mobile phase ratio, can shorten the productive temp time.

And, adopting the filling device 10 of this example, ball maintaining body 20 has two head 21a and 21b.Therefore, can form two independently moving regional A1 and A2 through this two head 21a and 21b.Have two independently the ball maintaining body 20 of head 21a and 21b be suitable for forming two independently moving regional A1 and A2.

In addition, the head 21a and the 21b that have scraper plate 62a and a 62b are suitable for forming two independently moving regional A1 and A2.Head 21a and 21b with scraper plate 62a and 62b have respectively driven region A1 and A2 around compile the function of ball B and mask 110 pushed smooth function with moving regional A1 and the corresponding part of A2.Therefore, even on mask 110, produce warpage or distortion,, therefore also can change flatness at moving regional A1 that has been sprinkled into ball B and A2 at least owing to peripheral part of moving regional A1 and A2 is pushed through scraper plate 62a and 62b.

In Figure 20, represented the schematic configuration of the ball filling device of the present invention's the 2nd execution mode with vertical view.In Figure 21, represented the ball carring device of Figure 20 with partial, partially-cross-sectioned side-elevation view.

This ball filling device 10 has ball maintaining body 20, mobile device 30, ball device for supplying and control part.Two independently moving zones that the upper surface 110a that ball maintaining body 20 is used to form at mask 110 moves; Mobile device 30 is used to make ball maintaining body 20 to move; The ball device for supplying is used for supply conductive ball in two moving regional A1 and A2; Control part is used for ball maintaining body 20, mobile device 30 and ball device for supplying are controlled.Owing to be used to make the structure of the mobile device 30 that ball maintaining body 20 moves identical, so omitted its repeat specification and on accompanying drawing, marked identical Reference numeral with the 1st execution mode.

Ball maintaining body 20 has two head 21a and 21b, through this two head 21a and 21b with two independently the group of conductive ball remain on respectively among two moving regional A1 and the A2.In addition, ball maintaining body 20 also has 1 motor 37, two axle 38a and 38b and axle 39.Motor 37 is used to make two head 21a and 21b to be rotated; Two axle 38a and 38b are corresponding with two head 21a and 21b; Axle 39 is located between two axle 38a and the 38b.Between the belt pulley 73a of the belt pulley 72a of axle 38a and axle 39, between the belt pulley 73b of the belt pulley 72b of axle 38b and axle 39, set up belt 74a, 74b and 74c respectively between the belt pulley of the rotating shaft 37r of motor 37 and spools 39 the belt pulley 73c.

Therefore; The rotation of motor 37 is transmitted through belt 74c → belt pulley 73c → axle 39 → belt pulley 73a → axle 38a; And drive head 21a makes its rotation, and is transmitted through belt 74c → belt pulley 73c → axle 39 → belt pulley 73b → axle 38b, and drive head 21b makes its rotation.Therefore, in this ball maintaining body 20, rely on 1 motor 37 that two head 21a and 21b are rotated.This ball maintaining body 20 is directly installed on the X axle workbench 31x of mobile device 30.

In addition, axle 38a is installed on the axle 39 through supporting member 75a.Thus, head 21a is free around axle 39 rotations.In addition, axle 38b likewise is installed on the axle 39 through supporting member 75b.Thus, head 21b is free around axle 39 rotations.Therefore, through changing the angle of supporting member 75a and supporting member 75b, head 21a and the variable spaced of head 21b on directions X.

In addition, the inside of axle 38a and 38b is hollow, passes through separately axle 38a and 38b supply ball in moving regional A1 and A2 from the ball device for supplying, because this point is identical with the 1st execution mode, and the identical mark that has therefore omitted repeat specification and on accompanying drawing, marked.

In addition, the number of head is not defined as two, can be more than 3 yet.The ball maintaining body preferably can form the structure of a plurality of distinct area, but in this case, also may not have and the corresponding a plurality of heads of these moving zone difference.That is, a plurality of moving zones may not be through forming with the corresponding respectively a plurality of heads in these moving zones.And the number in moving zone is not defined as two, can be more than 3 yet.In addition; In the disclosed technology of this specification; Being that 1 or moving zone are 1 the resulting action effect of device and method by the head number; The area that for example has the zone of conductive ball with respect to the ratio of the area in moving zone is the device (ball device for supplying) and the method (ball replenishing method) of 1/10～2/3 mode supply conductive ball, and is not only effective when adopting a plurality of heads (a plurality of moving zone), when adopting single head (1 moving zone), also is effective.In addition, when the mask that has used the such opening group of mask that is used on printed wiring board the configuration ball arranging, select the mode of track in moving zone to move when regional also be effective adopting 1 with the mode that forms empty band discretely.In these device and methods, the ball maintaining body gets final product for the structure that can form 1 distinct area at least.And the disclosed invention of this specification also comprises the device and method that adopts single head (1 moving zone).

As having formed a plurality of independently ball maintaining bodies in moving zone, enumerated a kind of like this mode: for example utilize the vibration of at least 1 member (for example head), ball is swept together along moving region direction by the member (for example scraper plate) that compiles that is installed in the member below.But this method exists because of direction of vibration and number of times, the shape etc. of compiling member make the zone not rounded, and becomes the round polygonal situation that is external in.Moving zone be shaped as polygon the time, may produce the quality of the ability of compiling ball because of the moving direction of member.

As having formed a plurality of independently ball maintaining bodies in moving zone, a kind of of optimal way is the such members of a plurality of heads.The member of these a plurality of heads applies the power that moves along the direction in a plurality of moving zones through rotation to conductive ball.Circular moving zone has can make along the moving direction of member to be compiled or keeps the ability of ball not produce the advantage of the moving direction of any selected member in good and bad ground.

In addition, having formed a plurality of independently ball maintaining bodies in moving zone, also can be the member with scraper plate.For example, member also can be for having the type of valve.This valve is used for ball is swept gas together on a plurality of moving zones to blowing on the surface of mask.The member of the type of blow gas can save drive member self and make the motor of its rotation, can simplify the structure of filling device.In addition, also can adopt dependence magnetic force to be adsorbed in the head of the type on the mask.

In addition, the above-mentioned execution mode that comprises travel mechanism only is used to realize an example of ball filling device that the present invention contains etc.For example, a plurality of heads that are used to form each moving zone also can be respectively be connected with the mobile device that is used for along directions X and Y direction move.Not being defined as the such mobile device of X-Y workbench, also can be the mobile device that has adopted arm.Also can each head be supported movably to it by the X-Y workbench.

1 purpose of this execution mode is to provide a kind of can shorten the device of productive temp time, the control method and the ball mounting method of device.But conspicuous partial alteration and variation are thought to be in the scope of the present invention for the technical staff.

Claims (6)

1. a ball filling device (10); This device (10) is used for being arranged under the state on the aforesaid substrate (100) will having the mask (110) that is used for conductive ball (B) is configured in a plurality of openings (111) on the substrate (100); Filled conductive property ball (B) in above-mentioned a plurality of openings (111); It is characterized in that

This device (10) comprising:

Head (21a), it is used for going up the group (Bg1) that keeps conductive ball in the part zone (A1) on aforementioned mask (110) surface (110a);

Head moving mechanism (30), it is mobile that it is used to make above-mentioned head (21a) to go up along aforementioned mask (110) surface (110a);

Ball supply parts (40), itself and above-mentioned head (21a) synchronously move, be used for being located in above-mentioned zone (A1) supply conductive ball (B) in the mobile purpose of above-mentioned head (21a),

Above-mentioned ball supply parts (40) with respect to conductive ball (B) one deck equably the amount of the conductive ball (B) of datum quantity α, the above-mentioned zone (A1) of the area of overlay area (A 1) be the mode supply conductive ball (B) of 1/4 α～10 α.

2. ball filling device according to claim 1 (10) is characterized in that,

This device (10) has a plurality of heads (21a, 21b),

Above-mentioned head moving mechanism (30) moves above-mentioned a plurality of head (21a, 21b),

The mode that above-mentioned ball supply parts (40) become 1/4 α～10 α with the amount of conductive ball (B) is respectively to zone (A1, A2) the supply conductive ball that is formed by above-mentioned a plurality of heads (21a, 21b).

3. ball filling device according to claim 1 (10) is characterized in that,

Above-mentioned ball supply parts (40) comprise the ball supply passageway (49a, 49b) of each inside that is used for conductive ball (B) is imported the above-mentioned zone (A1, A2) of each above-mentioned a plurality of head (21a, 21b).

4. a ball carring device (1) is characterized in that,

This ball carring device (1) has in the claim 1～3 any one and describedly is used for the device (10) of filled conductive property ball (B) and mask (110) is being arranged on the device (11) that is used to keep aforementioned mask (110) under the state on the aforesaid substrate (100).

5. method that is used to carry conductive ball (B); This method that is used to carry conductive ball (B) is that use device (10) is gone up the method for carrying conductive ball (B) at substrate (100); This device (10) is used for being arranged under the state on the aforesaid substrate (100) will having the mask (110) that is used for conductive ball (B) is configured in a plurality of openings (111) on the aforesaid substrate (100); Filled conductive property ball (B) is characterized in that in above-mentioned a plurality of openings (111)

Said apparatus (10) comprising:

Ball holding member (20), it is used on the part on aforementioned mask (110) surface (110a), being formed for keeping the zone (A1) of the group (Bg1) of conductive ball;

Moving-member (30), it is used to make above-mentioned ball holding member (20) to move;

Ball supply parts (40), itself and above-mentioned ball holding member (20) synchronously move, be used for by above-mentioned ball holding member (20), to group (Bg1) the supply conductive ball (B) of above-mentioned conductive ball,

This method comprises following operation:

Utilize above-mentioned ball holding member (20), the group (Bg1) of above-mentioned conductive ball is remained in the above-mentioned zone (A1) on surface (110a) of aforementioned mask (110);

The mobile purpose of above-mentioned ball holding member (20) be located in utilize above-mentioned ball supply parts (40) with respect to conductive ball (B) one deck equably the amount of the conductive ball (B) of datum quantity α, the above-mentioned zone (A1) of the area of overlay area (A1) become the inside supply conductive ball (B) of the mode of 1/4 α～10 α to above-mentioned zone (A1).

6. method according to claim 5 is characterized in that,

Above-mentioned ball holding member (20) is used to form a plurality of zones (A1, A2), and above-mentioned ball holding member (20) comprising:

A plurality of heads (21a, 21b), it is used for inciting somebody to action independently respectively, and the group of a plurality of conductive balls (Bg1, Bg2) encloses into the inside at above-mentioned a plurality of zones (A1, A2);

A plurality of axles (38a, 38b), it is used for above-mentioned a plurality of heads (21a, 21b) are connected with above-mentioned moving-member (30) respectively,

Above-mentioned operation of carrying out supply comprises: utilize above-mentioned ball supply parts (40), so that the quantitative change of above-mentioned a plurality of zone (A1, A2) conductive ball (B) separately is the mode supply conductive ball (B) of 1/4 α～10 α.

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