CN101956167B - Method for preparing target structure - Google Patents
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- CN101956167B CN101956167B CN 201010524411 CN201010524411A CN101956167B CN 101956167 B CN101956167 B CN 101956167B CN 201010524411 CN201010524411 CN 201010524411 CN 201010524411 A CN201010524411 A CN 201010524411A CN 101956167 B CN101956167 B CN 101956167B
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Abstract
The invention relates to a method for preparing a target structure. The method comprises the following steps of: providing a target, namely chromium or a chromium alloy, and activating the surface of the target; forming a metal plated layer on a solder side of the activated target by a chemical plating process; and soldering the chemically plated target to a back board. By taking the metal plated layer formed on the solder side of a chromium or chromium alloy target by chemical plating as an intermediary, the soldered target and back board are firmly bonded and have higher bonding strength. The invention provides a process for steadily plating a metal layer on the surface of the chromium or chromium alloy target by the chemical plating and realizes industrial production.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to the making method of target material structure.
Background technology
Generally, target material assembly is to constitute by the target that meets sputtering performance with backboard that said target combines, has certain intensity.Said backboard can be assembled in the sputter base station at said target material assembly and play a supporting role, and has the effect of conduction heat.In sputter procedure, the Working environment of said target material assembly is more abominable, and for example, the target material assembly working temperature is higher, for example 100 degrees centigrade to 300 degrees centigrade; In addition, it is cold by force that a side of target material assembly applies water coolant, and opposite side then is in 10
-9Under the high vacuum environment of Pa, relative two sides at target material assembly are formed with huge pressure difference thus; Have, target material assembly is in high-voltage electric field, the magnetic field again, receives the bombardment of various particles.Under rugged environment like this; If the bonding strength in the target material assembly between target and the backboard is higher; To cause target under heating condition, to be out of shape, to ftracture and come off mutually with the bonded backboard; Make sputter can't reach the sputter effect of uniform, also may cause damage simultaneously the sputter base station.
Therefore select a kind of effective welding process, make target and backboard realize reliable connection, satisfy the needs of producing, using target steady in a long-term, just seem very necessary.
The dissimilar metal welding is an one procedure very crucial in the target production process, and different targets need be used different welding process welding.With chromium or Chrome metal powder target is example; Chromium or Chrome metal powder are because its special physicochemical character; All there is not good bonding properties with various scolders of popular (for example indium In, tin Sn) now; Bonding strength is not high, and at present general treatment process adopts brazing mode that chromium or Chrome metal powder target and dissimilar metal (can be the copper base alloy that comprises copper or copper alloy, or comprise the aluminum base alloy of aluminum or aluminum alloy) backboard are directly welded exactly.The correlation technique of the dissimilar metal of relevant target welding can consult in addition that number of patent application is 200610146033.2, denomination of invention is the Chinese patent file of " a kind of method for welding ".
But, because being difficult to soak into low-temperature brazing filler metal, chromium or Chrome metal powder merge, and when using high-temp solder (at least greater than 1000 ℃), the oxidation easily again of copper or copper alloy, weld seam tensile strength is low, and the welding quality instability does not reach the requirement of semi-conductor target.
Summary of the invention
The problem that the present invention solves is that chromium or Chrome metal powder target and the direct solder bond intensity of backboard is not high, does not reach the requirement of semi-conductor target.
For addressing the above problem, the present invention provides a kind of making method of target material assembly, comprises target is provided, and said target is chromium or Chrome metal powder; Said target material surface is carried out activation treatment; Utilize chemical plating technology, on the target face of weld after the activation treatment, form metal plating; Target after the electroless plating processing is soldered to backboard.
Optional, before said target material surface being carried out activation treatment, also comprise the step of said target material surface being carried out blasting craft.
Optional, said target material surface is being carried out also comprise the step of polishing said target material surface before the blasting craft processing.
Optional; After to said target material surface polished finish and before said target material surface being carried out the blasting craft processing, to carrying out also comprising step before the activation treatment after the said target material surface blasting craft processing and to said target material surface with pure water or washed with de-ionized water target material surface.
Optional, it is 20 seconds～30 seconds that said target material surface is carried out the activation treatment time.
Optional, the temperature of the plating bath of said electroless plating is controlled at 86 ℃～90 ℃.
Optional, the pH value of said plating bath is 4.6～4.8.
Optional, the thickness of said metal plating is 8 μ m～10 μ m.
Optional, the material of said metal plating is a nickel.
Optional, said backboard specifically is by copper, aluminium or to include the alloy of any metal in copper and the aluminium made.
Compared with prior art; The present invention has the following advantages: electroless plating forms metal plating on the face of weld of chromium or Chrome metal powder target; Utilize metal plating as intermediary, make target and backboard welding back realize the mortise of the two, have higher binding strength.
The present invention has found out the technical process of a stable surface at chromium or Chrome metal powder target with the chemical plating method metal cladding, and has realized suitability for industrialized production.
Description of drawings
Fig. 1 is the schematic flow sheet that one embodiment of the invention is made target material structure;
Fig. 2 to Fig. 4 is a synoptic diagram of making target material structure according to flow process shown in Figure 1;
Fig. 5 is the schematic flow sheet that an alternative embodiment of the invention is made target material structure.
Embodiment
Contriver of the present invention finds in the making of existing chromium or Chrome metal powder target material assembly it is that chromium or Chrome metal powder and dissimilar metal (for example copper, copper alloy, aluminum or aluminum alloy) backboard are directly welded; Be prone to cause the two welding quality unstable (for example solder bond intensity is weak), do not reach the requirement of semi-conductor target.
The present invention provides a kind of making method of target material assembly, comprising: target is provided, and said target is chromium or Chrome metal powder; Said target material surface is carried out activation treatment; Utilize chemical plating technology, on the target face of weld after the activation treatment, form metal plating; Target after the electroless plating processing is soldered to backboard.
Do detailed explanation below in conjunction with the accompanying drawing specific embodiments of the invention.
With reference to figure 1, embodiment of the present invention provides a kind of making method of target, comprises the steps:
Step S1 provides target, and said target is chromium or Chrome metal powder;
Step S2 carries out activation treatment to said target material surface;
Step S3 utilizes chemical plating technology, on the target face of weld after the activation treatment, forms metal plating;
Step S4 is soldered to backboard with the target after the electroless plating processing and forms target material assembly.
Be elaborated for above-mentioned embodiment below in conjunction with accompanying drawing.
In conjunction with illustrated in figures 1 and 2, S1 is said like step, and target 20 is provided.In this embodiment, the material of said target can be the chromium or the Chrome metal powder of high purity or ultra-high purity, and the purity of said target for example is 3N5 (99.95%), 4N5 (99.995%) or 5N (99.999%) greater than 99.9%.In addition; The shape of target; Actual requirement according to applied environment, sputtering equipment; Can be in circle, rectangle, annular, taper shape or other analogous shapes (comprising regular shape and irregularly shaped) any, in this embodiment be that the circular target of 310mm is an example with the diameter, and its thickness is 12mm; Thickness can add 1 millimeter to 3 millimeters process redundancy on size, the purpose that increases process redundancy is to forming target material assembly procedure of processing afterwards well-to-do processing space to be provided.
Then performing step S2 carries out activation treatment to said target material surface.Have only and target material surface is carried out activation treatment the chemical plating metal layer process of target material surface is carried out smoothly; Because electroless plating does not have the external force startup and help overcomes any surface imperfection, workpiece one gets into the deposition interface that plating bath promptly forms uniformity; Therefore; Electroless plating is that the abutment surface condition starts, i.e. out-phase surface self-catalyzed reaction, rather than electric power.Therefore, target material surface is carried out activation treatment in order to increase the activation energy of target material surface, the reactive behavior of target material surface is strengthened, increase the speed of the chemical plating metal layer of target material surface, avoid the not firm serious problems of metal plating and matrix bond.The selection of acvator is relevant with target material, if can increase the surface of target activation energy, make that the reactive behavior enhanced acvator of target material surface can.
In this embodiment, the chemical nickel plating metal level is an example on chromium or Chrome metal powder target, and chromium or Chrome metal powder activation treatment are adopted concentrated hydrochloric acid solution (analytical pure concentrated hydrochloric acid solution), and soak time is 20s～30s.If soak time is less than 20s, then concentrated hydrochloric acid is bad to the activation effect of the target of chromium or Chrome metal powder, does not play complete activatory effect; If soak time is greater than 30s, then concentrated hydrochloric acid solution is too of a specified duration to the soak time of the target of chromium or Chrome metal powder, and concentrated hydrochloric acid solution can corrode the target of chromium or Chrome metal powder.
Then performing step S3 in conjunction with Fig. 1 and shown in Figure 3, utilizes chemical plating technology, on the face of weld 200 of target 20, forms metal plating 22.Metal plating 22 both can be formed on each surface of target 20 and go up (figure does not show), also can only be formed on the face of weld 200 of target 20.Metal plating 22 is formed on each surface of target 20, will remove except that the metal plating the face of weld 200 with the method for mechanical workout then.If metal plating 22 only is formed on the face of weld 200 of target 20, need in the process step of chemical plating metal layer, other surfaces except that face of weld 200 be protected, make other surfaces not carry out the chemical plating metal layer.But; The cost of protecting other surfaces and only metal plating 22 being plated in the chemical plating method of face of weld 200 is formed on than metal plating 22 on each surface of target 20, will remove the cost height of the metal plating removal of face of weld 200 then with the method for mechanical workout.The material of metal plating 22 can be the nickel metal, but not as limit, in other embodiments, metal plating 22 also can adopt other metal.
Chemical plating technology is a kind of energising that do not need, and according to principle of oxidation and reduction, utilizes strong reductant in containing metal ion solution, and metals ion is reduced into metal and is deposited on the method that various material surfaces form close coating.The coating that is obtained can make material surface possess multiple new function.Electroless plating is a kind of new type of metal process for treating surface, and this technical matters is easy, energy-saving and environmental protection receive publicity day by day.
In this embodiment, be to adopt nickel chemical plating technology, on the face of weld 200 of target 20, form nickel metal plating 22.Concrete technology comprises: all surface of chromium after the activation or Chrome metal powder welding target is immersed in the plating bath of coating bath, and said aqueduct and plating bath all are the coating bath and the plating bath of the chemical nickel plating of Shanghai Xinyang Semiconductor Material Co., Ltd.'s manufacturing.Contain nickel ion in the said plating bath, in this embodiment, the soluble nickel salt that metallic nickel ions is provided is single nickel salt (NiS047H20); Its relative molecular mass is 280.88, green crystal, and the solubleness in the time of 100 ℃ in 100g water is 478.5g; The solution that is made into is deep green, and the pH value is 4.5.
In this embodiment, the concentration of single nickel salt (NiS047H20) maintains 20～40g/L in the chemical nickel-plating solution prescription, contains Ni4～8g/L in other words.The excessive concentration of single nickel salt (NiS047H20) can cause some free Ni
2+When being present in the plating bath, the stability decreases of plating bath, the coating that obtains usually is a bit darkish in color, and color and luster is inhomogeneous.The concentration of single nickel salt (NiS047H20) is low excessively, the coating densification inadequately that plating speed (sedimentation velocity of plating bath) descends and forms.
Also comprise reductive agent in the plating bath.Reductive agent described in this embodiment is a sodium hypophosphite, and plating bath is controlled easily, and it contains two or more active hydrogens, reduction Ni
2+Lean on the catalytic dehydrogenation of reductive agent to carry out.Obtain the Ni-P alloy layer with sodium hypophosphite, and Ni-P alloy layer excellent property.Along with the increase of hypophosphite concentration, the sedimentation velocity of nickel rises.But the concentration of hypophosphite also has restriction, and the mol ratio of it and concentration of nickel sulfate should be greater than 4, otherwise cause coating coarse easily, even bring out the instantaneous decomposition of plating bath.The content of sodium hypophosphite is 20～40g/L in this embodiment.Could guarantee the sedimentation velocity of the existing maximum of chemical nickel-plating solution like this, satisfactory stability property is arranged again.
The influence factor of nickel chemical plating technology mainly comprises pH value, plating bath tonburden and the plating time of bath temperature, plating bath.
In the process of chemical nickel plating, bath temperature all has material impact for the sedimentation velocity of coating, the stability of plating bath and the quality of coating.The catalyzed reaction of chemical nickel plating can only realize under heating condition that generally the single reactions step of many chemical nickel platings is only just having more than 50 ℃ in the tangible speed of response, particularly acidic solution, and service temperature is generally all between 85～95 ℃.The plating bath sedimentation velocity raises with temperature and speeds, 10 ℃ of the general every risings of temperature, and sedimentation velocity just adds fast again.But it is pointed out that bath temperature is too high, can make plating bath unstable again, self-decomposition takes place easily.Temperature also can influence quality of coating except influencing the plating bath sedimentation velocity, temperature raises, the plating bath sedimentation velocity is fast, and phosphorus content descends in the coating, and the stress of coating and porosity increase, and corrosion resisting property reduces.In this embodiment, the temperature of said plating bath is 86 ℃～90 ℃.In addition, temperature control is evenly very important in the nickel process.Sheet coating if temperature fluctuation is excessive in the plating process, can take place in the temperature change of preferably keeping solution in ± 2 ℃, quality of coating is bad and influence binding force of cladding material.
The pH value is very big to the influence of plating bath and coating, and it is must the strict important factor of controlling in the processing parameter.In the acid chemical plating nickel process, the pH value has great influence to sedimentation velocity and coating phosphorus content.Rise with the pH value, the sedimentation velocity of nickel is accelerated, and the phosphorus content of coating descends simultaneously.The pH value changes also can influence stress distribution in the coating, and the coating that the plating bath that the pH value is high obtains is phosphorous low, shows as tensile stress, otherwise the phosphorous height of the coating that the plating bath that the pH value is low obtains shows as stress.To each concrete chemical nickel-plating solution, an optimal pH value scope is arranged all.For example, in this embodiment, the PH scope is 4.6～4.8.And in the chemical nickel plating plating process, along with the Ni-P alloy layer constantly deposits, H
+Constantly generate, the pH value of plating bath constantly descends, and therefore, must in time adjust in the production process, keeps the pH value of plating bath, make its fluctuation range be controlled at ± 0.2 scope within.The adjustment bath pH value; The general ammoniacal liquor that diluted that uses (generally, is diluted to 100ml with the analytically pure ammoniacal liquor of 40ml, also can uses the ammoniacal liquor of other concentration; As long as make that total pH value of solution is in 4.6～4.8 scopes) or sodium hydroxide is (generally; As coarse adjustment, the NaOH of 0.1mol/l also can use the sodium hydroxide solution of other concentration as fine setting with the NaOH of 1mol/l; As long as make that total pH value of solution is in 4.6～4.8 scopes), the pH value of adjustment plating bath will carry out under condition of stirring.During with NaOH adjustment bath pH value, the acid-base neutralisation reaction only takes place, with the H that generates in the reaction process
+Neutralize, and during with ammoniacal liquor adjustment bath pH value, except in plating bath H
+Outward, amino molecule in the plating bath and the Ni in the plating bath
2+Reaction has reduced free Ni in the plating bath
2+Concentration has effectively suppressed the deposition of phosphorous acid nickel, has improved the stability of plating bath.
The plating bath tonburden is meant workpiece plating area and the ratio that uses the plating bath volume.During the chemical nickel plating plating, tonburden is very big to the bath stability influence.In this embodiment, the tonburden of plating bath is at 0.5～1.5dm
2/ L.Tonburden is excessive, and promptly catalytic surface is excessive, and then deposition reaction is violent, be prone to generate phosphorous acid nickel deposition and influences the stability and the coating performance of plating bath; Tonburden is too small, and small impurity particle just can become catalytic active center and cause deposition in the plating bath, causes plating bath to decompose easily.
Adopt different plating times all influential to hardness, sedimentation rate, erosion resistance, microstructure and the pattern of coating in the nickel chemical plating technology, in this embodiment, the plating time length can be 30min ± 5min; This moment, quality of coating was best; Gained coating light, the cellular structure even compact, erosion resistance is strong; And having higher hardness, the thickness of chromium or Chrome metal powder target material surface institute metallizing nickel dam is 8 μ m～10 μ m.If the overlong time of chemical nickel plating (greater than 35min), the thickness of chromium or Chrome metal powder target material surface institute metallizing nickel dam blocked up (greater than 10 μ m) then, the bonding force of nickel metal layer and chromium or nickel metal layer and Chrome metal powder target material surface is not strong like this.If the time of chemical nickel plating too short (less than 25min), coating color light inadequately then, cellular structure can even compact, and erosion resistance thickness and hardness relatively poor and coating do not reach requirement (thickness requirement is 8 μ m～10 μ m).
Then said chromium or Chrome metal powder target are taken out, clean.Comprise: said chromium or Chrome metal powder target are taken out, with pure water or washed with de-ionized water; In pure water or deionized water, soak into oven dry.The said time of in pure water or deionized water, soaking into is 1 minute to 3 minutes, and temperature is 35 ℃ to 45 ℃.
Especially; If target is not when directly needing to store for some time with the backboard soldering behind the chemical nickel plating; Can also comprise chromium that is electroplate with the nickel metal plating or Chrome metal powder target after cleaning are given vacuum-packed step, problem such as can avoid target to be exposed to occurring for example oxidation under the external environment, make moist.
Then performing step S4 in conjunction with Fig. 1 and shown in Figure 4, provides backboard 24, and target 20 and backboard 24 are welded, and this embodiment is soldering, target 20 is soldered to backboard 24 forms target material assembly.The material of backboard 24 is the different metal of material (chromium or Chrome metal powder) with said target 20, for example is copper or copper alloy.
In above-mentioned steps S4, specifically can comprise: chromium or Chrome metal powder target 20 are carried out preheating, solder is evenly distributed on the face of weld 200 of chromium or Chrome metal powder target 20; To the processing of polishing of the face of weld of copper or copper alloy backing plate 24, and carry out preheating, solder is evenly distributed on the face of weld of copper or copper alloy backing plate 24; Let the face of weld 200 (face of weld 200 has nickel metal plating 22) of chromium or Chrome metal powder target 20 contact with the face of weld of copper or copper alloy backing plate 24; Under the HTHP effect, chromium or Chrome metal powder target 20 are soldered to copper or copper alloy backing plate 24 formation target material assemblies.
Can know by inference; Because in step S4; On the face of weld 200 of chromium or Chrome metal powder target 20, be formed with the nickel metal plating 22 that Yi Yutong or copper alloy combine, utilized nickel metal plating 22, thereby made chromium or Chrome metal powder target 20 and copper or copper alloy backing plate 24 through the two mortise of the realization behind the brazing operations as intermediary; Have very high bonding strength, meet the requirements of making of target material assembly.In addition; Chromium in target material assembly or 20 sputters of Chrome metal powder target also can be passed through surface treatment methods such as polishing, polishing after consuming, and are easy to remove solder residual on the face of weld of copper or copper alloy backing plate 24 and nickel metal plating; Thereby can guarantee that copper or copper alloy backing plate come into operation again; Constitute new target material assembly with other chromium or the welding of Chrome metal powder target, improved copper or copper alloy backing plate utilization ratio, saved production cost.
Do detailed explanation in the face of another embodiment of the invention down.The difference of this embodiment and a last embodiment is to provide the step of target (with reference to the step S1 of figure 1) afterwards and said target material surface is carried out activation treatment (with reference to the step S2 of figure 1) increased before said target material surface is carried out polished finish successively, said target material surface is cleaned, said target material surface is carried out the process step that blasting craft is handled, the said target material surface after the sandblast is cleaned.Can be so that the better effects if of follow-up activation step and chemical plating technology, make better to combine between target and the target back of the body.
With reference to figure 5, embodiment of the present invention provides a kind of making method of target, comprises the steps:
Step S51 provides target, and said target is chromium or Chrome metal powder;
Step S52 carries out polished finish to said target material surface;
Step S53 cleans said target material surface;
Step S54 carries out blasting craft to said target material surface and handles;
Step S55 cleans the said target material surface after the sandblast;
Step S56 carries out activation treatment to the said target material surface after the sandblast;
Step S57 utilizes chemical plating technology, on the target face of weld after the activation treatment, forms metal plating;
Step S58 is soldered to backboard with the target after the electroless plating processing and forms target material assembly.
Be elaborated for above-mentioned embodiment below in conjunction with accompanying drawing.
In conjunction with Fig. 5 and Fig. 2, S51 is said like step, and chromium or Chrome metal powder target are provided.Specifically can be with reference to the target 20 that provides among the last embodiment to the requirement of target.
Then performing step S52 carries out polished finish to said chromium or Chrome metal powder target material surface, and it is that this target material surface smooth is removed and made to the oxide debris of this target that said chromium or Chrome metal powder target material surface are carried out the polished finish purpose.
In this embodiment, it is to polish with water-based sand paper from coarse to fine that said chromium or Chrome metal powder target material surface are carried out polished finish.Specifically, at first use the surface (target all or is only carried out polished finish with the face of weld of target) of flint paper (present embodiment is 160# water-based sand paper) polishing target, the polishing time generally can be for about 10 minutes (min); Use fine sandpaper (present embodiment is 400# water-based sand paper) to continue the surface (target all or is only carried out polished finish with the face of weld of target) of polishing target then; The polishing time generally can be 5～10 minutes (min), so just can obtain the flour milling of smooth.In when polishing, water-based sand paper is attached on the rotating disk of sharpening machine, pins target (the surface of needs polishing towards sand paper) and on sand paper, grinds.The sharpening machine rotating speed can be 400～500 rev/mins (r/min).
Then performing step S53 cleans said target material surface; It is (target all or only to be cleaned the face of weld of target, if in step S52, only polish the face of weld of target, then among the step S53 face of weld is cleaned in order to clean dust and spot that target after the polished finish is cleaned; If in step S52, all surface of polishing target, then all surface to target cleans among the step S53).Detailed process is in the normal temperature, with a large amount of pure water or deionized water target material surface is washed 3～5 minutes (min), dries up then.
Then performing step S54 carries out the blasting craft processing to said chromium or Chrome metal powder target material surface; The effect of target material surface being carried out sandblasting mainly is to make that target formed metal level in surface when carrying out electroless plating is a discontinuous coating; Reduce the roughness of coating surface tension force, increase target material surface; Improve the bonding force of coating and target material surface, make that coating is not easy to come off from target material surface.
Sandblast is that employing pressurized air is power; To spray material (copper ore, silica sand, silicon carbide, iron sand, SEMEN AMOMI LONGILIGULA) high-velocity jet to the workpiece surface that needs to handle to form the high-velocity jet bundle; The appearance or the shape of the outside surface of workpiece surface are changed, because the spray material to the impact and the shear action of workpiece surface, makes the surface of workpiece obtain certain degree of cleaning and different roughness; The mechanical property of workpiece surface is improved; Therefore improve the fatigue resistence of workpiece, increased the sticking power between it and the coating, the weather resistance that has prolonged coating.
The principal element that influences the sandblast quality has: sand material, sand grains size, air pressure, spray angle, jet length.The variation of any one parameter all can influence the effect of sandblast to some extent, wherein is even more important for sand material, sand grains size, air pressure.
No. 46 white fused aluminas of selecting in this embodiment to contain 46 white fused aluminas per square inch are as the sand grains that uses.Pour No. 46 white fused aluminas into sandblast machine; Sandblast machine air pressure scope is controlled at about 0.4MPa ± 0.05; If air pressure is greater than 0.45MPa; Then the power of sandblast is too big, and the mean depth (it is 8 μ m～10 μ m that the degree of depth requires) in chromium or Chrome metal powder target material surface hole is strengthened, and influences the follow-up metal plating and the bonding force of target material surface.If air pressure is less than 0.35MPa, then being short of power of sandblast makes the mean depth in target material surface hole too little, influences the bonding force of follow-up metal plating and target material surface equally.
In this embodiment; The nozzle of sand-blasting gun is 10cm～15cm to the distance range of target material surface; The direction of No. 46 white fused aluminas of nozzle ejection is other angles except 90 degree (nozzle is vertical with target material surface) with the angle of target material surface; The best angle scope is 30～60 degree, can guarantee the homogeneity of sandblast and certain coverage is arranged.Forming mean depth at chromium or Chrome metal powder target material surface after the sandblast is the rough layer of 8～10 μ m.
Need to prove; In performing step S54, chromium or Chrome metal powder target all or are only carried out sandblast with the face of weld of chromium or Chrome metal powder target, if in step S52 and S53; Only polish and clean the face of weld of target, then the face of weld to target carries out sandblast among the step S54; If in step S52 and S53, all surface of polishing and cleaning target, then all surface to target carries out sandblast among the step S54.
Then performing step S55 cleans the said target material surface after the sandblast; Detailed process is with pure water or deionized water rinsing target material surface 5min～10min, and purpose is to clean up for the sand grains with target material surface.
Then performing step S56 carries out activation treatment to the said target material surface after the sandblast; Target material surface is carried out activation treatment in order to increase the activation energy of target material surface, the reactive behavior of target material surface is strengthened, increase the speed of the chemical plating metal layer of target material surface, avoid the not firm serious problems of metal plating and matrix bond.In this embodiment, chemical nickel plating metal level on the target of chromium or Chrome metal powder adopts concentrated hydrochloric acid solution (analytical pure concentrated hydrochloric acid solution) to chromium or Chrome metal powder activation treatment, and soak time is 20s～30s.Detailed process can in this embodiment, can be carried out activation treatment to the face of weld of target with reference to a last embodiment, also can carry out activation treatment to each surface of target.
Then performing step S57 utilizes chemical plating technology, on the target face of weld after the activation treatment, forms metal plating; In this embodiment, utilize chemical plating technology, on chromium or Chrome metal powder target, form the nickel metal plating.The nickel metal plating both can be formed on each surface of chromium or Chrome metal powder target, also can only be formed on the face of weld of chromium or Chrome metal powder target.This embodiment detailed process can be with reference to a last embodiment.
Need to prove if on each surface of chromium or Chrome metal powder target, form the nickel metal plating, need to remove other metal plating beyond the target face of weld with the method for mechanical polishing.
Then performing step S58 is soldered to backboard with the target after the electroless plating processing and forms target material assembly.In the present embodiment, be that chromium behind the chemical nickel plating or Chrome metal powder target are soldered to copper or copper alloy backing plate, concrete with reference to the S4 step among the last embodiment.
Specific embodiment:
Chromium target with 3N5,4N5 or 5N is that example is explained process step of the present invention and result:
(1), polished finish is carried out on each surface of chromium target (diameter is 310mm, and thickness is 12mm), at first use 10 minutes (min) in each surface of this target of 160# water-based sand papering; Use 8 minutes (min) in each surface of this target of 400# water-based sand paper continuation polishing then, can obtain the flour milling of smooth like this;
(2) each surface of the chromium target after will polishing dries up with cleaning 5 minutes (min) in pure water or the deionized water;
(3) blasting craft being carried out on each surface of dried said chromium target handles; Adopt No. 46 white fused alumina; Air pressure is 0.4MPa; The nozzle of sand-blasting gun is 15cm to the distance of this target material surface, and the direction of No. 46 white fused aluminas of nozzle ejection and the angle of target material surface are 60 degree, and forming mean depth at target material surface after the sandblast is the rough layer of 8 μ m;
(4) with pure water or 5 minutes (min) in each surface of this chromium target of deionized water rinsing;
(5) carry out activation to whole being immersed in of said chromium target in the analytically pure concentrated hydrochloric acid solution, soak time is 30s;
(6) all surface with the chromium target after the activation immerses in the plating bath of coating bath, and said aqueduct and plating bath all are the coating bath and the plating bath of the chemical nickel plating of Shanghai Xinyang Semiconductor Material Co., Ltd.'s manufacturing,
The content that the concentration of single nickel salt in the chemical nickel-plating solution (NiS047H20) maintains 30g/L, sodium hypophosphite is 30g/L; The tonburden of plating bath is at 1dm
2/ L; The temperature of said plating bath is 88 ℃, and the temperature change of keeping solution in the nickel process is in ± 2 ℃; Regulating and keeping said plating bath pH value is 4.7; The plating time length is 30 minutes (min), and forming thickness requirement on each surface of target at last is the metal nickel dam of 8 μ m;
(7) the said chromium target that will accomplish electroless plating takes out, and adopts a large amount of pure water or deionized water to clean;
(8) said chromium target is soaked in pure water or deionized water, the time of infiltration is about 2 minutes, and temperature is about 40 ℃;
The said chromium target that (9) will pass through infiltration takes out and oven dry;
(10) with the method for mechanical workout the nickel metal plating beyond the face of weld is removed then;
(11) the copper backboard is provided, chromium target and copper backboard are carried out soldering (with pure indium In scolder), form target material assembly.
If directly chromium target and copper backboard are welded with pure indium (In) scolder; Chromium or Chrome metal powder target can not carry out with indium well with the copper backboard that thereby the interface is wetting to be combined, i.e. about the basic position of the welding strength 0MPa of indium weldering this moment (not having bonding force basically).Through above-mentioned each step; Can be formed with the nickel metal plating so that said chromium target is handled the surface, back in electroless plating; Thereby make that the process indium welds post-job chromium target and the copper backboard has very high bonding strength; About the basic position of the welding strength 5MPa of i.e. indium weldering this moment (its bonding strength is the upper limit (UL) bonding strength), therefore produce high-quality target material assembly through above-mentioned steps.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction.Any those of ordinary skill in the art; Do not breaking away under the technical scheme scope situation of the present invention; All the method for above-mentioned announcement capable of using and technology contents are made many possible changes and modification to technical scheme of the present invention, or are revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical scheme of the present invention, all still belongs in the scope of technical scheme protection of the present invention any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (5)
1. the making method of a target material structure is characterized in that, said method comprises:
Target is provided, and said target is chromium or Chrome metal powder;
Said target material surface is carried out activation treatment;
Utilize chemical plating technology, on the target face of weld after the activation treatment, form metal plating, the thickness of said metal plating is 8 μ m～10 μ m; The electroplate liquid formulation of said electroless plating is the NiSO that concentration maintains 20～40g/L
47H
2O and content are the sodium hypophosphite of 20～40g/L, and the tonburden of plating bath is at 0.5～1.5dm
2/ L, the temperature of plating bath is controlled at 86 ℃～90 ℃, and the pH value of said plating bath is 4.6～4.8, and the material of said metal plating is a nickel;
Target after electroless plating handled is soldered to backboard, and said backboard specifically is by copper, aluminium or to include the alloy of any metal in copper and the aluminium made.
2. the making method of target material structure according to claim 1 is characterized in that, before said target material surface being carried out activation treatment, also comprises the step of said target material surface being carried out blasting craft.
3. the making method of target material structure according to claim 2 is characterized in that, said target material surface is being carried out also comprise the step of polishing said target material surface before the blasting craft processing.
4. the making method of target material structure according to claim 3; It is characterized in that, after to said target material surface polished finish and before said target material surface being carried out the blasting craft processing and before carrying out activation treatment after the said target material surface blasting craft processing and to said target material surface, also comprise step with pure water or washed with de-ionized water target material surface.
5. the making method of target material structure according to claim 1 is characterized in that, it is 20 seconds～30 seconds that said target material surface is carried out the activation treatment time.
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383099B (en) * | 2011-11-14 | 2013-11-13 | 余姚康富特电子材料有限公司 | Method for manufacturing target material structure |
| CN102586743A (en) * | 2011-11-30 | 2012-07-18 | 余姚康富特电子材料有限公司 | Manufacture method of target structure |
| CN102586742B (en) * | 2011-11-30 | 2013-12-11 | 余姚康富特电子材料有限公司 | Manufacture method of target material structure |
| CN102605331A (en) * | 2011-12-16 | 2012-07-25 | 余姚康富特电子材料有限公司 | Method for manufacturing target component |
| CN102534517B (en) * | 2011-12-27 | 2014-04-09 | 余姚康富特电子材料有限公司 | Making method for target assembly |
| CN102586744B (en) * | 2011-12-30 | 2014-05-07 | 余姚康富特电子材料有限公司 | Target blank and forming method thereof |
| CN105296943A (en) * | 2014-07-30 | 2016-02-03 | 宁波江丰电子材料股份有限公司 | Manufacturing method of target assembly |
| CN105331938A (en) * | 2014-07-30 | 2016-02-17 | 宁波江丰电子材料股份有限公司 | Manufacturing method for target material assembly |
| CN105803405A (en) * | 2014-12-31 | 2016-07-27 | 宁波江丰电子材料股份有限公司 | Method for manufacturing target material structure |
| CN112276271A (en) * | 2020-10-14 | 2021-01-29 | 宁波江丰电子材料股份有限公司 | Welding method of titanium-aluminum alloy target |
| CN113231705B (en) * | 2021-05-20 | 2022-11-04 | 上海博译金属有限公司 | Method for compounding chromium target and copper back plate for sputtering coating |
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Address after: 315400 Ningbo City, Yuyao Province Economic Development Zone, state science and Technology Industrial Park Road, No. 198, No. Patentee after: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Address before: 315400 Ningbo City, Yuyao Province Economic Development Zone, state science and Technology Industrial Park Road, No. 198, No. Patentee before: Ningbo Jiangfeng Electronic Materials Co., Ltd. |