CN112276271A - Welding method of titanium-aluminum alloy target - Google Patents
Welding method of titanium-aluminum alloy target Download PDFInfo
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- CN112276271A CN112276271A CN202011099163.1A CN202011099163A CN112276271A CN 112276271 A CN112276271 A CN 112276271A CN 202011099163 A CN202011099163 A CN 202011099163A CN 112276271 A CN112276271 A CN 112276271A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
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Abstract
The invention provides a welding method of a titanium-aluminum alloy target, which comprises the following steps: (1) respectively carrying out surface pretreatment on the titanium-aluminum alloy target and the back plate, wherein the surface pretreatment is sand blasting nickel plating treatment and/or polishing treatment; (2) heating the titanium-aluminum alloy target material subjected to surface pretreatment, and then distributing the welding flux on the welding surface of the titanium-aluminum alloy target material; (3) heating the backboard subjected to surface pretreatment, and then distributing the solder on the welding surface of the backboard; (4) the titanium-aluminum alloy target material distributed with the solder is attached to the back plate distributed with the solder, soldering is carried out, and the titanium-aluminum alloy target material assembly is obtained after cooling; wherein, the step (2) and the step (3) are not in sequence. The welding method provided by the invention is suitable for welding the titanium-aluminum alloy target material, and the welding bonding rate and the welding strength of the titanium-aluminum alloy target material can be improved under a low-temperature environment.
Description
Technical Field
The invention belongs to the field of semiconductor manufacturing, relates to a welding method of a target assembly, and particularly relates to a welding method of a titanium-aluminum alloy target.
Background
Nowadays, the demand of mobile data shows an explosive growth trend, and the existing mobile communication systems and devices are difficult to meet the huge demand in the future, so that the development of new 5G communication technology is urgent. New communication technologies are demanding on the integrated circuit industry. The metal film is a strategic material playing a role in supporting a core in the electronic information industry, and the sputtering target material is a key source material for preparing the metal film, and is mainly applied to the electronic and information industry, such as integrated circuits, information storage, liquid crystal display screens, laser memories, electronic control devices and the like. The titanium-aluminum alloy target is used as one of magnetron sputtering targets and is very widely applied. In the using process, the titanium-aluminum alloy target material is welded on a back plate material with good electrical conductivity, good thermal conductivity and high strength, and the welding rate and the welding strength of the titanium-aluminum alloy and the back plate material need to be ensured, so that the use stability of the target material and the electrical conductivity of the metal film are improved.
However, titanium-aluminum alloy as an active metal has many problems in the welding process: (1) the titanium-aluminum alloy has high affinity with oxygen, and a stable oxide film is easily generated on the surface of the titanium-aluminum alloy, so that the wetting and spreading of the brazing filler metal are influenced; (2) the titanium-aluminum alloy has adsorption tendency to hydrogen, oxygen and nitrogen in the heating process, and the adsorption is more serious the higher the temperature is, so that the plasticity and the toughness of the titanium-aluminum alloy are reduced rapidly; (3) the titanium-aluminum alloy can react with most of brazing filler metals to generate brittle compounds, so that the joints become brittle; (4) the titanium-aluminum alloy is subjected to phase transformation and grain coarsening when being heated, and the coarsening is more serious when the temperature is higher. Based on the above problems, it is necessary to develop a new welding method applicable to titanium-aluminum alloy.
CN 101745710a discloses a welding method of a target assembly, which can enhance the bonding strength of a chromium or chromium alloy target blank and a backing plate after brazing, and avoid oxidation of the backing plate during welding, thereby ensuring stable performance of the target assembly and meeting the product quality requirements. However, the preheating temperature of the invention is as high as 600-850 ℃, and the titanium-aluminum alloy is easy to generate phase change and grain coarsening at the temperature, thereby influencing the welding rate and the welding strength.
CN 101518851a discloses a welding structure and method for target and back plate, which can implement large area welding, effectively prevent metal from being oxidized, improve the bonding strength between the tantalum target and the copper or copper alloy back plate, and prevent the tantalum target from being detached during sputtering, thereby ensuring normal sputtering coating. However, the welding temperature of the invention is 450-800 ℃, and the invention is not suitable for titanium-aluminum alloy.
CN 104690417a discloses a method for welding a nickel or nickel alloy target material and a back plate, which can realize high-strength and high-welding-rate welding of a large-area nickel or nickel alloy target material, ensure good heat conduction between the target material and the back plate, prevent the nickel or nickel alloy target material from deforming, warping, separating and the like between the target material and the back plate due to excessive sputtering power, and ensure the sputtering performance of the nickel or nickel alloy target material. However, the welding temperature of the invention is 400-650 ℃, and the invention is also not suitable for titanium-aluminum alloy.
CN 101972875a discloses a welding method of tungsten-titanium alloy target, which can combine the tungsten-titanium alloy target with a back plate, especially a copper back plate, with high strength to meet the high strength requirement of the sputtering process; even when the target area is large, the target assembly, particularly the tungsten-titanium alloy target, can be effectively inhibited from being largely deformed or warped. However, said invention does not disclose whether it is suitable for titanium-aluminum alloys.
Therefore, how to provide a welding method suitable for titanium-aluminum alloy, which can improve the welding bonding rate and the welding strength of the titanium-aluminum alloy target material in a low-temperature environment, becomes a technical problem which needs to be solved urgently at present.
Disclosure of Invention
The invention aims to provide a welding method of a titanium-aluminum alloy target, which realizes the possibility of brazing the titanium-aluminum alloy target at a low temperature and improves the welding bonding rate and the welding strength between the titanium-aluminum alloy target and a back plate.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a welding method of a titanium-aluminum alloy target, which comprises the following steps:
(1) respectively carrying out surface pretreatment on the titanium-aluminum alloy target and the back plate, wherein the surface pretreatment is sand blasting nickel plating treatment and/or polishing treatment;
(2) heating the titanium-aluminum alloy target material subjected to surface pretreatment, and then distributing the welding flux on the welding surface of the titanium-aluminum alloy target material;
(3) heating the backboard subjected to surface pretreatment, and then distributing the solder on the welding surface of the backboard;
(4) the titanium-aluminum alloy target material distributed with the solder is attached to the back plate distributed with the solder, soldering is carried out, and the titanium-aluminum alloy target material assembly is obtained after cooling;
wherein, the step (2) and the step (3) are not in sequence.
Preferably, the surface pretreatment of the titanium-aluminum alloy target material in the step (1) is sand blasting nickel plating treatment.
Preferably, the grit blast roughness of the grit blast nickel plating process is 5 to 20 μm, and may be, for example, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm, but is not limited to the values recited, and other values not recited within the range of values are also applicable.
Preferably, the thickness of the nickel plated layer by the sandblasting nickel plating treatment is 1 to 15 μm, and may be, for example, 1 μm, 3 μm, 5 μm, 7 μm, 9 μm, 11 μm, 13 μm or 15 μm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
According to the invention, the sand blasting nickel plating treatment can enhance the infiltration and fusion of the solder and the titanium-aluminum alloy target material, so that the welding surface of the titanium-aluminum alloy target material and the welding surface of the back plate are welded together and have higher bonding strength, and the welding strength of the target material assembly can meet the high-strength requirement of a sputtering process.
Preferably, the material of the back plate in the step (1) is copper-based alloy or aluminum-based alloy.
Preferably, the surface pretreatment of the back plate is a polishing treatment.
Preferably, the roughness of the polishing treatment is 0.1 to 5 μm, and may be, for example, 0.1 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm or 5 μm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
In the invention, the polishing can increase the roughness of the surface of the back plate, so that the solder is easier to fuse on the welding surface of the back plate. The debris and impurities generated during the polishing process may be washed with organic solvents including alcohols and/or jet fuel.
Preferably, the heating temperature in step (2) is 160-300 ℃, and may be, for example, 160 ℃, 170 ℃, 180 ℃, 190 ℃, 200 ℃, 210 ℃, 220 ℃, 230 ℃, 240 ℃, 250 ℃, 260 ℃, 270 ℃, 280 ℃, 290 ℃ or 300 ℃, but is not limited to the recited values, and other unrecited values within the range of the values are also applicable.
According to the invention, the heating mode comprises heating furnace radiation heating and/or heating plate direct heating, the sputtering surface of the titanium-aluminum alloy target material needs to be protected necessarily before heating, firstly, the sputtering surface is protected from being scratched, secondly, the solder is convenient to remove subsequently, and the main protection mode is that a high-temperature-resistant adhesive tape is pasted on the sputtering surface of the target material.
Preferably, the solder in the step (2) is indium solder.
In the invention, the indium solder can be completely melted at the temperature of 160-300 ℃, and the titanium-aluminum alloy target material is infiltrated and fused, so that the possibility of brazing at low temperature is realized. And the low-temperature welding environment avoids a series of phenomena of air suction reaction of the target material, chemical reaction with the solder, coarsening of crystal grains and the like, thereby greatly improving the welding performance and the sputtering performance of the target material.
Preferably, the solder in the step (2) is also subjected to ultrasonic treatment in the distribution process.
Preferably, the solder in the step (2) further comprises the operation of brushing the welding surface by a steel brush after the distribution is finished.
In the invention, solder is required to be added continuously in the process of the ultrasonic treatment and the operation of brushing the welding surface by the steel brush, so that the solder can fully infiltrate the target material; the ultrasonic treatment and the steel brushing operation are both performed for 5-60min, and may be performed for 5min, 10min, 15min, 20min, 25min, 30min, 35min, 40min, 45min, 50min, 55min or 60min, for example, but not limited to the values listed, and other values not listed in the range of values are also applicable.
Preferably, the heating temperature in step (3) is 160-300 ℃, and may be, for example, 160 ℃, 170 ℃, 180 ℃, 190 ℃, 200 ℃, 210 ℃, 220 ℃, 230 ℃, 240 ℃, 250 ℃, 260 ℃, 270 ℃, 280 ℃, 290 ℃ or 300 ℃, but is not limited to the recited values, and other unrecited values within the range of the values are also applicable.
In the invention, the heating mode comprises heating furnace radiation heating and/or heating plate direct heating.
Preferably, the welding surface center of the back plate in the step (3) is provided with a solder groove, and the solder is distributed in the solder groove.
In the invention, the shape of the solder groove corresponds to the shape of the welding surface of the titanium-aluminum alloy, and the solder groove can completely accommodate the welding surface of the titanium-aluminum alloy so as to facilitate the welding of the titanium-aluminum alloy and the back plate.
Preferably, the solder in step (3) is indium solder.
In the invention, the indium solder can be completely melted at the temperature of 160-300 ℃, and wets and fuses the back plate, thereby realizing the possibility of brazing at low temperature.
Preferably, the solder in the step (3) is also subjected to ultrasonic treatment in the distribution process.
Preferably, the solder in the step (3) further comprises the operation of brushing the solder bath by a steel brush after the distribution is finished.
In the invention, the solder is required to be added continuously in the ultrasonic treatment and the operation of brushing the solder groove by the steel brush, so that the solder can fully infiltrate the back plate; the ultrasonic treatment and the steel brush brushing the solder bath are both performed for 5-60min, and may be, for example, 5min, 10min, 15min, 20min, 25min, 30min, 35min, 40min, 45min, 50min, 55min or 60min, but is not limited to the values listed, and other values not listed in the range of values are also applicable.
Preferably, the step (2) and the step (4) further comprise the step of scraping the welding surface of the steel brush after being brushed.
Preferably, the tool used for the scraping operation is a scraper.
Preferably, the scraping operation of the solder groove after the steel brush is brushed is further included between the step (3) and the step (4).
Preferably, the tool used for the scraping operation is a scraper.
In the invention, the strickling operation can remove the oxide layer and the internal impurities on the surface of the liquid solder, thereby achieving a mirror effect and further enhancing the welding bonding rate and the welding strength of the target and the back plate.
Preferably, the solder grooves of the back plate in step (4) are disposed with 1-5 concentric circles, such as 1, 2, 3, 4 or 5, but not limited to the values listed, and other values not listed in the range of values are also applicable.
Preferably, the concentric circles are made of metal wires.
In the invention, the material of the metal wire is the same as that of the back plate, for example, the metal wire can be a copper wire or an aluminum wire.
Preferably, the wire has a diameter of 0.1 to 1mm, and may be, for example, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, but is not limited to the recited values, and other values not recited within the range of values are equally applicable.
Preferably, the concentric circles are equally spaced.
In the invention, the concentric circles of the metal wires are added into the solder groove of the back plate to form a solder layer with a certain thickness, so that the target material is prevented from extruding the solder out of the solder groove; compared with a linear type metal wire, the design of the concentric circles facilitates subsequent rotation of the target, and further improves the welding bonding rate and the welding strength of the target and the back plate.
Preferably, the attaching of step (4) is accompanied by a pressing process.
In the invention, the target material placed in the back plate solder groove needs to be rapidly rotated for a plurality of circles before the pressing is carried out so as to remove air inside, and the pressing can prevent air from entering the inside from the welding edge on one hand and can prevent the target material from deforming in the cooling process on the other hand.
As a preferred embodiment of the present invention, the welding method includes the steps of:
(1) carrying out sand blasting nickel plating treatment on the surface of the titanium-aluminum alloy target, wherein the sand blasting roughness is 5-20 mu m, and the nickel plating thickness is 1-15 mu m; polishing the surface of the back plate, wherein the roughness of the polishing treatment is 0.1-5 mu m; the back plate is made of copper-based alloy or aluminum-based alloy;
(2) heating the titanium-aluminum alloy target material obtained in the step (1) at the temperature of 160-;
(3) heating the backboard obtained in the step (1) at the temperature of 160-300 ℃, then distributing indium solder in a solder groove of the backboard, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush grinding and brushing the solder groove after the distribution is finished, and then a scraper is used for scraping the solder groove of the backboard;
(4) placing 1-5 concentric circles of metal wires in the solder groove of the backboard obtained in the step (3), wherein the diameter of the metal wires is 0.1-1mm, and the distances between the concentric circles are equal; pressing and attaching the welding surface of the titanium-aluminum alloy target material obtained in the step (2) and a welding groove of a back plate, welding, and cooling to obtain a titanium-aluminum alloy target material assembly;
wherein, the step (2) and the step (3) are not in sequence.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the welding method provided by the invention, through carrying out a series of treatments on the titanium-aluminum alloy target material and the back plate, such as processes of sand blasting and nickel plating, ultrasonic treatment, steel brush grinding and brushing, metal wire adding and the like, the solder is better spread and infiltrated on the surface of the target material, the welding bonding rate and the welding strength between the titanium-aluminum alloy target material and the back plate are improved to a great extent, and the welding bonding rate reaches more than 99.5%;
(2) the invention realizes the possibility of brazing the titanium-aluminum alloy target material at low temperature, and avoids a series of phenomena of air suction reaction of the target material, chemical reaction with solder, grain coarsening and the like due to low welding temperature, thereby greatly improving the welding performance and sputtering performance of the target material.
Drawings
FIG. 1 is a flow chart of a welding method of a titanium-aluminum alloy provided by the invention;
FIG. 2 is a schematic view of a welding method of a titanium-aluminum alloy provided in example 1;
fig. 3 is a schematic view of a back plate solder bath in the titanium-aluminum alloy soldering method provided in example 1.
Wherein: 10-titanium aluminum alloy target material; 100-welding surface of titanium-aluminum alloy target material; 20-a back plate; 200-the soldering surface of the back plate; 201-a solder bath; 202-concentric circles of wire.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The embodiment provides a welding method of a titanium-aluminum alloy shown in fig. 1, which comprises the following steps:
(1) carrying out sand blasting nickel plating treatment on the surface of the titanium-aluminum alloy target material 10, wherein the sand blasting roughness is 12.5 mu m, and the nickel plating thickness is 8 mu m; polishing the surface of the back plate 20, wherein the roughness of the polishing treatment is 2.5 μm; the back plate 20 is made of copper-based alloy;
(2) heating the titanium-aluminum alloy target material 10 obtained in the step (1) at 230 ℃, then distributing indium solder on the welding surface 100 of the titanium-aluminum alloy target material, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush grinding and brushing welding surface operation after the distribution is finished, and then a scraper is used for scraping the welding surface 100 of the titanium-aluminum alloy target material;
(3) heating the backboard 20 obtained in the step (1) at 230 ℃, then distributing indium solder in a solder groove 201 of the backboard, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush grinding and brushing the solder groove after the indium solder is distributed, and then a scraper is used for scraping the solder groove 201 of the backboard;
(4) 3 concentric circles 202 of copper wires are placed in a solder groove 201 of the back plate obtained in the step (3), the diameter of each metal wire is 0.5mm, and the distance between every two adjacent concentric circles is equal (see fig. 3); pressing and attaching the welding surface 100 of the titanium-aluminum alloy target obtained in the step (2) and a welding groove 201 of a back plate, welding, and cooling to obtain a titanium-aluminum alloy target assembly (see fig. 2);
wherein, the step (2) and the step (3) are not in sequence.
The weld bonding rate of the titanium-aluminum alloy target assembly obtained in this example is shown in table 1.
Example 2
The embodiment provides a welding method of a titanium-aluminum alloy shown in fig. 1, which comprises the following steps:
(1) carrying out sand blasting nickel plating treatment on the surface of the titanium-aluminum alloy target, wherein the sand blasting roughness is 10 mu m, and the nickel plating thickness is 4 mu m; polishing the surface of the back plate, wherein the roughness of the polishing treatment is 1 micron; the back plate is made of aluminum-based alloy;
(2) heating the titanium-aluminum alloy target material obtained in the step (1) at 195 ℃, then distributing indium solder on the welding surface of the titanium-aluminum alloy target material, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush welding surface grinding and brushing operation after the distribution is finished, and then a scraper is used for scraping the welding surface of the titanium-aluminum alloy target material;
(3) heating the backboard obtained in the step (1) at 195 ℃, then distributing indium solder in a solder groove of the backboard, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises a steel brush grinding and brushing operation on the solder groove after the indium solder is distributed, and then a scraper is used for scraping the solder groove of the backboard;
(4) placing 2 concentric circles of aluminum wires in the solder groove of the backboard obtained in the step (3), wherein the diameter of each metal wire is 0.25mm, and the distance between every two concentric circles is equal; pressing and attaching the welding surface of the titanium-aluminum alloy target material obtained in the step (2) and a welding groove of a back plate, welding, and cooling to obtain a titanium-aluminum alloy target material assembly;
wherein, the step (2) and the step (3) are not in sequence.
The weld bonding rate of the titanium-aluminum alloy target assembly obtained in this example is shown in table 1.
Example 3
The embodiment provides a welding method of a titanium-aluminum alloy shown in fig. 1, which comprises the following steps:
(1) carrying out sand blasting nickel plating treatment on the surface of the titanium-aluminum alloy target, wherein the sand blasting roughness is 15 mu m, and the nickel plating thickness is 10 mu m; polishing the surface of the back plate, wherein the roughness of the polishing treatment is 4 microns; the back plate is made of aluminum-based alloy;
(2) heating the titanium-aluminum alloy target material obtained in the step (1) at 265 ℃, then distributing indium solder on the welding surface of the titanium-aluminum alloy target material, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush grinding and brushing operation on the welding surface after the distribution is finished, and then a scraper is used for scraping the welding surface of the titanium-aluminum alloy target material;
(3) heating the backboard obtained in the step (1) at 265 ℃, then distributing indium solder in a solder groove of the backboard, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises a steel brush grinding and brushing operation on the solder groove after the indium solder is distributed, and then a scraper is used for scraping the solder groove of the backboard;
(4) placing 4 concentric circles of aluminum wires in the solder groove of the backboard obtained in the step (3), wherein the diameter of each metal wire is 0.75mm, and the distance between every two concentric circles is equal; pressing and attaching the welding surface of the titanium-aluminum alloy target material obtained in the step (2) and a welding groove of a back plate, welding, and cooling to obtain a titanium-aluminum alloy target material assembly;
wherein, the step (2) and the step (3) are not in sequence.
The weld bonding rate of the titanium-aluminum alloy target assembly obtained in this example is shown in table 1.
Example 4
The embodiment provides a welding method of a titanium-aluminum alloy shown in fig. 1, which comprises the following steps:
(1) carrying out sand blasting nickel plating treatment on the surface of the titanium-aluminum alloy target, wherein the sand blasting roughness is 5 mu m, and the nickel plating thickness is 1 mu m; polishing the surface of the back plate, wherein the roughness of the polishing treatment is 0.1 mu m; the back plate is made of copper-based alloy;
(2) heating the titanium-aluminum alloy target material obtained in the step (1) at 160 ℃, then distributing indium solder on the welding surface of the titanium-aluminum alloy target material, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush grinding and brushing operation on the welding surface after the distribution is finished, and then a scraper is used for scraping the welding surface of the titanium-aluminum alloy target material;
(3) heating the backboard obtained in the step (1) at 160 ℃, then distributing indium solder in a solder groove of the backboard, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises a steel brush grinding and brushing operation on the solder groove after the indium solder is distributed, and then a scraper is used for scraping the solder groove of the backboard;
(4) placing 1 concentric circle of copper wires in the solder groove of the back plate obtained in the step (3), wherein the diameter of each metal wire is 0.1mm, and the distance between every two concentric circles is equal; pressing and attaching the welding surface of the titanium-aluminum alloy target material obtained in the step (2) and a welding groove of a back plate, welding, and cooling to obtain a titanium-aluminum alloy target material assembly;
wherein, the step (2) and the step (3) are not in sequence.
The weld bonding rate of the titanium-aluminum alloy target assembly obtained in this example is shown in table 1.
Example 5
The embodiment provides a welding method of a titanium-aluminum alloy shown in fig. 1, which comprises the following steps:
(1) carrying out sand blasting nickel plating treatment on the surface of the titanium-aluminum alloy target, wherein the sand blasting roughness is 20 microns, and the nickel plating thickness is 15 microns; polishing the surface of the back plate, wherein the roughness of the polishing treatment is 5 microns; the back plate is made of copper-based alloy;
(2) heating the titanium-aluminum alloy target material obtained in the step (1) at 300 ℃, then distributing indium solder on the welding surface of the titanium-aluminum alloy target material, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush grinding and brushing operation on the welding surface after the distribution is finished, and then a scraper is used for scraping the welding surface of the titanium-aluminum alloy target material;
(3) heating the backboard obtained in the step (1) at 300 ℃, then distributing indium solder in a solder groove of the backboard, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises a steel brush grinding and brushing operation on the solder groove after the indium solder is distributed, and then a scraper is used for scraping the solder groove of the backboard;
(4) placing 5 concentric circles of copper wires in the solder groove of the back plate obtained in the step (3), wherein the diameter of each metal wire is 1mm, and the distance between every two adjacent concentric circles is equal; pressing and attaching the welding surface of the titanium-aluminum alloy target material obtained in the step (2) and a welding groove of a back plate, welding, and cooling to obtain a titanium-aluminum alloy target material assembly;
wherein, the step (2) and the step (3) are not in sequence.
The weld bonding rate of the titanium-aluminum alloy target assembly obtained in this example is shown in table 1.
Example 6
The embodiment provides a welding method of a titanium-aluminum alloy, which comprises the following steps:
(1) carrying out sand blasting nickel plating treatment on the surface of the titanium-aluminum alloy target, wherein the sand blasting roughness is 12.5 mu m, and the nickel plating thickness is 8 mu m; polishing the surface of the back plate, wherein the roughness of the polishing treatment is 2.5 mu m; the back plate is made of copper-based alloy;
(2) heating the titanium-aluminum alloy target material obtained in the step (1) at 230 ℃, then distributing indium solder on the welding surface of the titanium-aluminum alloy target material, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush grinding and brushing operation on the welding surface after the distribution is finished, and then a scraper is used for scraping the welding surface of the titanium-aluminum alloy target material;
(3) heating the backboard obtained in the step (1) at 230 ℃, then distributing indium solder in a solder groove of the backboard, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises a steel brush grinding and brushing operation on the solder groove after the indium solder is distributed, and then a scraper is used for scraping the solder groove of the backboard;
(4) pressing and attaching the welding surface of the titanium-aluminum alloy target obtained in the step (2) and the welding groove of the back plate obtained in the step (3) for welding, and cooling to obtain a titanium-aluminum alloy target assembly;
wherein, the step (2) and the step (3) are not in sequence.
The weld bonding rate of the titanium-aluminum alloy target assembly obtained in this example is shown in table 1.
Comparative example 1
The present comparative example provides a welding method of a titanium-aluminum alloy, the welding method including the steps of:
(1) providing a titanium-aluminum alloy target, an indium solder and a copper-based alloy back plate;
(2) heating a titanium-aluminum alloy target material at 230 ℃, then distributing indium solder on a welding surface of the titanium-aluminum alloy target material, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises a steel brush grinding and brushing operation on the welding surface after the distribution is finished, and then a scraper is used for scraping the welding surface of the titanium-aluminum alloy target material;
(3) after the backboard is heated at 230 ℃, indium solder is distributed in a solder groove of the backboard, the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush brushing operation after the indium solder is distributed, and then a scraper is used for scraping the solder groove of the backboard;
(4) 3 concentric circles of copper wires are placed in a solder groove of the back plate, the diameter of each metal wire is 0.5mm, and the distance between every two adjacent concentric circles is equal; pressing and bonding the welding surface of the titanium-aluminum alloy target material with a welding groove of a back plate, welding, and cooling to obtain a titanium-aluminum alloy target material assembly;
wherein, the step (2) and the step (3) are not in sequence.
The welding bonding rate of the titanium-aluminum alloy target assembly obtained in the comparative example is shown in table 1.
TABLE 1
| Titanium-aluminum alloy target material assembly | Weld bonding ratio (%) |
| Example 1 | 99.50 |
| Example 2 | 99.87 |
| Example 3 | 99.61 |
| Example 4 | 99.55 |
| Example 5 | 99.74 |
| Example 6 | 73.49 |
| Comparative example 1 | 70.01 |
Note: the test method of the welding bonding rate of the titanium-aluminum alloy target assembly is the test method disclosed in CN 103792286A.
As can be seen from Table 1: in the embodiments 1 to 5, the methods of designing concentric circles of metal wires, pretreating the target material and the back plate, and the like can effectively improve the welding bonding rate and enhance the welding strength, thereby greatly improving the sputtering performance and the use stability of the target material.
Therefore, the welding method provided by the invention has the advantages that through a series of treatments, such as sand blasting and nickel plating, ultrasonic treatment, steel brush grinding and brushing, metal wire adding and the like, on the titanium-aluminum alloy target and the back plate, the solder can be better spread and infiltrated on the surface of the target, the welding bonding rate and the welding strength between the titanium-aluminum alloy target and the back plate are improved to a great extent, and the welding bonding rate reaches more than 99.5%; the invention realizes the possibility of brazing the titanium-aluminum alloy target material at low temperature, and avoids a series of phenomena of air suction reaction of the target material, chemical reaction with solder, grain coarsening and the like due to low welding temperature, thereby greatly improving the welding performance and sputtering performance of the target material.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (10)
1. The welding method of the titanium-aluminum alloy target is characterized by comprising the following steps of:
(1) respectively carrying out surface pretreatment on the titanium-aluminum alloy target and the back plate, wherein the surface pretreatment is sand blasting nickel plating treatment and/or polishing treatment;
(2) heating the titanium-aluminum alloy target material subjected to surface pretreatment, and then distributing the welding flux on the welding surface of the titanium-aluminum alloy target material;
(3) heating the backboard subjected to surface pretreatment, and then distributing the solder on the welding surface of the backboard;
(4) the titanium-aluminum alloy target material distributed with the solder is attached to the back plate distributed with the solder, soldering is carried out, and the titanium-aluminum alloy target material assembly is obtained after cooling;
wherein, the step (2) and the step (3) are not in sequence.
2. The welding method according to claim 1, wherein the surface pretreatment of the titanium-aluminum alloy target material in the step (1) is sand blasting nickel plating;
preferably, the sandblasting nickel plating treatment has a sandblasting roughness of 5-20 μm;
preferably, the thickness of the nickel plated by the sand blasting nickel plating treatment is 1-15 μm.
3. The soldering method according to claim 1 or 2, wherein the material of the backing plate of step (1) is a copper-based alloy or an aluminum-based alloy;
preferably, the surface pretreatment of the back plate is polishing treatment;
preferably, the roughness of the polishing treatment is 0.1 to 5 μm.
4. The welding method according to any one of claims 1 to 3, wherein the temperature of the heating in the step (2) is 160-300 ℃;
preferably, the solder in the step (2) is indium solder;
preferably, the solder in the step (2) is also subjected to ultrasonic treatment in the distribution process;
preferably, the solder in the step (2) further comprises the operation of brushing the welding surface by a steel brush after the distribution is finished.
5. The welding method according to any one of claims 1 to 4, wherein the temperature of the heating in step (3) is 160-300 ℃;
preferably, the welding surface center of the back plate in the step (3) is provided with a solder groove, and the solder is distributed in the solder groove;
preferably, the solder in step (3) is indium solder;
preferably, the solder in the step (3) is also subjected to ultrasonic treatment in the distribution process;
preferably, the solder in the step (3) further comprises the operation of brushing the solder bath by a steel brush after the distribution is finished.
6. The welding method according to claim 4, wherein the step (2) and the step (4) further comprise the step of scraping the welded surface of the steel brush after being brushed;
preferably, the tool used for the scraping operation is a scraper.
7. The soldering method according to claim 5, wherein a scraping operation is further performed on the solder bath after the steel brush is brushed between the step (3) and the step (4);
preferably, the tool used for the scraping operation is a scraper.
8. The soldering method according to claim 5, wherein 1 to 5 concentric circles are placed in the solder bath of the back plate in step (4);
preferably, the concentric circles are made of metal wires;
preferably, the diameter of the wire is 0.1-1 mm;
preferably, the concentric circles are equally spaced.
9. The welding method according to any one of claims 1 to 8, wherein the attaching of step (4) is accompanied by a pressing process.
10. Welding method according to any one of claims 1-9, characterized in that it comprises the following steps:
(1) carrying out sand blasting nickel plating treatment on the surface of the titanium-aluminum alloy target, wherein the sand blasting roughness is 5-20 mu m, and the nickel plating thickness is 1-15 mu m; polishing the surface of the back plate, wherein the roughness of the polishing treatment is 0.1-5 mu m; the back plate is made of copper-based alloy or aluminum-based alloy;
(2) heating the titanium-aluminum alloy target material obtained in the step (1) at the temperature of 160-;
(3) heating the backboard obtained in the step (1) at the temperature of 160-300 ℃, then distributing indium solder in a solder groove of the backboard, wherein the indium solder is subjected to ultrasonic treatment in the distribution process, the indium solder also comprises steel brush grinding and brushing the solder groove after the distribution is finished, and then a scraper is used for scraping the solder groove of the backboard;
(4) placing 1-5 concentric circles of metal wires in the solder groove of the backboard obtained in the step (3), wherein the diameter of the metal wires is 0.1-1mm, and the distances between the concentric circles are equal; pressing and attaching the welding surface of the titanium-aluminum alloy target material obtained in the step (2) and a welding groove of a back plate, welding, and cooling to obtain a titanium-aluminum alloy target material assembly;
wherein, the step (2) and the step (3) are not in sequence.
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