CN101954552A - Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal - Google Patents
Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal Download PDFInfo
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- CN101954552A CN101954552A CN2010100012246A CN201010001224A CN101954552A CN 101954552 A CN101954552 A CN 101954552A CN 2010100012246 A CN2010100012246 A CN 2010100012246A CN 201010001224 A CN201010001224 A CN 201010001224A CN 101954552 A CN101954552 A CN 101954552A
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- brazing flux
- filler metal
- brazing
- copper
- brazing filler
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Abstract
The invention provides a novel non-corrosive brazing flux used for a silver brazing filler metal or a copper-phosphorus-silver brazing filler metal, and aims to solve the technical problems of easy moisture absorption, easy caking, toxic gas generation, corrosivity and the like of the brazing flux in the prior art. The brazing flux provided by the invention comprises the following components in percentage by weight: 10 to 40 percent of lithium fluoride, 20 to 50 percent of boron anhydrous and the balance of potassium tetraborate. Matched with the corresponding brazing filler metal, the brazing flux of the invention is suitable for brazing of low-carbon steel, stainless steel, copper and copper alloys.
Description
Technical field
The present invention relates to a kind of novel non-corrosiveness brazing flux that is used for silver solder or Cu-P-Ag solder, specially refer to nonhygroscopic, do not lump, do not produce poison gas, non-corrosive a kind of environmental type brazing flux.
Background technology
Current, most widely used brazing flux is QJ102 when adopting silver solder or Cu-P-Ag solder soldering stainless steel, carbon steel, copper and copper alloy, and it is formed part (percentage by weight) and is: 35% boric anhydride (B
2O
3), 42% potassium fluoride (KF), 23% 4 potassium fluorozirconate (KBF
4); External this class brazing flux of being sold contains KHF toward contact except that mentioned component
2
The component of this class brazing flux in use following problem can occur:
Fluoride KF is the moisture absorption very easily, causes the very fast moisture absorption caking of powdery brazing flux, preserves in the time of can not growing, and is particularly outstanding in the humid area; Fluoride KBF
4(or) KHF
2In soldering heating process, decompose, produce toxic gas BF
3Or HF steam, the harm operator ' s health; Fluoride KF is corrosive, and makes the brazing flux residue after the soldering play corrosiveness to workpiece, must clean up, and produces and the wastewater treatment operation thereby increase.
Summary of the invention
For solving the deficiency of this class brazing flux existence that is proposed in the background technology, the present invention proposes a kind of novel non-corrosiveness brazing flux that can overcome above-mentioned deficiency fully.
Technical scheme of the present invention is as follows:
1, be used for a kind of novel non-corrosiveness brazing flux of silver solder or Cu-P-Ag solder, it is characterized in that, the constituent of this brazing flux (percentage by weight) is as follows:
Lithium fluoride 10-40%
Boric anhydride 20-50%
The dipotassium tetraborate surplus
The preferred composition (percentage by weight) of above-mentioned brazing flux is
Lithium fluoride 15-30%
Boric anhydride 25-35%
The dipotassium tetraborate surplus
2, above-mentioned novel non-corrosiveness brazing flux can be made into powdery or paste use.
3, above-mentioned novel non-corrosiveness brazing flux cooperates corresponding solder to be applicable to soldering mild steel, stainless steel, copper or copper alloy.
The characteristics of novel non-corrosiveness brazing flux of the present invention are to utilize active good lithium fluoride (LiF) to substitute the KBF that adopts usually in this class brazing flux
4, KHF
2And KF.LiF is nonhygroscopic, just can not cause the moisture absorption that brazing flux caused, the agglomeration problems that contains the KF component; LiF can not decompose in soldering heating process, just can not cause to contain KBF
4, KHF
2The brazing flux of component is separated out the problem of toxic gas in heating process; LiF does not play corrosiveness to workpiece, to the workpiece non-corrosiveness, thereby makes this brazing flux become an environmental type brazing flux worthy of the name.
The specific embodiment
1. the percentage by weight of brazing flux component:
Lithium fluoride 28%
Boric anhydride 26%
Dipotassium tetraborate 46%
Cooperate solder BAg45CuZn (45Ag-30Cu-20Zn) soldering Q235 carbon steel, 1Cr18Ni9Ti stainless steel, T2 red copper with brazing flux.Corresponding result of the test sees table 1 for details, goes out the comparative test result of QJ102 brazing flux with tabular.
Table 1
2. the percentage by weight of brazing flux component:
Lithium fluoride 18%
Boric anhydride 30%
Dipotassium tetraborate 52%
Cooperate solder 25Ag-40Cu-33Zn-25Sn soldering Q235 mild steel, 1Cr18Ni9Ti stainless steel, T2 red copper with this brazing flux.Corresponding result of the test sees table 2 for details, goes out the comparative test result of QJ102 brazing flux with tabular.
Table 2
3. the percentage by weight of brazing flux component:
Lithium fluoride 15%
Boric anhydride 34%
Dipotassium tetraborate 51%
Cooperate solder BCu91P Ag (91Cu-7P-2 Ag) soldering H62 brass with this brazing flux, corresponding result of the test sees table 3 for details, goes out the comparative test result of QJ102 brazing flux with tabular.
Table 3
In above three embodiment, each component of every kind of brazing flux is evenly mixed, in the humidistat of humidity 60%, place the moisture absorption and the caking situation of observing each brazing flux after two months.
Various brazing fluxes different by brazing metal on solder sprawl interview and test, and measure and sprawl the face size.
The situation that brazing member is corroded by brazing flux after brazing flux release poison gas situation and the soldering in the attention brazing process.Compare simultaneously with soldering result with the QJ102 brazing flux.
The result of the test of above-mentioned three embodiment shows, the novel non-corrosiveness brazing flux that the present invention proposes is compared with QJ102 brazing flux in the background technology, produces at the brazing flux moisture absorption, caking, poison gas, the corrosivity each side all obviously is better than the latter, is a kind of environmental type brazing flux.
Brazing flux of the present invention can be made into powdery and paste.
Claims (3)
1. be used for a kind of novel non-corrosiveness brazing flux of silver solder or Cu-P-Ag solder, it is characterized in that, the constituent of this brazing flux (percentage by weight) is as follows:
Lithium fluoride 10-40%
Boric anhydride 20-50%
The dipotassium tetraborate surplus.
2. a kind of novel non-corrosiveness brazing flux according to claim 1 is characterized in that,
This brazing flux can be made into powdery or paste uses.
3. a kind of novel non-corrosiveness brazing flux according to claim 1 is characterized in that,
This brazing flux cooperates corresponding solder to be applicable to soldering mild steel, stainless steel, copper or copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100012246A CN101954552B (en) | 2010-01-08 | 2010-01-08 | Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100012246A CN101954552B (en) | 2010-01-08 | 2010-01-08 | Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101954552A true CN101954552A (en) | 2011-01-26 |
| CN101954552B CN101954552B (en) | 2012-05-23 |
Family
ID=43482275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010100012246A Active CN101954552B (en) | 2010-01-08 | 2010-01-08 | Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal |
Country Status (1)
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|---|---|
| CN (1) | CN101954552B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105189032A (en) * | 2013-03-15 | 2015-12-23 | 林肯环球股份有限公司 | Boric acid free flux |
| CN106102990A (en) * | 2014-03-14 | 2016-11-09 | 林肯环球股份有限公司 | The most borated solder flux |
| US10058957B2 (en) | 2013-03-15 | 2018-08-28 | Lincoln Global, Inc. | Boric acid free flux |
| CN108890172A (en) * | 2018-07-12 | 2018-11-27 | 浙江新锐焊接科技股份有限公司 | It is a kind of be halogen-free exempt from pickling fluxing agent and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1018342B (en) * | 1990-06-14 | 1992-09-23 | 国家建筑材料工业局人工晶体研究所 | Soldering flux and soldering paste diamond tool |
| CN101190483B (en) * | 2006-11-22 | 2011-01-19 | 上海斯米克焊材有限公司 | Cream-like silver brazing fluxes |
| CN100577345C (en) * | 2007-08-10 | 2010-01-06 | 广州有色金属研究院 | Soldering aluminum and brazing flux of aluminum alloy |
| CN101439449B (en) * | 2008-12-18 | 2011-01-19 | 广州有色金属研究院 | Brazing flux without corrosion for aluminum and aluminum alloy brazing |
-
2010
- 2010-01-08 CN CN2010100012246A patent/CN101954552B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105189032A (en) * | 2013-03-15 | 2015-12-23 | 林肯环球股份有限公司 | Boric acid free flux |
| KR20160021748A (en) * | 2013-03-15 | 2016-02-26 | 링컨 글로벌, 인크. | Boric acid free flux |
| CN105189032B (en) * | 2013-03-15 | 2017-09-29 | 林肯环球股份有限公司 | The not welding agent and its application method of boronic acid containing |
| US10058957B2 (en) | 2013-03-15 | 2018-08-28 | Lincoln Global, Inc. | Boric acid free flux |
| US10668576B2 (en) | 2013-03-15 | 2020-06-02 | Lincoln Global, Inc. | Boric acid free flux |
| US10682731B2 (en) | 2013-03-15 | 2020-06-16 | Lincoln Global, Inc. | Process for making a boric acid free flux |
| CN106102990A (en) * | 2014-03-14 | 2016-11-09 | 林肯环球股份有限公司 | The most borated solder flux |
| CN108890172A (en) * | 2018-07-12 | 2018-11-27 | 浙江新锐焊接科技股份有限公司 | It is a kind of be halogen-free exempt from pickling fluxing agent and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101954552B (en) | 2012-05-23 |
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Address after: 528300, Foshan, Shunde, Daliang, Guangdong five, Shunde science and Technology Industrial Park, Xinhui Road, 22 Patentee after: Guangdong Sansheng Electric Co., Ltd Address before: 528300, Foshan, Shunde, Daliang, Guangdong five, Shunde science and Technology Industrial Park, Xinhui Road, 22 Patentee before: Foshan Shunde Sansheng Electrical Manufacture Co., Ltd. |
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