CN101914359A - Bar glue - Google Patents
Bar glue Download PDFInfo
- Publication number
- CN101914359A CN101914359A CN2010102739715A CN201010273971A CN101914359A CN 101914359 A CN101914359 A CN 101914359A CN 2010102739715 A CN2010102739715 A CN 2010102739715A CN 201010273971 A CN201010273971 A CN 201010273971A CN 101914359 A CN101914359 A CN 101914359A
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- CN
- China
- Prior art keywords
- parts
- weight
- agent
- defoamer
- weight parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003292 glue Substances 0.000 title claims abstract description 19
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 38
- 239000000945 filler Substances 0.000 claims abstract description 20
- 150000001412 amines Chemical class 0.000 claims abstract description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000007822 coupling agent Substances 0.000 claims abstract description 10
- 239000013530 defoamer Substances 0.000 claims description 18
- 239000006185 dispersion Substances 0.000 claims description 18
- 239000002994 raw material Substances 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000003086 colorant Substances 0.000 claims description 8
- 239000013078 crystal Substances 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 abstract 2
- 239000002518 antifoaming agent Substances 0.000 abstract 2
- 239000002270 dispersing agent Substances 0.000 abstract 2
- 239000003381 stabilizer Substances 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- -1 promotor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a bar glue and belongs to the technical field of glue preparation. The problem to be solved is to provide a bar glue for well gluing crystal bars. The invention adopts a technical scheme that: the bar glue comprises two components A and B, wherein the component A is prepared from 55 to 85 weight parts of modified bisphenol epoxy resin, 10 to 25 weight parts of filler, 2 to 3 weight parts of dispersant, 1 to 5 weight parts of stabilizer and 0.1 to 0.2 weight part of defoaming agent; and the component B is prepared from 68 to 89 weight parts of modified amine curing agent, 15 to 28 weight parts of filler, 1 to 6 weight parts of promoter, 0.1 to 0.2 weight part of defoaming agent, 0.1 to 0.3 weight part of coupling agent, 0.1 to 0.25 weight part of dispersant, 0.1 to 0.23 weight part of stabilizer, 0.1 to 0.2 weight part of flatting agent and 1 to 5 weight parts of color paste. The bar glue can be used as preferred glue for gluing crystal bars.
Description
Technical field
A kind of bar glue of the present invention belongs to technical field of glue preparation.
Background technology
At present, because the monocrystalline length that the crystal pulling in the industry is pulled out is different in size, cause boule length after the segment of follow-up workshop section can not satisfy the processing request (300mm/ root) of slicing machine, in order to improve the working (machining) efficiency of slicing machine, present way is together to reach the length of 300mm with two short crystal bar collocation, for not the steel wire pinch off, when being viscose glue, traditional method between two stubs, reserves the slit of 2-3mm, but the phenomenon that the inclined-plane that produces during owing to cut-out causes fragment to fall down when section extremely easily, thereby be brought to sometimes and produce wire jumper on the gauze, can produce broken string when serious, the client is strict to the specification of quality of silicon chip surface, broken string will cause to be scrapped, even broken string is connect, general silicon chip surface also can stay one even bad product such as several strias or aberration sheet, greatly reduces the yield rate of product.
In light of this situation, be badly in need of a kind of easy to operate, effective, bonding glue that price is low now.
Summary of the invention
The present invention overcomes the deficiencies in the prior art, and problem to be solved provides a kind of bar glue that can be good at bonding crystal bar.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of bar glue, form by A, B two portions;
Described A part is made by following raw materials in weight portion: 55 parts～85 parts of modified bisphenol Resins, epoxy, 10 parts～25 parts of fillers, 2 parts～3 parts of dispersion agents, 1 part～5 parts of stablizers, 0.1 part～0.2 part of defoamer;
Described B part is made up of following raw materials in weight portion: 68 parts～89 parts of modified amine curing agents, 15 parts～28 parts of fillers, 1 part～6 parts of promotor, 0.1 part～0.2 part of defoamer, 0.1 part～0.3 part of coupling agent, 0.1 part～0.25 part of dispersion agent, 0.1 part～0.23 part of stablizer, 0.1 part～0.2 part of flow agent, 1 part～5 parts of colors.
Preferred weight part proportioning of the present invention is:
Preferred weight part proportioning of each raw material of A part is: 65 parts～75 parts of modified bisphenol Resins, epoxy, 15 parts～20 parts of fillers, 2 parts～3 parts of dispersion agents, 2 parts～4 parts of stablizers, 0.1 part～0.2 part of defoamer;
Preferred weight part proportioning of each raw material of B part is: 75 parts～80 parts of modified amine curing agents, 18 parts～23 parts of fillers, 2 parts～5 parts of promotor, 0.1 part～0.2 part of defoamer, 0.1 part～0.2 part of coupling agent, 0.1 part～0.2 part of dispersion agent, 0.1 part～0.2 part of stablizer, 0.1 part～0.2 part of flow agent, 2 parts～4 parts of colors.
Optimum weight part proportioning of the present invention is:
Optimum weight part proportioning of each raw material of A part is: 70 parts of modified bisphenol Resins, epoxy, 18 parts of fillers, 2 parts of dispersion agents, 3 parts of stablizers, 0.1 part of defoamer;
Optimum weight part proportioning of each raw material of B part is: 78 parts of modified amine curing agents, 20 parts of fillers, 3 parts of promotor, 0.1 part of defoamer, 0.2 part of coupling agent, 0.2 part of dispersion agent, 0.2 part of stablizer, 0.1 part of flow agent, 3 parts of colors.
The beneficial effect that the present invention compared with prior art has is:
It is short that the present invention has the operating time, and the setting time weak point is difficult for outflow, and price is low, and easy-operating characteristics are packing materials of the bonding crystal bar of ideal.
Embodiment
Embodiment one:
A kind of bar glue is made up of A, B two portions, and the weight part proportioning of described each raw material of A part is: 70 parts of modified bisphenol Resins, epoxy, 18 parts of fillers, 2 parts of dispersion agents, 3 parts of stablizers, 0.1 part of defoamer;
The weight part proportioning of described each raw material of B part is: 78 parts of modified amine curing agents, 20 parts of fillers, 3 parts of promotor, 0.1 part of defoamer, 0.2 part of coupling agent, 0.2 part of dispersion agent, 0.2 part of stablizer, 0.1 part of flow agent, 3 parts of colors.
Making method:
The first step: make the A part, earlier modified bisphenol Resins, epoxy is added in the vacuum mixer, vacuum stirring 2 minutes adds filler, dispersion agent, stablizer and defoamer more successively, after stirring, takes out bottling.
Second step: make the B part, earlier modified amine curing agent is added in the vacuum mixer, vacuum stirring 2 minutes adds filler, promotor, defoamer, coupling agent, dispersion agent, stablizer, flow agent and color more successively, after stirring, takes out bottling.
Using method: during use, A part and B are partly stirred in 1: 1 ratio, be coated on the bonding two articles surface of wanting, two articles is docked quiet putting 20 minutes.
Embodiment two:
A kind of bar glue is made up of A, B two portions, and the weight part proportioning of described each raw material of A part is: 60 parts of modified bisphenol Resins, epoxy, 22 parts of fillers, 3 parts of dispersion agents, 1 part of stablizer, 0.2 part of defoamer;
The weight part proportioning of described each raw material of B part is: 85 parts of modified amine curing agents, 25 parts of fillers, 5 parts of promotor, 0.2 part of defoamer, 0.3 part of coupling agent, 0.1 part of dispersion agent, 0.1 part of stablizer, 0.2 part of flow agent, 2 parts of colors.
Claims (3)
1. bar glue is characterized in that: be made up of A, B two portions, described A part is made by following raw materials in weight portion: 55 parts～85 parts of modified bisphenol Resins, epoxy, 10 parts～25 parts of fillers, 2 parts～3 parts of dispersion agents, 1 part～5 parts of stablizers, 0.1 part～0.2 part of defoamer;
Described B part is made up of following raw materials in weight portion: 68 parts～89 parts of modified amine curing agents, 15 parts～28 parts of fillers, 1 part～6 parts of promotor, 0.1 part～0.2 part of defoamer, 0.1 part～0.3 part of coupling agent, 0.1 part～0.25 part of dispersion agent, 0.1 part～0.23 part of stablizer, 0.1 part～0.2 part of flow agent, 1 part～5 parts of colors.
2. a kind of bar glue according to claim 1, it is characterized in that: the weight part proportioning of described each raw material of A part is: 65 parts～75 parts of modified bisphenol Resins, epoxy, 15 parts～20 parts of fillers, 2 parts～3 parts of dispersion agents, 2 parts～4 parts of stablizers, 0.1 part～0.2 part of defoamer;
The weight part proportioning of described each raw material of B part is: 75 parts～80 parts of modified amine curing agents, 18 parts～23 parts of fillers, 2 parts～5 parts of promotor, 0.1 part～0.2 part of defoamer, 0.1 part～0.2 part of coupling agent, 0.1 part～0.2 part of dispersion agent, 0.1 part～0.2 part of stablizer, 0.1 part～0.2 part of flow agent, 2 parts～4 parts of colors.
3. a kind of bar glue according to claim 1 is characterized in that: the weight part proportioning of described each raw material of A part is: 70 parts of modified bisphenol Resins, epoxy, 18 parts of fillers, 2 parts of dispersion agents, 3 parts of stablizers, 0.1 part of defoamer;
The weight part proportioning of described each raw material of B part is: 78 parts of modified amine curing agents, 20 parts of fillers, 3 parts of promotor, 0.1 part of defoamer, 0.2 part of coupling agent, 0.2 part of dispersion agent, 0.2 part of stablizer, 0.1 part of flow agent, 3 parts of colors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010273971 CN101914359B (en) | 2010-09-04 | 2010-09-04 | Bar glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010273971 CN101914359B (en) | 2010-09-04 | 2010-09-04 | Bar glue |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101914359A true CN101914359A (en) | 2010-12-15 |
| CN101914359B CN101914359B (en) | 2013-01-09 |
Family
ID=43322010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010273971 Expired - Fee Related CN101914359B (en) | 2010-09-04 | 2010-09-04 | Bar glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101914359B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408861A (en) * | 2011-10-21 | 2012-04-11 | 北京清大奇士新材料技术有限公司 | Double-component epoxy structural adhesive and preparation method thereof |
| CN103552162A (en) * | 2013-09-30 | 2014-02-05 | 洛阳鸿泰半导体有限公司 | Method for removing silicon slice bonding surface check lines |
| CN109321185A (en) * | 2018-10-12 | 2019-02-12 | 南宁珀源能源材料有限公司 | Can boiling degumming bar glue and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101050344A (en) * | 2007-04-30 | 2007-10-10 | 湖南神力实业有限公司 | Epoxy binder modified by micropowder of crosslinked rubber, and preparation method |
| CN101402839A (en) * | 2008-11-18 | 2009-04-08 | 广州市鹿山化工材料有限公司 | Adhesion agent for aluminum cellular composite board and method of producing the same |
| JP2009221363A (en) * | 2008-03-17 | 2009-10-01 | Shin Etsu Chem Co Ltd | Resin composition for manufacturing semiconductor device |
| CN101654606A (en) * | 2009-10-20 | 2010-02-24 | 湖南固特邦土木技术发展有限公司 | Epoxy adhesive and preparation method thereof |
-
2010
- 2010-09-04 CN CN 201010273971 patent/CN101914359B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101050344A (en) * | 2007-04-30 | 2007-10-10 | 湖南神力实业有限公司 | Epoxy binder modified by micropowder of crosslinked rubber, and preparation method |
| JP2009221363A (en) * | 2008-03-17 | 2009-10-01 | Shin Etsu Chem Co Ltd | Resin composition for manufacturing semiconductor device |
| CN101402839A (en) * | 2008-11-18 | 2009-04-08 | 广州市鹿山化工材料有限公司 | Adhesion agent for aluminum cellular composite board and method of producing the same |
| CN101654606A (en) * | 2009-10-20 | 2010-02-24 | 湖南固特邦土木技术发展有限公司 | Epoxy adhesive and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408861A (en) * | 2011-10-21 | 2012-04-11 | 北京清大奇士新材料技术有限公司 | Double-component epoxy structural adhesive and preparation method thereof |
| CN103552162A (en) * | 2013-09-30 | 2014-02-05 | 洛阳鸿泰半导体有限公司 | Method for removing silicon slice bonding surface check lines |
| CN109321185A (en) * | 2018-10-12 | 2019-02-12 | 南宁珀源能源材料有限公司 | Can boiling degumming bar glue and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101914359B (en) | 2013-01-09 |
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Effective date of registration: 20160718 Address after: 037600 Shuozhou City, Yingxian County Province, the South West of the ring road, the four phase of the solar power Co., Ltd., the 1 phase of the plant Patentee after: Shanxi Jingdu Solar Energy Power Co.,Ltd. Address before: 030032 Taiyuan high tech Zone, Shanxi headquarters street, No. 12 Patentee before: Shanxi Tianneng Technology Co., Ltd. |
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Effective date of registration: 20170330 Address after: High tech Zone in Shanxi province Taiyuan City Longxing street 030032 No. 192 Building 1 Room 301 Patentee after: Shanxi Ruibang Kai Chong incubator management Co. Ltd. Address before: 037600 Shuozhou City, Yingxian County Province, the South West of the ring road, the four phase of the solar power Co., Ltd., the 1 phase of the plant Patentee before: Shanxi Jingdu Solar Energy Power Co.,Ltd. |
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Addressee: Shanxi Ruibang Kai Chong incubator management Co. Ltd. Document name: Notification of Passing Examination on Formalities |
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| CF01 | Termination of patent right due to non-payment of annual fee |