CN108219723A - A kind of multi-wire saw detachability epoxy adhesive and preparation method thereof - Google Patents
A kind of multi-wire saw detachability epoxy adhesive and preparation method thereof Download PDFInfo
- Publication number
- CN108219723A CN108219723A CN201711406552.2A CN201711406552A CN108219723A CN 108219723 A CN108219723 A CN 108219723A CN 201711406552 A CN201711406552 A CN 201711406552A CN 108219723 A CN108219723 A CN 108219723A
- Authority
- CN
- China
- Prior art keywords
- component
- detachability
- wire saw
- epoxy adhesive
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006332 epoxy adhesive Polymers 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 32
- 239000002994 raw material Substances 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims abstract description 15
- 150000001412 amines Chemical class 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 11
- 239000002002 slurry Substances 0.000 claims abstract description 8
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 239000012745 toughening agent Substances 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims description 27
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 238000007664 blowing Methods 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 14
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 12
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 8
- 239000011863 silicon-based powder Substances 0.000 claims description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 5
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 5
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 4
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical group CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 2
- 239000010456 wollastonite Substances 0.000 claims description 2
- 229910052882 wollastonite Inorganic materials 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000010426 asphalt Substances 0.000 claims 1
- 238000010790 dilution Methods 0.000 claims 1
- 239000012895 dilution Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000012986 modification Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 229920005862 polyol Polymers 0.000 claims 1
- 150000003077 polyols Chemical class 0.000 claims 1
- 229920001021 polysulfide Polymers 0.000 claims 1
- 239000005077 polysulfide Substances 0.000 claims 1
- 150000008117 polysulfides Polymers 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 13
- 229910052710 silicon Inorganic materials 0.000 abstract description 8
- 239000010703 silicon Substances 0.000 abstract description 8
- 238000001035 drying Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005303 weighing Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 239000004570 mortar (masonry) Substances 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- RHAXKFFKGZJUOE-UHFFFAOYSA-N 7-acetyl-6-ethyl-3,5,8-trihydroxy-9,10-dioxoanthracene-1,2-dicarboxylic acid Chemical compound O=C1C2=CC(O)=C(C(O)=O)C(C(O)=O)=C2C(=O)C2=C1C(O)=C(CC)C(C(C)=O)=C2O RHAXKFFKGZJUOE-UHFFFAOYSA-N 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of multi-wire saw detachability epoxy adhesive, the detachability epoxy adhesive is made of two component of A, B, wherein component A and B component A in mass ratio：B=1：1 cooperation, component A are prepared by the raw material of following mass percent：Epoxy resin 30~60%, toughener 5~10%, filler 15~30%, blue slurry 1~3%；B component is prepared by the raw material of following mass percent：Polymercaptan curing agent 15~50%, modified amine curing agent 10~30%, accelerating agent 1~2%, diluent 1~5%, filler 15~30%, yellow pulp 1~3%.The invention has the beneficial effects that：Viscosity is low after the mixing of 1.A/B components, has excellent operability；Surface drying time is fast after 2.A/B mixing, meets the efficient requirement of photovoltaic industry；3. cutting after, silicon chip can faster degumming, improve degumming efficiency.
Description
Technical field
The present invention relates to technical field of adhesive preparation, more particularly to a kind of multi-wire saw detachability epoxy adhesive
And preparation method thereof.
Background technology
There is explosive growth in more than ten years in past photovoltaic industry, and China's photovoltaic installation amount only has 145MW within 2008, arrives
It increases 238 times within 2016, reaches 34.54GW.Due to quickly increasing, Chinese solar energy installation amount had been accounted in last year
The share in the whole world 45%.
For silicon chip as the most important composition of photovoltaic module, processing method is mainly mortar cutting, in recent years, occurs one
Kind novel cutting mode-Buddha's warrior attendant wire cutting, Buddha's warrior attendant wire cutting have cutting efficiency is high, knife seam loss is small, environmental pollution is low,
The features such as silicon chip precision is good, surface damage is small, therefore Buddha's warrior attendant wire cutting just gradually substitution mortar cutting.
The solar power silicon sticklac that uses is if applied in Buddha's warrior attendant wire cutting in mortar cutting at present, then below generally existing
Problem：1. the machine stand-by period is longer on, influences production efficiency；2. the poor toughness of glue, there is piece risk in cutting process；3. glue exists
The performances degradation such as intensity, hardness in aqueous cutting liquid, be easy to cause piece, and under silicon rod during machine since glue-line is soft, silicon rod
It shakes, leads to silicon chip chipping；4. usually time is longer, subsequent production is influenced.
Invention content
In order to solve the deficiency that the epoxide-resin glue operating time is short, usually time is longer in the prior art, mesh of the invention
One of provide a kind of multi-wire saw detachability epoxy adhesive, with the operating time is long, surface drying time is short, bond
The features such as intensity height, easy degumming.
The second object of the present invention is to provide the preparation method of above-mentioned multi-wire saw detachability epoxy adhesive.
To achieve the above object, technical solution provided by the invention is：
A kind of multi-wire saw detachability epoxy adhesive as the first invention of the present invention, which is characterized in that by A groups
Divide and B component forms, wherein A/B component proportions are according to mass ratio A：B=1：1；
Wherein component A is prepared by the raw material of following mass percent：
Epoxy resin 30~60%, toughener 5~10%, diluent 1~5%, filler 15~40%, blue slurry 1~
3%；
Wherein B component is prepared by the raw material of following mass percent：
Polymercaptan curing agent 15~50%, modified amine curing agent 10~30%, accelerating agent 1~2%, filler 15~
45%th, yellow pulp 1~3%.
In a preferred embodiment of the invention, the epoxy resin is bisphenol A type epoxy resin, Bisphenol F type ring oxygen
The mixing of one or both of resin.
In a preferred embodiment of the invention, the toughener is nbr carboxyl terminal and epoxy resin pre-polymerization
Object, polyurethane modified epoxy resin, one kind in amino terminated butadiene acrylonitrile rubber or arbitrary two or more mixing.
In a preferred embodiment of the invention, the diluent is pungent for dibutyl sebacate, phthalic acid two
One kind or arbitrary two or more mixing in ester, dibutyl phthalate.
In a preferred embodiment of the invention, the filler for silicon powder, aluminium hydroxide, wollastonite, calcium carbonate,
One kind of talcum powder or arbitrary two or more mixing.
In a preferred embodiment of the invention, the Polymercaptan curing agent for CAPCURE3-800,
CAPCURE3830, ethylene glycol dimercapto acrylate, one kind in four sulfydryl acrylate of pentaerythrite or arbitrary two or more
Mixing.
In a preferred embodiment of the invention, the modified amine curing agent is modified fatty amine；
In a preferred embodiment of the invention, the accelerating agent in the B component is 2,4,6- tri- (dimethylamino first
Base) phenol, benzyl dimethylamine, benzyl alcohol, one kind in triphenylphosphine or arbitrary two or more mixing.
The preparation method of a kind of multi-wire saw detachability epoxy adhesive as second aspect of the present invention, by following
Step forms：
1) preparation of component A：Each raw material of component A is weighed by formula, by epoxy resin, toughener, diluent, filler, indigo plant
Mill base is put into reaction kettle successively, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, what when removing stirring, generated
Bubble, after blowing dispense, be sealed；
2) preparation of B component：Each raw material of B component is weighed by formula, by Polymercaptan curing agent, modified amine curing agent, promotion
Agent, filler, yellow pulp are put into reaction kettle successively, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, removing is stirred
The bubble generated when mixing, after blowing dispense, be sealed；
3) A, B component proportioning are according to weight ratio A：B=1：1.
The invention has the beneficial effects that long by introducing operating time early period, the fast polythiol hardener of cured later makes
30min or so reaches surface drying effect to this product upon mixing, meets photovoltaic industry and puies forward efficient requirement, while B component
Middle introducing modified amine curing agent improves the hardness after curing, reduces the chipping in cutting process, it is good to effectively increase product
Rate can also promote silicon chip degumming from resin plate in the later stage；A small amount of diluent is introduced in component A of the present invention, reduces component A
Viscosity is more convenient operation, improves the gluing efficiency of worker.
Specific embodiment
Mode by the following examples further illustrates the present invention, and does not therefore limit the present invention to the implementation
Among example range.
Embodiment 1
By the following component A raw material of quality weighing：Bisphenol A epoxide resin 55kg, nbr carboxyl terminal and epoxy resin prepolymer
Polymers 8kg, dibutyl sebacate (DBS) 3kg, silicon powder 20kg, talcum powder 15kg, blue slurry 1kg, above-mentioned raw materials add in order
Enter in reaction kettle, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, the bubble that when removing stirring generates terminates
Blowing dispenses afterwards, is sealed；
By the following B component raw material of quality weighing：CAPCURE3-800 Polymercaptan curing agents 45kg, modified amine curing agent
18kg, 2,4,6- tri- (dimethylamino methyl) phenol (DMP-30) 1kg, silicon powder 35kg, yellow pulp 1kg, above-mentioned raw materials are by suitable
Sequence is added in reaction kettle, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, the bubble that when removing stirring generates,
After blowing dispense, be sealed.
Embodiment 2
By the following component A raw material of quality weighing：Bisphenol A epoxide resin 45kg, bisphenol f type epoxy resin 10kg, polyurethane
Modified epoxy 8kg, dioctyl phthalate (DOP) 3kg, calcium carbonate 35kg, blue slurry 1kg, above-mentioned raw materials are in order
Add in reaction kettle, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, the bubble that when removing stirring generates, knot
Blowing dispenses after beam, is sealed；
By the following B component raw material of quality weighing：CAPCURE3-800 Polymercaptan curing agents 25kg, modified amine curing agent
38kg, 2,4,6- tri- (dimethylamino methyl) phenol (DMP-30) 1kg, silicon powder 35kg, yellow pulp 1kg, above-mentioned raw materials are by suitable
Sequence is added in reaction kettle, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, the bubble that when removing stirring generates,
After blowing dispense, be sealed.
Embodiment 3
By the following component A raw material of quality weighing：Bisphenol A epoxide resin 20kg, bisphenol f type epoxy resin 35kg, Amino End Group
Nitrile rubber 8kg, dibutyl phthalate (DBP) 3kg, calcium carbonate 35kg, blue slurry 1kg, above-mentioned raw materials are sequentially added into
In reaction kettle, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, the bubble that when removing stirring generates, after
Blowing dispenses, and is sealed；
By the following B component raw material of quality weighing：CAPCURE3830 Polymercaptan curing agents 45kg, modified amine curing agent 18kg,
Benzyl dimethylamine (BDMA) 1kg, talcum powder 35kg, yellow pulp 1kg, above-mentioned raw materials are sequentially added into reaction kettle, and stirring 1h is extremely
Material uniformly, no color differnece, then vacuumize 1~2h, the bubble that when removing stirring generates, after blowing dispense, be sealed.
Embodiment 4
By the following component A raw material of quality weighing：Bisphenol A epoxide resin 10kg, bisphenol f type epoxy resin 45kg, Amino End Group
Nitrile rubber 8kg, dioctyl phthalate (DOP) 3kg, aluminium hydroxide 35kg, blue slurry 1kg, above-mentioned raw materials add in order
Enter in reaction kettle, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, the bubble that when removing stirring generates terminates
Blowing dispenses afterwards, is sealed；
By the following B component raw material of quality weighing：CAPCURE3830 Polymercaptan curing agents 13kg, modified amine curing agent 50kg,
Benzyl dimethylamine (BDMA) 1kg, silicon powder 35kg, yellow pulp 1kg, above-mentioned raw materials are sequentially added into reaction kettle, and stirring 1h is extremely
Material uniformly, no color differnece, then vacuumize 1~2h, the bubble that when removing stirring generates, after blowing dispense, be sealed.
Comparative example
By the following component A raw material of quality weighing：Bisphenol A type epoxy resin 63kg, dibutyl phthalate (DBP)
1kg, calcium carbonate 35kg, blue slurry 1kg, above-mentioned raw materials are sequentially added into reaction kettle, stirring 1h to material uniformly, no color differnece,
Then vacuumize 1~2h, the bubble that when removing stirring generates, after blowing dispense, be sealed；
By the following B component raw material of quality weighing：CAPCURE3-800 Polymercaptan curing agents 58kg, benzyl dimethylamine (BDMA)
1kg, silicon powder 40kg, yellow pulp 1kg, above-mentioned raw materials are sequentially added into reaction kettle, stirring 1h to material uniformly, no color differnece,
Then vacuumize 1~2h, the bubble that when removing stirring generates, after blowing dispense, be sealed.
Test result is as follows：
Usually time test method：
Glass slide a line is coated into suitable glue, it is then vertical to glue on a glass, it is inverted after curing 4h and is placed on 60 DEG C
In lactic acid aqueous solution, glass plate is supported with stent, manual time-keeping, the time that observation glass slide comes off from glass plate.
Claims (9)
1. a kind of multi-wire saw detachability epoxy adhesive, which is characterized in that be made of component A and B component, wherein A/B
Component proportion is according to mass ratio A：B=1：1；
Wherein component A is prepared by the raw material of following mass percent：
Epoxy resin 30~60%, toughener 5~10%, diluent 1~5%, filler 15~40%, blue slurry 1~3%；
Wherein B component is prepared by the raw material of following mass percent：
Polymercaptan curing agent 15~50%, modified amine curing agent 10~30%, accelerating agent 1~2%, filler 15~45%, Huang
Mill base 1~3%.
A kind of 2. multi-wire saw detachability epoxy adhesive as described in claim 1, which is characterized in that the asphalt mixtures modified by epoxy resin
Fat is the mixing of one or both of bisphenol A type epoxy resin, bisphenol f type epoxy resin.
A kind of 3. multi-wire saw detachability epoxy adhesive as described in claim 1, which is characterized in that the toughening
Agent is nbr carboxyl terminal and one kind in epoxy prepolymer, polyurethane modified epoxy resin, amino terminated butadiene acrylonitrile rubber
Or arbitrary two or more mixing.
A kind of 4. multi-wire saw detachability epoxy adhesive as described in claim 1, which is characterized in that the dilution
Agent is dibutyl sebacate, dioctyl phthalate, one kind in dibutyl phthalate or arbitrary two or more mixed
It closes.
A kind of 5. multi-wire saw detachability epoxy adhesive as described in claim 1, which is characterized in that the filler
For silicon powder, aluminium hydroxide, wollastonite, calcium carbonate, one kind of talcum powder or arbitrary two or more mixing.
A kind of 6. multi-wire saw detachability epoxy adhesive as described in claim 1, which is characterized in that the polysulfide
Polyol curing agent is CAPCURE3-800, CAPCURE3830, ethylene glycol dimercapto acrylate, four sulfydryl acrylic acid of pentaerythrite
One kind or arbitrary two or more mixing in ester.
A kind of 7. multi-wire saw detachability epoxy adhesive as described in claim 1, which is characterized in that the modification
Amine curing agent is modified fatty amine.
A kind of 8. multi-wire saw detachability epoxy adhesive as described in claim 1, which is characterized in that the B groups
Point in accelerating agent for 2,4,6- tri- (dimethylamino methyl) phenol, benzyl dimethylamine, benzyl alcohol, one kind in triphenylphosphine or
Arbitrary two or more mixing.
9. a kind of preparation of multi-wire saw detachability epoxy adhesive described in any one of claim 1 to 8 claim
Method, which is characterized in that comprise the steps of：
1) preparation of component A：Each raw material of component A is weighed by formula, epoxy resin, toughener, diluent, filler, blue are starched
Put into reaction kettle successively, stirring 1h to material uniformly, no color differnece, then vacuumize 1~2h, the gas that when removing stirring generates
Bubble, after blowing dispense, be sealed；
2) preparation of B component：Each raw material of B component is weighed by formula, by Polymercaptan curing agent, modified amine curing agent, accelerating agent, is filled out
Material, yellow pulp are put into reaction kettle successively, stirring 1h to material uniformly, no color differnece, 1~2h is then vacuumized, during removing stirring
The bubble of generation, after blowing dispense, be sealed；
3) A, B component proportioning are according to weight ratio A：B=1：1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711406552.2A CN108219723A (en) | 2017-12-22 | 2017-12-22 | A kind of multi-wire saw detachability epoxy adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711406552.2A CN108219723A (en) | 2017-12-22 | 2017-12-22 | A kind of multi-wire saw detachability epoxy adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108219723A true CN108219723A (en) | 2018-06-29 |
Family
ID=62647840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711406552.2A Pending CN108219723A (en) | 2017-12-22 | 2017-12-22 | A kind of multi-wire saw detachability epoxy adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108219723A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109233715A (en) * | 2018-09-03 | 2019-01-18 | 东莞市阿普帮新材料科技有限公司 | The double-component epoxy adhesive and preparation method thereof of resistance to lithium-ion battery electrolytes |
| CN109321185A (en) * | 2018-10-12 | 2019-02-12 | 南宁珀源能源材料有限公司 | Can boiling degumming bar glue and preparation method thereof |
| CN109536098A (en) * | 2018-11-09 | 2019-03-29 | 苏州昇攀新材料技术有限公司 | A kind of epoxy adhesive and preparation method thereof for LED backlight mould group |
| CN109705784A (en) * | 2018-12-03 | 2019-05-03 | 上海康达新能源材料有限公司 | A kind of high-peeling strength epoxy construction adhesive and preparation method thereof |
| CN115595103A (en) * | 2022-10-25 | 2023-01-13 | 三一硅能（株洲）有限公司（Cn） | Epoxy resin adhesive and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102120925A (en) * | 2011-02-14 | 2011-07-13 | 上海康达化工新材料股份有限公司 | Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof |
| CN103709979A (en) * | 2013-12-07 | 2014-04-09 | 南宁珀源化工有限公司 | Adhesive used for semiconductor wafer cutting |
| CN106753130A (en) * | 2016-12-23 | 2017-05-31 | 上海康达化工新材料股份有限公司 | A kind of modified epoxy for diamond wire cutting silicon rod glue |
-
2017
- 2017-12-22 CN CN201711406552.2A patent/CN108219723A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102120925A (en) * | 2011-02-14 | 2011-07-13 | 上海康达化工新材料股份有限公司 | Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof |
| CN103709979A (en) * | 2013-12-07 | 2014-04-09 | 南宁珀源化工有限公司 | Adhesive used for semiconductor wafer cutting |
| CN106753130A (en) * | 2016-12-23 | 2017-05-31 | 上海康达化工新材料股份有限公司 | A kind of modified epoxy for diamond wire cutting silicon rod glue |
Non-Patent Citations (1)
| Title |
|---|
| 机械工业职业技能鉴定指导中心: "《高级模样工技术》", 31 May 1995, 机械工业出版社 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109233715A (en) * | 2018-09-03 | 2019-01-18 | 东莞市阿普帮新材料科技有限公司 | The double-component epoxy adhesive and preparation method thereof of resistance to lithium-ion battery electrolytes |
| CN109321185A (en) * | 2018-10-12 | 2019-02-12 | 南宁珀源能源材料有限公司 | Can boiling degumming bar glue and preparation method thereof |
| CN109536098A (en) * | 2018-11-09 | 2019-03-29 | 苏州昇攀新材料技术有限公司 | A kind of epoxy adhesive and preparation method thereof for LED backlight mould group |
| CN109705784A (en) * | 2018-12-03 | 2019-05-03 | 上海康达新能源材料有限公司 | A kind of high-peeling strength epoxy construction adhesive and preparation method thereof |
| CN115595103A (en) * | 2022-10-25 | 2023-01-13 | 三一硅能（株洲）有限公司（Cn） | Epoxy resin adhesive and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108219723A (en) | A kind of multi-wire saw detachability epoxy adhesive and preparation method thereof | |
| CN101235269B (en) | Double-component epoxy resin embedding adhesive and its preparation method and can sealing technique | |
| CN103923587B (en) | A kind of preparation method of stone material dry suspending glue of two-pack ambient cure | |
| CN109705784A (en) | A kind of high-peeling strength epoxy construction adhesive and preparation method thereof | |
| CN102627931B (en) | Pre-catalytic bonding glue and preparation method thereof | |
| CN102925088B (en) | Solar crystalline silicon wafer temporary adhesive and its preparation method | |
| CN102876274B (en) | Glue for cutting process of solar cell silicon wafers | |
| CN107502256A (en) | A kind of high grade of transparency, high rigidity, color inhibition epoxy joint trimming agent and its construction technology | |
| CN103756610A (en) | Double-component yellowing resistance epoxy resin adhesive and preparation method thereof | |
| RU2013127667A (en) | STRUCTURAL ADHESIVE COMPOSITIONS | |
| CN106381116A (en) | Special bonding agent for square cabin big plate bonding and preparation method thereof | |
| CN104403547A (en) | Environment-friendly high-performance polyurethane waterproof paint and preparing method thereof | |
| CN111424884A (en) | Retarded adhesive prestressed steel bar and preparation method thereof | |
| CN114538861B (en) | Water-based epoxy resin modified cement mortar and preparation method thereof | |
| CN114479736B (en) | Environment-friendly joint beautifying agent | |
| CN105440264A (en) | Polymer grouting material for repairing expressway subgrade defects | |
| CN102791761A (en) | Insulating polymer material composition | |
| CN107118724A (en) | A kind of high tenacity, high intensity, heat superconducting electron pouring sealant and preparation method thereof | |
| CN105419710A (en) | Water-resistant marble adhesive as well as preparation method and application method thereof | |
| CN112625634B (en) | Stone adhesive and preparation method thereof | |
| CN108329881A (en) | A kind of preparation method of weather-proof cloud stone glue | |
| CN109280521B (en) | Epoxy structural adhesive curing agent and preparation method and application thereof | |
| CN109439246B (en) | Two-component epoxy structural adhesive and preparation method thereof | |
| CN111675989A (en) | Low-stress epoxy pouring sealant and preparation method and use method thereof | |
| EP3012237B1 (en) | Liquid dispersant composition for gypsum |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 201419 No. 169, Leizhou Road, Shanghai, Fengxian District Applicant after: Shanghai Kangda Chemical New Material Group Co.,Ltd. Address before: 201419 No. 169, Leizhou Road, Shanghai, Fengxian District Applicant before: SHANGHAI KANGDA NEW MATERIALS Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 169 Leizhou Road, Fengxian District, Shanghai, 201419 Applicant after: Kangda new material (Group) Co.,Ltd. Address before: 169 Leizhou Road, Fengxian District, Shanghai, 201419 Applicant before: Shanghai Kangda Chemical New Material Group Co.,Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |