CN101911270B - 散热装置及使用楔形锁系统形成散热装置的方法 - Google Patents

散热装置及使用楔形锁系统形成散热装置的方法 Download PDF

Info

Publication number
CN101911270B
CN101911270B CN2008801240236A CN200880124023A CN101911270B CN 101911270 B CN101911270 B CN 101911270B CN 2008801240236 A CN2008801240236 A CN 2008801240236A CN 200880124023 A CN200880124023 A CN 200880124023A CN 101911270 B CN101911270 B CN 101911270B
Authority
CN
China
Prior art keywords
pyrolytic graphite
tpg
metallic material
graphite element
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801240236A
Other languages
English (en)
Chinese (zh)
Other versions
CN101911270A (zh
Inventor
D·S·斯拉顿
D·L·麦唐纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intelligent Platforms LLC
Original Assignee
GE Intelligent Platforms Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Intelligent Platforms Inc filed Critical GE Intelligent Platforms Inc
Publication of CN101911270A publication Critical patent/CN101911270A/zh
Application granted granted Critical
Publication of CN101911270B publication Critical patent/CN101911270B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN2008801240236A 2007-12-28 2008-11-14 散热装置及使用楔形锁系统形成散热装置的方法 Expired - Fee Related CN101911270B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/966,201 US8347502B2 (en) 2007-12-28 2007-12-28 Heat sink and method of forming a heatsink using a wedge-lock system
US11/966,201 2007-12-28
US11/966201 2007-12-28
PCT/US2008/083645 WO2009085423A2 (en) 2007-12-28 2008-11-14 A heat sink and method of forming a heatsink using a wedge-lock system

Publications (2)

Publication Number Publication Date
CN101911270A CN101911270A (zh) 2010-12-08
CN101911270B true CN101911270B (zh) 2013-03-13

Family

ID=40328487

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801240236A Expired - Fee Related CN101911270B (zh) 2007-12-28 2008-11-14 散热装置及使用楔形锁系统形成散热装置的方法

Country Status (6)

Country Link
US (2) US8347502B2 (cg-RX-API-DMAC10.html)
EP (1) EP2227822A2 (cg-RX-API-DMAC10.html)
JP (1) JP5384522B2 (cg-RX-API-DMAC10.html)
KR (1) KR20100110346A (cg-RX-API-DMAC10.html)
CN (1) CN101911270B (cg-RX-API-DMAC10.html)
WO (1) WO2009085423A2 (cg-RX-API-DMAC10.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7740380B2 (en) * 2008-10-29 2010-06-22 Thrailkill John E Solid state lighting apparatus utilizing axial thermal dissipation
US20110162828A1 (en) * 2010-01-06 2011-07-07 Graham Charles Kirk Thermal plug for use with a heat sink and method of assembling same
US9096784B2 (en) 2010-07-23 2015-08-04 International Business Machines Corporation Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
FR2967763B1 (fr) * 2010-11-19 2014-07-04 Thales Sa Dispositif de dissipation de chaleur et carte electronique correspondante
CN102768998A (zh) * 2011-05-05 2012-11-07 优杰精密机械(苏州)有限公司 大功率电子器件模组用基板
US9111899B2 (en) 2012-09-13 2015-08-18 Lenovo Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field
NL2012119C2 (en) * 2014-01-22 2015-07-23 Dutch Space B V Radiator, as well as space vehicle structure comprising such radiator.
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9357670B2 (en) 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
US9953957B2 (en) 2015-03-05 2018-04-24 Invensas Corporation Embedded graphite heat spreader for 3DIC
US10101099B2 (en) 2015-03-12 2018-10-16 Airbus Defence And Space Netherlands B.V. Radiator, as well as space vehicle structure comprising such radiator
US20190016482A1 (en) * 2015-03-12 2019-01-17 Airbus Defence And Space Netherlands B.V. Radiator, as well as space vehicle structure comprising such radiator
US10741519B2 (en) 2016-07-11 2020-08-11 Laird Technologies, Inc. Systems of applying materials to components
US11141823B2 (en) 2018-04-28 2021-10-12 Laird Technologies, Inc. Systems and methods of applying materials to components

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0125683A2 (en) * 1983-05-19 1984-11-21 Adjustable Bushing Corporation An improved radially expandable bushing assembly
US5316080A (en) * 1990-03-30 1994-05-31 The United States Of America As Represented By The Administrator Of The National Aeronautics & Space Administration Heat transfer device
CN1116400A (zh) * 1994-07-06 1996-02-07 松下电器产业株式会社 部件的冷却结构
US5969950A (en) * 1998-11-04 1999-10-19 Sun Microsystems, Inc. Enhanced heat sink attachment
CN1666079A (zh) * 2002-06-28 2005-09-07 先进能源科技公司 具有金属基板和石墨散热片的复合散热设备

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE755639A (fr) * 1969-09-05 1971-03-02 Amp Inc Connexion pour panneau de circuit imprimer
US4507034A (en) 1982-10-01 1985-03-26 Adjustable Bushing Corporation Expandable bushing and lock fastener
US5969949A (en) 1998-03-31 1999-10-19 Sun Microsystems, Inc. Interfitting heat sink and heat spreader slug
EP1187199A2 (de) 2000-08-28 2002-03-13 Alcan Technology & Management AG Kühlkörper für Halbleiterbauelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür
US7219721B2 (en) 2002-01-16 2007-05-22 Fujitsu Limited Heat sink having high efficiency cooling capacity and semiconductor device comprising it
US20030203181A1 (en) 2002-04-29 2003-10-30 International Business Machines Corporation Interstitial material with enhanced thermal conductance for semiconductor device packaging
US8584738B2 (en) * 2002-06-14 2013-11-19 Lockheed Martin Corporation Apparatus and method for extracting heat from a device
US7416362B2 (en) 2002-08-16 2008-08-26 Siemens Power Generation, Inc. Multidirectionally compliant fastening system
JP3948000B2 (ja) 2003-08-26 2007-07-25 松下電器産業株式会社 高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム
US7220485B2 (en) * 2003-09-19 2007-05-22 Momentive Performance Materials Inc. Bulk high thermal conductivity feedstock and method of making thereof
US6903271B2 (en) * 2003-09-30 2005-06-07 Intel Corporation Electronic assembly with thermally separated support
DE10353849B4 (de) 2003-11-18 2009-05-07 Infineon Technologies Ag Anpresselement zum Anpressen eines zu kühlenden elektrischen Beuteils an ein Kühlelement, System zum Kühlen eines elektrischen Bauteils, und Bauteilanordnung mit einem zu kühlenden elektrischen Bauteil
US20100326645A1 (en) * 2004-01-21 2010-12-30 Wei Fan Thermal pyrolytic graphite laminates with vias
US20070053168A1 (en) * 2004-01-21 2007-03-08 General Electric Company Advanced heat sinks and thermal spreaders
US7288839B2 (en) 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP4430451B2 (ja) * 2004-04-21 2010-03-10 大成ラミネーター株式会社 半導体素子の放熱装置
TWI244370B (en) * 2004-07-30 2005-11-21 Ind Tech Res Inst Bonding structure of heat sink fin and heat spreader
US7654311B2 (en) * 2004-10-20 2010-02-02 University Of Maryland Thermal management of systems having localized regions of elevated heat flux
US7290596B2 (en) * 2004-10-20 2007-11-06 University Of Maryland Thermal management of systems having localized regions of elevated heat flux
DE602005016456D1 (de) * 2004-11-09 2009-10-15 Shimane Prefectual Government Metallbasis-kohlenstofffaser-verbundmaterial und herstellungsverfahren dafür
US7567438B1 (en) * 2005-06-14 2009-07-28 Hewlett-Packard Development Company, L.P. Heat sink with precompressed bias member
WO2006134858A1 (ja) * 2005-06-16 2006-12-21 Matsushita Electric Industrial Co., Ltd. 放熱用グラファイトシートおよびそれを用いた電子機器
US20070188993A1 (en) 2006-02-14 2007-08-16 Gallina Mark J Quasi-radial heatsink with rectangular form factor and uniform fin length
US7901509B2 (en) * 2006-09-19 2011-03-08 Momentive Performance Materials Inc. Heating apparatus with enhanced thermal uniformity and method for making thereof
US7539019B2 (en) * 2007-07-31 2009-05-26 Adc Telecommunications, Inc. Apparatus for transferring heat from a heat spreader
US8051896B2 (en) * 2007-07-31 2011-11-08 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink
US7898807B2 (en) * 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0125683A2 (en) * 1983-05-19 1984-11-21 Adjustable Bushing Corporation An improved radially expandable bushing assembly
US5316080A (en) * 1990-03-30 1994-05-31 The United States Of America As Represented By The Administrator Of The National Aeronautics & Space Administration Heat transfer device
CN1116400A (zh) * 1994-07-06 1996-02-07 松下电器产业株式会社 部件的冷却结构
US5969950A (en) * 1998-11-04 1999-10-19 Sun Microsystems, Inc. Enhanced heat sink attachment
CN1666079A (zh) * 2002-06-28 2005-09-07 先进能源科技公司 具有金属基板和石墨散热片的复合散热设备

Also Published As

Publication number Publication date
CN101911270A (zh) 2010-12-08
EP2227822A2 (en) 2010-09-15
WO2009085423A2 (en) 2009-07-09
JP5384522B2 (ja) 2014-01-08
US20090166021A1 (en) 2009-07-02
JP2011508446A (ja) 2011-03-10
US20130092363A1 (en) 2013-04-18
KR20100110346A (ko) 2010-10-12
WO2009085423A3 (en) 2009-10-08
US8347502B2 (en) 2013-01-08

Similar Documents

Publication Publication Date Title
US8347502B2 (en) Heat sink and method of forming a heatsink using a wedge-lock system
US8081468B2 (en) Memory modules including compliant multilayered thermally-conductive interface assemblies
US7286352B2 (en) Thermally expanding base of heatsink to receive fins
US6097598A (en) Thermal conductive member and electronic device using same
US20100321897A1 (en) Compliant multilayered thermally-conductive interface assemblies
JP2003188323A (ja) グラファイトシート及びその製造方法
TWI342486B (en) Heat-dissipation module and electronic apparatus having the same
US6742573B2 (en) Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
TWI276390B (en) Integrated heat sink assembly
JP2011000884A (ja) 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール
US7200006B2 (en) Compliant thermal interface for electronic equipment
TW200805602A (en) Semiconductor module and heat radiating plate
US10117355B2 (en) Heat dissipation foil and methods of heat dissipation
US4982783A (en) Self-tightening heat sink
JP5018195B2 (ja) 放熱装置
JP2003218570A (ja) 放熱装置
US7040389B2 (en) Integrated heat dissipation apparatus
CN1987731A (zh) 用于分配热负荷的散热器
TWI391087B (zh) 擴充卡裝置及其散熱器
US20040240181A1 (en) Heat dissipating apparatus
TWM504439U (zh) 散熱組件
CN103140120B (zh) 散热模块及其组构方法
TWI295943B (en) Heat-dissipating device and method for producing the same
TWM322141U (en) Integrated heat-radiation shell structure
US20130153187A1 (en) Dual Heat Sinks For Distributing A Thermal Load

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130313

Termination date: 20141114

EXPY Termination of patent right or utility model