CN101908524A - Antioxidation method for finishing fuse - Google Patents

Antioxidation method for finishing fuse Download PDF

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Publication number
CN101908524A
CN101908524A CN 201010216521 CN201010216521A CN101908524A CN 101908524 A CN101908524 A CN 101908524A CN 201010216521 CN201010216521 CN 201010216521 CN 201010216521 A CN201010216521 A CN 201010216521A CN 101908524 A CN101908524 A CN 101908524A
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China
Prior art keywords
fuse
probe
finishing
impedance
oxidant
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CN 201010216521
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CN101908524B (en
Inventor
岳小兵
祁建华
刘远华
汪瑞祺
张志勇
叶守银
牛勇
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Sino IC Technology Co Ltd
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Sino IC Technology Co Ltd
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Publication of CN101908524A publication Critical patent/CN101908524A/en
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Abstract

The invention provides an antioxidation method for finishing a fuse. The method comprises the following steps: measuring the impedance of a fuse probe; judging whether the impedance of the fuse probe is larger than a higher limit value or not, cleaning the fuse probe and returning to the previous step if so, otherwise executing the following steps; setting the output voltage of a fuse circuit according to a formula V=R*I, wherein the V is the output voltage of the fuse circuit, the R is the impedance of the fuse probe, and the I is the blowout current of the fuse; and fusing the selected fuse. The antioxidation method for finishing the fuse can improve the success ratio for fusing the fuse, and ensures that the success ratio for fusing the fuse tends to be stable; and the service life of the fuse probe can be prolonged by using the antioxidation method for finishing the fuse.

Description

The method of anti-oxidant finishing fuse
Technical field
The present invention relates to wafer sort, relate in particular to a kind of method of anti-oxidant finishing fuse.
Background technology
Survey in the integrated circuit and be meant the performance parameter of using the integrated circuit on the Special Equipment test wafer.When in integrated circuit, surveying,, usually need to repair the fuse of integrated circuit to select suitable internal circuit module in order to optimize the performance of integrated circuit.
The fuse of integrated circuit is made by low-melting alloy, and the impedance of fuse is 0 ohm, internal circuit module of every fuse short circuit.
Finishing fuse is used big current fusing fuse exactly.
Referring to Fig. 1, the method for the finishing fuse of prior art may further comprise the steps:
Step 1, the parameter of integrated circuit on the measurement wafer, at this moment, the numerical value that records is the initial value of this parameter of integrated circuit;
Step 2 is according to the selected fuse that will repair of the initial value of parameter;
Absolute value according to the difference of the desired value of the initial value of parameter and parameter, the fuse that selection will be repaired (is generally many fuses, form the fuse combination), the repairing of chosen fuse combination transfers theoretical value near the absolute value of the difference of the desired value of the initial value of parameter and parameter;
Step 3, the fuse that pre-shaping step 2 is selected;
Finishing fuse uses fuse circuit and fuse probe, provide voltage to come blow out fuse by fuse circuit, the voltage that being specially fuse circuit provides produces an electric current, this electric current is transferred to fuse by fuse probe, the current flow heats fuse of the fuse probe of flowing through, make the temperature of fuse reach fusing point, thus blow out fuse;
In the prior art, during each root fuse in the blow out fuse combination, the voltage that fuse circuit provides is constant, and promptly fuse circuit provides fixed voltage.
Finishing fuse needs the bigger electric current fuse of flowing through, to add thermo-fuse, therefore, electric current by fuse probe is also bigger, fuse probe is oxidized easily, and it is big that the impedance of the fuse probe after the oxidation becomes, after the impedance of fuse probe becomes greatly, the electric current that is transferred to fuse by fuse probe will diminish, and this can reduce the success rate of blow out fuse.For improving the success rate of blow out fuse, the measure that prior art is taked is rule of thumb regularly to clear up fuse probe, this measure is simple to operation, but can not in time grasp the oxidation situation of fuse probe, and fuse probe is in life cycle stage oxidation rate difference, therefore, the phenomenon that the success rate of blow out fuse reduces gradually can appear in the method for the finishing fuse of prior art, and promptly the success rate of blow out fuse is tending towards unstable.
Summary of the invention
The object of the present invention is to provide a kind of method of anti-oxidant finishing fuse, improve the success rate of blow out fuse, and the success rate of blow out fuse is tended towards stability.
To achieve the above object, the invention provides a kind of method of anti-oxidant finishing fuse, may further comprise the steps: the impedance of measuring fuse probe; Whether the impedance of judging fuse probe is greater than higher limit, if the cleaning fuse probe returns above-mentioned steps, if not, carries out following step; According to the output voltage of formula V=R * I setting fuse circuit, wherein, V represents the output voltage of fuse circuit, and R represents the impedance of fuse probe, and I represents fusing current; The fuse that fusing is selected.
The method of above-mentioned anti-oxidant finishing fuse wherein, also comprises the initial value of measuring integrate circuit parameter on the wafer, according to the selected fuse combination that will repair of the initial value of the parameter that records.
The method of above-mentioned anti-oxidant finishing fuse, wherein, the impedance that the parameter measurement unit of employing test machine is measured described fuse probe.
The method of above-mentioned anti-oxidant finishing fuse, wherein, when the impedance of described fuse probe during greater than higher limit, the described test machine indication cleaning fuse probe of reporting to the police.
The method of above-mentioned anti-oxidant finishing fuse, wherein, the higher limit of described fuse probe impedance is 10 ohm.
The method of anti-oxidant finishing fuse of the present invention is monitored the oxidation situation of fuse probe in real time, and selects the output voltage of fuse circuit flexibly or clear up fuse according to the oxidation situation of fuse probe, can improve the success rate of blow out fuse;
Fuse probe is in life cycle stage oxidation rate difference, the method of anti-oxidant finishing fuse of the present invention is monitored the oxidation situation of fuse probe in real time, therefore, in the fuse probe life cycle stage, the frequency difference of the method cleaning fuse probe of the anti-oxidant finishing fuse of the present invention makes the success rate of blow out fuse tend towards stability.
Description of drawings
The method of anti-oxidant finishing fuse of the present invention is provided by following embodiment and accompanying drawing.
Fig. 1 is the flow chart of method of the finishing fuse of prior art.
Fig. 2 is the flow chart of the method for anti-oxidant finishing fuse of the present invention.
Fig. 3 is the circuit theory diagrams of the method for anti-oxidant finishing fuse of the present invention.
Embodiment
Below with reference to Fig. 2~Fig. 3 the method for anti-oxidant finishing fuse of the present invention is described in further detail.
Referring to Fig. 2, the method for the anti-oxidant finishing fuse of the present invention may further comprise the steps:
Measure the impedance of fuse probe;
Whether the impedance of judging fuse probe is greater than higher limit, if the cleaning fuse probe returns above-mentioned steps, if not, carries out following step;
According to the output voltage of formula V=R * I setting fuse circuit, wherein, V represents the output voltage of fuse circuit, and R represents the impedance of fuse probe, and I represents fusing current;
The fuse that fusing is selected.
The method of anti-oxidant finishing fuse of the present invention can improve the success rate of blow out fuse, makes the success rate of blow out fuse tend towards stability; Use the method for the anti-oxidant finishing fuse of the present invention can prolong the useful life of fuse probe.
The method of the anti-oxidant finishing fuse of the present invention now is described with a specific embodiment:
The parameter measurement unit that the impedance of measurement fuse probe adopts test machine to provide;
Figure 3 shows that the circuit theory diagrams of the method for the anti-oxidant finishing fuse of the present invention, when dpdt relay K opens (as shown in Figure 3), the parameter measurement unit PMU of test machine, the equiva lent impedance R of fuse probe, fuse FUSE and earth terminal GND are followed in series to form an impedance measurement loop, and this loop is used to measure the impedance of fuse probe; When dpdt relay K was closed, the equiva lent impedance R of fuse probe and fuse FUSE series connection constituted a finishing fuse loop between the positive pole and negative pole of fuse circuit 100, and this loop is used for blow out fuse;
Step S1, the initial value of integrate circuit parameter on the measurement wafer;
Step S2, the selected fuse combination that will repair of the initial value of the parameter that records according to step S1;
The fuse of repairing is generally many, and these the many fuses that will repair are formed fuse sets and closed;
In the present embodiment, according to the absolute value of the difference of the desired value of the initial value of parameter and parameter, the fuse combination that selection will be repaired, the repairing of chosen fuse combination transfers theoretical value near the absolute value of the difference of the desired value of the initial value of parameter and parameter;
Need to prove that the scheme of the selected fuse combination that will repair is not limited to the scheme of present embodiment among the present invention;
Step S3, the impedance of measuring fuse probe;
Referring to Fig. 3, open dpdt relay K, the equiva lent impedance R of parameter measurement unit PMU, fuse probe, fuse FUSE and earth terminal GND connect successively, form a loop, the data that parameter measurement unit PMU records are the impedance of fuse FUSE and the equiva lent impedance R sum of fuse probe, because the impedance of fuse FUSE is 0, so, in fact the data that parameter measurement unit PMU records are exactly the equiva lent impedance R of fuse probe, i.e. the impedance of fuse probe;
The fuse of fuse FUSE for repairing;
Whether step S4, test machine judge the impedance of fuse probe greater than higher limit, if test machine is reported to the police and is indicated the cleaning fuse probe, gets back to step S3 after the cleaning fuse probe, if not, execution in step S5;
For higher limit of impedance setting of fuse probe is for the oxidation rate of fuse probe is limited to slower scope because, when the impedance of fuse probe greater than this higher limit, continue the oxidation that finishing fuse can be accelerated fuse probe;
This higher limit for example is made as 10 ohm;
Step S5, according to the output voltage of formula V=R * I setting fuse circuit, wherein, V represents the output voltage of fuse circuit, and R represents the impedance of fuse probe, and I represents fusing current;
Finishing fuse with the big electric current fuse of flowing through, to add thermo-fuse, makes the temperature of fuse reach fusing point exactly, thus blow out fuse, and the value of the big electric current of this fuse of flowing through should equal the blowout current of fuse;
The blowout current of fuse is generally 0.2 ampere;
The big electric current of fuse of flowing through is provided by fuse circuit, is transferred to fuse by fuse probe, blow out fuse will correctly set the output voltage of fuse circuit (also being the key that improves the success rate of blow out fuse);
Step S6, a certain fuse that fusing is selected;
At a certain parameter of integrated circuit, the fuse that repair is many, needs one one ground fusing;
Continuation is referring to Fig. 3, closed dpdt relay K, the equiva lent impedance R of fuse probe and selected a certain fuse FUSE series connection are between the positive pole and negative pole of fuse circuit 100, form a loop, if equal the blowout current of fuse from the electric current of the positive pole of fuse circuit 100 output, closed dpdt relay K in a flash, from the electric current of the positive pole output of fuse circuit 100 flow through fuse probe, fuse, and blow out fuse, finish the finishing of this selected a certain fuse;
Step S7 returns step S3 and repairs all the other selected fuses, until having repaired all selected fuses of step S2.
The method of anti-oxidant finishing fuse of the present invention is monitored the oxidation situation of fuse probe in real time, and selects the output voltage of fuse circuit flexibly or clear up fuse according to the oxidation situation of fuse probe, can improve the success rate of blow out fuse;
Fuse probe is in life cycle stage oxidation rate difference, the method of anti-oxidant finishing fuse of the present invention is monitored the oxidation situation of fuse probe in real time, therefore, in the fuse probe life cycle stage, the frequency difference of the method cleaning fuse probe of the anti-oxidant finishing fuse of the present invention makes the success rate of blow out fuse tend towards stability;
In the large-scale production test process, use the method for the anti-oxidant finishing fuse of the present invention can prolong the useful life of fuse probe;
Experiment shows, uses the method for the anti-oxidant finishing fuse of the present invention can improve the success rate of blow out fuse more than 2%; Use the method for the anti-oxidant finishing fuse of the present invention that prolonged about 20% the useful life of fuse probe.

Claims (5)

1. the method for an anti-oxidant finishing fuse is characterized in that, may further comprise the steps:
Measure the impedance of fuse probe;
Whether the impedance of judging fuse probe is greater than higher limit, if the cleaning fuse probe returns above-mentioned steps, if not, carries out following step;
According to the output voltage of formula V=R * I setting fuse circuit, wherein, V represents the output voltage of fuse circuit, and R represents the impedance of fuse probe, and I represents fusing current;
The fuse that fusing is selected.
2. the method for anti-oxidant finishing fuse as claimed in claim 1 is characterized in that, also comprises the initial value of measuring integrate circuit parameter on the wafer, according to the selected fuse combination that will repair of the initial value of the parameter that records.
3. the method for anti-oxidant finishing fuse as claimed in claim 1 is characterized in that, the impedance that the parameter measurement unit of employing test machine is measured described fuse probe.
4. the method for anti-oxidant finishing fuse as claimed in claim 3 is characterized in that, when the impedance of described fuse probe during greater than higher limit, and the described test machine indication cleaning fuse probe of reporting to the police.
5. as the method for claim 1 or 3 described anti-oxidant finishing fuses, it is characterized in that the higher limit of described fuse probe impedance is 10 ohm.
CN2010102165212A 2010-06-30 2010-06-30 Antioxidation method for finishing fuse Active CN101908524B (en)

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Application Number Priority Date Filing Date Title
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CN101908524B CN101908524B (en) 2012-08-08

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103064004A (en) * 2012-12-17 2013-04-24 深圳深爱半导体股份有限公司 Chip-level testing device
CN104076271A (en) * 2013-03-27 2014-10-01 上海宏测半导体科技有限公司 Lithium battery protection circuit testing method and system
CN105470159A (en) * 2015-11-17 2016-04-06 无锡中微腾芯电子有限公司 Method for monitoring fuse burning yield rate in chip test
CN106443399A (en) * 2016-09-08 2017-02-22 上海华岭集成电路技术股份有限公司 Method for preventing mis-fusing of chip fuse

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006098274A (en) * 2004-09-30 2006-04-13 Tokusen Kogyo Co Ltd Probe pin for probe card
JP2008172045A (en) * 2007-01-12 2008-07-24 Matsushita Electric Ind Co Ltd Inspection method for semiconductor device and contact resistance measuring circuit
JP2008311469A (en) * 2007-06-15 2008-12-25 Fujitsu Microelectronics Ltd Semiconductor test device, semiconductor test method, program and recording medium
CN101510520A (en) * 2009-03-18 2009-08-19 上海华岭集成电路技术有限责任公司 Test method for asynchronously repairing and adjusting silicon wafer with anti-interference

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006098274A (en) * 2004-09-30 2006-04-13 Tokusen Kogyo Co Ltd Probe pin for probe card
JP2008172045A (en) * 2007-01-12 2008-07-24 Matsushita Electric Ind Co Ltd Inspection method for semiconductor device and contact resistance measuring circuit
JP2008311469A (en) * 2007-06-15 2008-12-25 Fujitsu Microelectronics Ltd Semiconductor test device, semiconductor test method, program and recording medium
CN101510520A (en) * 2009-03-18 2009-08-19 上海华岭集成电路技术有限责任公司 Test method for asynchronously repairing and adjusting silicon wafer with anti-interference

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103064004A (en) * 2012-12-17 2013-04-24 深圳深爱半导体股份有限公司 Chip-level testing device
CN104076271A (en) * 2013-03-27 2014-10-01 上海宏测半导体科技有限公司 Lithium battery protection circuit testing method and system
CN104076271B (en) * 2013-03-27 2018-05-01 上海宏测半导体科技有限公司 The test method and system of lithium battery protection circuit
CN105470159A (en) * 2015-11-17 2016-04-06 无锡中微腾芯电子有限公司 Method for monitoring fuse burning yield rate in chip test
CN105470159B (en) * 2015-11-17 2018-08-10 无锡中微腾芯电子有限公司 The method that scorification silk delivery rate is monitored in chip testing
CN106443399A (en) * 2016-09-08 2017-02-22 上海华岭集成电路技术股份有限公司 Method for preventing mis-fusing of chip fuse
CN106443399B (en) * 2016-09-08 2020-11-13 上海华岭集成电路技术股份有限公司 Method for preventing chip fuse from being mistakenly fused

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Owner name: SHANGHAI HUALING INTEGRATED CIRCUIT TECHNOLOGY CO.

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Address after: 201203 Shanghai Zhangjiang road 351 GuoShouJing No. 2 No. 1 floor

Patentee after: Shanghai Hualing Integrated Circuit Technology Co., Ltd.

Address before: 201203 Shanghai Zhangjiang road 351 GuoShouJing No. 2 No. 1 floor

Patentee before: Shanghai Hualing Integrated Circuit Co., Ltd.