CN101903477B - 用于微接触印刷的油墨溶液 - Google Patents
用于微接触印刷的油墨溶液 Download PDFInfo
- Publication number
- CN101903477B CN101903477B CN2008801220302A CN200880122030A CN101903477B CN 101903477 B CN101903477 B CN 101903477B CN 2008801220302 A CN2008801220302 A CN 2008801220302A CN 200880122030 A CN200880122030 A CN 200880122030A CN 101903477 B CN101903477 B CN 101903477B
- Authority
- CN
- China
- Prior art keywords
- ink solutions
- organosulfur compound
- ink
- solutions according
- organosulfur
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Ink Jet (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1498407P | 2007-12-19 | 2007-12-19 | |
| US61/014,984 | 2007-12-19 | ||
| PCT/US2008/086754 WO2009085678A1 (en) | 2007-12-19 | 2008-12-15 | Ink solutions for microcontact printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101903477A CN101903477A (zh) | 2010-12-01 |
| CN101903477B true CN101903477B (zh) | 2013-10-30 |
Family
ID=40350034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801220302A Expired - Fee Related CN101903477B (zh) | 2007-12-19 | 2008-12-15 | 用于微接触印刷的油墨溶液 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9027480B2 (enExample) |
| EP (1) | EP2231793B1 (enExample) |
| JP (1) | JP5543367B2 (enExample) |
| CN (1) | CN101903477B (enExample) |
| WO (1) | WO2009085678A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9701899B2 (en) | 2006-03-07 | 2017-07-11 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
| WO2009014590A2 (en) | 2007-06-25 | 2009-01-29 | Qd Vision, Inc. | Compositions and methods including depositing nanomaterial |
| CN102307851B (zh) | 2008-12-11 | 2015-05-06 | 3M创新有限公司 | 酰胺连接的全氟聚醚硫醇化合物及其制备方法和用途 |
| EP2197253A1 (en) * | 2008-12-12 | 2010-06-16 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Method for electric circuit deposition |
| WO2011079032A1 (en) | 2009-12-22 | 2011-06-30 | 3M Innovative Properties Company | Apparatus and method for microcontact printing using a pressurized roller |
| EP2360293A1 (en) | 2010-02-11 | 2011-08-24 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for depositing atomic layers on a substrate |
| EP2362411A1 (en) | 2010-02-26 | 2011-08-31 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus and method for reactive ion etching |
| FR2971369B1 (fr) * | 2011-02-04 | 2013-03-08 | Commissariat Energie Atomique | Procede de fabrication d'une monocouche autoassemblee d'injection |
| US10081174B2 (en) | 2012-12-31 | 2018-09-25 | 3M Innovative Properties Company | Re-inking roller for microcontact printing in a roll-to-roll process |
| WO2014105633A1 (en) * | 2012-12-31 | 2014-07-03 | 3M Innovative Properties Company | Microcontact printing with high relief stamps in a roll-to-roll process |
| WO2015047944A1 (en) * | 2013-09-30 | 2015-04-02 | 3M Innovative Properties Company | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
| WO2015069538A1 (en) | 2013-11-06 | 2015-05-14 | 3M Innovative Properties Company | Microcontact printing stamps with functional features |
| CN104119723B (zh) * | 2014-07-30 | 2015-12-30 | 广西师范学院 | 双层三明治型Eu金属酞菁配合物在微接触印刷中的应用 |
| KR20170066446A (ko) | 2014-09-30 | 2017-06-14 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 넓은 선폭을 갖는 전기 전도성 패턴 및 그의 생성 방법 |
| LU100270B1 (en) * | 2017-05-05 | 2018-12-03 | Luxembourg Inst Science & Tech List | Inkjet printing process |
| WO2019130221A1 (en) | 2017-12-29 | 2019-07-04 | 3M Innovative Properties Company | Nonplanar patterned nanostructured surface and printing methods for making thereof |
| LU100971B1 (en) * | 2018-10-25 | 2020-04-27 | Luxembourg Inst Science & Tech List | Inkjet printing process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060209117A1 (en) * | 2005-03-18 | 2006-09-21 | Parazak Dennis P | Methods and architecture for applying self-assembled monolayer(s) |
| CN1863853A (zh) * | 2003-10-04 | 2006-11-15 | 陶氏康宁公司 | 薄膜的沉积 |
| US20060254387A1 (en) * | 2005-05-10 | 2006-11-16 | Samsung Electro-Mechanics Co., Ltd. | Metal nano particle and method for manufacturing them and conductive ink |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1863853A (en) | 1931-02-14 | 1932-06-21 | Lora B Jackson | Can perforating and pouring attachment |
| US5512131A (en) | 1993-10-04 | 1996-04-30 | President And Fellows Of Harvard College | Formation of microstamped patterns on surfaces and derivative articles |
| WO1997007429A1 (en) | 1995-08-18 | 1997-02-27 | President And Fellows Of Harvard College | Self-assembled monolayer directed patterning of surfaces |
| GB0326904D0 (en) | 2003-11-19 | 2003-12-24 | Koninkl Philips Electronics Nv | Formation of self-assembled monolayers |
| JP2008506826A (ja) | 2004-07-21 | 2008-03-06 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | 光活性化方法及び逆転した2段階工程による触媒の使用 |
| KR100677149B1 (ko) * | 2004-11-12 | 2007-02-02 | 삼성전자주식회사 | 잉크 조성물 |
| US7160583B2 (en) * | 2004-12-03 | 2007-01-09 | 3M Innovative Properties Company | Microfabrication using patterned topography and self-assembled monolayers |
| US7932393B2 (en) | 2006-01-27 | 2011-04-26 | Fmc Corporation | Insecticidal (heteroarylalky)alkane thio and oxo amine derivatives |
| JP4939163B2 (ja) | 2006-10-12 | 2012-05-23 | 株式会社 資生堂 | 毛髪表面モデル基板 |
-
2008
- 2008-12-15 CN CN2008801220302A patent/CN101903477B/zh not_active Expired - Fee Related
- 2008-12-15 US US12/808,339 patent/US9027480B2/en not_active Expired - Fee Related
- 2008-12-15 WO PCT/US2008/086754 patent/WO2009085678A1/en not_active Ceased
- 2008-12-15 EP EP20080867566 patent/EP2231793B1/en not_active Not-in-force
- 2008-12-15 JP JP2010539667A patent/JP5543367B2/ja not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1863853A (zh) * | 2003-10-04 | 2006-11-15 | 陶氏康宁公司 | 薄膜的沉积 |
| US20060209117A1 (en) * | 2005-03-18 | 2006-09-21 | Parazak Dennis P | Methods and architecture for applying self-assembled monolayer(s) |
| US20060254387A1 (en) * | 2005-05-10 | 2006-11-16 | Samsung Electro-Mechanics Co., Ltd. | Metal nano particle and method for manufacturing them and conductive ink |
Non-Patent Citations (1)
| Title |
|---|
| Formation of Monolayer Films by the Spontaneous Assembly of Organic Thiols from Solution onto Gold;Colin D. Bain,etc...;《American Chemical Society》;19891231;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100258968A1 (en) | 2010-10-14 |
| US9027480B2 (en) | 2015-05-12 |
| WO2009085678A1 (en) | 2009-07-09 |
| CN101903477A (zh) | 2010-12-01 |
| EP2231793B1 (en) | 2014-01-22 |
| EP2231793A1 (en) | 2010-09-29 |
| JP2011508016A (ja) | 2011-03-10 |
| JP5543367B2 (ja) | 2014-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131030 Termination date: 20191215 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |