CN101896575B - 转换led - Google Patents

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Publication number
CN101896575B
CN101896575B CN200880120722.3A CN200880120722A CN101896575B CN 101896575 B CN101896575 B CN 101896575B CN 200880120722 A CN200880120722 A CN 200880120722A CN 101896575 B CN101896575 B CN 101896575B
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CN
China
Prior art keywords
fluorescent material
light source
bam
led
described light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880120722.3A
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English (en)
Chinese (zh)
Other versions
CN101896575A (zh
Inventor
迪尔克·贝尔本
蒂姆·菲德勒
雷娜特·希勒
京特·胡贝尔
弗兰克·耶尔曼
马丁·察豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PATRA PATENT TREUHAND
Original Assignee
PATRA PATENT TREUHAND
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PATRA PATENT TREUHAND filed Critical PATRA PATENT TREUHAND
Publication of CN101896575A publication Critical patent/CN101896575A/zh
Application granted granted Critical
Publication of CN101896575B publication Critical patent/CN101896575B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
CN200880120722.3A 2007-12-14 2008-11-17 转换led Expired - Fee Related CN101896575B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007060198A DE102007060198A1 (de) 2007-12-14 2007-12-14 Konversions-LED
DE102007060198.2 2007-12-14
PCT/EP2008/065648 WO2009077277A1 (de) 2007-12-14 2008-11-17 Konversions-led

Publications (2)

Publication Number Publication Date
CN101896575A CN101896575A (zh) 2010-11-24
CN101896575B true CN101896575B (zh) 2014-01-22

Family

ID=40329051

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880120722.3A Expired - Fee Related CN101896575B (zh) 2007-12-14 2008-11-17 转换led

Country Status (8)

Country Link
US (1) US8242528B2 (enExample)
EP (1) EP2220191B1 (enExample)
JP (1) JP5447870B2 (enExample)
KR (1) KR101579279B1 (enExample)
CN (1) CN101896575B (enExample)
DE (1) DE102007060198A1 (enExample)
TW (1) TW200937685A (enExample)
WO (1) WO2009077277A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007060199A1 (de) * 2007-12-14 2009-06-18 Osram Gesellschaft mit beschränkter Haftung Leuchtstoff und Beleuchtungssystem mit derartigem Leuchtstoff
TW201238406A (en) * 2011-03-11 2012-09-16 Ind Tech Res Inst Light emitting devices
DE102012202927B4 (de) * 2012-02-27 2021-06-10 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
CN109423285B (zh) 2017-08-31 2023-09-26 日亚化学工业株式会社 铝酸盐荧光体及发光装置
DE102017121889B3 (de) * 2017-09-21 2018-11-22 Heraeus Noblelight Gmbh Breitbandige halbleiterbasierte UV-Lichtquelle für eine Spektralanalysevorrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6255670B1 (en) * 1998-02-06 2001-07-03 General Electric Company Phosphors for light generation from light emitting semiconductors
US20050253114A1 (en) * 2004-05-14 2005-11-17 General Electric Company Phosphors containing oxides of alkaline-earth and group-IIIB metals and white-light sources incorporating same
US20060027781A1 (en) * 2004-08-04 2006-02-09 Intematix Corporation Novel phosphor systems for a white light emitting diode (LED)
WO2007020556A1 (en) * 2005-08-15 2007-02-22 Philips Intellectual Property & Standards Gmbh Light source and method for producing light modifiable in colour and/or luminosity

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0529956A1 (en) 1991-08-23 1993-03-03 Kabushiki Kaisha Toshiba Blue phosphor and fluorescent lamp using the same
US6466135B1 (en) 2000-05-15 2002-10-15 General Electric Company Phosphors for down converting ultraviolet light of LEDs to blue-green light
JP4168776B2 (ja) * 2002-02-15 2008-10-22 三菱化学株式会社 発光装置及びそれを用いた照明装置
JP4165255B2 (ja) * 2002-04-30 2008-10-15 三菱化学株式会社 発光装置及びそれを用いた照明装置
US7768189B2 (en) * 2004-08-02 2010-08-03 Lumination Llc White LEDs with tunable CRI
DE10316769A1 (de) * 2003-04-10 2004-10-28 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoffbassierte LED und zugehöriger Leuchtstoff
US7573072B2 (en) * 2004-03-10 2009-08-11 Lumination Llc Phosphor and blends thereof for use in LEDs
US7390437B2 (en) 2004-08-04 2008-06-24 Intematix Corporation Aluminate-based blue phosphors
AU2005281352B2 (en) 2004-09-09 2011-01-27 Yissum Research Development Company Of The Hebrew University Of Jerusalem Liposomal compositions of glucocorticoid and glucocorticoid derivatives
WO2006072919A2 (en) 2005-01-10 2006-07-13 Philips Intellectual Property & Standards Gmbh Illumination system comprising barium magnesium aluminate phosphor
WO2007125493A2 (en) 2006-05-02 2007-11-08 Koninklijke Philips Electronics N.V. Color-stable phosphor converted led

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6255670B1 (en) * 1998-02-06 2001-07-03 General Electric Company Phosphors for light generation from light emitting semiconductors
US20050253114A1 (en) * 2004-05-14 2005-11-17 General Electric Company Phosphors containing oxides of alkaline-earth and group-IIIB metals and white-light sources incorporating same
US20060027781A1 (en) * 2004-08-04 2006-02-09 Intematix Corporation Novel phosphor systems for a white light emitting diode (LED)
WO2007020556A1 (en) * 2005-08-15 2007-02-22 Philips Intellectual Property & Standards Gmbh Light source and method for producing light modifiable in colour and/or luminosity

Also Published As

Publication number Publication date
JP2011506654A (ja) 2011-03-03
KR101579279B1 (ko) 2015-12-21
CN101896575A (zh) 2010-11-24
US20100276714A1 (en) 2010-11-04
DE102007060198A1 (de) 2009-06-18
US8242528B2 (en) 2012-08-14
JP5447870B2 (ja) 2014-03-19
KR20100105676A (ko) 2010-09-29
WO2009077277A1 (de) 2009-06-25
EP2220191A1 (de) 2010-08-25
TW200937685A (en) 2009-09-01
EP2220191B1 (de) 2018-03-28

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SE01 Entry into force of request for substantive examination
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140122

CF01 Termination of patent right due to non-payment of annual fee