CN101893647A - Testing socket for package - Google Patents
Testing socket for package Download PDFInfo
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- CN101893647A CN101893647A CN2009102029431A CN200910202943A CN101893647A CN 101893647 A CN101893647 A CN 101893647A CN 2009102029431 A CN2009102029431 A CN 2009102029431A CN 200910202943 A CN200910202943 A CN 200910202943A CN 101893647 A CN101893647 A CN 101893647A
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- testing
- testing socket
- bearing part
- pedestal
- socket
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Abstract
The invention discloses a testing socket for a package, comprising a testing socket body, a bearing part and a testing base. The test socket body comprises an accommodating space. The bearing part can be detachably installed on the testing socket body and comprises a plurality of detecting points corresponding to welding balls of the package. The testing base comprises a plurality of electrical contacts corresponding to the detecting points of the bearing part; the testing base can be installed on the testing socket body, and at least one part of the testing base can be accommodated in the accommodating space; according to the type of the package, the corresponding bearing part and testing base are installed on the testing socket body. Therefore, the invention has the advantages of lower testing cost, wider testing range, and capability of testing packages with different size types and different configurations of the welding balls.
Description
Technical field
The present invention relates to a kind of test jack, particularly a kind of testing socket for package.
Background technology
In semiconductor industry, chip size packages (chip scale package) becomes one of main flow of encapsulation technology gradually, but according to the demand of product, different chip size packages patterns must be used different chip size packages test jacks, to satisfy the demand of back segment packaging and testing.
For example the novel patent in Taiwan promptly discloses a kind of chip testing tool for M327541 number, and it comprises the test pedestal and presses lid.Described test pedestal central authorities are provided with accommodation space with ccontaining chip to be measured.The described lid that presses comprises and covers body and pressure part, and a side of described lid body is articulated in described test pedestal and is combined on the accommodation space of described test pedestal with pivot caps; Described pressure part flexibly is arranged on a side of the adjacent accommodation space of described lid body, is used for elasticity and presses chip to be measured in accommodation space.
Yet described chip testing tool is to make according to the size of predetermined chip to be measured and the configuration of soldered ball (solder ball), and therefore after finishing assembling, described chip testing tool can only be tested at a kind of chip pattern.In the time will testing different chip patterns, then must change whole group measurement jig, therefore can improve testing cost and cause the waste of resource.
In view of this, the present invention proposes a kind of testing socket for package of replaceable partial component in addition, has lower testing cost and more flexible test specification, can be used for testing the packaging body of different size pattern and different soldered ball configurations.
Summary of the invention
The present invention proposes a kind of testing socket for package, and this testing socket for package can be according to size, space between solder balls and the soldered ball number of the packaging body to be measured of different types and the removable parts member, thereby reduces the testing cost of packaging body and reduce the wasting of resources.
The present invention proposes a kind of testing socket for package, is used to test the packaging body with a plurality of soldered balls, and described testing socket for package comprises testing socket body, bearing part and testing base.Described testing socket body comprises first accommodation space and second accommodation space.Described bearing part can load and unload testing socket body and comprise a plurality of detecting points corresponding to described a plurality of soldered balls of described packaging body.Testing base comprises a plurality of electrical contacts corresponding to the detecting point of described bearing part, and at least one part that described testing base can be loaded and unloaded described testing socket body and described testing base can be placed in described second accommodation space; Wherein, according to the pattern of described packaging body, can change the described bearing part and the described testing base of described testing socket body accordingly.
The present invention proposes a kind of testing socket for package in addition, is used to test the image sensor dice that comprises a plurality of soldered balls and image sensing district, and described testing socket for package comprises and covers body, pedestal, bearing part, testing base and test top cover.Described lid body wears first accommodation space.Described pedestal wears second accommodation space.Described bearing part can load and unload on the described pedestal and comprise a plurality of detecting points corresponding to described a plurality of soldered balls of described image sensor dice.Described testing base comprises a plurality of electrical contacts corresponding to the detecting point of described bearing part, and at least one part that described testing base can be loaded and unloaded described pedestal and described testing base can be placed in described second accommodation space.Described test top cover can load and unload in described first accommodation space of described lid body; Wherein, according to the pattern of described image sensor dice, corresponding described bearing part and described testing base can be changed to described pedestal and corresponding described test top cover is attached to described lid body.
Testing socket for package of the present invention is applicable to the test of the packaging body that uses ball lattice array encapsulation (BGA) and chip size packages (chip scale package) to make, for example test of image sensor dice.When test had the packaging body of different size, the bearing groove that replaceable encapsulation body bearing part, described packaging body bearing part are formed with respect to different package body sizes reached the detecting point that disposes with respect to different packaging body soldered balls.When test has the packaging body of different space between solder balls (pitch), replaceable testing base, described testing base is formed with the electrical contact with respect to different packaging body soldered balls, and described electrical contact corresponds to the detecting point of described bearing part.When test had the image sensor dice of different images sensing area area, replaceable test top cover, described test top cover were formed with respect to the lightlng hole of different images sensing area area so that test light can intactly shine in whole image sensing district.
Description of drawings
Fig. 1 shows the exploded view of the testing socket for package of embodiments of the invention;
Fig. 2 shows the synoptic diagram of replaceable member in the testing socket for package of embodiments of the invention;
Fig. 3 shows the cut-open view of the testing socket for package of embodiments of the invention;
Fig. 4 shows another cut-open view of the testing socket for package of embodiments of the invention.
[primary clustering symbol description]
1 testing socket for package, 10 testing socket body
11 lid bodies, 111 buckling pieces
112 first accommodation spaces, 113 teats
1131 axis holes, 12 pedestals
121 clip recesses, 122 second accommodation spaces
123 axle beds, 1231 axis holes
124 screws, 13 test top covers
131 daylighting grooves, 132 lightlng holes
14 bearing parts, 141 bearing grooves
1411 detectings point, 142 recesses
15 testing base, 151 electrical contacts
152 grooves, 153 screws
16 flexible members, 17 pivots
181,182 bolts, 19 flexible members
9 packaging bodies to be measured, 91 image sensing districts
Embodiment
For allow above and other objects of the present invention, feature and advantage can be more obvious, hereinafter with conjunction with figs., be described in detail below.
Please refer to Fig. 1, Fig. 1 shows the exploded view of the testing socket for package 1 of embodiments of the invention.Described testing socket for package 1 is used to test packaging body 9 operating performance of utilizing encapsulation of ball lattice array or chip size packages to make, for example operating performance of testing image sensor chip.When described packaging body 9 is image sensor dice, a surface (upper surface among Fig. 1) of described packaging body 9 comprises image sensing district 91, and comprises a plurality of soldered balls (solder ball) with respect to another surface (lower surface among Fig. 1) in described image sensing district 91.According to different goods, described packaging body 9 may have the image sensing district 91, different size pattern of different area, different space between solder balls and/or soldered ball numbers.
Described testing socket for package 1 comprises and covers body 11, pedestal 12, test top cover 13, bearing part 14, testing base 15, flexible member 16, pivot 17, a plurality of bolt 181,182 and a plurality of flexible member 19, the testing socket body 10 of its middle cover body 11, pedestal 12, flexible member 16 and pivot 17 formation testing socket for package 1 capable of being combined; And test top cover 13, bearing part 14 and testing base 15 constitute the replaceable member (replaceable elements) of testing socket for package 1.
Be formed with buckling piece 111, first accommodation space 112 and two teats 113 on the described lid body 11, these two teats 113 are equipped with axis hole 1131 respectively, wherein first accommodation space 112 is arranged in two apparent surfaces (upper and lower surface among Fig. 1) of covering body 11, buckling piece 111 is formed at a side of covering body 11, and described teat 113 is formed at the opposite side that covers body 11 with respect to buckling piece 111.
Be formed with clip recess 121, second accommodation space 122 and two axle beds 123 on the described pedestal 12, these two axle beds 123 are equipped with axis hole 1231 respectively, wherein second accommodation space 122 is arranged in two apparent surfaces (upper and lower surface among Fig. 1) of described pedestal 12, clip recess 121 is formed at a side of described pedestal 12, and described axle bed 123 is formed at the opposite side of described pedestal 12 with respect to clip recess 121.
When combination cover body 11 and pedestal 12 when forming testing socket body 10,1131 pairs of two axis holes that cover two teats 113 of body 11 are positioned at two axis holes 1231 of two axle beds 123 of pedestal 12, then pivot 17 is arranged in described axis hole 1131,1231 and the flexible member 16 so that lid body 11 is articulated in pedestal 12 by flexible member 16 and pivot 17, thereby lid body 11 can pivot and is covered on pedestal 12.When lid body 11 covered with pedestal 12,111 of the buckling pieces of lid body 11 can be fastened on the clip recess 121 of pedestal 12 to keep the state that covers that covers body 11 and pedestal 12.In addition, can be formed with a plurality of screws 124 on the pedestal 12 in addition, this screw 124 is provided with spiral shell respectively and establishes bolt 181, and its function will be described in the following passage.
Described test top cover 13 can be placed in first accommodation space 112 that covers body 11.Be formed with daylighting groove 131 and lightlng hole 132 on the test top cover 13, daylighting groove 131 can be used for built-in test light source (not shown).In one embodiment, daylighting groove 131 is formed at the center bottom that test top cover 13 central authorities and lightlng hole 132 are arranged in daylighting groove 131.In other embodiments, daylighting groove 131 can be made according to the placement location of packaging body 9 to be measured with lightlng hole 132.In another embodiment, test top cover 13 can only form two apparent surfaces' (for example upper and lower surface among Fig. 1) that are arranged in test top cover 13 lightlng hole 132 and not form daylighting groove 131.
Among the present invention, test top cover 13 is for replaceable member and be used for the test of image sensor dice, and wherein the size of lightlng hole 132 and position can be designed according to the size and location in the image sensing district 91 of different packaging bodies 9.When being used to test the packaging body 9 in image sensing district 91 with different area, only need change described test top cover 13 and need not change whole group testing socket for package 1, can reduce testing cost and reduce the wasting of resources.In other embodiments, when testing socket for package 1 was used for packaging body beyond the testing image sensor chip, test top cover 13 can not have daylighting groove 131 and lightlng hole 132, and is provided with a plurality of circuit that are used for input test signal to packaging body 9 to be measured in addition.
Be formed with bearing groove 141 and a plurality of recess 142 on the described bearing part 14.Bearing groove 141 is used to carry the size of packaging body 9 to be measured and bearing groove 141 corresponding to packaging body 9 to be measured.Being formed with a plurality of detecting points 1411 in the bearing groove 141 is used for electrically contacting with the soldered ball of packaging body 9 to be measured.Scrutable is that described a plurality of detecting points 1411 penetrate two apparent surfaces (upper and lower surface among Fig. 1) in bearing part 14.Described a plurality of recess 142 utilizes described a plurality of bolt 181 bearing part 14 can be fixed on the pedestal 12 by described a plurality of recesses 142 with respect to the screw 124 of pedestal and be provided with.Yet, in other embodiments, can not be formed with recess 142 on the bearing part 14, but can utilize described a plurality of bolt 181 that bearing part 14 is fixed on the pedestal 12 equally.In another embodiment, bearing part 14 can be fixed on the pedestal 12 by alternate manner, be not limited to the mode that to utilize described a plurality of bolt 181 to screw togather, for example utilize engaging, fastening, for repeated adhesionly paste that part binds or alternate manner is fixed on the pedestal 12.
Among the present invention, described bearing part 14 is replaceable member, and the size of the bearing groove 141 of bearing part 14 and the detecting point distance (pitch) and the number that are formed at bearing groove 141 bottoms can design according to the packaging body to be measured 9 of different types.Therefore, when test has the packaging body 9 of different size and different soldered ball configuration, only need change bearing part 14 and need not change whole group testing socket for package 1, can reduce testing cost and reduce the wasting of resources.
Be formed with a plurality of electrical contacts 151, a plurality of groove 152 and a plurality of screw 153 on the described testing base 15.At least one part of testing base 15 can be inserted in second accommodation space 122 of pedestal 12.The detecting point of the electrical contact 151 corresponding bearing parts 14 of testing base 15, and when testing base 15 and bearing part 14 are incorporated into pedestal 12, the electrical contact 151 of testing base 15 electrically is contacted with the detecting point of bearing part 14, transfers in the outside testing tool (not shown) in order to the test result with packaging body 9 to be measured.When testing base 15 was combined in pedestal 12, flexible member 19 was used to be connected to the bottom surface of bearing part 14 with the convenient bearing part 14 that takes out on pedestal 12.At least one part that each groove 152 is used for ccontaining flexible member 19 is with the fixing position of flexible member 19, yet described in other embodiments a plurality of groove 152 can be implemented.Testing base 15 can utilize a plurality of bolts 182 to be incorporated into pedestal 12 by described a plurality of screws 153.Among other embodiment, testing base 15 also can otherwise be incorporated into pedestal 12, for example utilizes engaging, fastening, for repeated adhesionly pastes part bonding etc.
Among the present invention, described testing base 15 is replaceable member, and the electrical contact distance and the contact number of testing base 15 can design according to the pattern of different packaging bodies to be measured 9.Therefore, when test has the packaging body 9 of different soldered balls distance and number, only need change described testing base 15 and need not change whole group testing socket for package 1, can reduce testing cost and reduce the wasting of resources.
Please refer to shown in Figure 2ly, Fig. 2 has shown the synoptic diagram of testing socket for package 1 when the removable parts member of one embodiment of the present of invention.When testing, lid body 11, pedestal 12, flexible member 16 and pivot 17 are combined into testing socket body 10; Test top cover 13, bearing part 14 and testing base 15 then can be changed respectively according to the pattern of difference packaging body 9 to be measured.The lightlng hole 132 of for example testing top cover 13 can design according to the size and the position in the image sensing district of difference image sensor dice to be measured; The size of the bearing groove 141 of bearing part 14 and the number and the spacing that are formed at the detecting point 141 of bearing part 14 can design according to the pattern of difference packaging body 9 to be measured; The contact number of electrical contact and contact spacing can design according to the pattern of difference packaging body 9 to be measured on the testing base 15, wherein the electrical contact on the testing base 15 is to being positioned at the detecting point of bearing groove 141, that is bearing part 14 and testing base 15 need to change simultaneously usually.
Please refer to shown in Figure 3ly, Fig. 3 has shown a cut-open view of the testing socket for package 1 of embodiments of the invention, tests wherein that top cover 13, bearing part 14 and testing base 15 have been combined in testing socket body 10 and testing socket for package 1 is in opening.
Please refer to shown in Figure 4ly, Fig. 4 has shown another cut-open view of the testing socket for package 1 of embodiments of the invention, and wherein testing socket for package 1 is in closure state and lid body 11 are fastened on pedestal 12 by buckling piece 111 clip recess 121.
As previously mentioned, because the existing chip measurement jig only designs at a kind of test chip pattern, therefore in the time will testing the chip of different types, must change whole group measurement jig thereby can improve testing cost.The present invention proposes a kind of testing socket for package, can reduce testing cost and reduce the wasting of resources according to the size and the soldered ball configuration removable parts member of the image sensing district size of difference encapsulation body examination to be measured and position, packaging body to be measured.
Though the present invention discloses with previous embodiment, so it is not to be used to limit the present invention, any the technical staff in the technical field of the invention, without departing from the spirit and scope of the present invention, when doing various changes and modification.Therefore protection scope of the present invention is as the criterion when looking the scope that accompanying Claim defines.
Claims (12)
1. a testing socket for package is used to test the packaging body with a plurality of soldered balls, and described testing socket for package comprises:
Testing socket body, this testing socket body comprise first accommodation space and second accommodation space;
Bearing part, this bearing part can load and unload described testing socket body and comprise a plurality of detecting points corresponding to described a plurality of soldered balls of described packaging body; And
Testing base, this testing base comprise a plurality of electrical contacts corresponding to the detecting point of described bearing part, and at least one part that described testing base can be loaded and unloaded described testing socket body and described testing base can be placed in described second accommodation space;
Wherein, according to the pattern of described packaging body, can change the described bearing part and the described testing base of described testing socket body accordingly.
2. testing socket for package according to claim 1, this packaging and testing socket also comprise the test top cover in described first accommodation space that can load and unload described testing socket body.
3. testing socket for package according to claim 2, wherein said test top cover is equipped with the lightlng hole with respect to the image sensing district of described packaging body; According to the pattern of described packaging body, corresponding described test top cover can be attached to described testing socket body; Described test top cover also comprises the daylighting groove so that light source to be set, and described lightlng hole then is arranged in the bottom of described daylighting groove.
4. testing socket for package according to claim 1, wherein said testing socket body comprise also and cover body and pedestal that described first accommodation space is arranged in described lid body; And described second accommodation space is arranged in described pedestal.
5. testing socket for package according to claim 4, wherein said bearing part and described testing base by screw togather, engage, fasten and bind in a kind of mode be fixed in described pedestal; Described lid body is articulated in described base.
6. testing socket for package according to claim 1, wherein said bearing part also comprise bearing groove carrying described packaging body, and the size of described bearing groove is corresponding to the size of described packaging body.
7. testing socket for package according to claim 1, wherein said bearing part and described testing base by screw togather, engage, fasten and bind in a kind of mode be fixed in described testing socket body; Described testing socket body comprises that also buckling piece is to keep the state that covers of described testing socket body.
8. a testing socket for package is used for the testing image sensor chip, and this image sensor dice comprises image sensing district and a plurality of soldered ball, and described testing socket for package comprises:
The lid body, this lid body is equipped with first accommodation space;
Pedestal, this pedestal is equipped with second accommodation space;
Bearing part, this bearing part can load and unload on the described pedestal and comprise a plurality of detecting points corresponding to described a plurality of soldered balls of described image sensor dice;
Testing base, this testing base comprise a plurality of electrical contacts corresponding to the detecting point of described bearing part, and at least one part that described testing base can be loaded and unloaded described pedestal and described testing base can be placed in described second accommodation space; And
The test top cover, this test top cover can load and unload in described first accommodation space of described lid body;
Wherein, according to the pattern of described image sensor dice, corresponding described bearing part and described testing base can be changed to described pedestal and corresponding described test top cover is attached to described lid body.
9. testing socket for package according to claim 8, wherein said test top cover is equipped with the lightlng hole with respect to the image sensing district of described image sensor dice; Described test top cover also comprises the daylighting groove so that light source to be set, and described lightlng hole then is arranged in the bottom of described daylighting groove.
10. testing socket for package according to claim 8, wherein said bearing part and described testing base by screw togather, engage, fasten and bind in a kind of mode be fixed in described pedestal.
11. testing socket for package according to claim 8, wherein said bearing part also comprise bearing groove carrying described packaging body, and the size of described bearing groove is corresponding to the size of described packaging body.
12. testing socket for package according to claim 8, wherein said lid body is articulated in described pedestal; Described lid body comprises that also buckling piece is to keep the state that covers of described lid body and described pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102029431A CN101893647A (en) | 2009-05-22 | 2009-05-22 | Testing socket for package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102029431A CN101893647A (en) | 2009-05-22 | 2009-05-22 | Testing socket for package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101893647A true CN101893647A (en) | 2010-11-24 |
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ID=43102901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102029431A Pending CN101893647A (en) | 2009-05-22 | 2009-05-22 | Testing socket for package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101893647A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552636A (en) * | 2016-02-05 | 2016-05-04 | 中国电子科技集团公司第四十研究所 | Modular embedded integrated circuit socket |
| CN107462747A (en) * | 2016-05-25 | 2017-12-12 | 豪威科技股份有限公司 | Test seat for testing image sensing chip |
| CN109001501A (en) * | 2018-06-01 | 2018-12-14 | 英特尔产品（成都）有限公司 | A kind of floating foundation substrate for chip semiconductor test |
-
2009
- 2009-05-22 CN CN2009102029431A patent/CN101893647A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552636A (en) * | 2016-02-05 | 2016-05-04 | 中国电子科技集团公司第四十研究所 | Modular embedded integrated circuit socket |
| CN107462747A (en) * | 2016-05-25 | 2017-12-12 | 豪威科技股份有限公司 | Test seat for testing image sensing chip |
| CN107462747B (en) * | 2016-05-25 | 2023-09-15 | 豪威科技股份有限公司 | Test seat for testing image sensing chip |
| CN109001501A (en) * | 2018-06-01 | 2018-12-14 | 英特尔产品（成都）有限公司 | A kind of floating foundation substrate for chip semiconductor test |
| CN109001501B (en) * | 2018-06-01 | 2019-10-01 | 英特尔产品（成都）有限公司 | A kind of floating foundation substrate for chip semiconductor test |
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Application publication date: 20101124 |