CN107462747A - Test seat for testing image sensing chip - Google Patents
Test seat for testing image sensing chip Download PDFInfo
- Publication number
- CN107462747A CN107462747A CN201610632328.4A CN201610632328A CN107462747A CN 107462747 A CN107462747 A CN 107462747A CN 201610632328 A CN201610632328 A CN 201610632328A CN 107462747 A CN107462747 A CN 107462747A
- Authority
- CN
- China
- Prior art keywords
- image sensing
- sensing chip
- test bench
- cover plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000009792 diffusion process Methods 0.000 claims description 28
- 238000005266 casting Methods 0.000 claims description 27
- 230000004308 accommodation Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 description 11
- 238000007667 floating Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 229920001342 Bakelite® Polymers 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000004637 bakelite Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2641—Circuits therefor for testing charge coupled devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lens Barrels (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
Abstract
The invention discloses a test socket for testing an image sensing chip, which comprises a substrate; a lens holder disposed on the substrate, wherein a lens is disposed on the lens holder; and a cover plate for pivotally connecting the base. Wherein, a first clamping part and a second clamping part which are correspondingly clamped with each other are respectively arranged on the substrate and the cover plate; the substrate and the cover plate are respectively provided with a plurality of first fixing holes and a plurality of second fixing holes which correspond to each other, and the plurality of fixing components are fixedly arranged in the plurality of first fixing holes and the plurality of second fixing holes. The test socket of the invention does not need to be mechanically readjusted for many times to align the optical center, can effectively solve the problem of mechanical readjustment, and obtains better efficiency of testing hardware adjustment.
Description
Technical field
The present invention is on a kind of test bench of semiconductor subassembly, more particularly to a kind of survey for testing image sensing chip
Try seat.
Background technology
With the progress in epoch, the mankind keep compact original to the demand of sci-tech product more and more higher in product
Under then, functional requirement but only increases, and in the case of for function enhancing but volume-diminished, electronic circuit gradually walks vector product
Body, when making has the chip of power, required cost of manufacture also improves therewith, for these expensive chips
Speech, the requirement of quality management also must more and more higher.
Image sensing chip, such as complementary metal oxide layer semiconductor image sensing chip (CMOS image
Sensor) or Charged Coupled Device (CCD) etc., after encapsulating, final test must still be carried out.
With digital camera, mobile phone, tablet PC, mobile computer, Cam for automobile and various monitoring
Device etc. is largely popularized, and creates the huge demand size of camera device, also lifts the fluffy of image sensor testing field step by step
The exhibition of breaking out.
In the image sensing chip for preparing to dispatch from the factory, it must all pass through the detection of product.In conventional method, in order to test
These accurate image sensing chip components, chip to be measured will be welded on test circuit plate.However, chip to be measured is welded in
On test circuit plate, test is difficult to remove after completing, and the chip to be measured is become consumptive material, produces unnecessary cost.This
Outside, chip to be measured often results in pin and lost, also result in unnecessary waste when welding.
On the other hand, electrical testing must be made by encapsulating the integrated circuit of completion, can ensure the quality of chip.With semiconductor
Encapsulate for factory, because its output is big, it is necessary to use the chip test system that can quickly test.For the electrical equipment of subsequent downstream
For manufacturer, because the usage quantity of chip is comparatively obvious less, it is still necessary to first to test before assembling with can
The defective products of energy screens, and so as to reducing the disqualification rate of the semi-finished product in finished product or processing procedure, and can reduce overall manufacture
Cost.
Therefore, a kind of test bench is developed based on the demand, can be placed on it by chip to be measured, allow test circuit
Plate is connected with each other the device of conducting with it.The method can save the step being welded in chip to be measured on test circuit plate, save
Many valuable times.It simultaneously can also avoid that chip to be measured is welded on test circuit plate and causes to damage caused damage
Lose.
Traditional test holder structure, because force inequality cause the lens mount of test bench produce move slightly and caused by optics
The heart is offset, it is necessary to readjust lens mount again.
The content of the invention
In view of this, it is a primary object of the present invention to provide a kind of test bench for testing image sensing chip.
To reach above-mentioned purpose, the technical proposal of the invention is realized in this way：
The present invention provides a kind of test bench for testing image sensing chip, comprising：One substrate；One lens mount, is configured at base
On bottom, wherein a lens configuration is on lens mount；And a cover plate, for being pivotally connected substrate；Wherein on substrate and cover plate
It is respectively equipped with the first shackle portion and the second shackle portion of mutually corresponding clamping；Wherein substrate on cover plate with being respectively equipped with phase
Multiple first fixing holes corresponding to mutually and multiple second fixing holes, multiple fixation kits are fixedly arranged on the plurality of first fixing hole with being somebody's turn to do
Among multiple second fixing holes.
Wherein the substrate is a work casting die.Wherein substrate, which is provided with, causes the lens mount to be configured at therein one accommodating sky
Between.
Wherein the plurality of first fixing hole and the plurality of second fixing hole are screw, and the plurality of fixation kit is screw.
Its cover plate, which is provided with, causes the opening that passes through of lens, and lens mount is provided with a groove so that lens configuration in
On the groove of lens mount.
Above-mentioned test bench also includes being configured at the diffusion sheet on lens, and to fix a fixation of the diffusion sheet
Ring.
Wherein the first shackle portion, the second shackle portion are respectively clamping recess, clamping convex portion.
Brief description of the drawings
Fig. 1 is shown as the schematic diagram of the mechanism for testing for testing image sensing chip according to one embodiment of the invention.
Fig. 2 is shown as the schematic diagram of the test bench for testing image sensing chip of one embodiment of the invention.
Critical piece reference：
10 bases；
20 floating plates；
21 positioning components；
22 elastic parts；
30 insulating assemblies；
100 test benches；
101 work casting dies；
101a accommodation spaces；
101b fixing holes (opening)；
101c clamping recesses；
102 lens mounts；
103 cover plates；
103a is open；
103b fixing holes (opening)；
103c clampings convex portion；
104 lens；
The visual subtended angles of 104a；
105 fixation kits；
106 diffusion sheets；
107 retainer rings.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be with
It is better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
An embodiment described in specification refers to that one specific is described the feature relevant with this embodiment, method or spy
Property is comprised at least some embodiments.Therefore, the implementation of each aspect of an embodiment or multiple embodiments, which differs, is set to phase
Same embodiment.In addition, relevant feature, method or the characteristic of the present invention can be combined as suitable in one or more embodiments it
In.
In order to provide correct image test hardware environment, the optical centre of lens is obtained by the shift control of lens mount
To adjustment, to ensure that the optical centre of lens can be directed at the image center of image sensor.Among the present invention, when in optics
The heart adjustment complete, can use fixation kit (such as：Screw) fix work casting die (work press) and cover plate (cover
plate).And when driving fixation kit to contact and when fixed work casting die is with cover plate, lens mount (lens holder) does not have
Small movement, thus do not interfere with the alignment of optical centre yet.Therefore, without lens mount is readjusted again, to carry out optics
The alignment at center.
As shown in figure 1, the mechanism for testing for testing image sensing chip of its display present invention.Mechanism for testing includes one
The floating plate (floating plate) 20 of 100, one base (test base) of test bench (test socket) 10, one, positioning group
Part 21, the insulating assembly 30 of elastic parts 22 and one, other components are not shown in the figures.The detailed construction of test bench 100 refer to
Fig. 2.Test bench 100 is configured on floating plate 20.Floating plate 20 is configured on base 10.Among an embodiment, test
Seat 100, which is fixed on, to be configured on base 10.Elastic parts 22 is configured between positioning component 21 and lens mount 102.By floating
That puts plate 20 moves up and down the upright position (Z axis position) that can control or adjust lens mount 102, and passes through.For example, it is fixed
Hyte part 21 includes multiple set screws, and elastic parts 22 includes multiple springs.Set screw 21 is configured at lens mount 102
Surrounding, and spring 22 is configured at least two sides (X-axis and Y-axis) of lens mount 102.Using the rotation of set screw 21 to compress two
The spring 22 of side, it can control or adjust the horizontal level (X-axis and Y-axis position) of lens mount 102.In other words, by positioning spiral shell
The collocation of silk and spring can finely tune the X-axis of lens mount 102 and the position of Y-axis, and can be with by moving up and down for floating plate 20
The Z axis position of lens mount 102 is finely tuned, as a result reaches the purpose of three-dimensional fine-tuning lens mount 102.
The present invention one floating plate 20 of offer configures to be vertically movable between work casting die 101 and base 10.And positioning
Spring 22 is provided between screw 21 and lens mount 102, the spring 22 is configured to be biased (bias) in lens mount 102.Pass through
Above-mentioned configuration and structure, can be with three-dimensional fine-tuning lens mount 102, to carry out the alignment of optical centre.
The material of insulating assembly 30 is, for example, bakelite.Bakelite is a kind of plastic product, its characteristic be do not absorb water, be non-conductive,
High temperature resistant, intensity are high.After bakelite adds the mixing such as wood sawdust, asbestos or clay using the phenolic resin of powdery, at high temperature with
Mould is extruded to complete.
As shown in Fig. 2 the test bench 100 for testing image sensing chip of its display present invention.Test bench 100 is one
Location structure, it can be fixed on a workbench or base, in favor of testing image sensing chip.In other words, test bench 100
For testing an image sensing chip, such as complementary metal oxide layer semiconductor (CMOS) image sensing chip or Charged Couple
Component (CCD).Image sensing chip has a photosensitive region, the light that photosensitive region is sent towards a light source.Photosensitive region
Mainly it is made up of picture element array, picture element array allows light to shine towards can cover a lenticule (micro lens) at light source
It is mapped to each picture element of picture element array.Lenticule has certain light transmittance, and its material can be saturating for silicon, quartz, glass, macromolecule
One of luminescent material and other optical materials etc. or its combination.Test bench 100 is provided with a substrate 101, a lens mount 102 and one
Cover plate 103, wherein substrate are a work casting die 101, and cover plate 103 is used to be pivotally connected work casting die 101.Work casting die 101 is provided with
One accommodation space 101a, such as groove, lens mount 102 is caused to be able to be configured at wherein to provide a space.Groove 101a shape
Shape can be rectangle.Corresponding groove 101a shape, the shape of lens mount 102 also can be rectangle.Groove 101a size is omited
More than the size of lens mount 102.For example, groove 101a length is slightly larger than the length and width of lens mount 102 with width respectively.
In another embodiment, when the groove 101a circle that is shaped as, the shape of lens mount 102 can be circle, and groove 101a circle
Zhou Changdu is slightly larger than the circumferential length of lens mount 102.For example, the size of work casting die 101 is about roughly equal to cover plate 103
Size.Above-mentioned work casting die 101 and cover plate 103 are provided with the shackle portion of mutual corresponding clamping, for example, located at its two
On side.For example, work casting die 101 both sides on be provided with clamping recess 101c, and the both sides of cover plate 103 have
Clamping convex portion 103c, utilize the underlying work of corresponding (standard) clampings of clamping convex portion 103c on cover plate 103 above
Clamping recess 101c on casting die 101, to reach the purpose that cover plate 103 is pivotally connected work casting die 101.
In addition, work casting die 101 is provided with multiple fixing holes (opening) 101b, and cover plate 103 is provided with multiple fixing holes
(opening) 103b.For example, the fixing hole 101b to work on casting die 101 number is 4, and the fixing hole on cover plate 103
103b number is also 4.For example, fixing hole 101b position is respectively arranged at 4 corners of rectangle work casting die 101, and
Fixing hole 103b is also respectively arranged at 4 corners of rectangle cover plate 103.When 4 fixing holes on cover plate 103 above
After 4 fixing hole 101b on corresponding (standard) the underlying work casting dies 101 of 103b, 4 fixation kits (such as：Screw)
105 fix the fixing hole 101b on work casting die 101 and the fixing hole 103b on cover plate 103 immediately, are fixed with reaching cover plate 103
Purpose on work casting die 101.Fixing hole 101b and fixing hole 103b is screw.Its fixing means is, for example, to rotate 4
Screw 105 is to fix 4 screw 103b on 4 screw 101b on work casting die 101 and cover plate 103.
The material of screw 105 includes galvanized iron, or the material that patience, rigidity are enough.
Among an embodiment, cover plate 103 includes light leakage, anti-anaclasis or scattering, anti-conductive structure design or material
Material, the aluminium metal sheet for example, handled via an anode, or be resistant to elevated temperatures working of plastics.
In one embodiment, cover plate 103 is provided with an opening 103a, to provide a space lens 104 is opened through this
Mouth 103a.In other words, the opening 103a of cover plate 103 size is more than the size of lens 104, makes lens 104 be obtained through being open
103a.Opening 103a shape can be rectangle, circle or other shapes.Among the present embodiment, the 103a's that is open is shaped as
Circle, and lens mount 102 is shaped as rectangle.Among an embodiment, the size for the 103a that is open is more than the chi of lens mount 102
It is very little, lens mount 102 is also accommodated therein.In addition, being also provided with a groove on lens mount 102, caused with providing a space
Lens 104 are configured on the groove of lens mount 102.In other words, the opening on lens mount 102 or the size of groove are more than lens
104 size, lens 104 are made to be obtained through being open or be configured on groove.Opening or the shape of groove can be rectangle, circle
Shape or other shapes.
Among an embodiment, the visual subtended angle 104a of lens 104 can reach 130 degree.
In addition, test bench 100 is also provided with a diffusion sheet (diffuser) 106, it is configured on lens 104.Light is by expansion
Discrete piece 106 can spread and scatter light.Diffusion sheet 106 can allow the light passed through to reduce brightness.For example, diffusion sheet 106
Can be made by extruded polystyrene (polystyrene, PS) or makrolon (polycarbonate, PC).Diffusion
The material of piece 106 includes engineering plastics.In addition, it is distributed in light with the space or diffusant with diffusion sheet material different refractivity
In diffusion sheet.Space or diffusant refraction or the light for being reflected into diffusion sheet inside diffusion sheet 106.Particularly, when enough numbers
When the space of amount or diffusant are presented in diffusion sheet 106, the light into diffusion sheet 106 is secondary enough in its internal refraction or reflection
Scattered after number.So when the light for entering diffusion sheet 106 leaves diffusion sheet, the intensity of light is consistent and the increase of its dispersion angle.
However, the light that part enters diffusion sheet 106 is absorbed after reflecting or reflecting by diffusion intra-piece voids or diffusant.Institute
Light loss can occur when light is by diffusion sheet 106, that is, optical attenuation can be produced.
In one embodiment, the opening 103a of cover plate 103 size is more than the size of diffusion sheet 106, obtains diffusion sheet 106
With through opening 103a.Among the present embodiment, diffusion sheet 106 is shaped as circle.Among an embodiment, diffusion sheet 106
Through the opening 103a of cover plate 103 be configured on the upper surface of lens 104 or its top.
In addition, test bench 100 is also provided with a retainer ring (ring) 107, to fixed diffusion sheet 106.For example, it is fixed
Ring 107 is provided with an opening and is able to accommodate diffusion sheet 106, and pushes down, fixes the diffusion sheet 106, to avoid diffusion sheet about 106
It is mobile.
As described above, among the present invention, the x-axis (trunnion axis) of a lens mount 102, y-axis (vertical axis) position are proposed
After adjustment is completed, it can obtain and more preferably be directed at optical centre.Then, 4 screws 105 are contacted and driven with by cover plate 103
It is fixed on work casting die 101, and will not be moved in the driving period of screw 105, cover plate 103.That is, when screw 105 will cover
During plate 103 is fixed on work casting die 101, because the clamping convex portion 103c on cover plate 103 above has been corresponded to
Clamping recess 101c on the underlying work casting die 101 of (standard) clamping, so in the rotary course that screw 105 is fixed,
Cover plate 103 will not be moved and rotated, and lens mount 102 will not also move because it contacts cover plate 103.That is, solid
Surely among the process operated, lens mount 102 there will not be small movement or rotation.Relatively, it is configured on lens mount 102
Lens 104 will not also move.Therefore, the present invention can be overcome in the assembling process of test bench of prior art, lens mount
Between lens centre and image center caused by mobile the problem of mis-alignment.In other words, test bench of the invention, without multiple
Machinery readjust to be directed at optical centre, be a stable, not time-consuming and efficient design.
The present invention can efficiently solve machinery and readjust problem, and obtain the efficiency of preferably test hardware adjustment.
The present invention provides a cover plate to be pivotally connected and fixed work casting die.For the viewpoint of operation, when driving screw
With securing cover plate when on the casting die that works, cover plate will not rotate.Also, after cover plate is fixed on work casting die, cover plate can connect
Touch lens mount.Based on the design concept of the present invention, during the fixed operation of component, lens mount does not have small movement.
So the design of test bench of the invention can reach the purpose for improving efficiency and stability.
According to the advantages of above-mentioned, the present invention is with：
First, new test bench design concept provides a stable test environment；
2nd, the stability of test environment gets a promotion；
3rd, the regulated efficiency for testing hardware gets a promotion.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
Enclose not limited to this.The equivalent substitute or conversion that those skilled in the art are made on the basis of the present invention, in the present invention
Protection domain within.Protection scope of the present invention is defined by claims.
Claims (10)
1. a kind of test bench for testing image sensing chip, it is characterised in that include：
One substrate；
One lens mount, it is configured on the substrate, wherein a lens configuration is on the lens mount；And
One cover plate, for being pivotally connected the substrate；
Wherein first shackle portion and second shackle portion of the substrate with being respectively equipped with mutual corresponding clamping on the cover plate；
Wherein the substrate is more with being respectively equipped with mutual corresponding multiple first fixing holes and multiple second fixing holes on the cover plate
Individual fixation kit is fixedly arranged among the plurality of first fixing hole and the plurality of second fixing hole.
2. the test bench according to claim 1 for testing image sensing chip, it is characterised in that the substrate is a work
Make casting die.
3. the test bench according to claim 1 or 2 for testing image sensing chip, it is characterised in that in the substrate
An accommodation space therein is configured at provided with the lens mount is caused.
4. the test bench according to claim 1 or 2 for testing image sensing chip, it is characterised in that the plurality of
One fixing hole and the plurality of second fixing hole are screw.
5. the test bench according to claim 4 for testing image sensing chip, it is characterised in that the plurality of fixed group
Part is screw.
6. the test bench according to claim 1 or 2 for testing image sensing chip, it is characterised in that on the cover plate
Provided with the opening for causing the lens to pass through.
7. the test bench according to claim 1 or 2 for testing image sensing chip, it is characterised in that the lens mount
It is provided with a groove so that the lens configuration is on the groove of the lens mount.
8. the test bench according to claim 1 or 2 for testing image sensing chip, it is characterised in that also include matching somebody with somebody
The diffusion sheet being placed on the lens.
9. the test bench according to claim 8 for testing image sensing chip, it is characterised in that also include to solid
One retainer ring of the fixed diffusion sheet.
10. the test bench according to claim 1 or 2 for testing image sensing chip, it is characterised in that first card
Socket part point, the second shackle portion are respectively clamping recess, clamping convex portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105116340 | 2016-05-25 | ||
| TW105116340A TWI596351B (en) | 2016-05-25 | 2016-05-25 | Test socket for testing image sensor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107462747A true CN107462747A (en) | 2017-12-12 |
| CN107462747B CN107462747B (en) | 2023-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610632328.4A Active CN107462747B (en) | 2016-05-25 | 2016-08-04 | Test seat for testing image sensing chip |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107462747B (en) |
| TW (1) | TWI596351B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108683905A (en) * | 2018-05-02 | 2018-10-19 | 重庆大学 | A kind of Cam for automobile Special-purpose testing jig |
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| KR20010004196A (en) * | 1999-06-28 | 2001-01-15 | 김영환 | Apparatus for testing chip of image sensor |
| CN1908717A (en) * | 2005-08-05 | 2007-02-07 | 宇东电浆科技股份有限公司 | Optical-mechanical assembly having optical track regulating mechanism |
| CN101893647A (en) * | 2009-05-22 | 2010-11-24 | 原相科技股份有限公司 | Testing socket for package |
| CN203786157U (en) * | 2014-03-26 | 2014-08-20 | 深圳市明信测试设备有限公司 | Conversion device for PCB connector test |
| CN205067539U (en) * | 2015-11-06 | 2016-03-02 | 武汉钧恒科技有限公司 | Short needle test fixture that arranges of optical module |
| CN105572561A (en) * | 2015-12-10 | 2016-05-11 | 华测检测认证集团股份有限公司 | Universal type test device for failure analysis of chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108683905A (en) * | 2018-05-02 | 2018-10-19 | 重庆大学 | A kind of Cam for automobile Special-purpose testing jig |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI596351B (en) | 2017-08-21 |
| CN107462747B (en) | 2023-09-15 |
| TW201741678A (en) | 2017-12-01 |
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