CN101892118A - Simplified industrial method for recovering cutting fluid from silicon chip cutting and processing mortar - Google Patents
Simplified industrial method for recovering cutting fluid from silicon chip cutting and processing mortar Download PDFInfo
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- CN101892118A CN101892118A CN2010101324090A CN201010132409A CN101892118A CN 101892118 A CN101892118 A CN 101892118A CN 2010101324090 A CN2010101324090 A CN 2010101324090A CN 201010132409 A CN201010132409 A CN 201010132409A CN 101892118 A CN101892118 A CN 101892118A
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Abstract
The invention relates to a simplified industrial method for recovering cutting fluid from silicon chip cutting and processing mortar. According to the technical scheme, the simplified industrial method for recovering the cutting fluid from the silicon chip cutting and processing mortar comprises the following steps of: firstly, adding a diluting agent into cutting mortar for reducing system viscosity; secondly, carrying out the one-stage separation on the viscosity-reduced mortar by a fine filtering device A to obtain one-stage separated mortar liquid L1; thirdly, carrying out the second-stage separation on the mortar liquid subjected to the one-stage separated by a fine filtering device B and controlling filter fineness to intercept minimum passing gains with grain diameters under 2 micron for further removing solid matters to obtain second-separated mortar liquid L2; and fourthly, ensuring that the second-stage separated mortar liquid L2 passes through an ultrasonic cleaning device and enters a distilling device to remove the diluting agent (recycle) to obtain the recovered cutting liquid.
Description
Technical field
The present invention relates to a kind of simplified industrial method that from silicon slice cutting and processing mortar, reclaims cutting fluid.Application Areas mainly is the recycling of sun power industry silicon slice cutting and processing mortar, electron trade silicon slice cutting and processing mortar.From mortar, reclaim the line cutting processing that the cutting fluid product that obtains can be back to silicon materials.
Technical background
Silicon chip is the important foundation of development solar energy industry.In silicon chip working process, it is current in the world at present processing mode that the linear cutting equipment by special use cuts into certain thickness sheet material with silicon rod (ingot).Along with developing rapidly of solar energy industry in the global range, the amount of finish and the demand of silicon chip increase substantially; Corresponding, the mortar that silicon chip cutting processing link the is produced growth that also can be directly proportional.At present, Chinese the development is important in the world silicon chip processing base.According to the industry statistic data, 2009 Chinese photovoltaic silicon chip output have surpassed 4GW, and production capacity breaks through 7GW, is sure to occupy the position that world's photovoltaic silicon chip is made first big country.
The whole process of brilliant material cutting processing need depend on being used of cutting fluid (claiming cutting liquid, suspension again) and silicon carbide micro-powder, wherein cutting fluid plays the effect of dispersion agent in the cutting processing process, make silicon carbide in cutting process, be evenly distributed, and take away the frictional heat that in cutting process, produces in a large number.The a large amount of cutting and machining mortar of association in the process of cutting processing production silicon chip.The main component of mortar is cutting fluid, silicon carbide, silicon powder and little metal impurity, will produce serious environmental and influence problem if can not get appropriate disposal.Technology according to the silicon chip cutting processing realizes situation, and the mortar total amount of silicon chip cutting processing link generation in domestic 2009 is approximately 800,000 tons.So a large amount of silicon slice cutting and processing mortars not only can produce serious environmental and pollute, and waste a large amount of resources if deal with improperly.Realize the repeatedly recycle and reuse of cutting fluid, not only can increase the comprehensive rate of utilization of resource, more can reduce the manufacturing cost of crystal silicon sheet, and can be in the pollution of fundamentally avoiding the mortar material may cause environment.
About recovery method cutting fluid from silicon wafer cutting mortar, all need at the extra later on a certain amount of chemical (as: flocculating aids, stablizer, steadily agent) that adds of viscosity-depression agent in many technical process of leading that appeared in the newspapers, above-mentioned chemical will be stayed in suspension agent or the cutting fluid system after distillation process removes viscosity-depression agent.So, repeatedly recycle the above-mentioned chemical in back in suspension agent or cutting fluid with continuous enrichment, will produce severe bad influence to the application performance of cutting fluid after reaching certain concentration value; Suspension agent after perhaps causing reclaiming or cutting fluid are difficult to realize recycling once more or repeatedly.
Still have a small amount of tiny silicon-carbide particle and little metal impurity and ionic situation at silicon slice cutting and processing mortar through behind the multi-filtering, the treatment process of being taked in the technology report in the past comprises: ion exchange resin removal, micro-pore-film filtration, tubular fibre membrane ultrafiltration and chemical stabilization are handled.So, then recovery process becomes quite complicated, and equipment configuration and processing method all are difficult to realize technical scaleization.
Summary of the invention
But the present invention is to realize a kind of recovery scheme of heavy industrialization of easy by problem to be solved.Its engineering comprises: by the use of thinner, scope with viscosity to one relative ideal that reduces mortar, pass through the secondary filter separation means of easy again, set suitable filtering accuracy, reach purpose to suspension small particles granularity and quantity control, continuation obtains reclaiming cutting fluid through distillation again by the processing of ultrasonic cleaning equipment cleaning, and it can be back to the cutting processing of silicon materials.
The technology of the present invention has effectively avoided each component to be difficult to the rough sledding of sharp separation, and its separation circuit is easy, need not to add other chemical except that thinner, has avoided the enrichment condition of additive in follow-up the recycling fully.The project technology is applied to industrial production, and operability and controllability are strong, and the follow-up reusable edible number of times of cutting fluid promotes significantly, comprehensive utilization of resources efficient height.
According to technical scheme provided by the invention, the described method that reclaims cutting fluid from silicon chip cutting mortar comprises the steps:
Step 1 adds thinner in the cutting mortar, to reduce system viscosity;
Step 2 is carried out flash trapping stage with the mortar material after the reduction viscosity by secondary filter device A, obtains the mortar liquid L1 of flash trapping stage;
Step 3, at through the mortar liquid behind the flash trapping stage, carry out secondary by secondary filter device B again and separate, the minimum that the controlled filter precision makes it possible to hold back by particle below 2 μ m, further remove solid matter, obtain the mortar liquid L2 after secondary separates;
Step 4, the mortar liquid L2 after will separating through secondary enters water distilling apparatus again and removes thinner (reuse capable of circulation), and obtain reclaiming cutting fluid by ultrasonic cleaning equipment.
The simplified industrial method that reclaims cutting fluid from silicon slice cutting and processing mortar of the present invention, it is characterized in that: silicon slice cutting and processing mortar comprises solar energy-level silicon wafer cutting and machining mortar and electronic-grade silicon chip cutting and machining mortar.
The simplified industrial method that from silicon slice cutting and processing mortar, reclaims cutting fluid of the present invention, it is characterized in that the composition of described cutting fluid is: two or more component in polyoxyethylene glycol, propylene glycol, ethylene glycol, ethylene glycol monomethyl ether, tensio-active agent, permeate agent and the viscosity modifier.
The simplified industrial method that from silicon slice cutting and processing mortar, reclaims cutting fluid of the present invention, it is characterized in that: the thinner described in the step 1 comprises acetone, butanone, methyl alcohol, ethanol, Virahol, vinyl acetic monomer, benzene, toluene, methylene dichloride, chloroform, ethylene dichloride, trieline, tetrahydrofuran (THF), second eyeball, propylene glycol, ethylene glycol, ethylene glycol monomethyl ether, glycol dimethyl ether, 1, the mixture of one or more in the 4-dioxane, consumption are 5%～75%; Described reduction system viscosity, the range of viscosities after it reduces is between the 10-100cps.
The simplified industrial method that from silicon slice cutting and processing mortar, reclaims cutting fluid of the present invention, it is characterized in that: secondary filter device A, the B described in the step 2, three comprises the one or more combination in accurate plate filter, PAE accurate filter, stacked accurate filter, micropore filter element strainer, filter membrane accurate filter, filer element type strainer and the swirler; Filtered version comprises filter residue collection type or filter residue self-discharging formula.
The simplified industrial method that reclaims cutting fluid from silicon slice cutting and processing mortar of the present invention is characterized in that: set the particle minimum particle size of controlled filter precision between 5-15 μ m according to the requirement of silicon materials line cutting described in the step 2.
The simplified industrial method that reclaims cutting fluid from silicon slice cutting and processing mortar of the present invention, it is characterized in that: the implication of the further removal solid constituent described in the step 3 is 0～5% (comparing the weight percent of total solids level) for the solid constituent residual quantity.
The simplified industrial method that from silicon slice cutting and processing mortar, reclaims cutting fluid of the present invention, it is characterized in that: the ultrasonic cleaning equipment described in the step 4 comprises the one or more combination in single-channel type Ultrasonic Cleaners, multi-channel Ultrasonic Cleaners, swing type Ultrasonic Cleaners, throw-in type Ultrasonic Cleaners, through type Ultrasonic Cleaners and the ultrasonic cleaning line; The cleaning form comprises manual type, half auto and full rotation type.
The easy method that from silicon slice cutting and processing mortar, reclaims cutting fluid of the present invention, it is characterized in that: the distillation plant described in the step 4 comprises single-effect evaporation thickening equipment, multiple-effect evaporation thickening equipment or rotary drum, falling film type, rises membrane type, vertical pipe type or forced cyclic type thickening equipment, perhaps negative pressure in these equipment or atmospheric evaporation equipment; Distillation temperature is 50～120 ℃; Describedly remove that the residual quantity of thinner is 0～20% (comparing the weight percent of thinner total addition level) behind the thinner.
Embodiment
From silicon slice cutting and processing mortar, reclaim the technical process of cutting fluid, specifically may further comprise the steps:
(1) silicon slice cutting and processing mortar is passed through pre-treatment in settling tank, to remove contained large granular impurity, send in the mixing tank by transferpump, open and stir and the adding thinner, the add-on of thinner is 5%～75% of a system gross weight, system viscosity is measured, and hierarchy of control viscosity is reduced between the 10-100cps.Described thinner comprises acetone, butanone, methyl alcohol, ethanol, Virahol, vinyl acetic monomer, benzene, toluene, methylene dichloride, chloroform, ethylene dichloride, trieline, tetrahydrofuran (THF), second eyeball, propylene glycol, ethylene glycol, ethylene glycol monomethyl ether, glycol dimethyl ether, 1, the mixture of one or more in the 4-dioxane.
(2) will the stir mortar that meets viscosity index and diluent mixture is sent to secondary filter device A and carries out flash trapping stage, require to set the controlled filter precision according to the size-grade distribution of silicon materials line cutting, obtain the mortar liquid L1 of flash trapping stage silicon carbide abrasive.Secondary filter device A can be the one or more combination in accurate plate filter, PAE accurate filter, stacked accurate filter, micropore filter element strainer, filter membrane accurate filter, filer element type strainer and the swirler; Filtered version can be filter residue collection type or filter residue self-discharging formula.According to the general requirement of silicon materials line cutting to silicon carbide abrasive, its particle minimum particle size of setting the controlled filter precision is between 5-15 μ m.It is standby as other that the collection flash trapping stage produces filter residue.
(3) will be sent to secondary filter device B through the mortar liquid L1 behind the flash trapping stage and carry out the secondary separation, the minimum that the controlled filter precision makes it possible to hold back below 2 μ m, is further removed solid matter by particle, obtains the mortar liquid L2 after secondary separates.Secondary filter device B can be the one or more combination in accurate plate filter, PAE accurate filter, stacked accurate filter, micropore filter element strainer, filter membrane accurate filter, filer element type strainer and the swirler; Filtered version can be filter residue collection type or filter residue self-discharging formula.Collect secondary separate to produce filter residue standby as other.
(4) will enter water distilling apparatus again and remove thinner (reuse capable of circulation of resulting thinner), and obtain reclaiming cutting fluid through the mortar liquid L2 after the secondary separation by the processing of ultrasonic cleaning equipment cleaning.Selected ultrasonic cleaning equipment can be the one or more combination in single-channel type Ultrasonic Cleaners, multi-channel Ultrasonic Cleaners, swing type Ultrasonic Cleaners, throw-in type Ultrasonic Cleaners, through type Ultrasonic Cleaners and the ultrasonic cleaning line; The cleaning form can be manual type, half auto or full rotation type.Selected distillation plant can be single-effect evaporation thickening equipment, multiple-effect evaporation thickening equipment or rotary drum, falling film type, rise membrane type, vertical pipe type or forced cyclic type thickening equipment, perhaps negative pressure in these equipment or atmospheric evaporation equipment; The distillation temperature of distillation thinner is controlled at 50～120 ℃; Remove that the residual quantity of thinner is 0～20% (comparing the weight percent of thinner total addition level) behind the thinner.
Embodiment 1:
Utilize the present invention to handle silicon slice cutting and processing mortar, wherein the mass ratio of silicon carbide, polyethylene glycol suspensoid is 1: 1, and the mass ratio of cutting fluid is 45% in the mortar, and used cutting fluid is from Lianyungang Jiayu Electron Material Science Co., Ltd.Its concrete steps are as follows:
Step 1 will be sent in the 5000L mixing tank by transferpump through the mortar 1000Kg behind the pre-treatment removal large granular impurity, opens and stirs after 10 minutes, adds thinner 2000L ethanol in 20 minutes, measures its viscosity number at 16.7cps.
Step 2, with above-mentioned mortar that stirs and diluent mixture, be sent to accurate plate filter according to the flow of 500Kg/h and carry out flash trapping stage, filtered version is a filter residue self-discharging formula, the filtering accuracy of setting accurate plate filter is 10 μ m, obtains the mortar liquid of flash trapping stage.It is standby as other that the collection flash trapping stage produces filter residue.
Step 3, mortar liquid behind the above-mentioned resulting flash trapping stage is sent to the precision Filter element strainer according to the flow of 800Kg/h, filtered version is a filter residue self-discharging formula, and the filtering accuracy of setting the precision Filter element strainer is 2 μ m, filters to such an extent that obtain mortar liquid after secondary separates.Collect secondary separate to produce filter residue standby as other.
Step 4, with above-mentioned resultant mortar liquid after separating through secondary by cleaning 1h in the semi-automatic throw-in type Ultrasonic Cleaners; Be transported to and carry out underpressure distillation in the multiple-effect evaporation thickening equipment, diluent ethanol is collected in 55 ℃ of distillation temperature controls; When collection alcoholic acid weight reaches addition 95%, stop distillation.Obtain surplus liquid 416Kg after the distillation, as the cutting fluid of silicon chip cutting processing.
Embodiment 2:
Utilize the present invention to handle silicon slice cutting and processing mortar, wherein the mass ratio of silicon carbide, polyethylene glycol suspensoid is 1: 1, and the mass ratio of cutting fluid is 45% in the mortar, and used cutting fluid is from Lianyungang Jiayu Electron Material Science Co., Ltd.Its concrete steps are as follows:
Step 1 will be sent in the 5000L mixing tank by transferpump through the mortar 1000Kg behind the pre-treatment removal large granular impurity, opens and stirs after 10 minutes, adds thinner 1500L acetone in 20 minutes, measures its viscosity number at 17.3cps.
Step 2, with above-mentioned mortar that stirs and diluent mixture, be sent to stacked accurate filter according to the flow of 400Kg/h, filtered version is the filter residue collection type, the filtering accuracy of setting stacked accurate filter is 6.5 μ m, obtains the mortar liquid of flash trapping stage.It is standby as other that the collection flash trapping stage produces filter residue.
Step 3, mortar liquid behind the above-mentioned resulting flash trapping stage is sent to the micropore filter element strainer according to the flow of 1000Kg/h, filtered version is the filter residue collection type, and the filtering accuracy of setting the micropore filter element strainer is 2 μ m, filters to such an extent that obtain mortar liquid after secondary separates.Collect secondary separate to produce filter residue standby as other.
Step 4, with above-mentioned resultant mortar liquid after separating through secondary by cleaning 1h in the full-automatic multi-channel Ultrasonic Cleaners; Carry out air distillation in the conveying drum formula thickening equipment again, thinner acetone is collected in 56 ℃ of distillation temperature controls; When the weight of collecting acetone reaches addition 93%, stop distillation.Obtain surplus liquid 419Kg after the distillation, as the cutting fluid of silicon chip cutting processing.
Claims (9)
1. simplified industrial method that from silicon slice cutting and processing mortar, reclaims cutting fluid.It is characterized in that described method comprises the steps:
Step 1 adds thinner in the cutting mortar, to reduce system viscosity;
Step 2 is carried out flash trapping stage with the mortar material after the reduction viscosity by secondary filter device A, obtains the mortar liquid L1 of flash trapping stage;
Step 3, at through the mortar liquid behind the flash trapping stage, carry out secondary by secondary filter device B again and separate, the minimum that the controlled filter precision makes it possible to hold back by particle below 2 μ m, further remove solid matter, obtain the mortar liquid L2 after secondary separates;
Step 4, the mortar liquid L2 after will separating through secondary enters water distilling apparatus again and removes thinner (reuse capable of circulation), and obtain reclaiming cutting fluid by ultrasonic cleaning equipment.
2. according to the described simplified industrial method that reclaims cutting fluid from silicon slice cutting and processing mortar of claim 1, it is characterized in that: silicon slice cutting and processing mortar comprises solar energy-level silicon wafer cutting and machining mortar and electronic-grade silicon chip cutting and machining mortar.
3. according to the described simplified industrial method that from silicon slice cutting and processing mortar, reclaims cutting fluid of claim 1, it is characterized in that the composition of described cutting fluid is: two or more component in polyoxyethylene glycol, propylene glycol, ethylene glycol, ethylene glycol monomethyl ether, tensio-active agent, permeate agent and the viscosity modifier.
4. according to the described simplified industrial method that from silicon slice cutting and processing mortar, reclaims cutting fluid of claim 1, it is characterized in that: the thinner described in the step 1 comprises acetone, butanone, methyl alcohol, ethanol, Virahol, vinyl acetic monomer, benzene, toluene, methylene dichloride, chloroform, ethylene dichloride, trieline, tetrahydrofuran (THF), second eyeball, propylene glycol, ethylene glycol, ethylene glycol monomethyl ether, glycol dimethyl ether, 1, the mixture of one or more in the 4-dioxane, consumption are 5%～75%; Described reduction system viscosity, the range of viscosities after it reduces is between the 10-100cps.
5. according to the described simplified industrial method that reclaims cutting fluid from silicon slice cutting and processing mortar of claim 1, it is characterized in that: secondary filter device A, the B described in the step 2, three comprises the one or more combination in accurate plate filter, PAE accurate filter, stacked accurate filter, micropore filter element strainer, filter membrane accurate filter, filer element type strainer and the swirler; Filtered version comprises filter residue collection type or filter residue self-discharging formula.
6. according to the described simplified industrial method that from silicon slice cutting and processing mortar, reclaims silicon carbide of claim 1, it is characterized in that: set the particle minimum particle size of controlled filter precision between 5-15 μ m according to the requirement of silicon materials line cutting described in the step 2.
7. according to the described simplified industrial method that reclaims cutting fluid from silicon slice cutting and processing mortar of claim 1, it is characterized in that: the implication of the further removal solid constituent described in the step 3 is 0～5% (comparing the weight percent of total solids level) for the solid constituent residual quantity.
8. according to the described simplified industrial method that reclaims cutting fluid from silicon slice cutting and processing mortar of claim 1, it is characterized in that: the ultrasonic cleaning equipment described in the step 4 comprises the one or more combination in single-channel type Ultrasonic Cleaners, multi-channel Ultrasonic Cleaners, swing type Ultrasonic Cleaners, throw-in type Ultrasonic Cleaners, through type Ultrasonic Cleaners and the ultrasonic cleaning line; The cleaning form comprises manual type, half auto and full rotation type.
9. according to the described easy method that from silicon slice cutting and processing mortar, reclaims cutting fluid of claim 1, it is characterized in that: the distillation plant described in the step 4 comprises single-effect evaporation thickening equipment, multiple-effect evaporation thickening equipment or rotary drum, falling film type, rises membrane type, vertical pipe type or forced cyclic type thickening equipment, perhaps negative pressure in these equipment or atmospheric evaporation equipment; Distillation temperature is 50～120 ℃; Describedly remove that the residual quantity of thinner is 0～20% (comparing the weight percent of thinner total addition level) behind the thinner.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102101326A (en) * | 2010-12-15 | 2011-06-22 | 湖南宇晶机器实业有限公司 | Method and device for recycling multi-thread cutting machine mortar |
| CN102502643A (en) * | 2011-10-08 | 2012-06-20 | 江苏佳宇资源利用股份有限公司 | Method for realizing resource recycling of silicon powder components in waste mortar from crystalline silicon cutting |
| CN102502650A (en) * | 2011-10-08 | 2012-06-20 | 江苏佳宇资源利用股份有限公司 | Method for preparing crystalline silicon components from crystalline silicon cutting waste mortar |
| CN102559361A (en) * | 2010-11-30 | 2012-07-11 | Sanwa生物技术株式会社 | Processing Method Of Silicon Cutting Waste Liquid |
| CN102643710A (en) * | 2012-04-07 | 2012-08-22 | 泗阳瑞泰光伏材料有限公司 | Silicon wafer-cutting waste slurry recovery method |
| CN103122071A (en) * | 2013-03-15 | 2013-05-29 | 南京高捷轻工设备有限公司 | Method for concentrating polyethylene glycol solution through combination of multiple-effect plate-type evaporation and flash evaporation |
| CN103435210A (en) * | 2013-07-19 | 2013-12-11 | 江苏吉星新材料有限公司 | Cutting fluid recycling method |
| CN103630586A (en) * | 2013-11-01 | 2014-03-12 | 河南新大新材料股份有限公司 | Method for detecting pH value of silicon wafer cutting liquid |
| CN110902886A (en) * | 2019-12-06 | 2020-03-24 | 扬州海吉科技有限公司 | Method for directly curing cutting waste liquid |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101239246A (en) * | 2008-02-20 | 2008-08-13 | 江南大学 | Method for recovering cutting solution from by-product of silicon chip cutting processing |
| CN101474511A (en) * | 2008-12-17 | 2009-07-08 | 西安交通大学 | Process for recovering polyethylene glycol and silicon carbide in waste mortar from silicon wafer wire cutting |
-
2010
- 2010-03-26 CN CN2010101324090A patent/CN101892118A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101239246A (en) * | 2008-02-20 | 2008-08-13 | 江南大学 | Method for recovering cutting solution from by-product of silicon chip cutting processing |
| CN101474511A (en) * | 2008-12-17 | 2009-07-08 | 西安交通大学 | Process for recovering polyethylene glycol and silicon carbide in waste mortar from silicon wafer wire cutting |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559361A (en) * | 2010-11-30 | 2012-07-11 | Sanwa生物技术株式会社 | Processing Method Of Silicon Cutting Waste Liquid |
| CN102101326A (en) * | 2010-12-15 | 2011-06-22 | 湖南宇晶机器实业有限公司 | Method and device for recycling multi-thread cutting machine mortar |
| CN102502643B (en) * | 2011-10-08 | 2013-06-05 | 江苏佳宇资源利用股份有限公司 | Method for realizing resource recycling of silicon powder components in waste mortar from crystalline silicon cutting |
| CN102502650A (en) * | 2011-10-08 | 2012-06-20 | 江苏佳宇资源利用股份有限公司 | Method for preparing crystalline silicon components from crystalline silicon cutting waste mortar |
| CN102502643A (en) * | 2011-10-08 | 2012-06-20 | 江苏佳宇资源利用股份有限公司 | Method for realizing resource recycling of silicon powder components in waste mortar from crystalline silicon cutting |
| CN102643710A (en) * | 2012-04-07 | 2012-08-22 | 泗阳瑞泰光伏材料有限公司 | Silicon wafer-cutting waste slurry recovery method |
| CN102643710B (en) * | 2012-04-07 | 2014-05-21 | 泗阳瑞泰光伏材料有限公司 | Silicon wafer-cutting waste slurry recovery method |
| CN103122071A (en) * | 2013-03-15 | 2013-05-29 | 南京高捷轻工设备有限公司 | Method for concentrating polyethylene glycol solution through combination of multiple-effect plate-type evaporation and flash evaporation |
| CN103122071B (en) * | 2013-03-15 | 2015-10-21 | 南京高捷轻工设备有限公司 | The polyglycol solution concentration method that Multi-effect plate type evaporation and flash distillation combine |
| CN103435210A (en) * | 2013-07-19 | 2013-12-11 | 江苏吉星新材料有限公司 | Cutting fluid recycling method |
| CN103630586A (en) * | 2013-11-01 | 2014-03-12 | 河南新大新材料股份有限公司 | Method for detecting pH value of silicon wafer cutting liquid |
| CN103630586B (en) * | 2013-11-01 | 2016-02-17 | 河南易成新能源股份有限公司 | The detection method of crystal silicon chip cutting liquid pH value |
| CN110902886A (en) * | 2019-12-06 | 2020-03-24 | 扬州海吉科技有限公司 | Method for directly curing cutting waste liquid |
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Application publication date: 20101124 |