CN101890548A - Solder printing type die bonding method - Google Patents
Solder printing type die bonding method Download PDFInfo
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- CN101890548A CN101890548A CN2010101741332A CN201010174133A CN101890548A CN 101890548 A CN101890548 A CN 101890548A CN 2010101741332 A CN2010101741332 A CN 2010101741332A CN 201010174133 A CN201010174133 A CN 201010174133A CN 101890548 A CN101890548 A CN 101890548A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 129
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000007639 printing Methods 0.000 title claims abstract description 31
- 238000003466 welding Methods 0.000 claims abstract description 91
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims description 29
- 238000007493 shaping process Methods 0.000 claims description 24
- 230000000877 morphologic effect Effects 0.000 claims description 6
- 230000003068 static effect Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 7
- 239000000155 melt Substances 0.000 abstract description 3
- 230000003213 activating effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 5
- 230000003111 delayed effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
The present invention relates to a solder printing type die bonding method, and particularly to a tube core welding method which melts the soldering wire to a pattern shape or linear shape for producing high-quality product through controlling a feeder that feds the soldering wire. The solder printing type die bonding method according to the invention comprises the following steps: a step of activating a feeding motor for declining the welding wire through a nozzle at a state that an X-axis worktable and a Y-axis worktable are still; a step of contacting between the welding wire and a lead frame; a step of simultaneously driving the X-axis worktable and the Y-axis worktable according to a solder line or a specific shape, and melting the soldering wire on the lead frame; and a step of reversing the feeding motor for causing the soldering wire to return to the original position. The die welding method of the invention can control the feeder that feeds the soldering wire thereby obtaining a required solder state and operating the chip with a plurality of dimensions through the state. Simultaneously, the thickness of the solder can be stabilized. A plurality of quality problems such as gap and inclination angle change, which are caused by thickness abnormity of solder can be settled.
Description
Technical field
The present invention relates to a kind of solder printing type die bonding method, particularly, relate to following a kind of solder printing type die bonding method, this die bonding method is used to supply with the feeder and the workbench (X-axis workbench and Y-axis workbench) of welding wire by control, and with described wire melting and brush into pattern form or rectilinear form, can produce high-quality product.
Background technology
In general; be formed with the silicon of semiconductor circuit and the transmitting chip of LED and be called tube core (Die); this tube core need carry out so-called packaging process: promptly make the input/output terminal of described tube core and power supply terminal be connected with external electric; protect it not to be subjected to the influence of environment on every side such as moisture or dust, and can bear exterior mechanical and impact.
Recently, along with the integrated and multifunction of chip develops rapidly, need make I/O (I/O) data volume of chip bigger, speed is faster, lead pin pitch (pitch) is littler and hot property is better etc., this makes the die package field more and more get more and more people's extensive concerning.
For above-mentioned packaging process, it is the die bonding method of epoxy resin that prior art is extensive use of encapsulating material, so-called epoxy resin die bonding method, promptly after point is annotated epoxy resin on the predetermined position of lead frame or substrate, load onto semiconductor chip in a position of notes epoxy resin, and in curing oven (cure Oven), be cured to carry out the method for tube core welding.
With regard to above-mentioned existing method, because epoxy resin is bigger than the thermal coefficient of expansion of silicon, therefore cracking takes place to separate in pin easily that be in contact with one another.In addition, moisture can infiltrate from the slit, and this can cause the weld zone of aluminium matter or connect the lead-in wire corrosion.In addition, also there are oxidized problem in this weld zone or connection lead-in wire.Moreover, should have the amount that method is difficult to the adjustable ring epoxy resins now, it can't make epoxy resin evenly distribute below chip, therefore reduced flatness, and owing to should have the assembling sequence of method now is to place chip again after epoxy points is annotated on epoxy resin, therefore produces the space easily on epoxy resin.
For addressing the above problem, particularly solve problem of oxidation, bring into use the solder bonds method, this welding joint method is by adding the thermal guide rail with filler wire or welding, and behind the scolder that bonding fusing forms on the predetermined position of lead frame or substrate, bonding semiconductor chips on the scolder of this fusing can be carried out the tube core welding thereby need not to solidify again.
With reference to the accompanying drawings, need not the solder bonds method that curing oven can carry out tube core welding and be elaborated above-mentioned.
Fig. 1 and Fig. 2 are the schematic diagrames of scolder spot welding state, Fig. 3 is the sequential schematic of existing scolder spot welding state, Fig. 4 is the schematic diagram that occurs the space state in the existing method, Fig. 5 is the schematic diagram that occurs inclination and scolder polar distribution of field poor distribution state in the existing method, Fig. 6 is the flow chart of the scolder spot welding of existing method, and Fig. 7 is the control flow chart of the scolder spot welding of existing method.
,, after being fused into point-like (hereinafter referred to as Dotting) form with welding wire 3, existing solder dots soldering method again tube core 5 (with reference to Fig. 5) is bonded to (with reference to Fig. 1 and Fig. 2) on the lead frame 4 to shown in Figure 7 as Fig. 1.
In addition, to drop to the lead frame 4 that is used to be provided with tube core 5 with the welding wire 3 that the length of setting is supplied with by ozzle 2, and welding wire 3 is contacted with lead frame 4, welding wire 3 is subjected to being delivered to the heat on the lead frame 4 and melts, be bonded on the lead frame 4 with the point-like form, thereby formed point-like scolder (with reference to Fig. 3).
Here, Fig. 6 and Fig. 7 illustrate existing scolder spot welding flow chart and control flow chart, existing scolder pinpoint welding procedure is: be under the static state at X, Y-axis workbench (not having diagram), start charging motor (Feeder Moter, not diagram) and descend to make welding wire 3 by ozzle 2.Then, in the moment that welding wire 3 contacts with lead frame 4, make feeder (not having diagram) stop and the scolder contact identical time of time delay, after scolder contact end time delay, restart feeder, so that welding wire moves and the identical length of scolder charging length (Solder Feeder Length), and welding wire 3 is melted on the lead frame 4, then, at feeding machine (Preformer, be commonly referred to " welding wire feedway ") feeder stop with after solder fusing finishes identical time time delay, the reverse rotation of charging motor retreats the identical length of length (Solder Reverse Length) so that welding wire retreats with scolder, thereby welding wire 3 is kept in the center.
Here, above-mentioned operation form is called scolder spot welding (Solder Dotting).
Below, with reference to scolder spot welding control flow chart shown in Figure 7 spot welding is elaborated.At first, feeding machine is positioned at charging initial point (S1) in X, Y, Z coordinate system.Then, transmission/reception starting position data (S2).According to these starting position data, the X of feeding machine, Y, Z axle mobile motor drive feeding machine and move to feed position (S3).After moving to this supply position, the X of feeding machine, Y, Z axle mobile motor shut down (S4).Send charging commencing signal (S5) then.Drive the charging motor (S6) of feeding machine according to this charging commencing signal.Then, the initial contact length data of transmission/reception scolder (S7).According to the initial contact length data of this scolder, welding wire is touched (S8) on the manipulating object.Then, transmission/reception scolder contact delay time data (S9).According to this scolder contact delay time data, make the charging motor of feeding machine stop (S10).Then, transmission/reception scolder charging length data (S11).According to this scolder charging length data, drive charging motor (S12) running of feeding machine.Then, transmission/reception solder fusing finishes delay time data (S13).Finish delay time data according to this solder fusing, make the charging motor of feeding machine stop (S14) running.Then, transmission/reception scolder retreats length data (S15).Retreat length data according to this scolder, drive charging motor (S16) counter-rotating of feeding machine.Then, the charging motor of feeding machine stops (S17).Then, transmission/reception beginning data (S18).Begin data according to this, drive X, Y, the Z axle mobile motor (S19) of feeding machine.Like this, feeding machine forms the circulation of the charging initial point repeat to be positioned at X, Y, Z coordinate system.
But, when above-mentioned solder dots soldering method is used for large size chip, can be because not evenly distribution of scolder, and make solder thickness inhomogeneous, occur space, inclination, scolder easily and cover problems such as bad, and need cost plenty of time, production efficiency not high (with reference to Fig. 4 and Fig. 5).
Summary of the invention
In order to address the above problem, to the object of the present invention is to provide and a kind ofly supply with the feeder of welding wire to produce the solder printing type die bonding method of high-quality product by control.
Solder printing type die bonding method of the present invention is characterized in, this method comprises: under the static state of X, Y-axis workbench, start charging motor (Feeder Moter), the step that welding wire (Solder Wire) is descended by ozzle; In the moment that described welding wire and lead frame join, make feeder stop the step of the time identical with scolder contact time delay; After the contact of described scolder finishes time delay, form morphology Control X, the Y-axis workbench of scolder as required, described feeder makes welding wire move and the solder line identical length of charging length that is shaped in earlier stage, and with the step of wire melting on lead frame; The feeder of feeding machine stops to be shaped in earlier stage after identical time time delay with solder line, and described feeder makes welding wire move and the identical length of scolder charging length, and with the step of wire melting on lead frame; Feeder stops to be shaped after identical time time delay with the solder line later stage, and feeder makes welding wire move and the identical length of solder line later stage shaping charging length, with the step of wire melting on lead frame; The feeder of feeding machine stops with after solder fusing finishes identical time time delay, and the reverse rotation of charging motor retreats the identical length of length so that welding wire retreats with scolder, thus the step that welding wire is kept in the center.
In addition, characteristics of the present invention are, if above-mentioned scolder charging length is invalid, will supply with welding wire in the time of the mobile motor work of the X of feeding machine, Y-axis workbench, and these characteristics were called according to X, Y-axis workbench working time to be supplied with.
In addition, characteristics of the present invention are, after above-mentioned scolder contact end time delay, described feeder makes welding wire move and the solder line identical distance of charging length that is shaped in earlier stage, thereby with the step of wire melting on lead frame, this step comprises: transmission/reception solder line be shaped the in earlier stage step of charging length data of charging rate/solder line that is shaped in earlier stage; According to described solder line charging rate/solder line charging length data that is shaped in earlier stage that is shaped in earlier stage, drive or stop the step of the charging motor of feeding machine.
In addition, characteristics of the present invention are, the feeder of above-mentioned feeding machine stops to be shaped in earlier stage after identical time time delay with solder line, feeder makes welding wire move and the identical length of scolder charging length, with with the step of wire melting on lead frame, this step comprises: be shaped the in earlier stage step of delayed data of transmission/reception solder line; According to the described solder line delayed data that is shaped in earlier stage, stop the step of the charging motor of feeding machine; The step of transmission/reception solder line welding charging rate/solder line welding morphological data; And, drive or stop the X of feeding machine, the step of Y-axis movable workbench motor according to described solder line welding charging rate/solder line welding morphological data.
In addition, characteristics of the present invention are, after the feeder of above-mentioned feeding machine stops the time identical with the shaping delay of solder line later stage, feeder makes welding wire move and the identical length of solder line later stage shaping charging length, and the step of wire melting on lead frame comprised: the step of transmission/reception solder line later stage shaping delayed data; According to described solder line later stage shaping delayed data, stop the step of mobile motor of X, the Y-axis workbench of feeding machine; The step of transmission/reception solder line later stage shaping charging rate/solder line later stage shaping charging length data; According to solder line later stage shaping charging rate/solder line later stage shaping charging length data, drive or stop the step of the charging motor of feeding machine.
As mentioned above, according to solder printing type die bonding method of the present invention, can control the feeder of supplying with welding wire, obtain required scolder form, and utilize the scolder form that the chip of multiple size is carried out operation, simultaneously, can stablize solder thickness, solve because the institute that solder thickness causes unusually defective in quality (that space, inclination, scolder cover is bad, X/Y change in location, angle variation etc.) produces high-quality product.
Description of drawings
Fig. 1 and Fig. 2 are the schematic diagrames of scolder spot welding state.
Fig. 3 is the sequential schematic of existing scolder spot welding.
Fig. 4 is the view that occurs the space in the existing method.
Fig. 5 is the view that occurs inclination and scolder polar distribution of field poor distribution in the existing method.
Fig. 6 is the flow chart of existing scolder spot welding.
Fig. 7 is the control flow chart of existing scolder spot welding.
Fig. 8 and Fig. 9 are the schematic diagrames according to solder printing type die bonding method of the present invention.
Figure 10 is the sequential schematic according to solder printing type die bonding method of the present invention.
Figure 11 is the flow chart according to solder printing type die bonding method of the present invention.
Figure 12 is the control flow chart according to solder printing type die bonding method of the present invention.
Reference numeral
2: ozzle, 3: welding wire, 4: lead frame, 5: tube core.
The specific embodiment
With reference to the accompanying drawings solder printing type die bonding method of the present invention is described in more details.In explanation the time of the present invention, when specifying that some related known technology or structure are carried out may be obscured the technology of the present invention main idea, will save its detailed description.In addition, the term that uses below considers function of the present invention and defines, can be according to client, operator or user's intention or custom and different, and the setting of for example relevant charging length, time delay etc.Therefore, the definition of term should be understood according to the whole content of this specification.
The identical in the accompanying drawings identical part of Reference numeral representative.
Fig. 8 and Fig. 9 are the schematic diagrames of solder printing type tube core welding manner of the present invention, Figure 10 is the sequential schematic of solder printing type tube core welding manner of the present invention, Figure 11 is the flow chart of solder printing type die bonding method of the present invention, and Figure 12 is the control flow chart of solder printing type die bonding method of the present invention.
Fig. 8 to Figure 12 illustrates according to solder printing type die bonding method of the present invention, its by solder printing technology (or claim scolder scribble technology) with welding wire 3 fusings and brush into wire or predetermined pattern form after, again chip (not diagram) is bonded to (with reference to Fig. 8 and Fig. 9) on the lead frame 4.
In addition, also illustrate by ozzle 2 and will drop to the lead frame 4 that is used to be provided with tube core with the welding wire 3 that preseting length is supplied with, by contacting with lead frame 4, welding wire 3 is subjected to being delivered to the heat of lead frame 4 and melts, at this moment, by control device charging motor and X, Y-axis movable workbench motor are carried out precision control, on lead frame 4, to form the scolder (with reference to Figure 10) of wire or predetermined pattern shape.
Here, Figure 11 and Figure 12 illustrate the flow chart and the control flow chart of solder printing type tube core welding of the present invention, solder printing type tube core welding process of the present invention starts charging motor (not diagram) under the static state of X, Y-axis workbench, begin by ozzle 2 welding wire 3 to be descended.Then, in the moment that welding wire 3 contacts with lead frame 4, feeder (not having diagram) is stopped and the scolder contact identical time of time delay, after scolder contact end time delay, feeder starting is so that welding wire moves and the solder line identical length of charging length that is shaped in earlier stage, and welding wire 3 is melted on the lead frame 4, then, stop to be shaped in earlier stage after identical time time delay at the feeder of feeding machine with solder line, the feeder starting also makes welding wire move and the identical length of scolder charging length, welding wire 3 is melted on the lead frame 4, and then, the feeder of feeding machine stops to be shaped the identical time of delay with the solder line later stage.Then, the feeder starting is so that welding wire moves and the identical length of solder line later stage shaping charging length, welding wire 3 is melted on the lead frame 4, the feeder of feeding machine stops with after solder fusing finishes identical time time delay, the reverse rotation of charging motor retreats the identical length of length so that welding wire retreats with scolder, thereby welding wire 3 is kept in the center.
If above-mentioned scolder charging length data is invalid, will in the time of the X of feeding machine, Y-axis movable workbench machine operation, supply with welding wire.
Solder printing type tube core welding control flow chart of the present invention below with reference to shown in Figure 12 is described in more details.At first, feeding machine is positioned at the charging initial point (S101) of X, Y, Z coordinate system.Then, transmission/reception starting position data (S102).According to these starting position data, the X of feeding machine, Y, Z movable workbench motor-driven feeding machine move to supplies with position (S103).After moving to described supply position, the X of feeding machine, Y, Z movable workbench motor stop (S104).Send feeder commencing signal (S105) then.Drive the charging motor (S106) of feeding machine according to this feeder commencing signal.Then, the initial contact length data of transmission/reception scolder (S107).According to the initial contact length data of this scolder, welding wire is touched (S108) on the manipulating object.Then, transmission/reception scolder contact delay time data (S109).According to this scolder contact delay time data, make the charging motor of feeding machine stop (S110) running.Then, transmission/reception solder line charging rate/solder line charging length data (S111) that is shaped in earlier stage that is shaped in earlier stage.According to this solder line charging rate/solder line charging length data that is shaped in earlier stage that is shaped in earlier stage, drive charging motor (S112) running of feeding machine.Then, the charging motor of feeding machine stops (S113) running.Then, the transmission/reception solder line delay time data (S114) that is shaped in earlier stage.According to this solder line delay time data that is shaped in earlier stage, the charging motor of feeding machine stops (S115).Then, transmission/reception solder line welding charging rate/solder line welding charging morphological data (S116).According to this solder line welding charging rate/solder line welding charging morphological data, drive X, the Y movable workbench motor (S117) of feeding machine.Then, the X of feeding machine, Y movable workbench motor stop (S118) running.Transmission/reception solder line later stage shaping delay time data (S119).According to solder line later stage shaping delay time data, stop the running of the charging motor (S120) of feeding machine.Then, transmission/reception solder line later stage shaping charging rate/solder line later stage shaping charging length data (S121).According to solder line later stage shaping charging rate/solder line later stage shaping charging length data, drive charging motor (S122) running of feeding machine.Then, the charging motor of feeding machine stops (S123).Transmission/reception solder fusing finishes delay time data (S124).Finish delay time data according to solder fusing, stop the charging motor (S125) of feeding machine.Transmission/reception scolder retreats length data commencing signal (S126).Retreat the length data commencing signal according to scolder, drive charging motor (S127) counter-rotating of feeding machine.Then, transmission/reception scolder retreats length data end signal (S128).Retreat the length data end signal according to this scolder, the charging motor (S129) of feeding machine shuts down.Then, transmission/reception beginning data (S130).According to this commencing signal, drive X, Y, the Z movable workbench motor (S131) of feeding machine.Like this, repeat to make that feeding machine is in the circulation of the charging initial point in X, Y, the Z coordinate system.
Shown in solid line among Figure 12 and dotted line, by solder printing type tube core welded condition control flow, utilize the sequencing control device that charging motor and X, Y-axis movable workbench motor are carried out precision control, thereby a kind of solder printing type die bonding method that can produce high-quality product is provided.
Therefore, solder printing type die bonding method of the present invention can be made required solder shape, and the chip of multiple size is carried out operation by these scolder forms, and can stablize solder thickness, solve because the several quality problems that solder thickness causes unusually (that space, inclination, scolder cover is bad, X/Y change in location, angle variation etc.), thereby can produce high-quality product.
More than, by preferred implementation the present invention is had been described in detail, but the present invention is not limited thereto, those skilled in the art can carry out multiple modification, replacement and adjustment to described embodiment in the category that does not break away from the technology of the present invention thought.Therefore, rights protection scope of the present invention should contain the embodiment of all modification that belong to the technology of the present invention thought range, replacement or adjustment.
Claims (5)
1. a solder printing type die bonding method is characterized in that, this die bonding method may further comprise the steps:
Under the static state of X, Y-axis workbench, start the charging motor, the step that welding wire is descended by ozzle;
In the moment that described welding wire contacts with lead frame, make feeder stop to contact the step of identical time of time delay with scolder;
After described scolder contact end time delay, the solder line shape of Xing Chenging or other predetermined solder shape drive X, Y-axis workbench simultaneously as required, at this moment, described feeder makes welding wire move and the solder line identical length of charging length that is shaped in earlier stage, and with the step of wire melting on described lead frame;
Stop to be shaped in earlier stage after identical time time delay with solder line at the described feeder of feeding machine, described feeder makes welding wire move and the identical length of scolder charging length, and with the step of wire melting on described lead frame;
The described feeder of feeding machine stops to be shaped after identical time time delay with the solder line later stage, and described feeder makes welding wire move and the identical length of solder line later stage shaping charging length, and with the step of wire melting on described lead frame; And
The described feeder of feeding machine stops with after solder fusing finishes identical time time delay, and the reverse rotation of described charging motor retreats the identical length of length so that welding wire retreats with scolder, thereby makes the step that welding wire is kept in the center;
Wherein, the key of this die bonding method is, when melting solder, according to the solder line shape of scolder needs formation or predetermined scolder pattern form, drives described X, Y-axis movable workbench.
2. solder printing type die bonding method according to claim 1 is characterized in that, if described scolder charging length data is invalid, then supplies with welding wire when the X of described feeding machine, Y-axis movable workbench motor rotation.
3. solder printing type die bonding method according to claim 1, it is characterized in that, after the contact of described scolder finished time delay, described feeder made welding wire move and the solder line identical length of charging length that is shaped in earlier stage, and the step of wire melting on described lead frame comprised:
Transmission/reception solder line be shaped the in earlier stage step of charging length data of charging rate/solder line that is shaped in earlier stage;
And, drive or stop the step of the charging motor of described feeding machine according to described solder line charging rate/solder line charging length data that is shaped in earlier stage that is shaped in earlier stage.
4. solder printing type die bonding method according to claim 1, it is characterized in that, the feeder of described feeding machine stops to be shaped in earlier stage after identical time time delay with solder line, described feeder moves and the identical length of scolder charging length, and the step of wire melting on described lead frame comprised:
Be shaped the in earlier stage step of delay time data of transmission/reception solder line;
According to the described solder line delay time data that is shaped in earlier stage, stop the step of the charging motor of described feeding machine;
The step of transmission/reception solder line welding charging rate/solder line welding morphological data;
According to described solder line welding charging rate/solder line welding morphological data, drive or stop the X of described feeding machine, the step of Y-axis movable workbench motor.
5. solder printing type die bonding method according to claim 1, it is characterized in that, the feeder of described feeding machine stops to be shaped after identical time time delay with the solder line later stage, described feeder makes welding wire move and the identical length of solder line later stage shaping charging length, and the step of wire melting on described lead frame comprised:
The step of transmission/reception solder line later stage shaping delay time data;
According to described solder line later stage shaping delay time data, stop the X of described feeding machine, the step of Y-axis movable workbench motor;
The step of transmission/reception solder line later stage shaping charging rate/solder line later stage shaping charging length data;
According to described solder line later stage shaping charging rate/solder line later stage shaping charging length data, drive or stop the step of the charging motor of described feeding machine.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2009-0043499 | 2009-05-19 | ||
| KR1020090043499A KR100916609B1 (en) | 2009-05-19 | 2009-05-19 | Die bonding method using solder writing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101890548A true CN101890548A (en) | 2010-11-24 |
| CN101890548B CN101890548B (en) | 2013-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101741332A Expired - Fee Related CN101890548B (en) | 2009-05-19 | 2010-05-13 | Solder printing type die bonding method |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100916609B1 (en) |
| CN (1) | CN101890548B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108381065A (en) * | 2018-01-30 | 2018-08-10 | 福建聚云科技股份有限公司 | A kind of electronic device printing equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001176893A (en) * | 1999-12-21 | 2001-06-29 | Nec Machinery Corp | Die bonding |
| JP2007311653A (en) * | 2006-05-19 | 2007-11-29 | Canon Machinery Inc | Solder coating method, solder coating unit, and die bonder |
| JP2007335478A (en) * | 2006-06-13 | 2007-12-27 | Matsushita Electric Ind Co Ltd | Solder supply apparatus and method of manufacturing semiconductor device using the same |
| JP2008192964A (en) * | 2007-02-07 | 2008-08-21 | Denso Corp | Mounting method of semiconductor chip |
-
2009
- 2009-05-19 KR KR1020090043499A patent/KR100916609B1/en active IP Right Grant
-
2010
- 2010-05-13 CN CN2010101741332A patent/CN101890548B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001176893A (en) * | 1999-12-21 | 2001-06-29 | Nec Machinery Corp | Die bonding |
| JP2007311653A (en) * | 2006-05-19 | 2007-11-29 | Canon Machinery Inc | Solder coating method, solder coating unit, and die bonder |
| JP2007335478A (en) * | 2006-06-13 | 2007-12-27 | Matsushita Electric Ind Co Ltd | Solder supply apparatus and method of manufacturing semiconductor device using the same |
| JP2008192964A (en) * | 2007-02-07 | 2008-08-21 | Denso Corp | Mounting method of semiconductor chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108381065A (en) * | 2018-01-30 | 2018-08-10 | 福建聚云科技股份有限公司 | A kind of electronic device printing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101890548B (en) | 2013-03-27 |
| KR100916609B1 (en) | 2009-09-14 |
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