CN101889194B - Non-destructive inspection using laser- ultrasound and infrared thermography - Google Patents
Non-destructive inspection using laser- ultrasound and infrared thermography Download PDFInfo
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- CN101889194B CN101889194B CN200780101871.0A CN200780101871A CN101889194B CN 101889194 B CN101889194 B CN 101889194B CN 200780101871 A CN200780101871 A CN 200780101871A CN 101889194 B CN101889194 B CN 101889194B
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- G01N21/84—Systems specially adapted for particular applications
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- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/228—Details, e.g. general constructional or apparatus details related to high temperature conditions
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- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
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Abstract
An inspection system (200) is provided to examine internal structures of a target material (216). This inspection system includes a generation laser (210), an ultrasonic detection system (220, 226, 228, 230), a thermal imaging system (234), and a processor/control module (232). The generation laser (210) produces a pulsed laser beam (212) that is operable to induce ultrasonic displacements and thermal transients at the target material (216). The ultrasonic detection system detects ultrasonic surface displacements at the target material (216). The thermal imaging system (234) detects thermal transients at the target material (216). The processor (232) analyzes both detected ultrasonic displacements and thermal imagery of the target material (216) to yield information about the target material's internal structure. The target material (216) preferably comprises composite material.
Description
Technical field
The present invention relates to non-destructive testing, and more particularly, relate to and use thermal imaging and ultrasonic tesint to inspect the inner structure of (inspect) material.
Background technology
In recent years, the use of senior composite structure obtains huge growth in aviation, automobile and much other business.Although compound substance provides great improvement at aspect of performance, after manufacturing process neutralization materials is used in manufactured goods, they need strict quality control process.Particularly, nondestructive evaluation (NDE) method must be evaluated the structural intergrity of compound substance.Suitable evaluation requires to have the inclusion, layering and the porous ability that detect at nearly surf zone and deep layer interior zone.
The whole bag of tricks and equipment have been proposed the structural intergrity for evaluating composite structure.A solution is used supersonic source in target material, to generate ultrasonic surface displacements.Measure subsequently and analyze ultrasonic surface displacements.Ultrasonic source can be scopodromic pulse generate laser beam (pulsedgeneration laser beam).From the illuminated with laser light ultrasonic surface displacements of independent detection laser, and by surface of the work scattering.Subsequently, collect optical device and collect the laser energy of scattering.Collect optical device and be coupled to interferometer or other device, and the data of the structural intergrity of relevant composite structure can obtain by the analysis of scattering laser energy.It is very effective to inspecting of member during manufacturing process that laser-ultrasound has proved.
Generally, lasing light emitter produces sound by thermal expansion in surperficial partial points (localized spot), and detects surface displacement or speed with the exploring laser light bundle of interferometer coupling.The thermal expansion causing due to the absorption of generation laser has produced the displacement by the demodulation of laser-ultrasound detection system, causes the pulse in the time that laser ultrasound signal starts.This echo is commonly referred to surface echo.Surface echo can be covered any echo that near the defect of sample surface produces.The duration of surface echo is depended on the frequency bandwidth that generates laser pulse duration and detection system.Generally, while using CO2 generation laser instrument and confocal Fabry-Perot to detect, surface echo may continue up to several microseconds.Therefore, at this time durations, any defect that produces echo may be covered.For this reason, laser-ultrasound is inspected deep layer inherent vice sensitive, more insensitive near surface flaw.
Another kind of NDE method is moment infrared (IR) thermographic, because it is to being deeper than the insensitive reason of defect of several millimeters in polymer matrix member (polymer-matrix parts), it takes inspecting of polymer matrix compound into account not yet in effectly.
Summary of the invention
Embodiments of the invention relate in fact and to solve definite demand and the system and method for other demand above.Embodiments of the invention have also been described in instructions below and claim.From specification, drawings and the claims, can understand advantage and the characteristic of embodiments of the invention.
Ultrasonic and the thermal imaging of embodiments of the invention combination laser is to solve in fact definite demand and other demand above.Laser-ultrasound generation technique can be used for providing moment thermal source.Therefore, infrared (IR) thermographic can combine to provide the more complete non-destructive inspection to polymer matrix member (, compound substance) with laser-ultrasound moment.
An embodiment provides inspection system to check nearly surface and the deep layer inner structure of target material.This inspection system comprises generation laser instrument, ultrasonic testing system, thermal imaging system and processor/control module.Generate laser instrument and produce pulse laser beam, this laser beam is operationally brought out ultrasound displacement and hot transient state at target material.Ultrasonic testing system detects the ultrasonic surface displacements at target material.Thermal imaging system detects the hot transient state at target material.The ultrasound displacement detecting and the thermal imaging of processor/controller evaluating objects material, and make it relevant to draw about the nearly surface of target material and the information of deep layer inner structure.
Another embodiment provides the method for the inner structure of inspecting target.The method relates to ultrasound displacement and the hot transient state of bringing out at target material.These ultrasound displacements and hot transient state can be used individual pulse to generate laser beam and produce.Ultrasound displacement and hot transient state that the generation laser beam that can determination and analysis aims at the mark surperficial causes.Generate and analyze and can relate to the synchronous and relevant to draw the more complete understanding about the structure of target of ultrasound information and thermal information.Analyze ultrasound displacement and for example can draw the information about deep layer inner structure in compound substance.Thermal imaging can draw the information about the nearly interior surface structure of compound substance.By the better understanding of relevant with the thermal information ultrasound information general internal structure that obtains target.
But another embodiment provides compound substance inspection system.This compound substance inspection system comprises that generation laser instrument is with production burst laser beam, and this laser beam is brought out in the ultrasound displacement of compound substance and hot transient state.Ultrasonic testing system is provided for detecting the ultrasonic surface displacements at compound substance.Thermal imaging system is provided for detecting the hot transient state at compound substance.Control module can be mated the collection of thermal imaging frame and be generated the pulse repetition rate of laser beam.Processor be provided for analyzing and testing to ultrasound displacement and thermal imaging and make it relevant to draw the information about the general internal structure of target.
Brief description of the drawings
For a more complete understanding of the present invention and advantage, now in connection with accompanying drawing, with reference to explanation below, wherein similarly label is indicated similar characteristic, and wherein:
Fig. 1 illustrates according to embodiments of the invention, uses generation laser beam and detection laser beam to generate and detection laser ultrasound displacement and hot transient state;
Fig. 2 provides the block diagram of the basic module that laser-ultrasound/thermal imaging system is shown;
Fig. 3 provides according to embodiments of the invention, block diagram or the functional diagram of laser-ultrasound and IR imaging system;
Fig. 4 describes according to embodiments of the invention, for collecting the processing about the IR image of the information of the nearly interior surface structure of target;
Fig. 5 illustrates according to embodiments of the invention, by the infrared result that on the polymer sheet with flat-bottom hole, scanning impulse CO2 laser beam obtains;
Fig. 6 provides the logical flow chart according to one or more embodiment of the present invention; And
Fig. 7 illustrates according to embodiments of the invention, operationally generates the block diagram of the generation laser instrument of ultrasound displacement and hot transient state.
Embodiment
The preferred embodiments of the present invention illustrate in the drawings, and similarly label is used in reference to the class Sihe corresponding part of each accompanying drawing.
Embodiments of the invention combination laser is ultrasonic to be inspected to provide such as, but not limited to the more intact of target material such as polymer matrix members (, compound substance) with thermal imaging.An embodiment provides the inspection system of the inner structure that operationally checks target material.This inspection system comprises generation laser instrument, ultrasonic testing system, thermal imaging system and processor/control module.Generate laser instrument and produce pulse laser beam, this laser beam is operationally brought out ultrasound displacement and hot transient state at target material.Ultrasonic testing system detects the ultrasonic surface displacements at target material.Thermal imaging system detects the hot transient state at target material.The ultrasound displacement of the target material that processor analyzing and testing arrives and thermal imaging, and make it relevant to draw the information about the general internal structure of target material.Embodiments of the invention are provided for realizing inspects speed, improved system reliability and lower running cost faster.
Fig. 1 illustrates according to embodiments of the invention, uses generation laser beam and detection laser beam to generate and detection laser ultrasound displacement and hot transient state.Laser beam 102 generates ultrasonic and hot transient state, and (detection) laser beam 104 of throwing light on detects ultrasonic in the target 106 such as compound substance such as in test.As shown in the figure, these laser can coaxially be applied to target 106.Generate laser beam 102 and cause thermal-elastic expansion 112 in target 106, this causes forming ultrasonic distortion or ultrasound wave 108.Distortion or ultrasound wave 108 are propagated in target 106, and modulation, scattering and reflection detection laser beam 104 to be to produce the phase modulated light 110 of guiding wide 106, and phase modulated light is through collecting and process the information of inner structure to obtain description target 106.
Fig. 2 provides band to be useful on the block diagram of the basic module of carrying out ultrasonic laser testing and infrared (IR) thermographic.Generate laser instrument 210 and produce generation laser beam 212, and this light beam is directed to target 216 by optical accessories 214.As shown in the figure, optical accessories 214 comprises along scanning or tests plane (scan or test plan) 218 and move scanner or other similar means of laser beam 212.Optical accessories 214 can comprise vision camera, depth camera, IR camera, range detector (range detectors), arrowband camera or other similar optical sensor well known to those skilled in the art.The each requirement of these optical sensors calibrated before execution is inspected.The ability of the information that the various sensors of this calibration verification system integration are collected.Generate laser instrument 210 and be created in ultrasound wave 108 and the hot transient state in target 216.The thermal imagery of thermal imaging system 232 target acquisitions.These images are treated to draw the information about the nearly interior surface structure of target 216.This process is with reference to Fig. 3 and below description in further detail.
The thermal-elastic expansion 112 that produces ultrasound wave 108 and hot transient state is because compound substance absorbs the reason that generates laser beam.Compound substance 216 easily absorbs generation laser beam 212 and can not corrode or decompose.More high-power generation laser not necessarily overcomes the preferred of signal to noise ratio (S/N ratio) (SNR) problem, because these laser can cause the surperficial material corrosion of workpiece, thereby may damage assembly.In other embodiments, the material of apparent test and determine, some corrosion can be acceptable, so that the SNR of the signal that increase detects.Generate laser beam 212 and there is suitable duration of pulse, power and frequency to bring out ultrasonic surface deformation and suitable hot transient state.For example, laterally excite atmospheric pressure (TEA) CO
2laser instrument can produce 10.6 micron wave length light beams of 100 Nanosecond Pulse Widths.The power of laser must be enough to carry for example 0.25 joule of pulse to target, and these can be with 100 watts of laser of 400Hz pulse recurrence rate operation.Generate laser beam 212 and be absorbed in target surface as heat, cause thus thermal-elastic expansion and corrosion-free.
The detection laser 220 operating in pulse mode or CW pattern is not brought out ultrasound displacement.For example, can use Nd:YAG laser instrument.The power of this laser instrument must be enough to carry for example 100 millijoule 100 microsecond pulses, and this can need one kilowatt of (KW) laser.Detection laser 220 generates detection laser beam 222.Detection laser 220 comprises filtering mechanism 224 or is optically coupled to filtering mechanism 224 to remove noise from detection laser beam 224.Optical accessories 214 is directed to detection laser beam 224 on the surface of the compound substance 216 of scattering and/or reflection detection laser beam 224.Result phase modulated light is collected by collecting optical device 226.As shown here, the detection laser of scattering and/or reflection is back propagated by optical accessories 214.Optional optical processor 228 and interferometer 230 are processed phase modulated light to produce the signal of the information that comprises the ultrasound displacement that is illustrated in compound substance 216 surfaces.Data processing and control system 232 are coordinated the operation of laser ultrasonic system assembly and thermal imaging assembly to draw the information about the inner structure of target.
Data processing and control system 232 can be single processing apparatus or multiple processing apparatus.This type of processing apparatus can be any device of microprocessor, microcontroller, digital signal processor, microcomputer, central processing unit, field programmable gate array, programmable logic device (PLD), state machine, logical circuit, mimic channel, digital circuit and/or the manipulation of the operational order based on storing in storer signal (simulation and/or numeral).Storer can be single memory part or multiple memory device.This type of memory device can be any device of ROM (read-only memory), random access memory, volatile memory, nonvolatile memory, static memory, dynamic storage, flash memory, cache memory and/or storing digital information.Memory stores is corresponding to the operational order of at least some steps and/or function as will be shown, and data processing and control system 232 are carried out these instructions.
Fig. 3 provides according to embodiments of the invention, block diagram or the functional diagram of laser-ultrasound and IR imaging system 300.Laser-ultrasound and IR imaging system 300 comprise generation laser instrument 302, control module 304, laser-ultrasound detection system 306, thermal imaging system 308, processing module 310 and optical system 312.Generate laser instrument 302 and produce generation laser beam, this laser beam is directed to by the target 314 forming such as, but not limited to materials such as compound substances by optical system 312, wherein, has brought out as mentioned above ultrasound displacement.Laser-ultrasound detection system 306 generates detection laser beam, and this laser beam is directed to target 314 by optical system 312, wherein, causes detection laser beam by phase-modulation at the ultrasound displacement on target 314 surfaces.Detection laser beam is by the surface scattering of target.Optical system 312 is also collected the phase modulated light of this scattering.Laser-ultrasound detection system 306 is processed the phase modulated light of collecting to form the signal comprising about the information of ultrasound displacement.Signal is provided to processing module 310.
Generating laser instrument 302 is also the hot transient state of thermal imaging measurement generation of target 314.Gather thermal imaging or the frame of target 314 interior hot transient states such as IR camera 308 thermal imaging systems such as grade.For each generation laser pulse gathers image.Other image can gather in the schedule time after each production burst.The thermographic of the treated complete area of being inspected with generation laser-ultrasound of these different images is inspected.
Thermographic result supplemental laser ultrasonic experiments, and provide in this way more complete and inspect more reliably.Moment IR thermographic itself is not provided for effectively inspecting composite component (composite parts) such as polymer matrix compound.Moment IR thermographic is only sensitive to the top surface of composite component, and this is because it is low heat conductivity on polymer matrix.Therefore, IR thermographic can not be used for identifying to detect and identify the deep zone defect in polymer matrix or composite component.
The thermal imaging that the nearly surface that laser-ultrasound and IR imaging system 300 comprise to be provided the laser-ultrasound of the inner inspection system of deep layer and solve target 314 is inspected.This has solved with laser-ultrasound and has inspected the problem that may be associated to the insensitive actual conditions of near surface flaw.By combining this two kinds of technology, may realize the more complete non-destructive inspection that compares composite component or material with possible inspecting in the time only using laser-ultrasound or IR thermographic.
Fig. 4 describes the processing of IR image to assemble the information about the inner structure of target 314.Thermal imagery can be assembled each generation after laser beam has been sent, or schedule time gathering after generation laser beam has been sent.Send or when transponder pulse, will scan generation laser beam along scanning pattern 316 to target 314A generating laser beam.Generate that the point 318 that is directed to of laser beam is each will have hot transient state 320.By repeating to illuminate target 314 by generation laser beam, and collect many thermal imagerys, target 314N illustrates the scanning in path 316.These hot transient states can be used for determining the thermal property being associated with target material.For example, by analyzing the thermal imaging at a period of time internal object, can determine the hot wall thickness (thermal wall thickness) of quantification.This can synthetic visual pattern form as shown in Figure 5 manifest.This analysis for the treatment of scheme infrared image (more particularly, analyzing time dependent temperature variation in different images).From all IR picture construction relative temperature change curves of each point of IR camera.
Another embodiment can provide scans I R thermographic technology to inspect the near surface flaw of material.This allows the peak heat load of limited target, and this is because only heat a fraction of target in any one time.This type systematic uses scanned laser to bring out hot transient state.
Fig. 5 illustrates the infrared result obtaining by the upper scanning impulse CO2 laser beam of the polymer sheet with flat-bottom hole (polymer plate).Defect in target 502 is clearly presented in gray scale image 500.Image 500 comprises each point 504 in material 502.This image can use such as being entitled as the formation method generation described in the United States Patent (USP) 6367969 of " synthesized reference thermal imaging method " (Synthetic reference thermalimaging method), for all objects, this patent is incorporated herein by reference.IR moment temperature-sensitive imaging analysis scheme can be used for the thickness of measurement target exactly, and provides the visual encoding of instruction its tranverse sectional thickness on the desired zone of target to show.
Substantially, in surperficial temperature-time (T-t) response analysis of Fast Heating target, the IR moment thermographic of flex point uses preferably and observes acquisition from " front end " IR camera.This flex point early occurs in T-t response, and substantially irrelevant with the lateral heat loss structure of missing a chance.(this type of consideration can be certain relevant, and for example, processing when metal, due to the high thermal conductivity of metal, the thermal response of metal target is quite fast, and therefore, the time that can be used for obtaining dsc data measurement result is conventionally very short).Flex point is extracted from the dsc data of continuous IR camera image frame collection in scheduled time slot.Preferably, the thickness estimation of the target based in assessment, this period is at least slightly longer than the expection characteristic time.
The hot reference data of each (x, y) location of pixels of imageable target is calculated, and is used to subsequently each pixel to determine time dependent contrast.Computer system control imaging system, record and analyzing through the surface temperature data of IR collected by camera, and the image (color or graypattern-keyed image) taking colour or grey scale pattern as feature corresponding to target thickness is provided exactly.This information can merge to produce with laser-ultrasound data the more detailed intra pictures of target.
The collection of surface temperature data generates laser and starts with the part surface of illuminating and add thermal target by sending.Subsequently, in a period of time after each generation laser pulse, record thermal map picture frame, and record image be used to form temperature-time (T-t) history, as the history being associated with the hot transient state 320 of Fig. 4.
Subsequently, for the each pixel in the picture frame gathering is carried out the Heat Flow Analysis of T-t history, to determine the thickness of target in each resolution element position.Conventionally, the instantaneous heat flow analysis of the solid portion by target requires " pulse " of determining heat energy to penetrate target at first surface, from apparent surface's reflection with return to the required characteristic time of first surface.Due to the distance dependent between this characteristic time and two surfaces, therefore, it can be used for determining the thickness between two surfaces of required point target.For each (x, y) location of pixels corresponding with each resolution element of target surface determined contrast and time curve.
Fig. 6 provides according to embodiments of the invention, describes the logical flow chart of inspecting such as, but not limited to the method for the materials such as compound substance.Operation 600 application Laser Ultrasonic Technique and thermal imaging or infrared temperature-sensitive imaging technique are to inspect and check the inner structure of the material that will test.Operation 600 starts in step 602, in this step, brings out ultrasound displacement and hot transient state in target material.These all can use the generation laser beam being associated with laser ultrasonic system to carry out.This generates laser beam in the time being directed to target material surperficial, generates as ultrasound displacement and hot transient state as described in reference to Fig. 1 and 4.In step 604, detect ultrasound displacement and hot transient state.Ultrasound displacement can use such as, but not limited to ultrasonic systems such as laser ultrasonic system and detect.Hot transient state can detect by the thermal imaging that gathers target material.As mentioned above, hot transient state and ultrasonic generation can be synchronous or relevant.The analysis result that this Information Availability is carried out in step 606 in coupling.In step 606, the ultrasound displacement that analyzing and testing arrives and thermal imaging.The ultrasound displacement detecting is by the information providing about the deep layer inner structure of target material, and the thermal imaging of hot transient state can be treated to determine the nearly surface structure in target material.Because ultrasound displacement and hot transient state are started by same generation laser beam, therefore, this Information Availability is in relevant with thermal imaging by the ultrasound displacement detecting like a cork.This allows the nearly surface of realize target material and the detailed Integrated Understanding of deep layer inner structure in step 608.
Relevant can partly being undertaken by the thermal imagery application time stamp to gathered.In addition the speed of thermal imaging acquisition frame, can be mated with the pulse repetition rate that generates laser beam.Thermographic allows for other expression of target material and determines composograph.This can relate to by analyzing thermal imaging determines the hot thickness of quantification arriving.The variation that quantizes hot wall thickness can be indicated the surprisingly near surface flaw of this point of variation at generating capacity heat-transmission wall thickness in target material.This information can show to manifest by contrast, wherein, and uncontinuity or the variation of the unexpected variation indicatrix heat-transmission wall thickness of contrast.
Generating laser beam can be middle infrared ultrasonic generation laser.This type of generates laser provides the compact middle infrared laser of (compact) high-average power to generate to realize ultrasonic and hot transient state.As shown in Figure 7, generate laser instrument 700 and comprise the pumping shaven head (pump laser head) 702 wherein with fibre laser, be coupled to the fiber that generates laser head 704.Use fibre laser to allow laser pump position away from generating laser head 704.Pumping shaven head can be coupled to and generate laser head 704 through optical fiber 702.
Pumping shaven head 702 is positioned at away from generating laser beam delivery head 704 position several meters away, this allows the infrared generation laser head in compact centre, and this laser head has reduced for delivery of generating total service load and the stability requirement of laser beam with the robot system of collection heat picture.Inspecting in head of robot system, only need installation kit to contain the compact and lightweight module of generation laser beam delivery head and IR camera.This allows to dispose the middle infrared laser source that uses less robot.Therefore, for the compound NDE in scene that uses portable laser ultrasonic system and IR thermographic system has created the new compound chance of inspecting.These schemes be entitled as " generating ultrasonic fibre laser " (FIBER LASER TO GENERATE ULTRASOUND) number _ _ _ _ _ U.S. Patent application in discuss, for all objects, this patent is incorporated herein by reference.
In a word, embodiments of the invention provide the inspection system of the inner structure that operationally checks target material.This inspection system comprises generation laser instrument, ultrasonic testing system, thermal imaging system and processor/control module.Generate laser instrument and produce pulse laser beam, this laser beam can operate to bring out ultrasound displacement and hot transient state at target material.Ultrasonic testing system detects the ultrasonic surface displacements at target material.Thermal imaging system detects the hot transient state at target material.Processor analyzing and testing to the ultrasound displacement of target material and thermal imaging to draw the information about the inner structure of target material.
The same just as skilled in the art will appreciate, term " in fact " or " approximately " provide the industry of its corresponding term to accept tolerance limit may use in this article time.This type of industry is accepted marginal range from lower than 1% to 20%, and corresponding to but be not limited to components values, integrated circuit technology variation, temperature variation, lifting time and/or thermonoise.As those skilled in the art by also understand, term " operationally coupling " comprises direct-coupling and the indirect coupling through another assembly, element, circuit or module may use in this article time, wherein, for indirect coupling, intermediary's assembly, element, circuit or module are not revised the information of signal and may be adjusted its levels of current, voltage level and/or power level.The same just as skilled in the art will appreciate, deduction coupling (inferred coupling) (, an element is coupled to another element by inferring (inference)) comprises the direct and indirect coupling of the use mode identical with " operationally coupling " between two elements.As those skilled in the art, by also understanding, term " favourable by comparison " represents may use in this article time relatively to provide required relation between two or more elements, project, signal etc.For example, be signal 1 while having than the larger amplitude of signal 2 in required relation, favourable relatively may be greater than when the amplitude of signal 2 or the amplitude of signal 2 are less than the amplitude of signal 1 and realize in the amplitude of signal 1.
Although the present invention describes in detail, should be understood that not departing from enclose claims definition spirit and scope in the situation that, can it be carried out different changes, substitutes and be changed.
Claims (15)
1. inspect an order calibration method, comprising:
Produce the generation laser beam of operationally bringing out ultrasound displacement and hot transient state in described target;
By generation laser beam being directed to the surface of described target, in described target, produce ultrasound displacement and hot transient state;
Detect the described ultrasound displacement in described target;
Gather the thermal imaging of described target to detect the hot transient state in described target;
Analyze the ultrasound displacement arriving in described target detection; And
The thermal imaging of analyzing described target draws the information about described target.
2. the method for claim 1, wherein said target comprises compound substance.
3. method as claimed in claim 2, also comprises:
By analyzing and testing to ultrasound displacement obtain the information about the deep layer inner structure of described compound substance;
Analyze and draw the information about the nearly interior surface structure of described compound substance in the thermal imaging of described compound substance;
By relevant the information of the described near interior surface structure of the information of the described deep layer inner structure about described compound substance and described compound substance.
4. the method for claim 1, also comprises
The step that gathers thermal imaging is mated with the pulse repetition rate of described generation laser beam.
5. the method for claim 1, wherein determines by analyzing in the thermal imaging of described target the hot wall thickness quantizing.
6. method as claimed in claim 5, the unexpected variation of the hot wall thickness of wherein said quantification indicated the defect in described unexpected variation place in described target.
7. the method for claim 1, also comprise the step of utilizing thermographic system, wherein thermographic system comprises IR moment temperature-sensitive imaging system, wherein said IR moment temperature-sensitive imaging system comprises IR thermal camera, described IR thermal camera operationally gathers the picture frame of the described target being illuminated by described generation laser beam, the picture frame of wherein said target comprises the array of pixel, and be assigned with the frame number corresponding to the elapsed time, wherein determine by analyzing the successive frame of thermal imaging the hot wall thickness quantizing.
8. the method for claim 1, wherein analyzes in the thermal imaging of described target and comprises infrared (IR) moment thermographic.
9. an inspection system of operationally inspecting the inner structure of target, comprising:
Generate laser instrument, operationally production burst laser beam, described laser beam is operationally brought out ultrasound displacement and hot transient state in described target;
Ultrasonic testing system, operationally detects the described ultrasonic surface displacements in described target;
Thermal imaging system, operationally detects the described hot transient state in described target;
Processor, operationally analyzes the ultrasound displacement that arrives in described target detection and the thermal imaging of described target, to draw the information about the described inner structure of described target.
10. inspection system as claimed in claim 9, wherein said ultrasonic testing system comprises:
Detection laser, operationally generates detection laser beam, and described laser beam operationally illuminates the described ultrasonic surface displacements in described target;
Collect optical device, carry out the light of phase-modulation for collecting the described detection laser beam of comfortable described target surface scattering by ultrasonic surface displacements;
Interferometer, processes described phase modulated light and generates at least one output signal; And
Processing unit, processes described at least one output signal, to obtain the data of the described ultrasonic surface displacements that is illustrated in described target.
11. inspection systems as claimed in claim 9, wherein said thermal imaging system comprises infrared (IR) moment temperature-sensitive imaging system.
12. inspection systems as claimed in claim 11, wherein said IR moment temperature-sensitive imaging system comprises the responsive camera of IR, the responsive camera of described IR operationally gathers the picture frame of the described target being illuminated by described generation laser beam.
13. inspection systems as claimed in claim 9, wherein said processor is suitable for relevant with described thermal imaging the described ultrasound displacement detecting.
14. inspection systems as claimed in claim 9, also comprise control module, and described control module is operationally mated the pulse repetition rate of the collection of thermal imaging frame and described generation laser beam.
15. inspection systems as claimed in claim 9, wherein said target comprises compound substance.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2007/025228 WO2009073014A1 (en) | 2007-12-06 | 2007-12-06 | Non-destructive inspection using laser- ultrasound and infrared thermography |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101889194A CN101889194A (en) | 2010-11-17 |
| CN101889194B true CN101889194B (en) | 2014-06-18 |
Family
ID=39327481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200780101871.0A Expired - Fee Related CN101889194B (en) | 2007-12-06 | 2007-12-06 | Non-destructive inspection using laser- ultrasound and infrared thermography |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP2217908A1 (en) |
| JP (1) | JP5307155B2 (en) |
| KR (1) | KR101380491B1 (en) |
| CN (1) | CN101889194B (en) |
| AU (1) | AU2007361989B2 (en) |
| BR (1) | BRPI0719944A2 (en) |
| CA (1) | CA2672378A1 (en) |
| IL (1) | IL199202A (en) |
| WO (1) | WO2009073014A1 (en) |
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- 2007-12-06 EP EP07867691A patent/EP2217908A1/en not_active Withdrawn
- 2007-12-06 CA CA002672378A patent/CA2672378A1/en not_active Abandoned
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- 2007-12-06 WO PCT/US2007/025228 patent/WO2009073014A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101380491B1 (en) | 2014-04-01 |
| AU2007361989B2 (en) | 2013-10-03 |
| IL199202A (en) | 2013-04-30 |
| KR20100099040A (en) | 2010-09-10 |
| EP2217908A1 (en) | 2010-08-18 |
| CN101889194A (en) | 2010-11-17 |
| BRPI0719944A2 (en) | 2014-06-10 |
| WO2009073014A1 (en) | 2009-06-11 |
| AU2007361989A1 (en) | 2009-06-11 |
| JP2011506927A (en) | 2011-03-03 |
| CA2672378A1 (en) | 2009-06-11 |
| JP5307155B2 (en) | 2013-10-02 |
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