CN101882562B - 半导体封装用导线接合装置及其方法 - Google Patents

半导体封装用导线接合装置及其方法 Download PDF

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CN101882562B
CN101882562B CN2009100508677A CN200910050867A CN101882562B CN 101882562 B CN101882562 B CN 101882562B CN 2009100508677 A CN2009100508677 A CN 2009100508677A CN 200910050867 A CN200910050867 A CN 200910050867A CN 101882562 B CN101882562 B CN 101882562B
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王德峻
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Ase Assembly & Test (shanghai) Ltd
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Abstract

本发明公开一种半导体封装用导线接合装置及其方法，所述接合装置包含一焊针、一电子点火杆、至少一气体供应管及一气体监测元件。所述焊针具有一供线孔，以输出一具反应活性的导线。所述电子点火杆邻接于所述焊针，以使所述焊针输出的导线的端部形成一焊球。所述至少一气体供应管具有一供气口朝向所述焊针的一导线成球位置或一导线焊接位置，以对所述焊针的导线成球位置或导线焊接位置提供一保护气体。所述气体监测元件邻接于所述焊针的供线孔，以监测所述焊针的供线孔附近的氧气浓度。

Description

半导体封装用导线接合装置及其方法
【技术领域】
本发明是有关于一种半导体封装用导线接合装置及其方法，特别是有关于一种具作业环境氧气监测功能的半导体封装用导线接合装置及其方法。
【背景技术】
在半导体封装构造制造过程中，打线接合(wire bonding)技术已广泛地应用于半导体芯片与封装基板或导线架之间的电性连接上。一般打线接合制造过程是以金线(gold wire)为主，但相较于金线，由于铜线(copper wire)具有低成本的优势且具有较佳的导电性、导热性及机械强度，因而铜制焊线的线径可设计得更细且散热效率较佳。然而，铜线最大的缺点在于铜金属本身容易与氧起氧化反应。特别是，当铜线处于高温打线环境下时，铜线表面极易发生严重的氧化问题，因而影响铜线与半导体芯片或基板的焊垫之间的结合可靠度。
为了解决上述技术问题，美国专利公开第2007/0251980号提出一种打线用减少氧化系统(Reduce Oxidation System for Wire Bonding)，其适用于具有反应活性的导线(如铜线)，其中一打线机台包含：一结合位置区，用以在打线过程中支撑一半导体装置，所述半导体装置包含一基板及一芯片；一焊针(capillary)，用以输出一具反应活性的导线(如铜线)；一电子火焰熄灭杆(electronic flame off wand)，用以在导线的端部形成焊球；一第一气体供应管，用以在导线(如铜线)形成焊球时，减少导线的氧化；以及，一第二气体供应管，具有一出口朝向所述结合位置区，所述第二气体供应管可以由所述结合位置区的上方提供一气体至所述结合位置区，以便在导线结合所述基板及芯片的过程中，减少导线的氧化。
虽然上述打线机台可利用所述第一及第二气体供应管提供气体，以覆盖处于高温环境下的导线并避免导线氧化，但是实际上作业常遇到的问题在于：若气体供应量太少，则导线可能氧化；若气体供应量太多，则可能过度浪费气体使用量。目前，操作人员大多通过依靠经验由远端调控气体控制阀门，以控制气体的单位时间流量，来达到一个可被接受的气体控制状态。然而，这种远端调控控制气体流量的方式无法反映实际打线位置的作业环境氧气(O2)浓度，因此仍无法达到即时精准调整控制气体用量的目的。
故，有必要提供一种改良的半导体封装用导线接合装置及其方法，以解决现有技术所存在的问题。
【发明内容】
本发明的主要目的在于提供一种半导体封装用导线接合装置及其方法，其中焊针的供线口附近邻接一气体监测元件，以精准监测焊针的供线口在导线成球或焊接期间的作业环境氧气(O2)实际浓度，进而有利于提高即时监控保护气体流量的监测精准度。
本发明的次要目的在于提供一种半导体封装用导线接合装置及其方法，其中气体监测元件能产生氧气浓度数值，因此可利用氧气浓度数值加以自动化即时控制保护气体的远端控制阀门，进而有利于达到自动化即时调整保护气体流量的目的。
为达成本发明的前述目的，本发明提供一种半导体封装用导线接合装置，包含：一焊针，具有一供线孔，以输出一具反应活性的导线；一电子点火杆，邻接于所述焊针，以使所述焊针输出的导线的端部形成一焊球；以及，至少一气体供应管，具有一供气口朝向所述焊针的一导线成球位置或一导线焊接位置，以对所述焊针的导线成球位置或导线焊接位置(即作业区)提供保护气体；其特征在于：所述接合装置另包含：一气体监测元件，邻接于所述焊针的供线孔，以监测所述焊针的供线孔附近的氧气浓度。
另一方面，本发明提供一种半导体封装用导线接合方法，包含步骤：提供一接合装置，包含一焊针、一电子点火杆及至少一气体供应管；由所述焊针的一供线孔输出一具反应活性的导线，利用所述电子点火杆使所述导线的端部在一导线成球位置形成一焊球，并在成球期间利用所述气体供应管的一供气口朝向所述导线成球位置提供保护气体；以及，移动所述焊针及其输出的导线至一导线焊接位置进行焊接，并在焊接期间利用所述气体供应管的供气口朝向所述导线焊接位置提供保护气体；其特征在于：所述接合装置另包含一气体监测元件，其邻接于所述焊针的供线孔，所述气体监测元件在成球及焊接期间监测所述焊针的供线孔附近的氧气浓度。
在本发明的一实施例中，所述的具反应活性的导线为铜线(Cu)、铝线(Al)、银线(Ag)、钯线(Pd)或其合金线材。
在本发明的一实施例中，所述气体监测元件的端部具有一氧气感应器(sensor)，其朝向所述焊针的供线孔。
在本发明的一实施例中，所述气体监测元件的端部具有一吸气口，其朝向所述焊针的供线孔，以将所述焊针的供线孔附近的气体吸取至一远端的氧气感应器。
在本发明的一实施例中，所述气体监测元件朝向所述焊针的供线孔所输出的导线的端部下方。
在本发明的一实施例中，所述气体监测元件在成球及焊接期间与所述焊针同步移动。
在本发明的一实施例中，所述至少一气体供应管包含一第一气体供应管及一第二气体供应管，两者分别朝向所述导线成球位置及所述导线焊接位置。
在本发明的一实施例中，所述保护气体包含氮(N2)、氩(Ar)或其组合。
在本发明的一实施例中，所述保护气体另混合有氢(H2)。
【附图说明】
图1是本发明第一实施例半导体封装用导线接合装置的示意图。
图2A、2B、2C及2D是本发明第一实施例半导体封装用导线接合方法的流程示意图。
图3是本发明第二实施例半导体封装用导线接合装置的示意图。
【具体实施方式】
为让本发明上述目的、特征及优点更明显易懂，下文特举本发明较佳实施例，并配合附图，作详细说明如下：
请参照图1及2A所示，本发明第一实施例的半导体封装用导线接合装置主要包含一焊针(capillary)1、一电子点火杆(spark rod)2、一第一气体供应管3、一第二气体供应管4及一气体监测元件(gas monitoring element)5，上述元件共同装设在所述接合装置的一可移动式的机构(未绘示)上，以在打线(wire bonding)期间同步移动。在本实施例中，所述焊针1是由耐热金属制成的中空微型针状元件，其具有一供线孔11，以输出一具反应活性的导线6，所述导线6优选为铜线(Cu)、铝线(Al)、银线(Ag)、钯线(Pd)或其合金线材。再者，所述电子点火杆2是邻接于所述焊针1，所述电子点火杆2可适时产生火花，使所述焊针1输出的导线6的端部形成一焊球61。所述电子点火杆2并可选择结合在所述第一气体供应管3上。
请再参照图1及2A所示，本发明第一实施例的第一气体供应管3也邻接于所述焊针1，且所述第一气体供应管3具有一第一供气口31，所述第一供气口31朝向所述焊针1的一导线成球位置，以对所述导线成球位置提供一第一保护气体32。所述导线成球位置指的是所述导线6的端部形成所述焊球61时所在的一空间位置，本发明对其空间的尺寸优选约定义在1立方公分左右，但可能因所述焊针1的尺寸而做变动。再者，所述第二气体供应管4邻接于所述焊针1，且通常与所述第一气体供应管3位在所述焊针1的不同侧。所述第二气体供应管4具有一第二供气口41，所述第二供气口41朝向所述焊针1的一导线焊接位置，以对所述导线焊接位置提供一第二保护气体42。所述导线焊接位置指的是所述导线6焊接至一半导体封装半成品7时所在的一空间位置，本发明对其空间的尺寸优选约定义在1立方公分左右，但可能因所述焊针1的尺寸而做变动。在本实施例中，所述第一及第二保护气体32、42优选包含氮(N2)、氩(Ar)或其组合，并可选择另混合有氢(H2)。所述第一及第二保护气体32、42所含的气体种类及比例可选择为相同或不同。
请再参照图1及2A所示，本发明第一实施例的气体监测元件5是邻接于所述焊针1及所述第一气体供应管3的第一供气口31，例如选择位于所述焊针1及第二供气口41之间、位于所述焊针1及第一供气口31之间，或是位于所述焊针1的其他邻接侧。在本发明中，所述气体监测元件5邻接于所述焊针1的供线孔11的距离优选约定义在小于1公分，特别是小于0.5公分，以便邻近监测所述焊针1的供线孔11附近的氧气(O2)浓度。在本实施例中，所述气体监测元件5的端部具有一氧气感应器(sensor)51，其用以感应氧气的感应端是朝向所述焊针1的供线孔11，更具体而言，是朝向所述焊针1的供线孔11所输出的导线6的端部下方。特别是，所述气体监测元件5能与所述焊针1同步移动，以达到即时监测氧气浓度目的。再者，所述气体监测元件5的氧气感应器51能通过线路电性电连至一远端的氧气分析仪52，以分析、计算及显示氧气浓度，进而用于调整控制所述第一及第二保护气体32、42的单位时间流量。
请参照图1、2A、2B、2C及2D所示，其揭示将本发明第一实施例的半导体封装用导线接合装置应用于一种半导体封装用导线接合方法，所述接合方法包含下述步骤：
请参照图1及2A所示，本发明第一实施例的接合方法第一步骤是：提供一接合装置，包含一焊针1、一电子点火杆2、至少一气体供应管3、4及一气体监测元件5。在本步骤中，所述接合装置具有如图1所示的全部元件，其中所述焊针1具有一供线孔11；所述电子点火杆2邻接于所述焊针1；所述至少一气体供应管3、4包含一第一气体供应管3及一第二气体供应管4，两者分别具有一第一供气口31、一第二供气口41，所述第一供气口31及一第二供气口41分别朝向所述焊针1的一导线成球位置或一导线焊接位置；所述气体监测元件5是邻接于所述焊针1的供线孔11，且所述气体监测元件5的氧气感应器51通过线路电性电连至一远端的氧气分析仪52。
请参照图2A所示，本发明第一实施例的接合方法第二步骤是：由所述焊针1的供线孔11输出一具反应活性的导线6，利用所述电子点火杆2使所述导线6的端部在导线成球位置形成一焊球61，并在成球期间利用所述第一气体供应管3的第一供气口31朝向所述导线成球位置提供一第一保护气体32，同时所述气体监测元件5邻近监测所述焊针1的供线孔11附近的氧气浓度。在进行本步骤前，所述接合装置下方预先放置有一半导体封装半成品7，其具有一载板71及至少一芯片72，所述载板71可选自单层或多层的电路基板(substrate)，或选自导线架(leadframe)。所述导线成球位置是指位于所述半导体封装半成品7上方的一空间位置，所述导线6的端部在导线成球位置先形成所述焊球61，以便后续进行导线焊接的步骤。所述第一气体供应管3的第一供气口31所提供的第一保护气体32优选包含氮(N2)、氩(Ar)或其组合，并可选择另混合有氢(H2)。在图2A的成球期间，本发明的气体监测元件5的氧气感应器51能邻近监测所述焊针1的供线孔11附近的氧气浓度，并将数据传送至所述远端的氧气分析仪52，以分析、计算及显示氧气浓度，进而用于调整控制所述第一保护气体32的单位时间流量。
请参照图2B、2C及2D所示，本发明第一实施例的接合方法第三步骤是：移动所述焊针1及其输出的导线6至一导线焊接位置进行焊接，并在焊接期间利用所述第二气体供应管4的供气口41朝向所述导线焊接位置提供一第二保护气体42，同时所述气体监测元件5邻近监测所述焊针1的供线孔11附近的氧气浓度。在本步骤中，所述气体监测元件5能与所述焊针1同步移动，以达到即时监测氧气浓度目的。在焊接期间，如图2B所示，所述焊针1首先压迫所述导线6的焊球62，使所述焊球62焊接结合至所述芯片72(或载板71)的一有源表面的焊垫(未标示)上；接着，如图2C所示，所述焊针1牵引所述导线6，并由所述供线孔11进一步输出一段长度的导线6，直到所述导线6延伸至所述载板71(或芯片72)的焊垫(未标示)上。之后，所述焊针1压迫所述导线6，使所述导线6焊接结合至所述载板71(或芯片72)的焊垫上，并扯断所述导线6。如图2D所示，在完成焊接动作后，所述焊针1及所述气体监测元件5回复至所述导线成球位置，以进行下一周期的成球及焊接动作。在图2B及2C的焊接期间，本发明的气体监测元件5的氧气感应器51能邻近监测所述焊针1的供线孔11附近的氧气浓度，并将数据传送至所述远端的氧气分析仪52，以分析、计算及显示氧气浓度，进而用于调整控制所述第二保护气体42的单位时间流量。
请参照图3所示，本发明第二实施例的半导体封装用导线接合装置基本上相同于第一实施例的接合装置并可应用于相同的接合方法，因此本发明第二实施例大致沿用相同图号以示意相同功能的元件，但本发明第二实施例的接合装置的特征在于：所述气体监测元件5的端部具有一吸气口53，至少所述吸气口53能与所述焊针1同步移动。所述气体监测元件5的吸气口53朝向所述焊针1的供线孔11，且更具体而言，是朝向所述焊针1的供线孔11所输出的导线6的端部下方。在所述导线6进行成球及焊接的期间，所述气体监测元件5的吸气口53可用以将所述焊针1的供线孔11附近的气体通过输送管(未标示)吸取至一远端的氧气感应器51。所述氧气感应器51再通过线路电性电连至一氧气分析仪52，以分析、计算及显示氧气浓度，进而用于调整控制所述第一及第二保护气体32、42的单位时间流量。
如上所述，相较于现有打线机台虽利用气体供应管提供气体以避免导线氧化，但却存在难以即时精准调整控制气体用量的问题，图1至3的本发明通过在所述焊针1的供线口11附近邻接所述气体监测元件5，以精准监测所述焊针1的供线口11在导线成球或焊接期间的作业环境氧气(O2)实际浓度，进而有利于提高即时监控保护气体流量的监测精准度。再者，由于所述气体监测元件5能产生氧气浓度数值，因此可利用氧气浓度数值加以自动化即时控制保护气体的远端控制阀门(未绘示)，进而有利于达到自动化即时调整保护气体流量的目的。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包含于本发明的范围内。

Claims (9)

1.一种半导体封装用导线接合装置，其包含：
一焊针，具有一供线孔，以输出一具反应活性的导线，所述的具反应活性的导线为铜线、铝线、银线、钯线或其合金线材；
一电子点火杆，邻接于所述焊针，以使所述焊针输出的导线的端部形成一焊球；及
至少一气体供应管，具有一供气口朝向所述焊针的一导线成球位置或一导线焊接位置，以对所述焊针的导线成球位置或导线焊接位置提供保护气体；
其特征在于：所述接合装置另包含：
一气体监测元件，邻接于所述焊针的供线孔，以监测所述焊针的供线孔附近的氧气浓度。
2.如权利要求1所述的半导体封装用导线接合装置，其特征在于：所述气体监测元件的端部具有一氧气感应器，其朝向所述焊针的供线孔。
3.如权利要求1所述的半导体封装用导线接合装置，其特征在于：所述气体监测元件的端部具有一吸气口，其朝向所述焊针的供线孔，以将所述焊针的供线孔附近的气体吸取至一远端的氧气感应器。
4.如权利要求1所述的半导体封装用导线接合装置，其特征在于：所述所述气体监测元件朝向所述焊针的供线孔所输出的导线的端部下方。
5.如权利要求1所述的半导体封装用导线接合装置，其特征在于：所述气体监测元件与所述焊针同步移动。
6.一种半导体封装用导线接合方法，其包含步骤：
提供一接合装置，包含一焊针、一电子点火杆及至少一气体供应管；
由所述焊针的一供线孔输出一具反应活性的导线，利用所述电子点火杆使所述导线的端部在一导线成球位置形成一焊球，并在成球期间利用所述气体供应管的一供气口朝向所述导线成球位置提供保护气体，其中所述的具反应活性的导线为铜线、铝线、银线、钯线或其合金线材；及
移动所述焊针及其输出的导线至一导线焊接位置进行焊接，并在焊接期间利用所述气体供应管的供气口朝向所述导线焊接位置提供保护气体；
其特征在于：
所述接合装置另包含一气体监测元件，其邻接于所述焊针的供线孔，所述气体监测元件在成球及焊接期间监测所述焊针的供线孔附近的氧气浓度。
7.如权利要求6所述的半导体封装用导线接合方法，其特征在于：所述气体监测元件的端部具有一氧气感应器，其朝向所述焊针的供线孔。
8.如权利要求6所述的半导体封装用导线接合方法，其特征在于：所述气体监测元件的端部具有一吸气口，其朝向所述焊针的供线孔，以将所述焊针的供线孔附近的气体吸取至一远端的氧气感应器。
9.如权利要求6所述的半导体封装用导线接合方法，其特征在于：所述气体监测元件在成球及焊接期间与所述焊针同步移动。
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CN101427359A (zh) * 2006-04-20 2009-05-06 株式会社海上 工件夹具及引线接合装置

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