CN101867106A - Electronic element and method for assembling electronic element and circuit board - Google Patents
Electronic element and method for assembling electronic element and circuit board Download PDFInfo
- Publication number
- CN101867106A CN101867106A CN 201010183068 CN201010183068A CN101867106A CN 101867106 A CN101867106 A CN 101867106A CN 201010183068 CN201010183068 CN 201010183068 CN 201010183068 A CN201010183068 A CN 201010183068A CN 101867106 A CN101867106 A CN 101867106A
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- Prior art keywords
- circuit board
- electronic component
- welding foot
- receiving space
- tin cream
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Abstract
The invention discloses an electronic element, which inserts in a circuit board with solder paste from one end and is welded on one surface of the circuit board. The electronic element comprises a terminal with a welding pin; the welding pin is provided with an accommodating space for accommodating the corresponding solder paste. The method for assembling an electronic element and a circuit board comprises the following steps of transversely moving the electronic element and the circuit board so as to accommodate the solder paste in the accommodating space. By adopting the method, the invention not only avoids the scraping of the solder paste in the insertion of the electronic element, but also ensures the more amount of the solder paste, so that the dependable welding between the electrode element and the circuit board is ensured.
Description
[technical field]
The present invention relates to a kind of electronic component and with the assemble method of circuit board, be meant especially a kind of along a circuit board one end insert and be welded in described circuit board surface electronic component and with the assemble method of circuit board.
[background technology]
In order to reduce the mainboard height, some electronic components as electric connector, insert and are welded in described circuit board surface along a circuit board one end at present.Before the assembling, circuit board surface can corresponding electronic component terminal print solder paste.During assembling, electronic component and circuit board insert mutually, and at this moment the electronic component terminal can be distinguished the monoblock tin cream on the pushing tow circuit board, tin cream is wiped off caused failure welding, or adjacent tin cream contact causes short circuit, influence the normal operation of electronic component.
For addressing the above problem, U.S. Pat 5666721 has disclosed a kind of method that electric connector is welded in circuit board.The bending that makes progress of its electric connector terminal weld part stage casing protrude to form receiving space, to accommodate the tin cream after the fusing.Its welding manner is: during print solder paste, it is with paste solder printing the inner in weld pad, when electric connector inserts on the circuit board, the terminal tin cream that just contacts slightly of its terminal weld part, heating then enters receiving space after the tin cream fusing, and weld part and PCB weld pad are welded to connect at Liang Chu.Paste solder printing can be avoided terminal to strike off more tin cream in the inner this mode of weld pad and cause short circuit between failure welding or terminals of adjacent and influence the normal transmission of signal that the setting of receiving space can increase terminal and PCB weld pad welding reliability.
Yet, because of tin cream is struck off by terminal for avoiding, and only be printed in weld pad the inner, so the tin cream amount is less, and it is unreliable to cause terminal and PCB weld pad to weld, pad may disconnect under vibrations or other situation, and causes the electric connector cisco unity malfunction.
Therefore, be necessary to design a kind of new electronic component, to overcome the problems referred to above.
[summary of the invention]
Creation purpose of the present invention be to provide electronic component that a kind of and circuit board reliably be connected and with the assemble method of circuit board.
In order to achieve the above object, electronic component of the present invention is in order to insert and to be welded in described circuit board one surface along circuit board one end with tin cream, described electronic component comprises that one has the terminal of welding foot, and described welding foot forms one in order to accommodate corresponding described tin cream in receiving space wherein.The assemble method of electronic component of the present invention and circuit board, described electronic component inserts and is welded in described circuit board one surface along described circuit board one end, described assemble method comprises the steps: to provide described electronic component, it comprises that one has the terminal of welding foot, and described welding foot forms a receiving space; Described circuit board is provided, and surface thereof is provided with some tin creams; Described electronic component is inserted along described circuit board one end, during insertion, allow described welding foot between described tin cream; Relative to laterally moving, make described tin cream be arranged in receiving space described electronic component and described circuit board; And heating, make tin cream fusing and described welding foot is welded mutually with described circuit board.
Compared with prior art, electronic component of the present invention and with the assemble method of circuit board by on described welding foot, forming one in order to accommodate corresponding described tin cream in described receiving space wherein, so can avoid when inserting, striking off tin cream, more tin cream amount can be guaranteed again, thereby the reliable welding between described electronic component and the described circuit board can be guaranteed.
[description of drawings]
Fig. 1 is electronic component of the present invention and the preceding stereogram of circuit board assembling;
Fig. 2 is the three-dimensional exploded view of electronic component shown in Figure 1;
Fig. 3 is that electronic component shown in Figure 1 and circuit board insert the traversing preceding stereogram in back;
Fig. 4 is the upward view of Fig. 3;
Fig. 5 is the cutaway view of Fig. 4 along A-A;
Fig. 6 is the upward view before the traversing back heating of electronic component shown in Figure 1 and circuit board;
Fig. 7 is the partial sectional view of Fig. 6;
Fig. 8 is the partial sectional view after electronic component shown in Figure 1 and the circuit board heating.
The drawing reference numeral explanation of embodiment:
Welding foot 112 receiving spaces 113 abutting parts 114 shielding casings 12
[embodiment]
For ease of better understanding purpose of the present invention, structure, feature and effect etc., now be described further to electronic component of the present invention and with the assemble method of circuit board with embodiment in conjunction with the accompanying drawings.
As Fig. 1, described electronic component is that electric connector 1, one end is welded in circuit board 3, and the other end is connected with butt joint electronic component (not icon).Certainly, described electronic component also is not limited to described electric connector 1, also can be chip module, LED (light-emitting diode) or the like other assembly.Described circuit board about in the of 3 two surface printings some tin creams 30 are arranged.Described electronic component 1 forms electronic building brick with described circuit board 3.
As Fig. 2, described electric connector 1 comprises an insulating body 10, is fixed in the plurality of terminals 11 of described insulating body 10, and the shielding casing 12 that is coated on described insulating body 10.
Described insulating body 10 comprises a base portion 100 and the tongue piece 101 that is extended to form forward by described base portion 100, and is provided with two rows are extended to described tongue piece 101 upper and lower surfaces forward respectively by described base portion 100 rear ends terminal containing slot 102.
Described terminal 11 is two rows respectively, the corresponding described terminal containing slot 102 of difference, each described terminal 11 comprises the fixed part of fixing with described insulating body 10 110, the contact site 111 that extends to form forward by described fixed part 110 front ends, and the welding foot 112 that extends back and form by described fixed part 110 rear ends.Each described welding foot 112 is corresponding with described tin cream 30 respectively, and have one be " ㄇ " shape in order to accommodate corresponding described tin cream 30 in wherein receiving space 113 and in order to be connected to the abutting part 114 (as Fig. 5) on described circuit board 3 surfaces.Described abutting part 114 is positioned at described welding foot 112 ends, certainly also can be positioned at the junction with described fixed part 110, but be positioned at the easier controlling dimension of described welding foot 112 ends, and elasticity is better.Receiving space described in the present embodiment 113 is to deviate from described circuit board 3 installation directions bending by described abutting part 114 to extend to form, and the formation of certain described receiving space 113 also can be adopted alternate manner.
Extremely shown in Figure 8 as Fig. 1 and Fig. 3, embodiment of the invention electronic component 1 comprises the steps: with the assemble method of circuit board 3
The above electronic component 1 is provided, and it comprises that one has the described terminal 11 of described welding foot 112, and described welding foot 112 forms a described receiving space 113 (as Fig. 1 and Fig. 5);
Described circuit board 3 is provided, and surface thereof is provided with some described tin creams 30 (as Fig. 1);
Described electronic component 1 is inserted along described circuit board 3 one ends, during insertion, allow described welding foot 112 be positioned at a side of described tin cream 30, at this moment, described tin cream 30 is positioned at described receiving space 113 outer (as Fig. 4 and Fig. 5);
Relative to laterally moving, allow described welding foot 112 align described electronic component 1 and described circuit board 3, make described tin cream 30 be arranged in described receiving space 113 (as Fig. 6 and Fig. 7) with described tin cream 30; And
Heat, make described tin cream 30 fusings and described welding foot 112 is welded (as Fig. 8) mutually with described circuit board 3.
The foregoing description is relative to laterally moving with described electronic component and described circuit board, make described tin cream be arranged in described receiving space, but persons skilled in the art can be expected alternate manner in view of the above, as welding foot is lifted or the like when inserting, allow described tin cream be arranged in described receiving space, therefore, as long as form one in order to accommodate corresponding described tin cream in described receiving space wherein at described welding foot, no matter and described tin cream is arranged in receiving space with which kind of mode, all can avoid when inserting, striking off described tin cream, more tin cream amount can be guaranteed again, thereby the reliable welding between described electronic component and the described circuit board can be guaranteed.Certainly, adopt described electronic component and described circuit board relative to the mode that laterally moves, simple in structure, easy to operate.
Before electronic component described in the present invention and described circuit board insert the back heating, described tin cream and described receiving space have two states, be respectively to have and be arranged in described receiving space and be positioned at outside the described receiving space, like this, described welding foot strikes off described tin cream in the time of both can avoiding inserting, more tin cream amount can be guaranteed again, thereby the reliable welding between described electronic component and the described circuit board can be guaranteed.
Welding foot described in the present invention has one in order to be connected to the described abutting part of described circuit board surface, and described receiving space is to deviate from described circuit board installation direction by described abutting part to extend to form, and is this simple in structure, handling ease.
Only more than describe explanation in detail for the present invention's preferred embodiment, non-so limit to claim of the present invention, so the equivalence techniques variation that all this creation of utilization specifications and diagramatic content are done all is contained in the claim of the present invention.
Claims (10)
1. electronic component, in order to insert and to be welded in described circuit board one surface along circuit board one end with tin cream, it is characterized in that, comprise that one has the terminal of welding foot, described welding foot forms one in order to accommodate corresponding described tin cream in receiving space wherein.
2. electronic component as claimed in claim 1 is characterized in that: described welding foot has one in order to be connected to the abutting part of described circuit board surface, and described receiving space is to deviate from described circuit board installation direction by described abutting part to extend to form.
3. electronic component as claimed in claim 2 is characterized in that: described abutting part is positioned at described welding foot end.
4. an electronic building brick is characterized in that, comprising:
One circuit board, surface thereof are provided with some tin creams; And
One electronic component, in order to insert and to be welded in described circuit board one surface along described circuit board one end, it comprises that one has the terminal of welding foot, described welding foot forms a receiving space, before described electronic component and described circuit board inserted the back heating, described tin cream had the state that is arranged in described receiving space.
5. electronic building brick as claimed in claim 4 is characterized in that: before described electronic component and described circuit board inserted the back heating, described tin cream also had the state that is positioned at outside the described receiving space, and it is before being arranged in the state of described receiving space.
6. electronic component, in order to insert and to be welded in relative two surfaces of described circuit board along circuit board one end with tin cream, it is characterized in that, comprise that two rows have the terminal of welding foot, the described welding foot of every row is welded in relative two surfaces of described circuit board respectively, and each described welding foot forms one in order to accommodate corresponding described tin cream in described receiving space wherein.
7. electronic component as claimed in claim 6 is characterized in that: described welding foot has one in order to be connected to the abutting part of described circuit board surface, and described receiving space is to deviate from described circuit board installation direction by described abutting part to extend.
8. electronic component as claimed in claim 7 is characterized in that: described abutting part is positioned at described welding foot end.
9. the assemble method of electronic component and circuit board is characterized in that, comprises the steps:
Described electronic component is provided, and it comprises that one has the terminal of welding foot, and described welding foot forms a receiving space;
Described circuit board is provided, and surface thereof is provided with some tin creams;
Described electronic component is inserted along described circuit board one end, during insertion, allow described welding foot between described tin cream;
Relative to laterally moving, make described tin cream be arranged in described receiving space described electronic component and described circuit board; And heating, make the fusing of described tin cream and described welding foot is welded mutually with described circuit board.
10. the assemble method of electronic component as claimed in claim 9 and circuit board, it is characterized in that: described welding foot has one in order to be connected to the abutting part of described circuit board surface, and described receiving space is to deviate from described circuit board installation direction bending by described abutting part to extend to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010183068 CN101867106B (en) | 2010-05-21 | 2010-05-21 | Electronic element and method for assembling electronic element and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010183068 CN101867106B (en) | 2010-05-21 | 2010-05-21 | Electronic element and method for assembling electronic element and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101867106A true CN101867106A (en) | 2010-10-20 |
| CN101867106B CN101867106B (en) | 2013-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010183068 Active CN101867106B (en) | 2010-05-21 | 2010-05-21 | Electronic element and method for assembling electronic element and circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064402A (en) * | 2010-10-22 | 2011-05-18 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
| CN102064398A (en) * | 2010-11-01 | 2011-05-18 | 番禺得意精密电子工业有限公司 | Splint-type connector module |
| CN102074813A (en) * | 2011-01-10 | 2011-05-25 | 番禺得意精密电子工业有限公司 | Electronic assembly and production method thereof |
| CN102122786A (en) * | 2010-12-15 | 2011-07-13 | 实盈电子(东莞)有限公司 | Soldering and mounting method of electric connector |
| CN102176604A (en) * | 2010-12-22 | 2011-09-07 | 番禺得意精密电子工业有限公司 | Electronic component manufacturing method |
| CN103002669A (en) * | 2010-12-02 | 2013-03-27 | 番禺得意精密电子工业有限公司 | Electronic component and method for assembling electronic component with circuit board |
| CN106304632A (en) * | 2016-08-31 | 2017-01-04 | 安徽赛福电子有限公司 | Electronic component elastic insertion type circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5666721A (en) * | 1994-01-18 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | Method of soldering an electronic connector on a printed circuit board |
| CN2377691Y (en) * | 1998-12-29 | 2000-05-10 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| JP2002359458A (en) * | 2001-05-31 | 2002-12-13 | Smk Corp | Mounting component |
| JP2004303858A (en) * | 2003-03-31 | 2004-10-28 | Brother Ind Ltd | Method for bonding flexible wiring board and printer |
| CN2718952Y (en) * | 2004-08-04 | 2005-08-17 | 汪应斌 | Electronic element |
| CN2775874Y (en) * | 2004-12-29 | 2006-04-26 | 全康精密工业股份有限公司 | Electric connector terminal |
-
2010
- 2010-05-21 CN CN 201010183068 patent/CN101867106B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5666721A (en) * | 1994-01-18 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | Method of soldering an electronic connector on a printed circuit board |
| CN2377691Y (en) * | 1998-12-29 | 2000-05-10 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| JP2002359458A (en) * | 2001-05-31 | 2002-12-13 | Smk Corp | Mounting component |
| JP2004303858A (en) * | 2003-03-31 | 2004-10-28 | Brother Ind Ltd | Method for bonding flexible wiring board and printer |
| CN2718952Y (en) * | 2004-08-04 | 2005-08-17 | 汪应斌 | Electronic element |
| CN2775874Y (en) * | 2004-12-29 | 2006-04-26 | 全康精密工业股份有限公司 | Electric connector terminal |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064402A (en) * | 2010-10-22 | 2011-05-18 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
| CN102064402B (en) * | 2010-10-22 | 2014-07-09 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
| CN102064398A (en) * | 2010-11-01 | 2011-05-18 | 番禺得意精密电子工业有限公司 | Splint-type connector module |
| CN102064398B (en) * | 2010-11-01 | 2014-05-07 | 番禺得意精密电子工业有限公司 | Splint-type connector module |
| CN103002669A (en) * | 2010-12-02 | 2013-03-27 | 番禺得意精密电子工业有限公司 | Electronic component and method for assembling electronic component with circuit board |
| CN102122786A (en) * | 2010-12-15 | 2011-07-13 | 实盈电子(东莞)有限公司 | Soldering and mounting method of electric connector |
| CN102176604A (en) * | 2010-12-22 | 2011-09-07 | 番禺得意精密电子工业有限公司 | Electronic component manufacturing method |
| CN102074813A (en) * | 2011-01-10 | 2011-05-25 | 番禺得意精密电子工业有限公司 | Electronic assembly and production method thereof |
| CN106304632A (en) * | 2016-08-31 | 2017-01-04 | 安徽赛福电子有限公司 | Electronic component elastic insertion type circuit board |
| CN106304632B (en) * | 2016-08-31 | 2018-12-14 | 安徽赛福电子有限公司 | Electronic component elastic insertion type circuit board |
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| Publication number | Publication date |
|---|---|
| CN101867106B (en) | 2013-01-23 |
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