CN102074813A - Electronic assembly and production method thereof - Google Patents
Electronic assembly and production method thereof Download PDFInfo
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- CN102074813A CN102074813A CN2011100053522A CN201110005352A CN102074813A CN 102074813 A CN102074813 A CN 102074813A CN 2011100053522 A CN2011100053522 A CN 2011100053522A CN 201110005352 A CN201110005352 A CN 201110005352A CN 102074813 A CN102074813 A CN 102074813A
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- weld part
- circuit board
- strutting
- described weld
- weld
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 49
- 239000006071 cream Substances 0.000 claims description 49
- 239000011469 building brick Substances 0.000 claims description 34
- 238000003780 insertion Methods 0.000 claims description 29
- 230000037431 insertion Effects 0.000 claims description 29
- 238000013459 approach Methods 0.000 claims description 11
- 238000000407 epitaxy Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000003032 molecular docking Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses an electronic assembly, which comprises a circuit board and an electronic element, wherein a block-up part is arranged on one surface of the circuit board; a plurality weld pads are arranged at the block-up part; the electronic element is inserted into and welded to the surface of the circuit board along one end of the circuit board and comprises an insulating body and a plurality of terminals fixed on the insulating body; each terminal respectively corresponds to the weld pad and is provided with a weld part and a shoving part arranged at the rear end of the weld part; relative to the weld part, the shoving part is deflected in the transverse direction and is closer to the circuit board in the height direction, so that the shoving part is positioned between adjacent weld pads and is shoved off by the block-up part to drive the welding parts to offset outwards in the inserting process; and then the shoving part spans over the block-up part and returns to drive the welding parts to return and enables the welding parts to be respectively positioned on the front sides and the outer sides of the weld pads. The invention also provides a production method of the electronic assembly.
Description
[technical field]
The present invention relates to a kind of electronic building brick and manufacture method thereof, be meant a kind of electronic building brick and manufacture method thereof that comprises that electronic component inserts along circuit board one end especially.
[background technology]
In order to reduce the mainboard height, at present in some electronic building bricks, circuit board upper and lower surface as described in electronic component (as electric connector) inserted and be welded in along circuit board one end.Before the assembling, described circuit board surface can be in the described terminals of electronic components cooperation position of correspondence print solder paste.During assembling, described electronic component and described circuit board insert mutually, at this moment described electronic component terminal can be distinguished the described tin cream on the described circuit board of pushing tow, described tin cream is wiped off, pad can be because of the very few failure welding that causes of described tin cream amount, or adjacent described tin cream contact causes short circuit, influences the normal operation of described electronic component.
For addressing the above problem, United States Patent (USP) has disclosed the fit structure of an electric connector and circuit board for No. 4303291, and it is provided with row's pothole in described circuit board upper and lower surface, is coated with tin cream in the described pothole.When described connector terminals weld part when its lateral margin inserts, described weld part is strutted by described circuit board earlier, when being inserted into certain depth, described weld part is fallen in the described pothole and with described tin cream and is contacted.Like this, during insertion, described weld part can the described tin cream of pushing tow, so can effectively avoid the generation of failure welding and short circuit.
But this mode is more not easy to operate.Because when on circuit board tin cream being set, common way is to adopt the mode of printing, and this mode needs described tin cream to be higher than described circuit board surface.And in the above-mentioned patent, described tin cream is lower than described circuit board surface, so can not adopt mode of printing, and can only adopt other particular form, and can not together be provided with other locational tin cream of circuit board, so complicated operation, efficient is lower, and is difficult for guaranteeing operational quality.
Therefore, be necessary to design a kind of new electronic building brick and manufacture method thereof, to overcome the problems referred to above.
[summary of the invention]
Creation purpose of the present invention is to provide a kind of can avoid failure welding and short circuit and electronic building brick and manufacture method thereof simple to operate.
In order to achieve the above object, electronic building brick of the present invention can comprise a circuit board, and wherein a surface is provided with a bed hedgehopping portion, and is provided with a plurality of weld pads in described bed hedgehopping portion; An and electronic component, insert and be welded in described circuit board surface along described circuit board one end, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and have a weld part and be located at the portion that struts of described weld part rear end, with respect to described weld part, the described portion of strutting is deviation in the horizontal, more approach described circuit board on the short transverse, make in the insertion process, the described portion of strutting is positioned between the adjacent described weld pad, and strutted earlier by described bed hedgehopping portion, drive described weld part and outwards be offset, then cross described bed hedgehopping portion and reply, drive described weld part and reply and lay respectively at the positive outside of described weld pad.
Electronic building brick of the present invention also can comprise a circuit board, and wherein a surface is provided with a depression, and is provided with a plurality of weld pads between described depression and corresponding ora terminalis; An and electronic component, insert and be welded in described circuit board surface along described circuit board one end, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and have a weld part and be located at the portion that struts of described weld part rear end, with respect to described weld part, the described portion of strutting is deviation in the horizontal, more approach described circuit board on the short transverse, make in the insertion process, the described portion of strutting is positioned between the adjacent described weld pad, and strutted by described circuit board surface earlier, drive described weld part and outwards be offset, then enter described depression and reply, drive described weld part and reply and lay respectively at the positive outside of described weld pad.
The present invention also provides a kind of electronic assembly manufacturing method, comprises the steps: to provide a circuit board, and wherein a surface is provided with a bed hedgehopping portion, and is provided with a plurality of weld pads in described bed hedgehopping portion; A plurality of tin creams are provided, place respectively on the corresponding described weld pad; One electronic component is provided, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and have a weld part and be located at the portion that struts of described weld part rear end, with respect to described weld part, the described portion of strutting is deviation in the horizontal, more approaches described circuit board on the short transverse; Described electronic component is installed on the described circuit board along described circuit board one end insertion, the described portion of strutting is positioned between the adjacent described weld pad during insertion, in the insertion process, the described portion of strutting is strutted by described bed hedgehopping portion earlier, drive the outside skew of described weld part and be located at the corresponding described tin cream outside, the then described portion of strutting crosses described bed hedgehopping portion and replys, and drives described weld part answer and makes it contact corresponding described tin cream; And heating, make described tin cream fusing form welding material, described weld part is connected with corresponding described weld pad respectively.
The present invention also provides a kind of electronic assembly manufacturing method, comprises the steps: to provide a circuit board, and wherein a surface is provided with a depression, and is provided with a plurality of weld pads between described depression and corresponding ora terminalis; A plurality of tin creams are provided, place respectively on the corresponding described weld pad; One electronic component is provided, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and have a weld part and be located at the portion that struts of described weld part rear end, with respect to described weld part, the described portion of strutting is deviation in the horizontal, more approaches described circuit board on the short transverse; Described electronic component is installed on the described circuit board along described circuit board one end insertion, the described portion of strutting is positioned between the adjacent described weld pad during insertion, in the insertion process, the described portion of strutting is strutted by described circuit board surface earlier, drive the outside skew of described weld part and be located at the corresponding described tin cream outside, the then described portion of strutting enters described depression and replys, and drives described weld part answer and makes it contact corresponding described tin cream; And heating, make described tin cream fusing form welding material, described weld part is connected with corresponding described weld pad respectively.
Compared with prior art, electronic building brick of the present invention and manufacture method thereof can reduce not even pushing tow tin cream, avoid the generation of failure welding and short circuit, and simple to operate again, efficient is higher, and can guarantee operational quality.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of electronic building brick first execution mode of the present invention;
Fig. 2 is the stereogram of terminal in the electronic building brick shown in Figure 1;
Fig. 3 is the front view of terminal shown in Figure 1;
Fig. 4 is the stereogram of another angle of electronic building brick shown in Figure 3;
Fig. 5 is a cutaway view shown in Figure 3;
Fig. 6 is the stereogram in electronic component and the circuit board insertion process in the electronic building brick shown in Figure 1;
Fig. 7 is a cutaway view shown in Figure 6;
Fig. 8 is the stereogram after electronic component and circuit board insert in the electronic building brick shown in Figure 1;
Fig. 9 is a cutaway view shown in Figure 8;
Figure 10 is electronic component in electronic building brick second execution mode of the present invention and the preceding stereogram of circuit board insertion;
Figure 11 is a cutaway view shown in Figure 10;
Figure 12 is the stereogram in electronic component and the circuit board insertion process in the electronic building brick shown in Figure 10;
Figure 13 is a cutaway view shown in Figure 12;
Figure 14 is the stereogram after electronic component and circuit board insert in the electronic building brick shown in Figure 10;
Figure 15 is a cutaway view shown in Figure 14.
The drawing reference numeral explanation of embodiment:
Terminal containing slot 315 terminals 33 fixed parts 331 docking sections 333
[embodiment]
For ease of better understanding purpose of the present invention, structure, feature and effect etc., now with embodiment electronic building brick of the present invention and manufacture method thereof are described further in conjunction with the accompanying drawings.
Fig. 1 with Figure 9 shows that first execution mode of the present invention.
As Fig. 1, electronic building brick comprises a circuit board 1 and an electronic component 3.Described circuit board 1 is respectively equipped with the bed hedgehopping portion 11 of a predetermined altitude in upper and lower surface of its contiguous ora terminalis, and is provided with a plurality of weld pads 13 in described bed hedgehopping portion 11.The described weld pad 13 of upper and lower surface is staggered and arranges.When assembling, on each described weld pad 13 tin cream 5 (as Fig. 4) will be set.
Described electronic component 3 is an electric connector, and an end is welded in described circuit board 1, and the other end is connected with butt joint electronic component (figure does not show).Certainly, described electronic component also is not limited to described electric connector, also can be chip module, LED (light-emitting diode) or the like other assembly.Described electronic component 3 forms electronic building brick with described circuit board 1.Described electric connector 3 comprises an insulating body 31, is fixed in a plurality of terminals 33 of described insulating body 31, and the shielding casing 35 that is coated on described insulating body 31.
Described insulating body 31 comprises a base portion 311 and the hyoplastron 313 that is extended to form forward by described base portion 311, and is provided with two rows are extended to described hyoplastron 313 upper and lower surfaces forward respectively by described base portion 311 rear ends terminal containing slot 315.
As Fig. 2 and Fig. 3, described terminal 33 is arranged in two rows, is contained in described terminal containing slot 315 respectively, and the corresponding described weld pad 13 of difference.As Fig. 2, each described terminal 33 comprises the fixed part of fixing with described base portion 311 331, the docking section 333 that extends to form forward by described fixed part 331 front ends, the epitaxy part 335 that stretches out and form by described fixed part 331 rear ends, the weld part 337 that extends to form backwards by described epitaxy part 335 ends, by the oblique connecting portion that extends to form 338 in described weld part 337 rear ends, and by described connecting portion 338 ends backwards and towards the portion that struts 339 that described circuit board 1 direction extends to form.With respect to described weld part 337, described half that struts that portion 339 deviation distance in the horizontal equals distance between described weld part 337 and the adjacent described weld part 337 (also can equal 1.5 times, 2.5 times, 3.5 times of distance between described weld part 337 and the adjacent described weld part 337 ...).
According to said structure, described weld part 337 is parallel to described fixed part 331 and away from described circuit board 1, makes the position of described fixed part 331 need not be subjected to the restriction of described circuit board 1 thickness on short transverse, thereby can flexible design.With respect to described weld part 337, described portion 339 deviation in the horizontal that struts, vertically go up parallel, more approach described circuit board 337 (as Fig. 4 and Fig. 5) on the short transverse, make in the insertion process, the described portion 339 that struts is between adjacent described weld pad 13, and strutted earlier by described bed hedgehopping portion 11, drive described weld part 337 and outwards be offset (as Fig. 6 and Fig. 7), then cross described bed hedgehopping portion 11 and reply, drive described weld part 337 and reply and lay respectively at the described weld pad 13 positive outsides (as Fig. 8 and Fig. 9).Like this, can make described weld part 337 earlier outwards skew avoid the described tin creams 5 that are provided with on the described weld pad 13, then reply contacting described tin cream 5, thereby can reduce the not even described tin cream 5 of pushing tow, avoid the generation of failure welding and short circuit.
Described electronic assembly manufacturing method comprises five steps, now is described below respectively.
The first step provides circuit board 1 mentioned above (as Fig. 4 and Fig. 5).
Second step provided a plurality of described tin creams 5, placed respectively (as Fig. 4 and Fig. 5) on the corresponding described weld pad 13.
In the 3rd step, provide above-mentioned electric connector 3 (as Fig. 4 and Fig. 5).
The 4th step, described electric connector 3 is installed on the described circuit board 1 along described circuit board 1 one ends insertion, the described portion 339 that struts is between adjacent described weld pad 13 (as Fig. 4 and Fig. 5) during insertion, in the insertion process, the described portion 339 of strutting is strutted by described bed hedgehopping portion 11 earlier, drive described weld part 337 outside skews and be located at corresponding described tin cream 5 outsides (as Fig. 6 and Fig. 7), the then described portion 339 that struts crosses described bed hedgehopping portion 11 and replys, and drives described weld part 337 and replys and make it contact corresponding described tin cream 5 (as Fig. 8 and Fig. 9).Like this, can make described weld part 337 earlier outwards skew avoid described tin cream 5, then reply contacting described tin cream 5, thereby can reduce the not even described tin cream 5 of pushing tow, avoid the generation of failure welding and short circuit.This specification indication " answer " comprises that part is replied and answer fully, that is to say, in end-state, can be that the described portion 339 that struts is unsettled, and described weld part 337 is connected on the described tin cream 5, and the at this moment described portion 339 that struts is answer fully, and described weld part 337 is the part answer; Also can be that the described portion 339 that struts is connected to described circuit board 1 surface, the at this moment described portion 339 that struts be the part answer with described weld part 337; Can also be that the described portion 339 that struts all replys (being this kind mode shown in the present embodiment, as Fig. 9) fully with described weld part 337.
In the 5th step, heating (generally being that they are put in the heating furnace) makes 5 fusings of described tin cream form welding materials 5 ', with described weld part 337 be connected with corresponding described weld pad 13 respectively (as Fig. 7).
Above step not necessarily will be carried out in regular turn, goes on foot and can carry out earlier such as the 3rd, and then carry out other step.This a part of those skilled in the art just repeats no more at this because of learning by above description.
In the present embodiment, because described weld pad 13 is arranged at described bed hedgehopping portion 11, but not in the pothole, so can adopt the mode of printing setting, and can together be provided with other locational tin cream of circuit board, so simple to operate, efficient is higher, and can guarantee operational quality.
Certainly, persons skilled in the art can be done some design alterations according to above description.For example, described connecting portion 338 can perhaps not adopt oblique mode by oblique backward the extending to form of described weld part 337 sides yet, but laterally extends back earlier again.The described portion 339 that struts also can can't help described connecting portion 338 ends and extends to form backwards, but is extended by described connecting portion 338 sides, also can be not parallel to described weld part 337.In a word, terminal structure can be done bigger change, as long as in the described terminal 33, with respect to described weld part 337, described portion 339 deviation in the horizontal that struts, more approach described circuit board 1 on the short transverse, make in the insertion process, the described portion 339 that struts and is strutted by described bed hedgehopping portion 11 earlier between adjacent described weld pad 13, drives described weld part 337 and outwards is offset, then cross described bed hedgehopping portion 11 and reply, drive described weld part 337 and reply and lay respectively at the described weld pad 13 positive outsides, just can reduce the not even described tin cream 5 of pushing tow, avoid the generation of failure welding and short circuit.
In addition, the above electric connector comprises that the described terminal 33 of described terminal 33, two rows of two rows is welded in described circuit board 1 relative two surfaces respectively, in actual applications, also can only establish the described terminal 33 of a row, this is arranged described terminal 33 and is welded in described circuit board 1 one surfaces.
Figure 10 is to Figure 15 shows that second execution mode of the present invention.
As Figure 10 and Figure 11, in the present embodiment, described circuit board 1 lower surface thereon is respectively equipped with the depression 15 of a desired depth, and is provided with a plurality of described weld pads 13 in described depression 15.
Described electric connector 3 and the described electric connector structure of first execution mode are basic identical, difference is, in the described terminal 33, with respect to described weld part 337, described portion 339 deviation in the horizontal that struts, more approach described circuit board 1 on the short transverse, make in the insertion process, the described portion 339 that struts is between adjacent described weld pad 13, and strutted by described circuit board 1 surface earlier, drive described weld part 337 and outwards be offset, then enter described depression 15 and reply, drive described weld part 337 and reply and lay respectively at the described weld pad 13 positive outsides.
The 4th step of described electronic assembly manufacturing method is: described electric connector 3 is installed on the described circuit board 1 along described circuit board 1 one ends insertion, the described portion 339 that struts is between adjacent described weld pad 11 (as Figure 10 and Figure 11) during insertion, in the insertion process, the described portion 339 that struts is strutted by described circuit board 1 surface earlier, drive described weld part 337 outside skews and be located at corresponding described tin cream 5 outsides (as Figure 12 and Figure 13), the then described portion 339 that struts enters described depression 15 and replys, and drives described weld part 337 and replys and make it contact corresponding described tin cream 5 (as Figure 14 and Figure 15).Like this, can make described weld part 337 earlier outwards skew avoid described tin cream 5, then reply contacting described tin cream 5, thereby can reduce the not even described tin cream 5 of pushing tow, avoid the generation of failure welding and short circuit.
In the present embodiment, because described weld pad 13 is arranged at described circuit board 1 surface, but not in the pothole, so can adopt the mode of printing setting, and can together be provided with other locational tin cream of circuit board, so simple to operate, efficient is higher, and can guarantee operational quality.
Only more than describe explanation in detail for the present invention's preferred embodiment, non-so limit to claim of the present invention, so the equivalence techniques variation that all this creation of utilization specifications and diagramatic content are done all is contained in the claim of the present invention.
Claims (20)
1. an electronic building brick is characterized in that, comprising:
One circuit board, wherein a surface is provided with a bed hedgehopping portion, and is provided with a plurality of weld pads in described bed hedgehopping portion; And
One electronic component, insert and be welded in described circuit board surface along described circuit board one end, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and have a weld part and be located at the portion that struts of described weld part rear end, with respect to described weld part, the described portion of strutting is deviation in the horizontal, more approach described circuit board on the short transverse, make in the insertion process, the described portion of strutting is positioned between the adjacent described weld pad, and strutted earlier by described bed hedgehopping portion, drive described weld part and outwards be offset, then cross described bed hedgehopping portion and reply, drive described weld part and reply and lay respectively at the positive outside of described weld pad.
2. electronic building brick as claimed in claim 1 is characterized in that: described circuit board upper and lower surface is equipped with described bed hedgehopping portion, and correspondingly, described terminal is arranged in two rows, respectively the described weld pad of corresponding upper and lower surface.
3. electronic building brick as claimed in claim 1 is characterized in that: the described portion of strutting is parallel with described weld part in the vertical.
4. electronic building brick as claimed in claim 3 is characterized in that: the oblique backwards extension in described weld part rear end is provided with connecting portion, and the described portion that struts is extended to form backwards by described connecting portion end.
5. electronic building brick as claimed in claim 1 is characterized in that: each described terminal comprises that also one is fixed in the fixed part of described insulating body, and described weld part is parallel to described fixed part and away from described circuit board on short transverse.
6. electronic building brick as claimed in claim 5 is characterized in that: described fixed part rear end extends outwardly and is provided with an epitaxy part, and described weld part is extended to form backwards by described epitaxy part end.
7. as arbitrary described electronic building brick in the claim 1 to 6, it is characterized in that: with respect to described weld part, the described portion of strutting deviation distance in the horizontal equals half of distance between described weld part and the adjacent described weld part.
8. an electronic assembly manufacturing method is characterized in that, comprises the steps:
One circuit board is provided, and wherein a surface is provided with a bed hedgehopping portion, and is provided with a plurality of weld pads in described bed hedgehopping portion;
A plurality of tin creams are provided, place respectively on the corresponding described weld pad;
One electronic component is provided, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and have a weld part and be located at the portion that struts of described weld part rear end, with respect to described weld part, the described portion of strutting is deviation in the horizontal, more approaches described circuit board on the short transverse;
Described electronic component is installed on the described circuit board along described circuit board one end insertion, the described portion of strutting is positioned between the adjacent described weld pad during insertion, in the insertion process, the described portion of strutting is strutted by described bed hedgehopping portion earlier, drive the outside skew of described weld part and be located at the corresponding described tin cream outside, the then described portion of strutting crosses described bed hedgehopping portion and replys, and drives described weld part answer and makes it contact corresponding described tin cream; And
Heating makes described tin cream fusing form welding material, and described weld part is connected with corresponding described weld pad respectively.
9. electronic assembly manufacturing method as claimed in claim 8 is characterized in that: described circuit board upper and lower surface is equipped with described bed hedgehopping portion, and correspondingly, described terminal is arranged in two rows, respectively the described weld pad of corresponding upper and lower surface.
10. as claim 9 or 10 described electronic assembly manufacturing methods, it is characterized in that: with respect to described weld part, the described portion of strutting deviation distance in the horizontal equals half of distance between described weld part and the adjacent described weld part.
11. an electronic building brick is characterized in that, comprising:
One circuit board, wherein a surface is provided with a depression, and is provided with a plurality of weld pads between described depression and corresponding ora terminalis; And
One electronic component, insert and be welded in described circuit board surface along described circuit board one end, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and have a weld part and be located at the portion that struts of described weld part rear end, with respect to described weld part, the described portion of strutting is deviation in the horizontal, more approach described circuit board on the short transverse, make in the insertion process, the described portion of strutting is positioned between the adjacent described weld pad, and strutted by described circuit board surface earlier, drive described weld part and outwards be offset, then enter described depression and reply, drive described weld part and reply and lay respectively at the positive outside of described weld pad.
12. electronic building brick as claimed in claim 1 is characterized in that: described circuit board upper and lower surface is equipped with described depression,
Correspondingly, described terminal is arranged in two rows, respectively the described weld pad of corresponding upper and lower surface.
13. electronic building brick as claimed in claim 1 is characterized in that: the described portion of strutting is parallel with described weld part in the vertical.
14. electronic building brick as claimed in claim 3 is characterized in that: the oblique backwards extension in described weld part rear end is provided with connecting portion, and the described portion that struts is extended to form backwards by described connecting portion end.
15. electronic building brick as claimed in claim 1 is characterized in that: each described terminal comprises that also one is fixed in the fixed part of described insulating body, and described weld part is parallel to described fixed part and away from described circuit board on short transverse.
16. electronic building brick as claimed in claim 5 is characterized in that: described fixed part rear end extends outwardly and is provided with an epitaxy part, and described weld part is extended to form backwards by described epitaxy part end.
17. as arbitrary described electronic building brick in the claim 1 to 6, it is characterized in that: with respect to described weld part, the described portion of strutting deviation distance in the horizontal equals half of distance between described weld part and the adjacent described weld part.
18. an electronic assembly manufacturing method is characterized in that, comprises the steps:
One circuit board is provided, and wherein a surface is provided with a depression, and is provided with a plurality of weld pads between described depression and corresponding ora terminalis;
A plurality of tin creams are provided, place respectively on the corresponding described weld pad;
One electronic component is provided, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and have a weld part and be located at the portion that struts of described weld part rear end, with respect to described weld part, the described portion of strutting is deviation in the horizontal, more approaches described circuit board on the short transverse;
Described electronic component is installed on the described circuit board along described circuit board one end insertion, the described portion of strutting is positioned between the adjacent described weld pad during insertion, in the insertion process, the described portion of strutting is strutted by described circuit board surface earlier, drive the outside skew of described weld part and be located at the corresponding described tin cream outside, the then described portion of strutting enters described depression and replys, and drives described weld part answer and makes it contact corresponding described tin cream; And
Heating makes described tin cream fusing form welding material, and described weld part is connected with corresponding described weld pad respectively.
19. electronic assembly manufacturing method as claimed in claim 8 is characterized in that: described circuit board upper and lower surface is equipped with described depression, and correspondingly, described terminal is arranged in two rows, respectively the described weld pad of corresponding upper and lower surface.
20. as claim 9 or 10 described electronic assembly manufacturing methods, it is characterized in that: with respect to described weld part, the described portion of strutting deviation distance in the horizontal equals half of distance between described weld part and the adjacent described weld part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100053522A CN102074813B (en) | 2011-01-10 | 2011-01-10 | Electronic assembly and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100053522A CN102074813B (en) | 2011-01-10 | 2011-01-10 | Electronic assembly and production method thereof |
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| CN102074813A true CN102074813A (en) | 2011-05-25 |
| CN102074813B CN102074813B (en) | 2013-12-04 |
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| CN101867106A (en) * | 2010-05-21 | 2010-10-20 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
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|---|---|---|---|---|
| US4303291A (en) * | 1980-11-24 | 1981-12-01 | Western Electric Company, Inc. | Method of seating connector terminals on circuit board contact pads |
| CN2424543Y (en) * | 2000-04-29 | 2001-03-21 | 州邑企业有限公司 | Electrical connector |
| US6623302B2 (en) * | 2000-12-21 | 2003-09-23 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having printed substrates therein electrically contacting conductive contacts thereof by solderless |
| CN1825711A (en) * | 2005-02-23 | 2006-08-30 | 日本电气株式会社 | Connector device |
| CN101257158A (en) * | 2008-04-01 | 2008-09-03 | 东莞捷仕美电子有限公司 | Card connector terminal and manufacturing method thereof |
| CN201336406Y (en) * | 2008-12-05 | 2009-10-28 | 富港电子（东莞）有限公司 | Electrical connector |
| CN201438550U (en) * | 2009-06-09 | 2010-04-14 | 富士康(昆山)电脑接插件有限公司 | Terminal of electrical connector |
| CN101867106A (en) * | 2010-05-21 | 2010-10-20 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
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| CN102074813B (en) | 2013-12-04 |
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