CN101855382B - Method for forming sputtering film on three-dimensional work and apparatus used in the method - Google Patents
Method for forming sputtering film on three-dimensional work and apparatus used in the method Download PDFInfo
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- CN101855382B CN101855382B CN200880116299.XA CN200880116299A CN101855382B CN 101855382 B CN101855382 B CN 101855382B CN 200880116299 A CN200880116299 A CN 200880116299A CN 101855382 B CN101855382 B CN 101855382B
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- 238000004544 sputter deposition Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims description 10
- 239000002245 particle Substances 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 4
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 17
- 239000007789 gas Substances 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000013022 venting Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Provided is a sputtering technology for uniformly forming a film with sputter particles even on a work having a complicated three-dimensional shape. The film is formed on the three-dimensional work, which is attached to a rotating carousel-type work holder arranged to face the target, by sputtering the target. The three-dimensional work is rotated by means of a shaft arranged within a surface vertical to a surface which connects the target and the rotating shaft of the carousel-type work holder. At least for a partial time during the total sputtering time, the main scattering direction of the spatter particles scattering from the target is permitted to be a direction decentered from the center direction of the rotating shaft of the carousel-type work holder.
Description
Technical field
The present invention relates to by method and the device thereof of sputter in the even film forming of workpiece of the 3D shape of complexity.
Background technology
So far, sputter is in the fields such as semi-conductor, liquid crystal, plasma display, CD, the technology of even film forming sputter particle on the level and smooth workpiece of the two dimensions such as metal or plastics.
But, be not only in recent years the level and smooth workpiece of aforesaid two dimension, the workpiece that the body of photographic camera, mobile telephone etc., peripheral hardware product etc. has a complex three-dimensional forms also is required sputter particle film forming equably.
Use existing sputtering apparatus when the workpiece with complicated 3D shape carries out film forming, because strong by the particle rectilinearity of sputter from target, hardly can scattering, therefore have not the problem poor with the covering power of the side of target subtend or top and bottom.
Summary of the invention
Therefore, even problem of the present invention also can be with the sputter technology of the even film forming of sputter particle at the 3D shape workpiece with complexity for providing.
The result that the inventor studies intensively in order to solve above-mentioned problem, discovery sputtered target material and when carrying out film forming when rotation is installed on the workpiece of 3D shape of rotating disc type anchor clamps, in whole sputter at least a portion in the time within the time, make the master of the sputter particle that disperses from the described target direction of dispersing become eccentric direction by rotating shaft center's direction of described rotating disc type workholder, accordingly can be with the even film forming of sputter particle on the workpiece with complicated 3D shape, thus the present invention finished.
Namely, the present invention is a kind of sputtering film forming method that workpiece with 3D shape is carried out, belong to by sputtered target material, and to being installed in the method for carrying out film forming with the workpiece of the 3D shape of the setting of target subtend and the rotating disc type workholder that is rotated, it is characterized in that:
Described workpiece with 3D shape is rotated to be positioned at the axle that connects described target and the vertical surface on the plane of the turning axle of rotating disc type workholder,
And,
In whole sputter at least a portion in the time within the time, make the master of the sputter particle that disperses from the described target direction of dispersing be eccentric in rotating shaft center's direction of described rotating disc type workholder.
And the present invention is a kind of sputtering apparatus, and this sputtering apparatus has target and with the setting of target subtend and have the rotating disc type workholder of turning axle, it is characterized by in vacuum chamber:
Described rotating disc type workholder has workholder support portion and a plurality of workpiece maintaining part, described workpiece maintaining part is arranged at the peripheral part of described workholder support portion, described rotating disc type workholder and/or workpiece maintaining part are arranged to be positioned at the axle rotation of vertical surface on the plane of the turning axle that connects target and rotating disc type workholder
Described target has turning axle and is arranged to and can rotate to left and right direction.
And the present invention is a kind of sputtering apparatus, and this sputtering apparatus has target, target magnet and with the setting of target subtend and have the rotating disc type workholder of turning axle, it is characterized by in vacuum chamber:
Described rotating disc type workholder has workholder support portion and a plurality of workpiece maintaining part, described workpiece maintaining part is arranged at the peripheral part of described workholder support portion, described rotating disc type workholder and/or workpiece maintaining part are arranged to be positioned at the axle rotation of vertical surface on the plane of the turning axle that connects target and rotating disc type workholder
Described target magnet has turning axle and is arranged to and can rotate to left and right direction.
And the present invention is a kind of sputtering apparatus, and this sputtering apparatus has target and with the subtend setting of target magnet and have the rotating disc type workholder of turning axle, it is characterized by in vacuum chamber:
Described rotating disc type workholder has workholder support portion and a plurality of workpiece maintaining part, described workpiece maintaining part is arranged at the peripheral part of described workholder support portion, described rotating disc type workholder and/or workpiece maintaining part are arranged to be positioned at the axle rotation of vertical surface on the plane of the turning axle that connects target and rotating disc type workholder
Described target is configured such that the master of the sputter particle that disperses from the target direction of dispersing is eccentric in rotating shaft center's direction of described rotating disc type workholder.
And the present invention is a kind of sputtering apparatus, and this sputtering apparatus has target, target magnet and with the setting of target subtend and have the rotating disc type workholder of turning axle, it is characterized by in vacuum chamber:
Described rotating disc type workholder has workholder support portion and a plurality of workpiece maintaining part, described workpiece maintaining part is arranged at the peripheral part of described workholder support portion, described rotating disc type workholder and/or workpiece maintaining part are arranged to be positioned at the axle rotation of vertical surface on the plane of the turning axle that connects target and rotating disc type workholder
Be arranged to make the master of the sputter particle that disperses from the described target direction of dispersing to be eccentric in rotating shaft center's direction of described rotating disc type workholder described target magnet.
According to the present invention, even to having the workpiece sputter of 3D shape, also can make not with all platings of the side of target subtend or top and bottom good.
Thereby, also can have to the body of photographic camera, mobile telephone etc., peripheral hardware product etc. the workpiece of complex three-dimensional forms, with sputter particle film forming equably.
Description of drawings
Fig. 1 is the figure (among the figure, hollow arrow represents the turning direction of target magnet 5) of the major portion of expression coaxial-type anode for sputter coating of the present invention;
Fig. 2 is the A-A ' sectional view of Fig. 1;
Fig. 3 is the figure (among the figure, hollow arrow represents the turning direction of target magnet 5) of expression magnet arrangement;
Fig. 4 is the figure of expression from the magnet arrangement of the B direction observation of Fig. 3;
Fig. 5 is the figure (among the figure, hollow arrow represents the master of the sputter particle direction of dispersing) of the major portion of the coaxial-type anode for sputter coating of expression another kind of form of the present invention;
Fig. 6 is the figure of the structure of expression rotating disc type workholder;
Fig. 7 is the figure (among the figure, hollow arrow represents the turning direction of target magnet 5) of the major portion of the coaxial-type anode for sputter coating of expression another kind of form of the present invention;
Fig. 8 is the figure of the major portion of the coaxial-type anode for sputter coating of expression another kind of form of the present invention;
Fig. 9 is the figure of the major portion of the coaxial-type anode for sputter coating of expression another kind of form of the present invention.
Nomenclature: 1 is the coaxial-type anode for sputter coating, and 2 is vacuum chamber, and 3 is target, 4 is the magnet holding part, and 5 is target magnet, 5a, is the magnet support stick, 5b, 5c, 5d are magnet, and 6 is the rotating disc type workholder, and 6a is rotating disc type workholder support portion, 6b is the workpiece maintaining part, and 6c is hook, and 7 is workpiece, 8 is venting port, 9 is gas introduction port, and 10 are the plasma high-voltage power supply, and 11 is ground connection.
Embodiment
Continue below in conjunction with accompanying drawing that the present invention will be described, wherein accompanying drawing represents the anode for sputter coating (below be referred to as the coaxial-type anode for sputter coating) as the use round shape target of one embodiment of the present invention.
Fig. 1 is the figure of the major portion of model utility ground expression coaxial-type anode for sputter coating.Among the figure, 1 expression coaxial-type anode for sputter coating, 2 expression vacuum chambers, 3 expression round shape targets, 4 expression magnet holding parts, 5 expression target magnet, 6 expression rotating disc type workholders, the workpiece of 7 expression 3D shapes, 8 expression venting ports, 9 expression gas introduction ports.
And Fig. 2 is the A-A ' sectional view of Fig. 1.Among the figure, the represented parts of symbol 1～9 are identical with above-mentioned explanation, symbol 10 expression plasma high-voltage power supplies, and symbol 11 represents ground connection.
As long as vacuum chamber 2 within it section arranges target 3 and rotating disc type workholder 6, then have no particular limits for its size and shape.And, be provided with venting port 8 at vacuum chamber 2.This venting port 8 is used for connecting the vacuum pump (not shown) of rotor pump, turbomolecular pump etc.And, be provided with for the gas introduction port 9 that imports the employed gas of sputter at vacuum chamber 2.For the not special restriction of the gas that is used for sputter, can use such as argon gas, nitrogen, oxygen etc.
The inside of round shape target 3 is provided with magnet holding part 4, and section is provided with the target magnet 5 that has sufficient length with respect to round shape target 3 within it.Between round shape target 3 and magnet holding part 4, be supplied with the water coolant for cooling drum shape target 3.Target magnet 5 is made of three magnet 5b, 5c being fixed in magnet support stick 5a and 5d.Magnet 5b and 5d are made as the N utmost point with magnet support stick side, and the target side is made as the S utmost point, and magnet 5c then is arranged to opposite with magnet 5b and 5d magnetic pole (with reference to Fig. 3).And described magnet 5b and 5d connect at the upper and lower ends of target magnet 5, form ring texture (with reference to Fig. 4).If make described magnet 5 equilibratory magnetic fields, can make the magnetic force of magnet 5c be equivalent to the magnetic force of the magnet that is consisted of by magnet 5b and 5d, if and to make magnet 5 produce nonequilibrium magnetic field, can make the magnetic force of magnet 5c be weaker than the magnetic force of the magnet that is consisted of by magnet 5b and 5d.
Use described round shape target 3 and target magnet 5, in all sputters at least a portion in the time in the time, the master of the sputter particle that disperses from described round shape target 3 direction of dispersing is set to direction (below, be referred to as " eccentric direction ") from the rotating shaft eccentric of rotating disc type workholder 6 described later.At this, the master of the sputter particle direction of dispersing refers to be arranged on the direction that the center at two the strongest places of the magnetic field of inner target magnet 5 is connected with the center of round shape target 3.
For the master of the sputter particle direction of dispersing is set to eccentric direction, for example shown in Figure 1, round shape target 3 is arranged to and rotating disc type workholder 6 subtends described later, and the described target magnet 5 that will be arranged at described round shape target 3 inside is arranged to and can be rotated to left and right direction with the axle identical with round shape target 3.The slewing area of target magnet 5 has no particular limits, as long as can be at the workpiece 7 of 3D shape with the even film forming of sputter particle.And, by controlling described rotation, make that to compare the sputter of center position for the sputter of workpiece 7 eccentric directions of three-dimensional longer for good.
And, be set to the other means of eccentric direction as the master of the sputter particle direction of dispersing, for example shown in Figure 5, with round shape target 3 and rotating disc type workholder 6 subtend settings described later, and be arranged to make the master of the sputter particle that disperses from round shape target 3 direction of dispersing to be eccentric in the direction of the turning axle of rotating disc type workholder 6 the target magnet 5.At this moment, be preferably that target magnet 5 does not rotate and the position is fixed, at all sputters in the time, the master of the sputter particle that disperses from round shape target 3 direction of dispersing is set to eccentric direction.And this moment, round shape target 3 arranged a plurality ofly, was preferably and arranged two.
Rotating disc type workholder 6 is arranged to and round shape target 3 subtends.As shown in Figure 6, described rotating disc type workholder 6 is made of slightly cylindric workholder support portion 6a and a plurality of workpiece maintaining part 6b, and workpiece maintaining part 6b possesses a plurality of hook 6c for fixation workpiece.Workpiece maintaining part 6b is arranged on the peripheral part of described workholder support portion 6a.Described rotating disc type workholder 6 and/or workpiece maintaining part 6b are arranged to and can rotate with the parallel shafts that is positioned at the axle that connects round shape target 3 and the vertical surface on the plane of the turning axle of rotating disc type workholder 6, preferably be arranged to form with the axle with columnar target 3 parallel axle rotation, thus separately independence or synchronous rotary (revolution, rotation).Described rotating disc type workholder 6 and vacuum chamber 2 electrical isolations.
And, in the present invention, for in the workpiece 7 of 3D shape film forming more equably, extremely shown in Figure 9 such as Fig. 7, except the round shape target 3 that arranges with rotating disc type workholder 6 subtends, preferably above the rotating disc type workholder 6 and/or below round shape target 3 (section is provided with magnet holding part 4 and target magnet 5 within it) is set.And the rotating manner that make the target magnet 5 that is arranged at round shape target 3 inside this moment is identical with foregoing target magnet 5, adjust accordingly 3D shape workpiece 7 about covering power.
In device described above, when carrying out sputter, at first after vacuum chamber 2 carries out exhaust, supply sputter gas.Then, provide electric power (in the situation of direct supply, target 3 being made as negative electrode) by the high-voltage power supply 10 that is connected in target 3 and vacuum chamber 2, begin glow discharge according to this and can begin to carry out sputter.
In the described device, in at least a portion time of whole sputter in the time, make the master of the sputter particle that disperses from the described target direction of dispersing be eccentric in the direction of the turning axle of described rotating disc type workholder, accordingly can be with the even film forming of sputter particle in the workpiece of the 3D shape that is installed in the rotating disc type workholder.
And, carry out sputter by top and/or below from the workpiece of described 3D shape, can carry out the film forming of the outstanding and uniform film thickness of covering power.
Adopt aforesaid coaxial-type anode for sputter coating of the present invention, with following condition when the workpiece plated film of 3D shape, film forming equably.
＜filming condition 〉
Workpiece (shape): BS resin (mobile phone outer casing)
Sputter gas: argon
Target: titanium
The layout of target: the layout of (1) Fig. 1
(2) layout of Fig. 5
(3) layout of Fig. 6
(4) layout of Fig. 7
(5) layout of Fig. 8
Magnetic field: unbalanced type
Vacuum tightness in the chamber: 10
-3～10
-4Torr
Power input: 10kW
Power supply type: direct current
Time: 20～30 minutes
And, in the above description, although to columnar target is illustrated as the coaxial-type anode for sputter coating that target uses, even if but the present invention to such as the anode for sputter coating that plate shaped target is used as target, do not use the sputtering apparatus of target magnet etc., still can implement the present invention.
That is, when plate shaped target was used as target, the axle of the vertical surface on the plane that the axle that 3 D workpiece is had with the plane that is positioned at the sputter that will carry out plate shaped target is connected with the turning axle of rotating disc type workholder rotated and gets final product.In addition, when the sputtering apparatus of target magnet is not used in employing, target is arranged to and can be rotated to left and right direction, and rotating shaft center's direction that direction is eccentric in described rotating disc type workholder gets final product perhaps target to be arranged to make the master of the sputter particle that disperses from target to disperse.
Utilizability on the industry
The present invention can carry out sputter from all directions for the workpiece of complicated shape, can carry out uniform film forming thus.Therefore, not only on the level and smooth workpiece of two dimension, can also effectively be used on the workpiece of the 3D shapes such as body, peripheral hardware product at photographic camera, mobile telephone sputter particle film forming equably.
Claims (9)
1. sputtering film forming method that the workpiece of 3D shape is carried out by the round shape target is carried out sputter, carries out film forming to the workpiece that is installed on the 3D shape on the rotating disc type workholder with described round shape target subtend setting and rotation, it is characterized in that:
The workpiece of described 3D shape is rotated with the axle that the axle with the round shape target parallels,
And,
In whole sputter at least a portion in the time within the time, make the master of the sputter particle that disperses from the described round shape target direction of dispersing be eccentric in rotating shaft center's direction of described rotating disc type workholder.
2. the sputtering film forming method that the workpiece of 3D shape is carried out according to claim 1 is characterized in that, carries out sputter from top and/or the below of the workpiece of 3D shape.
3. the sputtering film forming method that the workpiece of 3D shape is carried out according to claim 1 and 2 is characterized in that, with magnetic control sputtering plating target is carried out sputter.
4. sputtering apparatus has the round shape target and with described round shape target subtend setting and have the rotating disc type workholder of turning axle, it is characterized in that in vacuum chamber:
Described rotating disc type workholder has workholder support portion and a plurality of workpiece maintaining part, described workpiece maintaining part is arranged at the peripheral part of described workholder support portion, the axle that described rotating disc type workholder and/or workpiece maintaining part are arranged to parallel with the axle with the round shape target rotates
Described round shape target has turning axle and can rotate to left and right direction.
5. sputtering apparatus has round shape target, target magnet and with the subtend setting of round shape target and have the rotating disc type workholder of turning axle, it is characterized in that in vacuum chamber:
Described rotating disc type workholder has workholder support portion and a plurality of workpiece maintaining part, described workpiece maintaining part is arranged at the peripheral part of described workholder support portion, the axle that described rotating disc type workholder and/or workpiece maintaining part are arranged to parallel with the axle with the round shape target rotates
Described target magnet has turning axle and can rotate to left and right direction.
6. workpiece film forming sputtering apparatus to 3D shape has the round shape target and with the subtend setting of round shape target and have the rotating disc type workholder of turning axle, it is characterized in that in vacuum chamber:
Described rotating disc type workholder is used for installing the workpiece of 3D shape, have workholder support portion and a plurality of workpiece maintaining part, described workpiece maintaining part is arranged at the peripheral part of described workholder support portion, the axle that described rotating disc type workholder and/or workpiece maintaining part are arranged to parallel with the axle with the round shape target rotates
Described round shape target is configured such that the master of the sputter particle that disperses from the round shape target direction of dispersing is eccentric in rotating shaft center's direction of described rotating disc type workholder.
7. workpiece film forming sputtering apparatus to 3D shape possesses round shape target, target magnet and with the subtend setting of round shape target and have the rotating disc type workholder of turning axle, it is characterized in that in vacuum chamber:
Described rotating disc type workholder is used for installing the workpiece of 3D shape, have workholder support portion and a plurality of workpiece maintaining part, described workpiece maintaining part is arranged at the peripheral part of described workholder support portion, the axle that described rotating disc type workholder and/or workpiece maintaining part are arranged to parallel with the axle with the round shape target rotates
Be arranged to make the master of the sputter particle that disperses from the described round shape target direction of dispersing to be eccentric in rotating shaft center's direction of described rotating disc type workholder described target magnet.
8. the described sputtering apparatus of any one in 7 according to claim 4 is characterized in that, the round shape target is arranged on top and/or the below of described rotating disc type workholder.
9. according to claim 5 or 7 described sputtering apparatuss, it is characterized in that it is inner that described target magnet is arranged at described target.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007294660 | 2007-11-13 | ||
| JP2007-294660 | 2007-11-13 | ||
| PCT/JP2008/070178 WO2009063789A1 (en) | 2007-11-13 | 2008-11-06 | Method for forming sputtering film on three-dimensional work and apparatus used in the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101855382A CN101855382A (en) | 2010-10-06 |
| CN101855382B true CN101855382B (en) | 2013-03-13 |
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ID=40638641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880116299.XA Expired - Fee Related CN101855382B (en) | 2007-11-13 | 2008-11-06 | Method for forming sputtering film on three-dimensional work and apparatus used in the method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5307723B2 (en) |
| KR (1) | KR101246131B1 (en) |
| CN (1) | CN101855382B (en) |
| TW (1) | TWI481734B (en) |
| WO (1) | WO2009063789A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018115516A1 (en) | 2017-06-28 | 2019-01-03 | Solayer Gmbh | Sputtering apparatus and sputtering method for coating three-dimensionally shaped substrate surfaces |
| EP3508611B1 (en) * | 2018-01-04 | 2023-03-15 | Raytheon Technologies Corporation | Metallic coating process for combustor panels using a barrel configuration |
| KR102399748B1 (en) * | 2018-10-01 | 2022-05-19 | 주식회사 테토스 | A device for depositing a metal film on a surface of a three-dimensional object |
| EP4324015A1 (en) * | 2021-04-16 | 2024-02-21 | Evatec AG | Sputtering apparatus for coating of 3d-objects |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86205741U (en) * | 1986-08-16 | 1987-07-15 | 北京市有色金属研究总院 | Coating device for physical vapor deposition |
| CN1580317A (en) * | 2004-05-20 | 2005-02-16 | 中国科学院上海光学精密机械研究所 | Control device for three-dimensional movement of clamp |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0768614B2 (en) * | 1990-03-05 | 1995-07-26 | 宇部興産株式会社 | Carousel type sputtering device and spattering method thereof |
| JP2004300465A (en) * | 2003-03-28 | 2004-10-28 | Matsushita Electric Ind Co Ltd | Sputtering apparatus |
| JP2005133110A (en) * | 2003-10-28 | 2005-05-26 | Konica Minolta Opto Inc | Sputtering system |
| JP2005163151A (en) * | 2003-12-04 | 2005-06-23 | Seinan Kogyo Kk | Three-dimensional sputter film deposition apparatus and method |
| JP2007162049A (en) * | 2005-12-12 | 2007-06-28 | Asahi Techno Glass Corp | Carousel type sputtering system |
| JP2007170215A (en) * | 2005-12-20 | 2007-07-05 | Yamaha Motor Co Ltd | Component for internal combustion engines and its manufacturing method |
-
2008
- 2008-11-06 CN CN200880116299.XA patent/CN101855382B/en not_active Expired - Fee Related
- 2008-11-06 KR KR1020107010731A patent/KR101246131B1/en not_active IP Right Cessation
- 2008-11-06 WO PCT/JP2008/070178 patent/WO2009063789A1/en active Application Filing
- 2008-11-06 JP JP2009541108A patent/JP5307723B2/en not_active Expired - Fee Related
- 2008-11-13 TW TW097143911A patent/TWI481734B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86205741U (en) * | 1986-08-16 | 1987-07-15 | 北京市有色金属研究总院 | Coating device for physical vapor deposition |
| CN1580317A (en) * | 2004-05-20 | 2005-02-16 | 中国科学院上海光学精密机械研究所 | Control device for three-dimensional movement of clamp |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2005-133110A 2005.05.26 |
| JP特开2007-162049A 2007.06.28 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5307723B2 (en) | 2013-10-02 |
| TWI481734B (en) | 2015-04-21 |
| WO2009063789A1 (en) | 2009-05-22 |
| KR20100084658A (en) | 2010-07-27 |
| KR101246131B1 (en) | 2013-03-21 |
| CN101855382A (en) | 2010-10-06 |
| JPWO2009063789A1 (en) | 2011-03-31 |
| TW200940731A (en) | 2009-10-01 |
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