CN101853896A - Method for removing materials of edges of settled layer of thin-film solar cell - Google Patents
Method for removing materials of edges of settled layer of thin-film solar cell Download PDFInfo
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- CN101853896A CN101853896A CN200910130063A CN200910130063A CN101853896A CN 101853896 A CN101853896 A CN 101853896A CN 200910130063 A CN200910130063 A CN 200910130063A CN 200910130063 A CN200910130063 A CN 200910130063A CN 101853896 A CN101853896 A CN 101853896A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a method for removing materials of edges of a settled layer of a thin-film solar cell. In the method, the settled layer of the thin-film solar cell adjacent to substrate edges is removed by using an ultrasonic cutter, preferably, an air-extractor is matched, and processing scraps and dusts are sucked and removed while the cutter is used for removing materials. Compared with the traditional method for removing materials in the manner of sand blasting, the invention can reduce the processing scraps and dusts remained on the thin-film solar cell; and compared with the traditional method in the manner of laser processing, the invention requires lower cost and has faster processing speed.
Description
Technical field
The present invention relates to a kind of method for removing materials of edges of settled layer of thin-film solar cell, particularly a kind of method by utilizing the ultrasonic wave cutter that the edges of settled layer of thin-film solar cells is removed.
Background technology
Thin-film solar cells is to deposit the sedimentary deposit that one deck has conductivity on the substrate of plastic cement, glass or metal, sedimentary deposit roughly comprises a nesa coating (TCO film), a P-I-N silicon thin film and a back of the body contact membranes, and every layer of deposited film all need cut out the independent battery block (cell) of suitable distance, can produce photoelectric film to form.After above-mentioned sedimentary deposit deposition finishes, must remove the zone that sedimentary deposit is positioned at substrate edges, to avoid producing short circuit phenomenon when follow-up envelope frame is assembled, this processing procedure of removing the edges of settled layer zone is called the edge and removes (Edge Deletion).
Existing mode of carrying out removing at the edge is to be undertaken by sandblast or laser hot melt, yet, sandblast is owing to be difficult for than being easier to cause chip or dust to remain in the slit between the battery block or on the thin-film solar cells, removing, and the laser hot melt then is that speed is slow and cost is higher.
Summary of the invention
Therefore, utilize sandblast to make chip or dust remain in the problem of battery block easily at aforementioned, and utilize the laser hot melt that the slow and cost problem of higher of speed is arranged easily, the invention provides a kind of method for removing materials of edges of settled layer of thin-film solar cell, can reduce machining chips, dust is residual, and cost is lower, process velocity is very fast.
Method for removing materials of edges of settled layer of thin-film solar cell of the present invention by utilizing the substrate edges feeding of a ultrasonic wave cutter along this thin-film solar cells, is removed the sedimentary deposit at this thin-film solar cells adjacent substrates edge.
Method for removing materials of edges of settled layer of thin-film solar cell of the present invention drives this ultrasonic wave cutter and removes before the material, utilizes a shade to cover this sedimentary deposit earlier and fringe region that this sedimentary deposit desire is removed exposes.
Method for removing materials of edges of settled layer of thin-film solar cell of the present invention when this ultrasonic wave cutter is driven feeding except that material, is bled around this ultrasonic wave cutter simultaneously, detaches with the chip with this sedimentary deposit.
Method for removing materials of edges of settled layer of thin-film solar cell of the present invention, after this thin-film solar cells being positioned at the sedimentary deposit removal of substrate edges when this ultrasonic wave cutter, the chip, the dust shake that utilize vibration of ultrasonic wave will residue in this thin-film solar cells remove.
Method for removing materials of edges of settled layer of thin-film solar cell of the present invention, this ultrasonic wave cutter is driven the mode feeding with milling, cutting or grinding.
Method for removing materials of edges of settled layer of thin-film solar cell of the present invention when this ultrasonic wave cutter is driven feeding, drives this ultrasonic wave cutter simultaneously around self center rotation.
Beneficial effect of the present invention is: by utilizing the ultrasonic wave cutter edges of settled layer of thin-film solar cell is removed the material operation, mode compared to sandblast in the past, can reduce chip, dust is residual, and compared to the mode of utilizing laser processing, not only process velocity is very fast, and cost is also cheaper.
Description of drawings
Fig. 1 is the structural representation of a thin-film solar cells.
Fig. 2 removes material equipment schematic diagram according to method for removing materials of edges of settled layer of thin-film solar cell of the present invention employed.
Fig. 3 is the flow chart of steps according to a preferred embodiment of method for removing materials of edges of settled layer of thin-film solar cell of the present invention.
Fig. 4 is according in the preferred embodiment of method for removing materials of the present invention, and shade is covered in schematic diagram on the settled layer of thin-film solar cell.
Fig. 5 is according in the preferred embodiment of method for removing materials of the present invention, utilizes the ultrasonic wave cutter to remove the schematic diagram of material.
Fig. 6 is according in the preferred embodiment of method for removing materials of the present invention, the schematic side view of utilizing the ultrasonic wave cutter to remove material and bleed simultaneously.
Fig. 7 is according in the preferred embodiment of method for removing materials of the present invention, utilizes the ultrasonic wave cutter of another kind of structure to remove the schematic diagram of expecting, and the cover body that do not draw among Fig. 7.
Fig. 8 is according in the preferred embodiment of method for removing materials of the present invention, utilizes the ultrasonic wave cutter of another structure to remove the schematic diagram of expecting, and the cover body that do not draw among Fig. 8.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples.
Consult Fig. 1, zone (as shown in Figure 1 the imaginary line block) excision of method for removing materials of edges of settled layer of thin-film solar cell of the present invention in order to the sedimentary deposit 12 of thin-film solar cells 1 is positioned at substrate 11 edges.The sedimentary deposit 12 that general thin-film solar cells 1 comprises a substrate 11 and is deposited on substrate 11, the sedimentary deposit 12 of following examples indication roughly comprises a nesa coating (TCO film), a P-I-N film and a back of the body contact membranes, but the machinable thin-film solar cells of the present invention is not exceeded with this aspect, mainly be that substrate 11 tops and the electric conducting material that is positioned at substrate 11 edges are removed, make the edge offset (offset) of electric conducting material go into the inboard, edge of substrate 11, avoid thin-film solar cells 1 phenomenon that when the assembling of follow-up envelope frame, is short-circuited easily.
As shown in Figure 2, method for removing materials of edges of settled layer of thin-film solar cell of the present invention utilizes one to remove material equipment 2 and carry out, remove material equipment 2 and comprise that a conveying mechanism 21, is positioned at the processing platform 22 in conveying mechanism 21 downstreams, a cleaning platform 23 and a tipping wagons structure 24 (see figure 5)s, processing platform 22 comprises that a platform body 221, is positioned at platform body 221 tops and can be driven the past shade 222 of bottom offset to be close to platform body 221, and a dust excluder 223 that is set around contiguous outer rim place, shade 222 bottom surfaces, dust excluder 223 can be a rubber-like rubber material etc.Tipping wagons structure 24 comprises that a ultrasonic wave cutter 241, is located at outside the ultrasonic wave cutter 241 and the air-extractor (figure do not show) of the cover body 242 of bottom opening and in order to being bled in cover body 242 inner spaces.
Consult Fig. 3, a preferred embodiment of method for removing materials of edges of settled layer of thin-film solar cell of the present invention may further comprise the steps:
Step 11: utilize shade 222 to be covered in sedimentary deposit 12 middle sections of thin-film solar cells 1.Cooperate and consult Fig. 2, Fig. 4, in this step, thin-film solar cells 1 is delivered on the platform body 221 and the location by conveying mechanism 21, the mode that thin-film solar cells 1 is positioned platform body 221 can be to utilize modes such as vacuum suction or mechanical positioning, then, driving is positioned at the shade 222 past bottom offsets of platform body 221 tops with adjacent films solar cell 1 again, and the dust excluder 223 that makes shade 222 bottom surfaces is contacted with on the sedimentary deposit 12 of thin-film solar cells 1 (as shown in Figure 6), herein, the area of shade 222 is less than the area of sedimentary deposit 12, to such an extent as to when shade 222 was covered on the sedimentary deposit 12 of thin-film solar cells 1, sedimentary deposit 12 fringe regions that thin-film solar cells 1 desire is removed exposed.
Step 12: drive ultrasonic wave cutter 241 and remove material.Cooperate and consult Fig. 2, Fig. 4, Fig. 5, Fig. 6, after on the sedimentary deposit 12 that shade 222 is covered in thin-film solar cells 1, just can drive ultrasonic wave cutter 241 and remove the material operation, in the present embodiment, make ultrasonic wave cutter 241 end sides to towards sedimentary deposit 12 central authorities and around self center rotation and with the mode feeding of grinding, cooperate vibration of ultrasonic wave to process again, whereby substrate 11 tops being exposed to shade 222 outer sedimentary deposit 12 fringe regions removes, herein, driving 241 feedings of ultrasonic wave cutter can utilize programme controlled mode to drive, in addition, what deserves to be mentioned is, in this step, when ultrasonic wave cutter 241 removes the material operation, utilize air-extractor that cover body 242 volume inside are bled (shown in the direction of arrow of Fig. 6) simultaneously, make ultrasonic wave cutter 241 surrounding spaces that covered by cover body 242 produce negative pressure, will add sedimentary deposit 12 chips that produced man-hour, dust detaches, and avoids machining chips, dust residues on the thin-film solar cells 1.
Step 13: ultrasonic waves for cleaning.Cooperate and consult Fig. 2, after ultrasonic wave cutter 241 is positioned at sedimentary deposit 12 the material removal at substrate 11 edges, then again the thin-film solar cells 1 that processes is moved on the cleaning platform 23, in the present embodiment, cleaning platform 23 is a vibration of ultrasonic wave platform, utilize the mode of vibration of ultrasonic wave, or cooperate the air blowing mode again, thin-film solar cells 1 is carried out " dry-cleaning ", the machining chips that still remains on the thin-film solar cells 1 is removed, promptly finished the operation of sedimentary deposit 12 removing materials of edges of thin-film solar cells 1.
In the abovementioned steps 11, another effect that utilizes shade 222 to cover sedimentary deposit 12 middle sections before processing is, dust excluder 223 by shade 222 bottom surfaces is provided with, also can avoid removing the chip that produced in the material process and dust and fly into sedimentary deposit 12 in the zone that shade 222 is covered or fall into gap between the battery block, cause follow-up cleaning difficult.
Consult Fig. 6, Fig. 7, in the abovementioned steps 12, in another kind of way, the structure of ultrasonic wave cutter 241 ' also can similar scraper structure, and with the feeding of scraping mode and cooperate vibration of ultrasonic wave, perhaps, ultrasonic wave cutter 241 " structure also can similar emery wheel structure; add man-hour, drive ultrasonic wave cutter 241 " the terminal rotation down and around self center and along substrate 11 edges of thin-film solar cells 1 with the mode feeding of similar milling and cooperate vibration of ultrasonic wave.
In addition, the present invention is utilizing ultrasonic wave cutter 241,241 ', 241 " remove when material, do not exceed with single cutter yet, also can be that many group cutters remove the different outer rims place of thin-film solar cells 1 simultaneously with the different directions feeding and expect operation.
In sum, the present invention carries out the sedimentary deposit 12 removing materials of edges operations of thin-film solar cells 1 by utilizing ultrasonic wave cutter 241, cooperate again and add the operation of bleeding simultaneously man-hour and the operation of follow-up ultrasonic waves for cleaning, mode compared to sandblast in the past, can reduce chip, dust is residual, and compared to the mode of utilizing laser processing, not only process velocity is very fast, cost is also cheaper, so can reach purpose of the present invention really.
Claims (7)
1. method for removing materials of edges of settled layer of thin-film solar cell, it is characterized in that, this method for removing materials of edges of settled layer of thin-film solar cell is by utilizing the substrate edges feeding of a ultrasonic wave cutter along this thin-film solar cells, and the sedimentary deposit that this thin-film solar cells is positioned at substrate edges is removed.
2. method for removing materials of edges of settled layer of thin-film solar cell according to claim 1 is characterized in that, when this ultrasonic wave cutter is driven feeding except that material, bleeds in this ultrasonic wave cutter peripheral region simultaneously, detaches with the chip with this sedimentary deposit.
3. method for removing materials of edges of settled layer of thin-film solar cell according to claim 2 is characterized in that, drives this ultrasonic wave cutter and removes before the material, utilizes a shade to cover this sedimentary deposit earlier and fringe region that this sedimentary deposit desire is removed exposes.
4. method for removing materials of edges of settled layer of thin-film solar cell according to claim 1 is characterized in that, drives this ultrasonic wave cutter and removes before the material, utilizes a shade to cover this sedimentary deposit earlier and fringe region that this sedimentary deposit desire is removed exposes.
5. method for removing materials of edges of settled layer of thin-film solar cell according to claim 1, it is characterized in that, after this thin-film solar cells being positioned at the sedimentary deposit removal of substrate edges when this ultrasonic wave cutter, the chip, the dust shake that utilize vibration of ultrasonic wave will residue in this thin-film solar cells remove.
6. method for removing materials of edges of settled layer of thin-film solar cell according to claim 1 is characterized in that, this ultrasonic wave cutter is driven the mode feeding with milling, cutting or grinding.
7. method for removing materials of edges of settled layer of thin-film solar cell according to claim 1 is characterized in that, when this ultrasonic wave cutter is driven feeding, drives this ultrasonic wave cutter simultaneously around self center rotation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910130063A CN101853896A (en) | 2009-04-03 | 2009-04-03 | Method for removing materials of edges of settled layer of thin-film solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910130063A CN101853896A (en) | 2009-04-03 | 2009-04-03 | Method for removing materials of edges of settled layer of thin-film solar cell |
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| Publication Number | Publication Date |
|---|---|
| CN101853896A true CN101853896A (en) | 2010-10-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910130063A Pending CN101853896A (en) | 2009-04-03 | 2009-04-03 | Method for removing materials of edges of settled layer of thin-film solar cell |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103165729A (en) * | 2011-12-09 | 2013-06-19 | 龙焱能源科技（杭州）有限公司 | Method and device for photovoltaic assembly sand blasting edge abrading |
| CN107186537A (en) * | 2017-07-13 | 2017-09-22 | 昂华（上海）自动化工程股份有限公司 | A kind of milling device |
| WO2019104791A1 (en) * | 2017-11-30 | 2019-06-06 | 北京铂阳顶荣光伏科技有限公司 | Film solar cell film removal process and film solar cell |
-
2009
- 2009-04-03 CN CN200910130063A patent/CN101853896A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103165729A (en) * | 2011-12-09 | 2013-06-19 | 龙焱能源科技（杭州）有限公司 | Method and device for photovoltaic assembly sand blasting edge abrading |
| CN103165729B (en) * | 2011-12-09 | 2015-09-09 | 龙焱能源科技（杭州）有限公司 | Limit method and device are beaten in a kind of photovoltaic module sandblasting |
| CN107186537A (en) * | 2017-07-13 | 2017-09-22 | 昂华（上海）自动化工程股份有限公司 | A kind of milling device |
| WO2019104791A1 (en) * | 2017-11-30 | 2019-06-06 | 北京铂阳顶荣光伏科技有限公司 | Film solar cell film removal process and film solar cell |
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Application publication date: 20101006 |