CN210607215U - Cleaning jig for surface of sound surface filter wafer - Google Patents
Cleaning jig for surface of sound surface filter wafer Download PDFInfo
- Publication number
- CN210607215U CN210607215U CN201921879951.5U CN201921879951U CN210607215U CN 210607215 U CN210607215 U CN 210607215U CN 201921879951 U CN201921879951 U CN 201921879951U CN 210607215 U CN210607215 U CN 210607215U
- Authority
- CN
- China
- Prior art keywords
- wafer
- vacuum
- cleaning
- pipeline
- positioning groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a cleaning jig for the surface of a sound surface filter wafer, which comprises a cleaning platform, wherein a sealing cavity is formed inside the cleaning platform, the sealing cavity is connected with an external vacuumizing device through a first pipeline, and an air suction valve is arranged on the first pipeline; the upper surface of the cleaning platform is provided with a positioning groove, the shape of the positioning groove is matched with the external outline of the wafer, and air holes communicated with the sealed cavity are distributed on the surface of the positioning groove; the cleaning platform is connected with the vacuum alarm box through a second pipeline, and a digital display type vacuum gauge electrically connected with the vacuum alarm box is arranged on the second pipeline. The utility model discloses have the vacuum adsorption wafer function, the remaining clean effectual of wafer reverse side solvent, and avoid the wafer scratch that causes because of the personnel completely, break, reduced former material cost of scrapping.
Description
Technical Field
The utility model belongs to the technical field of wafer cleaning jig technique and specifically relates to a clean tool on sound table wave filter wafer surface.
Background
There are basically two ways for the current wafer dicing in the acoustic surface filter industry: one is to directly adopt the protection mode of CO2, water or refrigerating fluid to carry out cutting without coating a protective solvent; the other is to coat a layer of wafer protecting solvent on the surface of the wafer and then to cut the wafer, in order to protect the wafer from chipping or static electricity during cutting, and the other is to prevent foreign matters from falling on the surface of the wafer to cause poor characteristics. When the wafer is cut by adopting the wafer protection solvent coating method, the solvent overflows to the reverse side of the wafer, so that the solvent residue exists on the reverse side of the wafer after baking. The residual substances need to be cleaned, and the cleaning mode in the prior art is to use a dust-free cloth and alcohol to wipe the two sides of the wafer by holding the wafer by hands, but because the wafer is fragile, if the force is not uniform, the wafer is easy to break, or because the wafer is contacted manually for a long time, foreign matters and scratches are easy to occur.
SUMMERY OF THE UTILITY MODEL
The applicant provides a cleaning jig for the surface of the acoustic surface filter wafer, which is reasonable in structure, and aims to overcome the defects in the prior art, so that the wafer is prevented from being manually taken and placed, the uniform stress of the wafer is ensured, and the condition that the wafer is polluted by external foreign matters is effectively avoided.
The utility model discloses the technical scheme who adopts as follows:
a cleaning jig for the surface of a sound surface filter wafer comprises a cleaning platform, wherein a sealed cavity is formed inside the cleaning platform and is connected with an external vacuumizing device through a first pipeline, and an air suction valve is arranged on the first pipeline; the upper surface of the cleaning platform is provided with a positioning groove, the shape of the positioning groove is matched with the external outline of the wafer, and air holes communicated with the sealed cavity are distributed on the surface of the positioning groove; the cleaning platform is connected with the vacuum alarm box through a second pipeline, and a digital display type vacuum gauge electrically connected with the vacuum alarm box is arranged on the second pipeline.
As a further improvement of the above technical solution:
the vacuum suction pen is characterized by further comprising a vacuum suction pen, the tail part of the vacuum suction pen is connected with the air suction pipe, and the head part of the vacuum suction pen is provided with a conical suction head.
The locating slot has a circular outline, and the air holes on the surface are uniformly distributed in a radial shape by taking the circle center as the center.
The utility model has the advantages as follows:
the utility model discloses have the vacuum adsorption wafer function, avoid the wafer scratch that causes because of the personnel completely, break, reduced former material cost of scrapping. The positioning groove of the cleaning jig is used as a bearing support, and the cleaning effect of the residual solvent on the back surface of the wafer is better. The vacuum suction pen of the cleaning jig replaces the situation that personnel take the wafer, and the wafer is prevented from being polluted by the personnel. The utility model discloses compact structure, reasonable, convenient operation, it is with low costs, the suitability is strong.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic structural view of the vacuum suction pen of the present invention.
Wherein: 1. a vacuum alarm box; 2. cleaning the platform; 3. a digital display type vacuum gauge; 4. positioning a groove; 5. an air intake valve; 6. a vacuum suction pen; 7. a conical shaped suction head.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1 and fig. 2, the cleaning fixture for the surface of the wafer of the acoustic surface filter of the present embodiment includes a cleaning platform 2, a sealed cavity is formed inside the cleaning platform 2, the sealed cavity is connected to an external vacuum pumping device through a first pipeline, and an air suction valve 5 is disposed on the first pipeline; the upper surface of the cleaning platform 2 is provided with a positioning groove 4, the shape of the positioning groove 4 is matched with the external outline of the wafer, and air holes communicated with the sealed cavity are distributed on the surface of the positioning groove 4; the cleaning platform 2 is connected with the vacuum alarm box 1 through a second pipeline, and a digital display type vacuum gauge 3 electrically connected with the vacuum alarm box 1 is arranged on the second pipeline.
The vacuum suction pen also comprises a vacuum suction pen 6, the tail part of the vacuum suction pen 6 is connected with an air suction pipe, and the head part of the vacuum suction pen is provided with a conical suction head 7.
The positioning groove 4 has a circular outline, and air holes on the surface are uniformly distributed in a radial shape by taking the circle center as the center.
The utility model discloses at the implementation in-process, the mode that vacuum suction pen 6 inhaled the gassing through the vacuum replaces the wafer operation of personnel taking.
The cleaning platform 2 is internally provided with a sealed cavity, the positioning groove 4 on the surface is mainly used for bearing a wafer to be cleaned, and the suction valve 5 is mainly used for opening the suction valve 5 to suck the wafer through the cavity of the cleaning platform 2 when the wafer is placed in the positioning groove 4 with holes through the vacuum suction pen 6;
the digital display type vacuum gauge 3 mainly can display the current actual vacuum value of the chamber when the chamber of the cleaning platform 2 holds the wafer. The vacuum alarm box 1 has the function that when the display value of the display type vacuum gauge 3 is lower than a set value, an electronic signal is fed back to the vacuum alarm box 1, and the vacuum alarm box 1 gives out a vacuum abnormity alarm. The vacuum alarm box 1 and the digital display type vacuum gauge 3 can be commercially available products.
The utility model discloses the contaminated situation of product has been avoided to the mode that uses the vacuum suction pen to replace personnel to take the wafer. The cleaning platform 2 and the vacuum suction pen 6 replace a mode of manually taking and placing the cleaning wafer, so that the wafer is prevented from cracking. The vacuum adsorption mode can ensure that the wafer is not scratched during cleaning. And a vacuum alarm function is also added.
The above description is for the purpose of explanation and not limitation of the invention, which is defined in the claims, and any modifications may be made within the scope of the invention.
Claims (3)
1. A cleaning jig for the surface of a sound surface filter wafer is characterized in that: the cleaning device comprises a cleaning platform (2), wherein a sealed cavity is formed inside the cleaning platform (2), the sealed cavity is connected with an external vacuum-pumping device through a first pipeline, and a suction valve (5) is arranged on the first pipeline; a positioning groove (4) is formed in the upper surface of the cleaning platform (2), the shape of the positioning groove (4) is matched with the outer contour of the wafer, and air holes communicated with the sealing cavity are distributed in the surface of the positioning groove (4); the cleaning platform (2) is connected with the vacuum alarm box (1) through a second pipeline, and a digital display type vacuum gauge (3) electrically connected with the vacuum alarm box (1) is arranged on the second pipeline.
2. The tool for cleaning the surface of a wafer of an acoustic surface filter according to claim 1, wherein: the vacuum suction pen is characterized by further comprising a vacuum suction pen (6), the tail part of the vacuum suction pen (6) is connected with an air suction pipe, and the head part of the vacuum suction pen is provided with a conical suction head (7).
3. The tool for cleaning the surface of the surface acoustic wave filter wafer of claim 1 or 2, wherein: the positioning groove (4) has a circular outline, and air holes on the surface are uniformly distributed in a radial shape by taking the circle center as the center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921879951.5U CN210607215U (en) | 2019-11-04 | 2019-11-04 | Cleaning jig for surface of sound surface filter wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921879951.5U CN210607215U (en) | 2019-11-04 | 2019-11-04 | Cleaning jig for surface of sound surface filter wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210607215U true CN210607215U (en) | 2020-05-22 |
Family
ID=70695574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921879951.5U Active CN210607215U (en) | 2019-11-04 | 2019-11-04 | Cleaning jig for surface of sound surface filter wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210607215U (en) |
-
2019
- 2019-11-04 CN CN201921879951.5U patent/CN210607215U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108466086B (en) | Vacuum adsorption device and cutting equipment | |
| US9623539B2 (en) | Carving cabinet having protective carving barrier | |
| KR102185240B1 (en) | Method for carrying out plateshpaed work | |
| CN210607215U (en) | Cleaning jig for surface of sound surface filter wafer | |
| JP2009297859A (en) | Cleaner with deposit discharge mechanism and method of cleaning chuck table using the same | |
| JP6216262B2 (en) | Cutting equipment | |
| JP2006027795A (en) | Sucking device, method of carrying plate-like member, and method of manufacturing liquid crystal display | |
| US20150056727A1 (en) | Method of inspecting semiconductor device, method of fabricating semiconductor device, and inspection tool | |
| CN212683553U (en) | Vacuum suction tool for ultrathin single-layer ceramic capacitor substrate | |
| JP3252074B2 (en) | Vacuum suction device, sealing tool for vacuum suction device, and vacuum suction method | |
| JP2009135132A (en) | Wafer processing apparatus | |
| CN112687606A (en) | Wafer sucking disc with back protection function | |
| CN210755842U (en) | High-efficient dust collector of laser beam machining | |
| CN101853896A (en) | Method for removing materials of edges of settled layer of thin-film solar cell | |
| CN112829091A (en) | Method and apparatus for processing glass substrate | |
| CN211334090U (en) | Positioning device for lens processing | |
| JP6166122B2 (en) | Chuck table | |
| CN213531265U (en) | Laser cutting platform | |
| CN212577630U (en) | Shearing device for chip manufacturing | |
| CN218428710U (en) | Automatic dust removal mechanism for film trimming and film trimming device | |
| KR200169728Y1 (en) | Tape for protecting semiconductor wafer | |
| CN213292360U (en) | Glass product transportation equipment | |
| CN207900899U (en) | Accurate sand-wheel slice cutting machine carries microchip sucker | |
| CN214444846U (en) | Chip vacuum unloading tool | |
| CN218298141U (en) | Nondestructive detector for pipeline processing welding position |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |