CN101842892A - A heat transfer device - Google Patents
A heat transfer device Download PDFInfo
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- CN101842892A CN101842892A CN200780053654A CN200780053654A CN101842892A CN 101842892 A CN101842892 A CN 101842892A CN 200780053654 A CN200780053654 A CN 200780053654A CN 200780053654 A CN200780053654 A CN 200780053654A CN 101842892 A CN101842892 A CN 101842892A
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- heat transfer
- htu
- transfer unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Abstract
A heat transfer device for maintaining a temperature of a device under test with heat generating capability at a prescribed temperature, the heat transfer device comprising an inlet flow-duct; an outlet flow-duct; a conductor block comprising a plurality of through-holes, the through-holes receiving a fluid from the inlet flow-duct and delivering the fluid to the outlet flow-duct; and inserts disposed in the respective through-holes for reducing a cross-sectional area of the respective through-holes to improve heat transfer efficiency.
Description
Technical field
The present invention relates generally to a kind of heat transfer unit (HTU), and it can make the temperature of the temperature maintenance of the Devices to test with calorific capacity in regulation.
Background technology
Generally, all high-performance electronic equipment all were subjected to 100% functional test before manufactured merchant's shipment.For example, high-power microprocessor equipment is subjected to hierarchical test usually to determine the actual motion speed of this equipment.In hierarchical test, the temperature that the temperature of microprocessor chip is remained on each regulation simultaneously plant capacity to change between the rated power 0%～100% in predetermined testing sequence be very important.
In test,, designed the equipment of knowing----temperature control unit (TCUs) for chip being remained on the temperature of regulation.In general, heating process is to realize by heater is installed in temperature control unit.In order to realize cooling procedure, temperature control unit is coupled to a closed-loop system and both discharged cold medium elimination by the testing equipment heat that for example microprocessor produced by temperature control unit.Cold medium can be single phase flow or two-phase flow, and the single phase flow medium can be eliminated heat and not change its state by forced convertion.
Use single phase flow in tests microprocessor, to use always in the cold water temperature control unit technology.Found that the approaching about 50W/cm2 of the power density in the encapsulation microprocessor is to about 100W/cm2, because the increase of the power density level of micro processor device might make in the single phase flow technology tests microprocessor at low temperatures to reach its limit.
Therefore, be necessary to provide a new temperature control unit, it has solved one of above-mentioned problem at least.
Summary of the invention
According to a first aspect of the invention, provide its temperature maintenance that can make the Devices to test with calorific capacity of a kind of heat transfer unit (HTU) in the temperature of stipulating, this heat transfer unit (HTU) comprises an influent stream pipe and an outflow tube; One has the conductor block of plurality of through holes, and through hole receives from the fluid of influent stream pipe and transports fluid into an outflow tube; Be arranged on each through hole in order to the area of section that reduces each through hole to improve the insert of heat transfer efficiency.
Be arranged on the insert of each through hole, its each insert is not limited to a position with respect to the cross section center fixation of each through hole
For vertically also being set in each through hole, the longitudinal axis of each insert is parallel with through hole haply haply for insert.
The influent stream pipe is connected with the two ends of conductor block to form heat transfer module with outflow tube, and wherein heat transmission mainly occurs in heat transfer module.
Heat transfer module is arranged in the housing, heat transfer unit (HTU) comprises that also one is arranged on and is used to remove in the housing air on the housing to produce the valve of a parital vacuum environment around heat transfer module, wherein the parital vacuum environment makes heat transfer module be easy to be suspended in the housing, and makes the isolation of conducting heat between heat transfer module and the housing prevent to take place condensation on housing.
Conductor block is T shape and comprise a stem portion and a branching portion haply, and this branching portion comprises plurality of through holes, and this stem portion comprises a surface that contacts with Devices to test.
The influent stream pipe links to each other with the two ends of conductor block branching portion with outflow tube and flows in through hole to be easy to fluid.
Heat transfer unit (HTU) also comprises a zone of heating, this zone of heating be arranged on the conductor block branching portion the surface and with the conductor block stem portion contact with testing equipment surperficial relative.
Zone of heating can be fixed on the conductor block by the heater fixture, and wherein the vacuum seal pad is arranged between conductor block and the heater fixture.
Heat transfer unit (HTU) comprises that further one is arranged on the temperature sensor that is used to measure the Devices to test temperature on the conductor block.
Heat transfer unit (HTU) further comprises one with the coupling of described temperature sensor and with the temperature maintenance of the testing equipment controller in set point of temperature.
This controller can pass through the power of control input zone of heating and/or the temperature that flows the temperature maintenance of Devices to test is being stipulated of control fluid.
In operation, fluid enters through hole and is in haply saturated liquid state, changes gaseous state haply under the effect from the Devices to test heat into, goes out through hole and is haply gaseous state.
Housing is made so that the ability of the high pressure resistant peak value in structural rigidity and the housing to be provided by high-strength material.
Housing is made to avoid the part on the housing that condensation takes place by high conductivity material.
This through hole is pressed plural ranks alignment layout on conductor block.
Heat transfer unit (HTU) further comprises one or more embedding elements, and each embeds element and passes two or more through holes.
This insert is made to improve heat transfer efficiency by high conductivity material.
Conductor block is being made to improve heat transfer efficiency by high conductivity material of one.
Influent stream pipe, outflow tube and heater fixture are made to prevent pipe section generation condensation on influent stream pipe, outflow tube and heater fixture by the low heat conductivity material.
According to a second aspect of the invention, provide its temperature maintenance that can make the Devices to test with calorific capacity of a kind of heat transfer unit (HTU) in the temperature of stipulating, this heat transfer unit (HTU) comprises an influent stream pipe and an outflow tube; One has the conductor block of plurality of through holes, and through hole receives from the fluid of influent stream pipe and transports fluid into an outflow tube; Conductor block wherein, the influent stream pipe, outflow tube is formed heat transfer module, heat transfer module is arranged in the housing, heat transfer unit (HTU) comprises that also one is arranged on and is used to remove in the housing air on the housing to produce the valve of a parital vacuum environment around heat transfer module, wherein the parital vacuum environment makes heat transfer module be easy to be suspended in the housing, and makes the isolation of conducting heat between heat transfer module and the housing prevent to take place condensation on housing.
Description of drawings
Those skilled in the art can understand embodiments of the invention in conjunction with the accompanying drawings better by following description.
Fig. 1 is the generalized section when heat transfer unit (HTU) is temperature control unit.
Fig. 2 is the generalized section of the heat transfer module of temperature control unit among Fig. 1.
Fig. 3 is another generalized section when heat transfer unit (HTU) is temperature control unit.
Fig. 4 is the top cross-sectional view of the heat transfer module of temperature control unit among Fig. 1.
Fig. 5 is the schematic diagram that the heat transfer module of temperature control unit among Fig. 1 contacts with testing equipment.
Embodiment
Embodiment as herein described provides a kind of temperature control unit of novel employing two-phase flow process, and the two-phase flow medium is taken away heat by changing gaseous state into by liquid state.
Fig. 1 is the generalized section when heat transfer unit (HTU) is temperature control unit 100.This temperature control unit 100 comprises a housing 102, and it comprises a housing base 104 and a main casing 106.One check-valves 108 is arranged on the main casing 106.
In the electronics cooling, the water of Cun Zaiing all is extremely worthless in any form.Because temperature control unit 100 moves in the open environment that has water to exist, so just the problem at temperature control unit 100 surface condensations is arranged.In order to prevent on the housing 102 of temperature control unit 100 condensation to take place, heat transfer module 110 is isolated.Air in the temperature control unit 100 is extracted out with check-valves 108.By extracting the air in the temperature control unit 100 out, in temperature control unit 100, just form the partial vacuum environment.Because the partial vacuums in the temperature control unit 100 are fabulous thermal insulation, remain on the dew point temperature towards the surface temperature of the housing 102 of external environment condition, it is the factor relevant with humidity and ambient temperature.The condensation on heat transfer module 110 surfaces just can be avoided easily.In addition, in heating process, the partial vacuum zone has heat-blocking action, has prevented the thermal loss of heat transfer module 110.
Although the aforesaid method that prevents condensation is arranged, condensation can't not take place in the housing 102 of temperature control unit 100 fully yet.Because transmitting the condensation of housing 102, local cool region and the localized heat between heat transfer module 110 and the housing 102 still can take place.Therefore the high conductivity material housing 102 that is used for making temperature control unit 100 avoids condensation to occur in local cool region to guarantee good heat conduction.In one embodiment, use aluminium alloy, but available other high conductivity material are used for different embodiment.
In order to reduce housing 102 local cool regions as far as possible, heat transfer module 110 will be avoided or be reduced with any directly the contact all between the housing 102.In an embodiment by heat transfer module 110 is suspended in the housing 102.The vacuum seal pad of being made by the low heat conductivity heat-barrier material 116 is used to be filled in space between housing 102 and the heat transfer module 110 to reduce the heat transmission between housing 102 and heat transfer module 110, to lower the influence of local cool region.Vacuum seal pad 116 has avoided the air in the environment to flow in the temperature control unit 100 at an easy rate.Partial vacuum zone in the temperature control unit 100 also can be fixed vacuum seal pad 116 in position.Because the partial vacuum zone of heat transfer module 110 tops, the pressure official post of heat transfer module 110 vertical direction act on the air pressure on heat transfer module 110 surfaces 112 and will hold up at the heat transfer module in the housing 102 110, thereby heat transfer module 110 is suspended in the housing 102.The hard stopping of being made by heat-barrier material 114 is arranged between heat transfer module 110 and the main casing 106 reducing heat transmission, thereby has reduced local cool region, and heat transfer module 110 is arranged in the housing 102.In an embodiment, the low heat conductivity material for example stainless steel or highstrenghtpiston for example Merlon be used to make hard stopping 114, other low heat conductivity materials can be used for different embodiment.
In order to ensure the closed environment of temperature control unit 100, embodiment middle shell 102 should suitably seal.Vacuum seal pad 120 plug between housing base 104 and main casing 106, and between the conductor block 202 heater fixtures 210 to prevent that air from leaking in the temperature control unit 100.If faulty equipment flows to heat transfer module 110 along graph with high-pressure fluid, housing 102 is designed to the reinforcement of heat transfer module 110.Withstand operating pressure peak, housing 102 is made by the high-strength material that structural rigidity can be provided, and uses aluminium alloy in an embodiment, but other high-strength materials can be used for other embodiment.
Fig. 2 is the generalized section of the heat transfer module of temperature control unit among Fig. 1.Heat transfer module 110 comprises conductor block 202, influent stream pipe 205 and outflow tube 206, zone of heating 208, heater fixture 210.Conductor block 202 is T shape and comprise a stem portion and a branching portion haply, and this branching portion is the top 203 of width greater than stem portion, and this stem portion is bottom 204.Transmit with convenient heat, conductor block 202 is made by high conductivity material and is one.In an embodiment, use copper alloy, in other embodiments, other high conductivity material also can be used.
In order to reduce the heat transmission of invading and harassing and to avoid as far as possible at each influent stream pipe 205 by the environment hot-fluid, outflow tube 206 and on the heater fixture 210 of external environment condition tube section 228,230,232 condensation, influent stream pipe 205, outflow tube 206 and heater fixture 210 are made by the material of poor thermal conductivity.Use for example stainless steel or highstrenghtpiston Merlon for example of low heat conductivity material.
Zone of heating 208 is arranged on the surface 209 on the top 203 of conductor block 202, and is relative with the surface 112 of the bottom 204 of conductor block 202.Zone of heating 208 uses fastener 214 and vacuum seal pad 120 to be fixed on the top 203 of conductor block 202 by heater fixture 210.In an embodiment, zone of heating 208 is a flat resistance heater on the market, but other zones of heating can be used for different embodiment.Vacuum seal pad 120 is arranged between conductor block 202 and the heater fixture 210.Heater fixture 210 is made to reduce heat transmission by having heavily-shielded material.In an embodiment, use for example stainless steel or highstrenghtpiston Merlon for example of low heat conductivity material.But other low heat conductivity material can be used for other different embodiment.Sealing gasket 216 is arranged on the top 203 and influent stream pipe 205 of conductor block 202, between the outflow tube 206 to avoid the leakage of fluid.Sealing gasket 216 is made by the material of the high low temperature of tolerance, in an embodiment, uses fluorubber or silicones, and other low heat conductivity material can be used for other different embodiment.
A kind of thermocouple 218 temperature sensors that spring is housed are arranged in the chamber 220, and this chamber roughly is in the center of conductor block 202.The thermocouple 218 and peripheral control unit 222 couplings of spring are housed.The thermocouple 218 that spring is housed detects the temperature of Devices to test 502 also with this Temperature Feedback controller 222.Controller 222 is monitored the fluid that flows into heat transfer module 110 simultaneously, and under specific pressure, temperature and flow velocity, the power of the zone of heating 208 of control input simultaneously remains on the temperature of regulation with the temperature with Devices to test 502.Controller 222 and power-supply controller of electric 224 and 226 couplings of liquid reservoir controller.The power-supply controller of electric 224 of control zone of heating 208 input power supplys and zone of heating 208 couplings.The liquid reservoir controller 226 and influent stream pipe 205 that are used for propelling fluid, outflow tube 206 couplings.
Fig. 3 is another generalized section when heat transfer unit (HTU) is temperature control unit, as shown in Figure 3, the conductor block 202 of heat transfer module 110 comprises that a plurality of tops 203 in conductor block 202 are the through hole of pipe 302 forms, pipe 302 is arranged with plural ranks in thermocouple 218 both sides, and this thermocouple 218 is arranged in the chamber 220 of conductor block 202.
Have two factor affecting to transmit to conductor block 202 heat of temperature control unit 100, they be effectively heat transferred to the fluid of the conductor block 202 of flowing through and the Fluid Volume that is transported to the pipe 302 of conductor block 202.Flow boiling in the pipe has very high heat-transfer capability, has improved the coefficient of overall heat transmission of fluid, and pipe 302 has littler hydraulic diameter, and to make it that littler hydraulic diameter be arranged be a problem in conventional mechanical processing yet processing has the conductor block 202 of pipe 302.
Vertically insert for example wire insert in the pipe 302 of conductor block 202 to block the flow regions of respectively managing in 302 to reduce pipe 302 sectional areas, therefore, can obtain a littler hydraulic diameter, total fluid heat transferring rate of flowing pipe 302 increases, and makes and more effectively eliminates heat by fluid.For example use the wire hydraulic diameter of control valve 302 flexibly, to make conductor block 202 more convenient because the increase of pipe 302 diameters can make, thereby conventional mechanical processing can be used for the manufacturing of the conductor block 202 of temperature control unit 100.Be arranged on for example wire 304 of the insert of respectively managing in 302, it is not limited to the center in cross section in each pipe 302.In order further to improve heat transfer efficiency, insert for example wire 304 is made by high conductivity material.In an embodiment, insert for example wire 304 be copper or aluminium alloy wire.But other high conductivity material can be used for different embodiment.
The preferred length scope of through-hole diameter and diameter wiry is 0.2 millimeter to 3 millimeters.Those skilled in the art as can be known,
Millimeter, runner pipe is commonly called miniature tube, and this is to be suitable for most at present use insert in the present embodiment to reduce the technology in cross section.In temperature control unit 100, wire need surpass 0.7 with the diameter of through hole than preferable scope, surpasses 50% to reduce the cross section, reduces hydraulic diameter and surpasses 70%.Under identical barometric gradient, flow rate reduces above 85%.
Fig. 4 is the top cross-sectional view of the heat transfer module 110 of temperature control unit 100 among Fig. 1.Insert is an end of an end insertion tube 302 of wire 304 for example, is drawn out and inserts an adjacent end of the pipe 302 of adjacent same delegation from the other end of same pipe.As shown in Figure 4, each line pipe 302 of each side of thermocouple 218 is arranged in the chamber 220 of conductor block 202, and the insert for example threading of wire 304 starts from starting point 402, and ends at the terminal point 404 of proximity thermal galvanic couple 218 away from thermocouple 218.Those skilled in the art as can be known, this threading method and or pattern be not limited in the above embodiments.The insert for example two ends of wire 304 is fixed by welding in starting point 402 and terminal point 404.Pipe 302 and insert for example wire 304 are centered on by influent stream pipe 205 and outflow tube 206.
Fig. 5 is the schematic diagram that the heat transfer module of temperature control unit among Fig. 1 contacts with Devices to test.Devices to test 502 is installed on the mounting layer 504.Can so that contacting with the surface 112 of conductor block 202, test equipment under test 502 by moving up equipment under test 502 or move down heat transfer module 110.Realize just contacting between the surface 112 of equipment under test 502 and conductor block 202 by the transmission device (not shown).Being connected in the test between the surface 112 of Devices to test 502 and conductor block 202 is not shown.
Equipment under test 502 has calorific capacity.In temperature-fall period,, eliminate by cold medium fluid to the heat of conductor block 202 through pipe 302 by Devices to test 502 biographies for the temperature with Devices to test 502 remains on set point of temperature.The fluid that is in saturated liquid state haply is transfused in the influent stream pipe 205 shown in arrow 506.Fluid is flowed through the pipe 302 of conductor block 202 as the made direction of arrow 508.The fluid of pipe in 302 changes haply gaseous state into by haply saturated liquid state in heat transfer process.Be haply the fluid of gaseous state by outflow tube 206 output conductor pieces 202 shown in arrow 510.The fluid of the conductor block of flowing through 202 pipes has been eliminated heat.In an embodiment, refrigerant gas for example can use R22, R404A and CO2.Other fluids can be used for different embodiment.
In order to improve the temperature of Devices to test 502 in heating process, open zone of heating 208 and be equipment under test 502 heat supplies.Heat passes to Devices to test 502 by conductor block 202.
Aforesaid temperature control unit 100 can reach the probe temperature of wanting easily also can carry out heating and cooling fast by the two-phase flow process.Aforesaid temperature control unit 100 has simple structure and is easy to dismounting.All parts of temperature control unit 100 have simple design and need not produce by special technology and equipment.Reduced production cost.Since temperature control unit 100 design compact can being integrated into easily in the test processor system.
In addition, temperature control unit 100 has taken into full account durability and reliability.For example, Fast Heating and cooling can cause influencing the fatigue of its overall performance material, can be by selecting suitable material this fatigue is reduced to minimum degree.The structural configuration of this temperature control unit 100 has fail safe can stand any high-pressure peak to guarantee rigidity.Therefore, the design of this temperature control unit 100 has reliability.
In addition, the coupling of this temperature control unit 100 and cooling system is to realize the result who wants and to apply to require in the test processor system of testing equipment heating and cooling.
The above, only for preferred embodiment of the present invention, so can not limit scope of the present invention with this, i.e. the equivalence of doing according to claim of the present invention and description changes and modification, all should still belong in the scope that patent of the present invention contains.
Claims (20)
1. its temperature maintenance that can make the Devices to test with calorific capacity of heat transfer unit (HTU) is in the temperature of stipulating, this heat transfer unit (HTU) comprises:
One influent stream pipe;
One outflow tube;
One has the conductor block of plurality of through holes, and through hole receives from the fluid of influent stream pipe and transports fluid into an outflow tube;
Be arranged on each through hole in order to the area of section that reduces each through hole to improve the insert of heat transfer efficiency.
2. heat transfer unit (HTU) according to claim 1 is characterized in that: be arranged on the insert of each through hole, its each insert is not limited to a position with respect to the cross section center fixation of each through hole.
3. heat transfer unit (HTU) according to claim 1 and 2 is characterized in that: for vertically also being set in each through hole, the longitudinal axis of each insert is parallel with through hole haply haply for insert.
4. according to claim 1 or 2 or 3 described heat transfer unit (HTU)s, it is characterized in that: the influent stream pipe is connected with the two ends of conductor block to form heat transfer module with outflow tube, and wherein heat transmission mainly occurs in heat transfer module.
5. according to claim 1 or 2 or 3 or 4 described heat transfer unit (HTU)s, it is characterized in that: heat transfer module is arranged in the housing, heat transfer unit (HTU) comprises that also one is arranged on and is used to remove in the housing air on the housing to produce the valve of a parital vacuum environment around heat transfer module, wherein the parital vacuum environment makes heat transfer module be easy to be suspended in the housing, and makes the isolation of conducting heat between heat transfer module and the housing prevent to take place condensation on housing.
6. according to claim 1 or 2 or 3 or 4 or 5 described heat transfer unit (HTU)s, it is characterized in that: conductor block is T shape and comprise a stem portion and a branching portion haply, and this branching portion comprises plurality of through holes, and this stem portion comprises a surface that contacts with Devices to test.
7. heat transfer unit (HTU) according to claim 6 is characterized in that: the influent stream pipe links to each other with the two ends of conductor block branching portion with outflow tube and flows in through hole to be easy to fluid.
8. according to claim 6 or 7 described heat transfer unit (HTU)s, it is characterized in that: heat transfer unit (HTU) also comprises a zone of heating, this zone of heating be arranged on the conductor block branching portion the surface and with the conductor block stem portion contact with testing equipment surperficial relative.
9. heat transfer unit (HTU) according to claim 8 is characterized in that: zone of heating can be fixed on the conductor block by the heater fixture, and wherein the vacuum seal pad is arranged between conductor block and the heater fixture.
10. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 described heat transfer unit (HTU)s, it is characterized in that: heat transfer unit (HTU) comprises that further one is arranged on the temperature sensor that is used to measure the Devices to test temperature on the conductor block.
11. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 described heat transfer unit (HTU)s, it is characterized in that: heat transfer unit (HTU) further comprises one with the coupling of described temperature sensor and with the temperature maintenance of the testing equipment controller in set point of temperature.
12. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 described heat transfer unit (HTU)s, it is characterized in that: this controller can pass through the power of control input zone of heating and/or the temperature that flows the temperature maintenance of testing equipment is being stipulated of control fluid.
13. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 described heat transfer unit (HTU)s, it is characterized in that: in operation, fluid enters through hole and is in haply saturated liquid state, under effect, change gaseous state haply into, go out through hole and be haply gaseous state from the Devices to test heat.
14. heat transfer unit (HTU) according to claim 5 is characterized in that: housing is made so that the ability of the high pressure resistant peak value in structural rigidity and the housing to be provided by high-strength material.
15. according to claim 5 or 14 described heat transfer unit (HTU)s, it is characterized in that: housing is made to avoid the part on the housing that condensation takes place by high conductivity material.
16. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 described heat transfer unit (HTU)s, it is characterized in that: this through hole is pressed plural ranks alignment layout on conductor block.
17. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 or 16 described heat transfer unit (HTU)s, it is characterized in that: heat transfer unit (HTU) further comprises one or more embedding elements, and each embeds element and passes one or more through holes.
18. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 described heat transfer unit (HTU)s, it is characterized in that: this insert is made to improve heat transfer efficiency by high conductivity material.
19. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 or 16 described heat transfer unit (HTU)s, it is characterized in that: conductor block is being made to improve heat transfer efficiency by high conductivity material of one.
20. its temperature maintenance that can make the Devices to test with calorific capacity of heat transfer unit (HTU) is in the temperature of stipulating, this heat transfer unit (HTU) comprises:
One influent stream pipe;
One outflow tube;
One has the conductor block of plurality of through holes, and through hole receives from the fluid of influent stream pipe and transports fluid into an outflow tube;
Conductor block wherein, the influent stream pipe, outflow tube is formed heat transfer module, heat transfer module is arranged in the housing, heat transfer unit (HTU) comprises that also one is arranged on and is used to remove in the housing air on the housing to produce the valve of a parital vacuum environment around heat transfer module, wherein the parital vacuum environment makes heat transfer module be easy to be suspended in the housing, and makes the isolation of conducting heat between heat transfer module and the housing prevent to take place condensation on housing.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200705052-9A SG148900A1 (en) | 2007-07-06 | 2007-07-06 | A heat transfer device |
| SG200705052-9 | 2007-07-06 | ||
| PCT/SG2007/000419 WO2009008836A1 (en) | 2007-07-06 | 2007-12-07 | A heat transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101842892A true CN101842892A (en) | 2010-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200780053654A Pending CN101842892A (en) | 2007-07-06 | 2007-12-07 | A heat transfer device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110011564A1 (en) |
| EP (1) | EP2165361A1 (en) |
| JP (1) | JP2010532918A (en) |
| CN (1) | CN101842892A (en) |
| SG (1) | SG148900A1 (en) |
| TW (1) | TW200923310A (en) |
| WO (1) | WO2009008836A1 (en) |
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| US9804223B2 (en) | 2009-11-30 | 2017-10-31 | Essai, Inc. | Systems and methods for conforming test tooling to integrated circuit device with heater socket |
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| DE10225602A1 (en) * | 2002-06-07 | 2004-01-08 | Heraeus Sensor-Nite Gmbh | Semiconductor component with integrated circuit, heat sink and temperature sensor |
| KR200307398Y1 (en) * | 2002-12-18 | 2003-03-15 | 주식회사 영동 | Device for radiating heat in CPU in computer |
| JP4539425B2 (en) * | 2005-04-28 | 2010-09-08 | 日立電線株式会社 | Heat pipe heat sink and method for manufacturing the same |
-
2007
- 2007-07-06 SG SG200705052-9A patent/SG148900A1/en unknown
- 2007-12-07 JP JP2010514704A patent/JP2010532918A/en not_active Withdrawn
- 2007-12-07 US US12/667,469 patent/US20110011564A1/en not_active Abandoned
- 2007-12-07 WO PCT/SG2007/000419 patent/WO2009008836A1/en active Application Filing
- 2007-12-07 EP EP07835567A patent/EP2165361A1/en not_active Withdrawn
- 2007-12-07 CN CN200780053654A patent/CN101842892A/en active Pending
-
2008
- 2008-05-30 TW TW097120367A patent/TW200923310A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009008836A1 (en) | 2009-01-15 |
| TW200923310A (en) | 2009-06-01 |
| SG148900A1 (en) | 2009-01-29 |
| US20110011564A1 (en) | 2011-01-20 |
| JP2010532918A (en) | 2010-10-14 |
| EP2165361A1 (en) | 2010-03-24 |
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Open date: 20100922 |