CN101819002A - Flat and thin type heat pipe - Google Patents
Flat and thin type heat pipe Download PDFInfo
- Publication number
- CN101819002A CN101819002A CN200910300561A CN200910300561A CN101819002A CN 101819002 A CN101819002 A CN 101819002A CN 200910300561 A CN200910300561 A CN 200910300561A CN 200910300561 A CN200910300561 A CN 200910300561A CN 101819002 A CN101819002 A CN 101819002A
- Authority
- CN
- China
- Prior art keywords
- area
- capillary structure
- flat
- inwall
- guide pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a flat and thin type heat pipe which comprises a hollow flat pipe body and a capillary structure arranged on the inner wall of the pipe body, wherein the pipe body comprises an evaporation section and a condensation section along the longitudinal direction of the pipe body; the capillary structure extends from the evaporation section of the pipe body to the condensation section; the pipe body consists of a first area and a second area along the transverse direction; and the capillary structure is only paved on the inner wall of the first area.
Description
Technical field
The invention relates to a kind of heat pipe, particularly about a kind of flat and thin heat guide pipe.
Background technology
Present stage, heat pipe has the advantage of higher heat output because of it, has been widely used in the electronic component of the big caloric value of tool, and in the narrow and small electronic equipment such as notebook computer in inner space, because the restriction of installing space makes that the application of platypelloid type heat pipe is comparatively general.
The inwall of the most whole housing of existing platypelloid type heat pipe all is provided with capillary structure, and this capillary structure is generally groove-shaped or slug type.This housing has and is parallel to each other and relative up and down upper plate and lower plate, and being attached at need keep at a certain distance away between the capillary structure of the capillary structure of this upper plate inwall and lower plate inwall passes through for steam to form steam channel.At present, platypelloid type heat pipe forward develops towards the ultrathin type direction, when the housing of this traditional hot conduit is very thin, when promptly the spacing between this upper plate and the lower plate is very little, because this capillary structure self has certain thickness, make the capillary structure of this upper plate inwall and lower plate inwall easily fit in together and stop up the steam channel of heat pipe inside, cause steam can't be swimmingly in the internal flow of this heat pipe, thereby influence the performance of heat pipe.
Summary of the invention
In view of this, be necessary to provide a kind of tool high performance flat and thin heat guide pipe.
A kind of flat and thin heat guide pipe, comprise a hollow flat body and be located at the capillary structure of inboard wall of tube body, this body vertically comprises an evaporator section and a condensation segment along it, this capillary structure extends to condensation segment from the evaporator section of this body, this body is along transversely being made up of first area and second area, and this capillary structure only is layed in the inwall of this first area.
In this flat and thin heat guide pipe, its capillary structure only is layed in the inwall of this body first area, and the second area inwall does not cover capillary structure, thereby is surrounded the gas channel of a broad in second area by inwall.Therefore, when this flat and thin heat guide pipe has as thin as a wafer thickness, still have the gas channel of broad in its body and ensure the performance of this flat and thin heat guide pipe, all be provided with the thermal conducting tube phase ratio of capillary structure with the whole inwall of tradition, this flat and thin heat guide pipe can be machined to thinner.The development trend that more can adapt to electronics miniaturization.
Description of drawings
Fig. 1 is the side view of flat and thin heat guide pipe first embodiment of the present invention.
Fig. 2 is the horizontal section schematic diagram of flat and thin heat guide pipe shown in Figure 1.
Fig. 3 is the flow chart of a manufacture method of flat and thin heat guide pipe shown in Figure 1.
Fig. 4 inserts the preceding floor map of body for capillary structure shown in Figure 2.
Fig. 5 inserts the horizontal section schematic diagram that capillary structure flattens body preceding heat pipe afterwards in the manufacture method shown in Figure 3.
Fig. 6 is the horizontal section schematic diagram of flat and thin heat guide pipe second embodiment of the present invention.
The specific embodiment
See also Fig. 1 and Fig. 2, this flat and thin heat guide pipe 10 comprises a hollow flat body 12, be located at a capillary structure 14 of these body 12 inwalls and inject an amount of hydraulic fluid in this body 12.
This body 12 is made by the material of tool thermal conductive resins such as copper, can be passed to its inside by the heat that it is outside.
This body 12 is the lengthwise shape, vertically comprises an evaporator section 121 and a condensation segment 122 along it.This body 12 is a hollow sealing cavity, and it is flattened by a hollow circular tube and forms, and comprises a top board 124, a base plate 126 and biside plate 125.This top board 124 is parallel to each other with base plate 126 and is relative up and down, this biside plate 125 is curved, lay respectively at the both sides of body 12 and link to each other with base plate 126 with top board 124, thus make this body 12 with vertically vertical horizontal cross section on form the profile of similar racetrack.
This body 12 is along transversely being made up of a first area and a second area, and this first area and second area all are horizontal U-shaped structure, and is relative and minute surface is symmetrical about this first area and second area.This first area and second area include between the upper and lower every relative two parts tube wall, and this capillary structure 14 only is attached at the whole inwall of this first area, does not cover second area, so is surrounded first gas channel 120 of a broad in this second area by inwall.
This capillary structure 14 is established by a rectangular network structure volume and is formed.This network structure can be formed by the silk thread braiding that copper, stainless steel, fiber and other material are made.Form some tiny holes on this capillary structure 14, these holes can produce capillary force, thereby provide power for the backflow of working media.
This capillary structure 14 is the lengthwise shape, body 12 vertically on, this capillary structure 14 extends to condensation segment 122 from the evaporator section 121 of this body 12.This capillary structure 14 also takes the shape of the letter U along the profile on the horizontal cross section, cooperates with the profile phase of the first area inwall of body 12.Whole this capillary structure 14 is layed in the inwall of this first area, and the whole outer peripheral face of this capillary structure 14 is attached at the inwall of body 12.This capillary structure 14 comprises relative and symmetrical up and down first 141 and second portion 142, this first 141 and second portion 142 relative spacings are attached at the two-part inwall up and down of these body 12 first areas, thereby therebetween form second a narrower gas channel 140.
Certainly, this capillary structure 14 also can be layed in the inwall of the second area of this body 12, thereby in the first area, surround first gas channel 120 of a broad, and be arranged at the first 141 of the capillary structure 14 in the second area and second portion 142 forms second a narrower gas channel 140 at interval by inwall.
This working media is the more lower boiling materials of tool such as water, wax, alcohol, methyl alcohol.When the evaporator section 121 of body 12 contacts with thermal source, this working media is from evaporator section 121 heat absorption evaporations, be with heat to move to condensation segment 122 from first gas channel 120 and second gas channel 140, after condensation segment 122 heat releases, condense into liquid, heat is discharged, finish the heater element heat radiation of (figure does not show).This capillary structure 14 provides capillary force to make condensation segment 122 at body 12 working media that forms that condenses be back to evaporator section 121, realizes the shuttling movement of working media in body 12, to finish the lasting heat radiation to heater element.
Owing to be formed with first gas channel 120 and second gas channel 140 in this heat pipe 10, and first gas channel 120 is surrounded by the inwall of second area, the peripheral inwall of this first gas channel 120 is not provided with capillary structure 14, thereby makes these first gas channel, 120 broads and be difficult to stop up.Even therefore when body 12 deform this second gas channel 140 is stopped up and hinder steam by the time, this first gas channel 120 still keeps the unimpeded steam that supplies to pass through, thereby ensures the performance of this heat pipe 10.
In like manner, when needs have the heat pipe of thinner thickness, can be depressed into heat pipe 10 thinner, even when the first 141 of this capillary structure 14 and second portion 142 are fitted mutually, when also promptly this capillary structure 14 fills up the gap between the inwall of two parts up and down of first area, as long as form a gap between the tube wall of two parts up and down of this second area, just surround the smooth circulation that one first gas channel 120 guarantees steam by inwall in this second area, and then maintenance heat pipe 10 performances is stable, therefore, this heat pipe 10 can be machined to very thin, its thickness (also i.e. top board 124 outer surfaces of this heat pipe 10 and the distance h between base plate 126 outer surfaces) can reach below the 1.2mm, even when heat pipe 10 thickness be 1.0mm, 0.8mm the time, this heat pipe 10 still can guarantee good performance.The whole inwall of comparing traditional housing all is provided with the platypelloid type heat pipe of capillary structure, and the heat pipe 10 of present embodiment can be done thinlyyer, more is applicable to electronic equipment that the inner space is narrow and small such as notebook computer etc.
In the present embodiment, because this first area and second area are symmetrical, and this capillary structure 14 only covers the whole inwall of this first area, so this capillary structure 14 has covered 1/2 of these body 12 whole inwalls.Certainly, this capillary structure 14 is not limited only to cover half of these body 12 inwalls, prove through repetition test, in other embodiments, this capillary structure 14 can cover more than 1/3 below 3/4 of these body 12 whole inwalls, but need this capillary structure 14 of assurance only to be located at horizontal sides in this body 12, promptly be located at the inwall of body 12 first areas (or second area), thereby make and form first gas channel 120 of broad to ensure passing through smoothly of steam in the second area (or first area) of this body 12.
See also Fig. 3 to Fig. 5, described heat pipe 10 can be made by following steps: a hollow circular metal body 12a is provided; Provide a length and width than the netted capillary structure 14a of big rectangle; It is semicircular lengthwise structure that capillary structure 14a volume is set as a cross section, insert in this body 12a, make vertically going up of this body 12a extend to the other end from the end of body 12a, and the whole outer peripheral face of this capillary structure 14a is attached at the inwall of this body 12a, on the lateral cross section of body 12a, this capillary structure 14a covers half of the whole inwall of this body 12a; The body 12a that inserts capillary structure 14a is heated, make this capillary structure 14a partial melting, thereby make this capillary structure 14a be fixed in difficult drop-off on the inwall of this body 12a; Fluid injection, sealed after being vacuumized body 12a; Flatten this body 12a, first area and second area that this body 12 is taken the shape of the letter U along formation on its horizontal cross section, and make this capillary structure 14 be positioned at the first area inwall of this body 12; Obtain required heat pipe 10 at last.With respect to the thin heat guide pipe of conventional groove type or slug type, the processing procedure of this heat pipe 10 is simple, is convenient to volume production.
See also Fig. 6, be illustrated as the flat and thin heat guide pipe 60 of second embodiment of the invention, this heat pipe 60 comprises the flat body 62 of a hollow and is located at a capillary structure 64 of body 62 inwalls.Body 62 vertically on, this capillary structure 64 extends to the condensation segment of body 62 from the evaporator section of this body 62.The difference of the heat pipe 10 of this embodiment and first embodiment is: the first area of this body 62 is the zone at base plate 626 places, the second area of this body 62 is the zone at these top board 624 places, this capillary structure 64 be a length with width than big rectangle network structure, this capillary structure 64 is tiled in the inwall of base plate 626, and relative at interval with the inwall of top board 624.Form a gas channel 620 that can supply steam to pass through between this capillary structure 64 and the top board 624.Because this capillary structure 64 only covers the inwall of the base plate 626 of this body 62, and the inwall of top board 624 is not provided with capillary structure 64, be equipped with the thermal conducting tube phase ratio of capillary structure with the whole inwall of traditional housing, in the body 62 of same thickness, this heat pipe 60 has the gas channel 620 of broad and is difficult for taking place to stop up and the performance of guarantee heat pipe 60.Therefore for ultra-thin body 62, this heat pipe 60 has good performance because of the gas channel 620 with broad.Certainly, above-mentioned capillary structure 64 also can be located at this body 62 top board 624 inwall and with the inwall of base plate 626 separately.
Claims (9)
1. flat and thin heat guide pipe, comprise a hollow flat body and be located at the capillary structure of inboard wall of tube body, this body vertically comprises an evaporator section and a condensation segment along it, this capillary structure extends to condensation segment from the evaporator section of this body, it is characterized in that: this body is along transversely being made up of first area and second area, and this capillary structure only is layed in the inwall of this first area.
2. flat and thin heat guide pipe as claimed in claim 1, it is characterized in that: the first area and the second area of this body are oppositely arranged, and all be the U type, this first area includes relative at interval two parts inwall with second area, surrounds a gas channel by inwall in this second area.
3. flat and thin heat guide pipe as claimed in claim 2 is characterized in that: this capillary structure is the U type along the profile on the lateral cross section, comprises relative at interval first and second portion, forms another gas channel between this first and the second portion.
4. flat and thin heat guide pipe as claimed in claim 2 is characterized in that: form a gap between two parts inwall of this first area, this capillary structure fills up this gap.
5. flat and thin heat guide pipe as claimed in claim 1 is characterized in that: this body comprises a top board and a base plate relative up and down with this top board, and described first area is the zone at one of them place of this top board and base plate.
6. flat and thin heat guide pipe as claimed in claim 5 is characterized in that: another the inwall wherein of this capillary structure and this top board and base plate is relative at interval.
7. flat and thin heat guide pipe as claimed in claim 1 is characterized in that: this body is flattened by a pipe and forms.
8. as any described flat and thin heat guide pipe in the claim 1 to 7, it is characterized in that: this capillary structure covers more than 1/3 below 3/4 of the whole inner wall area of this body.
9. as any described flat and thin heat guide pipe in the claim 1 to 7, it is characterized in that: the thickness of this heat pipe is below 1.2mm.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910300561A CN101819002A (en) | 2009-02-26 | 2009-02-26 | Flat and thin type heat pipe |
| US12/489,418 US20100212870A1 (en) | 2009-02-26 | 2009-06-22 | Flat heat pipe |
| US13/654,609 US20130037244A1 (en) | 2009-02-26 | 2012-10-18 | Flat heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910300561A CN101819002A (en) | 2009-02-26 | 2009-02-26 | Flat and thin type heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101819002A true CN101819002A (en) | 2010-09-01 |
Family
ID=42629920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910300561A Pending CN101819002A (en) | 2009-02-26 | 2009-02-26 | Flat and thin type heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US20100212870A1 (en) |
| CN (1) | CN101819002A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103292628A (en) * | 2012-03-02 | 2013-09-11 | 联想(北京)有限公司 | Heat pipe and processing method thereof, and electronic equipment employing heat pipe |
| CN103868385B (en) * | 2012-12-14 | 2017-02-08 | 富瑞精密组件（昆山）有限公司 | Heat pipe and manufacturing method thereof |
| CN111863746A (en) * | 2019-04-25 | 2020-10-30 | 华为技术有限公司 | Heat dissipation device, circuit board and electronic equipment |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4881352B2 (en) * | 2008-08-11 | 2012-02-22 | ソニー株式会社 | HEAT SPREADER, ELECTRONIC DEVICE, AND HEAT SPREADER MANUFACTURING METHOD |
| CN201532142U (en) * | 2009-10-30 | 2010-07-21 | 昆山巨仲电子有限公司 | Flat heat pipe with hooked capillary structure |
| CN102252544A (en) * | 2011-06-10 | 2011-11-23 | 深圳市凯强热传科技有限公司 | Platelike heat pipe and manufacturing method thereof |
| US20120325437A1 (en) * | 2011-06-27 | 2012-12-27 | Celsia Technologies Taiwan, I | Flat heat pipe with capilllary structure |
| CN103217040A (en) * | 2012-01-19 | 2013-07-24 | 奇鋐科技股份有限公司 | Heat pipe heat radiating structure |
| TWI577958B (en) * | 2012-03-09 | 2017-04-11 | 鴻準精密工業股份有限公司 | Plate-type heat pipe |
| TWI457528B (en) * | 2012-03-22 | 2014-10-21 | Foxconn Tech Co Ltd | Plate type heat pipe |
| US9618275B1 (en) * | 2012-05-03 | 2017-04-11 | Advanced Cooling Technologies, Inc. | Hybrid heat pipe |
| TW201437592A (en) * | 2013-03-28 | 2014-10-01 | Quanta Comp Inc | Heat guiding module, heat pipe, and manufacturing method of heat pipe |
| US20150122460A1 (en) * | 2013-11-06 | 2015-05-07 | Asia Vital Components Co., Ltd. | Heat pipe structure |
| RU2568105C2 (en) * | 2014-02-28 | 2015-11-10 | Виктор Викторович Сысун | High-power led lamp with cooling |
| US20160069616A1 (en) * | 2014-09-05 | 2016-03-10 | Asia Vital Components Co., Ltd. | Heat pipe with complex capillary structure |
| CN105517406B (en) * | 2014-09-24 | 2018-02-27 | 中山市云创知识产权服务有限公司 | Electronic installation and its radiating machine casing |
| US11454456B2 (en) | 2014-11-28 | 2022-09-27 | Delta Electronics, Inc. | Heat pipe with capillary structure |
| CN110220404A (en) * | 2014-11-28 | 2019-09-10 | 台达电子工业股份有限公司 | Heat pipe |
| WO2019022214A1 (en) * | 2017-07-28 | 2019-01-31 | 古河電気工業株式会社 | Wick structure and heat pipe accommodating wick structure |
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| US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
| US3700028A (en) * | 1970-12-10 | 1972-10-24 | Noren Products Inc | Heat pipes |
| US3834457A (en) * | 1971-01-18 | 1974-09-10 | Bendix Corp | Laminated heat pipe and method of manufacture |
| US4322737A (en) * | 1979-11-20 | 1982-03-30 | Intel Corporation | Integrated circuit micropackaging |
| US4366526A (en) * | 1980-10-03 | 1982-12-28 | Grumman Aerospace Corporation | Heat-pipe cooled electronic circuit card |
| US4674565A (en) * | 1985-07-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe wick |
| US5029389A (en) * | 1987-12-14 | 1991-07-09 | Hughes Aircraft Company | Method of making a heat pipe with improved end cap |
| TW407455B (en) * | 1997-12-09 | 2000-10-01 | Diamond Electric Mfg | Heat pipe and its processing method |
| US6146779A (en) * | 1999-04-01 | 2000-11-14 | Plug Power Inc. | Fluid flow plate, fuel cell assembly system, and method employing same for controlling heat in fuel cells |
| US6293333B1 (en) * | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
| US7134485B2 (en) * | 2004-07-16 | 2006-11-14 | Hsu Hul-Chun | Wick structure of heat pipe |
| US7140421B2 (en) * | 2004-09-03 | 2006-11-28 | Hul-Chun Hsu | Wick structure of heat pipe |
| CN100443849C (en) * | 2005-09-20 | 2008-12-17 | 富准精密工业(深圳)有限公司 | Working medium filling method |
| CN101055158A (en) * | 2006-04-14 | 2007-10-17 | 富准精密工业(深圳)有限公司 | Heat pipe |
| CN100480612C (en) * | 2006-04-28 | 2009-04-22 | 富准精密工业(深圳)有限公司 | Heat pipe |
| CN101398272A (en) * | 2007-09-28 | 2009-04-01 | 富准精密工业(深圳)有限公司 | Hot pipe |
| JP4352091B2 (en) * | 2008-03-27 | 2009-10-28 | 株式会社東芝 | Electronic equipment, cooling device |
-
2009
- 2009-02-26 CN CN200910300561A patent/CN101819002A/en active Pending
- 2009-06-22 US US12/489,418 patent/US20100212870A1/en not_active Abandoned
-
2012
- 2012-10-18 US US13/654,609 patent/US20130037244A1/en not_active Abandoned
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103292628A (en) * | 2012-03-02 | 2013-09-11 | 联想(北京)有限公司 | Heat pipe and processing method thereof, and electronic equipment employing heat pipe |
| CN103292628B (en) * | 2012-03-02 | 2017-03-01 | 联想(北京)有限公司 | Heat pipe and its processing method and the electronic equipment with this heat pipe |
| CN103868385B (en) * | 2012-12-14 | 2017-02-08 | 富瑞精密组件（昆山）有限公司 | Heat pipe and manufacturing method thereof |
| US9689625B2 (en) | 2012-12-14 | 2017-06-27 | Furui Precise Component (Kunshan) Co., Ltd. | Heat pipe |
| CN111863746A (en) * | 2019-04-25 | 2020-10-30 | 华为技术有限公司 | Heat dissipation device, circuit board and electronic equipment |
| CN111863746B (en) * | 2019-04-25 | 2023-10-13 | 华为技术有限公司 | Heat abstractor, circuit board and electronic equipment |
| US12041710B2 (en) | 2019-04-25 | 2024-07-16 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus, circuit board, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100212870A1 (en) | 2010-08-26 |
| US20130037244A1 (en) | 2013-02-14 |
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Application publication date: 20100901 |