CN101807421B - Adaptable test carrier for storage devices and method of testing the same - Google Patents
Adaptable test carrier for storage devices and method of testing the same Download PDFInfo
- Publication number
- CN101807421B CN101807421B CN2009102063042A CN200910206304A CN101807421B CN 101807421 B CN101807421 B CN 101807421B CN 2009102063042 A CN2009102063042 A CN 2009102063042A CN 200910206304 A CN200910206304 A CN 200910206304A CN 101807421 B CN101807421 B CN 101807421B
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- memory device
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- anchor clamps
- carrier
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
- G11B33/122—Arrangements for providing electrical connections, e.g. connectors, cables, switches
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B25/00—Apparatus characterised by the shape of record carrier employed but not specific to the method of recording or reproducing, e.g. dictating apparatus; Combinations of such apparatus
- G11B25/04—Apparatus characterised by the shape of record carrier employed but not specific to the method of recording or reproducing, e.g. dictating apparatus; Combinations of such apparatus using flat record carriers, e.g. disc, card
- G11B25/043—Apparatus characterised by the shape of record carrier employed but not specific to the method of recording or reproducing, e.g. dictating apparatus; Combinations of such apparatus using flat record carriers, e.g. disc, card using rotating discs
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- Testing Of Individual Semiconductor Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The present invention relates to test carriers (10) for smaller electronic storage devices of less than 3.5 inches for testing small form factor (SFF) storage devices in a 3.5 inch hard disk drive tester.
Description
Technical field
The present invention relates to be used for the test carrier of electronic storage device.The present invention is applicable to the little form parameter of test (small form factor, SFF) memory device in 3.5 inches hard drive testers particularly.
Background technology
Below be to be used for promoting to the discussion of background of the present invention to understanding of the present invention.Yet, being to be understood that the discussion here is not that the affirmation of following a kind of situation is perhaps admitted, any content that promptly the present invention relates in any jurisdiction limit at the priority date of applying for is what delivered, a part known or common practise.
Electronic data storage has and is configured to such as desktop personal computers laptop PC, the multiple form parameter size of application-specific such as server and miscellaneous consumer electronics.The form parameter that is used for memory device of widespread usage is that 2.5 inches (6.35 centimetres) are in the scope of 1.8 inches (4.6 centimetres) and 1 inch (2.54 centimetres) at 3.5 inches (8.9 centimetres) at present.Yet in every kind of form parameter classification, the height of memory device can change.
In common memory device manufacture process,, require to use the memory device of the proving installation of special manufacturing line and given shape parameter size with every type of assembly and checkout for the purpose of quality control.The test of on memory device, carrying out includes but not limited to temperature test, electronic circuit logic testing, harddisk memory test, magnetic head dielectric tests and HPI test.
The problem of a trouble is exactly the different testing apparatus of memory device needs of difformity parameter size.Test carrier by its applicant's development in patent publication us WO2006/115465 can be modified to the standard size proving installation in order to test the memory device of little form parameter size.This makes that little form parameter (SFF) memory device can be to be tested in 3.5 inches test trough.Saved the inconvenience of replacing the proving installation of the memory device that is used for difformity parameter size such as the modification of remodeling proving installation.
Yet, when testing the memory device of different size, require to interrupt or stop the running of manufacturing line.This is to revise for test interface is made suitably.Each test machine has thousands of test trough substantially, and all grooves all must stop to make amendment with the test interface to one or more test trough.Because the demand fluctuation of every type memory device, the product proportioning changes every day, so become one of reason of factory's poor efficiency capital equipment utilization the stop time of this manufacturing line that causes thus.The more great fluctuation process that in the product proportioning, produces can cause interruption and so the lower efficient of longer time.
In addition, the applicant finds that the test carrier in patent publication us WO2006/115465 may not be applicable to Different Weight and memory device highly.Test carrier need be generally pcb component (PCBA) form electronic circuit in addition so that signal is passed to the tester interface connector from the storage device interface connector.Additional this independently PCBA interface possibly introduced the electronic signal noise, and said noise has reduced the integrality and the reliability of interface signal.Also increased simultaneously the overall expenses of test carrier.
The object of the invention is for reducing the test carrier of the problems referred to above.
Goal of the invention
The full piece of writing of presents, only if opposite indication is arranged, " comprising ", " formation " and similar word are interpreted as and are included rather than exhaustive.
According to a first aspect of the invention, be provided for testing the test carrier of form parameter less than 3.5 inches memory device, said test carrier comprises: the carrier substrate with 3.5 inches size memory; Along the inwall that carrier base engages, said inwall engages with said carrier base to define and is suitable for laying the space of form parameter less than 3.5 inches memory device; And be installed at least one the side directed pin on the inwall, and said side directed pin is suitable for receiving at least one mounting hole less than 3.5 inches memory device, and wherein said memory device is suitable for being remained in the test position by said at least one side directed pin; Said test position is constructed to be in the orientation that receives external test interface, and said external test interface is the existing test interface that is used for 3.5 inches memory devices.
Advantageously, test carrier comprises the top guided plate that is attached on the inwall, and said top guided plate is suitable for receiving the memory device of known maximum height.More advantageously, test carrier also comprises the anchor clamps that are installed on the carrier base, and said anchor clamps have at least one compressible devices so that anchor clamps can move to second extended position from first compression position.
Advantageously, carrier substrate comprises the weight retainer that is used to keep at least one weight.
Advantageously, secondary guided plate removably is attached on the guided plate of top.
Advantageously, the compressible devices of anchor clamps is the elasticity pushing.
Advantageously, compressible devices realizes the elasticity pushing by at least one spring.
Advantageously, anchor clamps comprise a pair of damper that is used for fixing memory device.
Be provided for testing the method for the memory device of difformity parameter size according to a second aspect of the invention, it may further comprise the steps:
(a) memory device of form parameter less than 3.5 inches inserted in the test carrier.
(b) through fixing memory device at least one side directed pin inserted-shape parameter at least one mounting hole with test carrier less than 3.5 inches memory device; Wherein said memory device inserts with such orientation; Promptly; Form parameter is exposed to the orientation of external test interface less than the HPI connector of 3.5 inches memory devices, and said external test interface is the existing test interface that is used for 3.5 inches memory devices.
Advantageously, method comprises step: the contact shape parameter is less than the upper surface of 3.5 inches memory device below the guided plate of top.
Advantageously; Method comprises step: before the inserted-shape parameter is less than 3.5 inches memory device, anchor clamps are moved to first compression position; And anchor clamps are moved to second extended position with the memory device of contact shape parameter less than 3.5 inches, make anchor clamps and form parameter less than the vibration of the contact inhibition between 3.5 inches the memory device in the test period generation.
Advantageously, reach inhibition through additional weight to test carrier to the vibration of memory device.By this way, weight flexibly remains in the weight retainer.
Advantageously, dismountable secondary guided plate is attached on the guided plate of top, with the memory device of level altitude less than 15mm.
Advantageously, anchor clamps rely on spring to move to second extended position from first compression position.
Advantageously, reach the inhibition of form parameter through on anchor clamps, increasing a pair of damper less than the vibration of 3.5 inches memory device.
Description of drawings
To make description to the present invention according to the following accompanying drawing of reference:
Fig. 1 shows the isometric view of test carrier according to an embodiment of the invention.
Fig. 2 shows the vertical view of test carrier according to an embodiment of the invention.
Fig. 3 shows the isometric view of carrier base according to an embodiment of the invention.
Fig. 4 a shows the isometric view of overlooking of anchor clamps according to an embodiment of the invention.
Fig. 4 b shows the isometric view of looking up of anchor clamps according to an embodiment of the invention.
Fig. 5 shows the embodiment that is used to have highly for the test carrier of 2.5 inches memory devices of 15mm (not in scale).
Fig. 6 a shows secondary guided plate according to an embodiment of the invention.
Fig. 6 b shows the secondary guided plate that is attached on the test carrier according to an embodiment of the invention.
Fig. 6 c shows the embodiment that is used to have highly for the test carrier of 2.5 inches memory devices of 9mm (not in scale).
Fig. 7 a to Fig. 7 c shows and is loaded in the step on the test carrier to memory device.
Fig. 8 shows the 2.5 inches memory devices of little form parameter with its HPI connector.
Embodiment
Be to be understood that the direction that relates to and position (on, preceding down, after, the top, the end, about etc.) should specifically as the typical operation direction of the present invention that defines among Fig. 2, understand in the linguistic context like accompanying drawing.
Carrier base 11 comprises integrally molded carrier substrate 12, anchor clamps retainer assembly 22 and weight retainer 16 together.The size of carrier substrate 12 and 3.5 inches test trough are roughly the same.Yet, the short memory device 60 of the right side edge of carrier substrate 12 to adapt to little form parameter.Common shape parameter memory device comprises 2.5 inches of form parameters in industry, the memory device of 1.8 inches and 1 inch.Along the part path of first side of substrate 12, flat rectangular sheet has the part charge that is limited back guiding wall 13, and said part charge has: anchor clamps 14, tapered wall 15 and the wall that defines cube space or recess.Anchor clamps 14 are positioned at the place, space that is limited at the core that roughly centers on part charge.Limit a wherein wall and anchor clamps 14 adjacency of the wall of cube space or recess.Two walls in the remaining wall cross with the right angle and form the exterior angle wall, and said exterior angle wall is sat idly in the plane vertical with the plane of carrier substrate 12.Two walls in the wall of said remainder and the plane of carrier substrate 12 form three orthogonal crossing plane at the place, angle (left rear corner that defines in like Fig. 2) of carrier substrate 12.Define last wall and weight retainer 16 adjacency in the wall of cube space or recess.Weight retainer 16 comprises one of them continuity of the wall at the angle that forms carrier substrate 12, and said retainer extends and exceed the short side termination of the exposure of carrier substrate 12 along one of them vertical side of carrier substrate 12.Inwall 17 is parallel with the wall that extends along the vertical side of one of them of carrier substrate 12 and exceed the short side termination of the exposure of carrier substrate 12.Parallel walls engages with the right angle through end wall 18, and outstanding the putting of said end wall exceeds carrier substrate 12.The weight retainer 16 that is described below is applicable to lays weight 20.Top guided plate 21 extends perpendicular to inwall 17 in the plane parallel with carrier substrate 12 cardinal principles substantially, and at least two side directed pins 26 stretch out from inwall 17 at contiguous carrier substrate 12 places.The space that is limited carrier substrate 12, back guiding wall 13 and inwall 17 forms base plate 24, and said base plate is applicable to lays the memory device that will test.Fig. 3 shows carrier base 11 (removing the test carrier 10 of anchor clamps 14 and weight 20).Weight retainer 16 comprises reed 54a, 54b.When weight 20 is inserted into weight retainer 16, its with reed 54a, 54b backup to the outer wall that is parallel to inwall 17.In case weight 20 inserts, reed 54a, 54b can rely on elastic mechanism (for example deformable fingers) to remove and therefore weight 20 is applied suitable pressure to guarantee said weight fix in position from lateral wall 56.Additional weight 20 may be added to weight retainer 16 and thinks that test carrier 10 provides the damping weight of expectation.Use the purpose of weight 20 to be to make the minimize vibration of the test carrier of introducing by the moveable part of the cooling fan of test macro and other testers 10.The false judgment that this external source vibration can be reduced in the performance of the memory device under the test and cause testing---for example, be spurious glitches with intact normal storage equipment 60 false judgment.
Anchor clamps retainer assembly 22 has been shown in the part charge of Fig. 3, and it comprises:
Be installed in the slider guide spare 30a on the carrier substrate 12, its form is a C shape passage; Relatively be installed in the second slider guide spare 30b on the wherein wall of the wall that defines the cube recess; It forms the support that extends perpendicular to said wall makes wall and support form relative C shape passage, and this C shape channel is used to lay said anchor clamps when anchor clamps 14 slips are in place.The location bias of slider guide spare 30a, 30b is to the rear portion of the carrier substrate in part charge 12.The L-shape flange of slider guide spare 30a for stretching out from carrier substrate 12.The base portion of the L-shape flange that links to each other with carrier substrate is long rails 31a.The support of the second slider guide spare 30b is in substantially parallel relationship to the second long rails 31b and stretches out.Track 31b is parallel substantially with track 31a.
With reference to figure 3 and Fig. 4, anchor clamps 14 removably are attached to slider guide spare 30a, 30b by means of track shoulder 40a, 40b.Track shoulder 40a, 40b is applicable to cooperates with track 31a, 31b.It is known so that between track shoulder 40a, 40b and track 31a, 31b, suitable sliding contact is provided that track shoulder 40a, 40b and track 31a, 31b are designed to those skilled in the art, do not do describing in further detail at this.
When anchor clamps 14 were in place by track 31a and 31b guided slidable, the motion of anchor clamps 14 was limited between back end breaket 42 and the opposite preceding stop pin 43.The motion of anchor clamps 14 is approx in the direction vertical with the rear wall (not shown).Back end breaket 42 is attached to rear wall 36.Back end breaket 42 is applicable to the end that holds spring 44.Spring 44 extends into anchor clamps 14 and in connector recess 45, is attached to anchor clamps 14.Connector recess 45 shown in Fig. 4 b is connected on the downside of anchor clamps 14.Be positioned at second rectangular recess 46 on the opposition side of connector recess 45 be applicable to hold before stop pin 43.
Make anchor clamps 14 be positioned to its first compression position by means of circular depressions 36 and become easy.Circular depressions 36 is applicable to that mechanical arm pulls to first compression position with anchor clamps 14.
The length of base plate 24 and width dimensions are slightly less than little form parameter memory device 60, and said little form parameter memory device 60 is less than 3.5 inches.Base plate 24 comprises a plurality of air openings that are used to ventilate 50 in addition.
With reference to figure 5, when memory device 60 in use the time, it is positioned on the base plate 24.2.5 inches memory devices are positioned on the base plate 24 in a current example.Memory device is settled like this, makes it extend beyond base plate 24 with at the HPI connector 64 of memory device be used for being placed between the existing test interface of 3.5 inches memory devices of proving installation enough paths are provided.Two side directed pins 26 are placed near the bottom of madial wall 17 substantially and can be fitted into the side mounting hole 62 of memory device 60.Usually memory device 60 will have at least 4 side mounting holes 62, respectively have two at opposition side.The position of side mounting hole 62 is confirmed by the universal industrial standard and can be changed for the memory device of difformity parameter size.For the universal industrial normal place of the side mounting hole of the concrete memory device that will test, mount pin can fit into the side mounting hole.
Top guided plate 21 stretches out from the top centre portion of madial wall 17.The downside place of guided plate 21 extends through its whole width at the top two extension 17a, 17b are properly spaced out.Confirm that by the height of the highest memory device 60 that is used to test 2.5 of embodiment inches memory device height are roughly 15mm hereto from the height of base plate 24 guided plate 21 to the top.For test case height as shown in Figure 6 less than peaked memory device 60, top guided plate 21 can have on top guided plate 21 the secondary guided plate 80 that slides.On top guided plate 21, can be used for receiving and be used for secondary guided plate 80 is attached at the folder 82 above the top guided plate 21 with madial wall 17 adjacent rectangular channels 19.Secondary guided plate 80 removably is attached on the top guided plate 21 by means of folder 82.Except the ducted body 84 that is suitable on top guided plate 21, sliding (seeing Fig. 6 b), secondary guided plate 80 is similar with top guided plate 16 in shape.Be stuck at the folder 82 on the secondary guided plate 80 on the rectangular channel 19 of top guided plate 21, make it securely by attached.
Fig. 6 c shows the use of the secondary guided plate 80 of the 9mm2.5 inch memory device on being loaded in test carrier 10.
To in the example background of operation, do to describe with reference to 7 pairs of test carriers of figure 10.
Use test carrier 10 comes test storage equipment 60, and memory device 60 must at first be loaded on the test carrier 10.Said loading is perhaps perhaps accomplished by machine by operator's manual operation.In this example:
(a) use and to comprise that the machine (not shown) of mechanical arm accomplishes loading and unloading.
(b) with weight 20 appropriateness adjustment weight retainers 16 with the weight of balance memory device 60 and suppress any undesirable vibration of producing by test.Substantially, weight 20 is many 50g weights, and the weight retainer can load reach 6 weights 20 (being equivalent to 300g).
According to the step 72 of Fig. 7 a, use mechanical arm that anchor clamps 14 are positioned to its first compression position.
According to the step 74 of Fig. 7 b, in step 74, use mechanical arm that memory device 60 is inserted from the exposed side of test carrier 10.This can rely on and use the computer controller manipulation to realize as the mechanical arm that those skilled in the art knew.During inserting, the orientation of memory device 60 is such, and the HPI connector 64 that makes memory device 60 is towards the exposed side 65 near test carrier 10 madial walls 17.In the time of in memory device 60 is placed in test carrier 10, it contacts with top guided plate 21, madial wall 17, back guiding wall 13 and base plate 24, and it is designed to outstandingly rest on the base plate 24 and extend beyond base plate 24.In order to ensure being fixed at test period memory device 60 on the test carrier 10 preventing any unnecessary motion and vibration, two side directed pins 26 of test carrier 10 are inserted in two side mounting holes 62 at the side place that memory device 60 contacts with madial wall.Memory device 60 fully is inserted in the test carrier 10 shown in Fig. 7 b then.
According to the step 76 of Fig. 7 c, anchor clamps 14 are released, and make spring 44 extend and push anchor clamps 14 to memory device 60 forward.Shown in Fig. 7 c, damper 52 is pushed against on the rear wall 63 of memory device 60.The pliability of the rigidity of spring 44 and damper 52 can balance and is optimized so that the firm clamping with optimal vibration damping to be provided on memory device 60.In order to confirm the optimal vibration damping, can obtain the measurement result of said memory device vibrational energy when memory device moves in test carrier.
These measurement results are used for obtaining vibration peak power spectral line through the method that any those skilled in the art can know subsequently.When vibration peak power spectral line is minimum, reach best.Two side directed pins 26 that are inserted into the mounting hole 62 of memory device 60 can prevent that memory device 60 from moving forward.This arrangement is fixed to test carrier 10 with memory device 60 and is used for test.
When memory device 60 is loaded in test in carrier 10 time, memory device 60 is ready to can be to be tested in 3.5 inches memory device testers of standard.3.5 inches memory device testers of standard are connected to the HPI connector 64 of memory device 60.
In case test storage equipment 60 is accomplished,, 3.5 inches memory device testers of standard unload memory device 60 through being broken off from HPI connector 64.Repeating step 72 promotes spring 14 to its first compression position then.Memory device 60 is unloaded by mechanical arm then.Software program in tester is carried out inspection to confirm whether next memory device 60 is sustained height and/or same form parameter size.If memory device 60 is the differing heights (such as 9mm) of 2.5 inches identical shaped parameter size, before implementation step 72 to step 76, machine automatically is inserted into secondary guided plate 80 on the top guided plate 21.Yet if next memory device 60 is 3.5 inches memory devices, machine will be ignored the needs of test carrier 10 and 3.5 inches memory device testers will be connected to HPI connector 64.
It should be noted that memory device 60 that unloading has been tested and load in the process of next not detection of stored equipment, need not interrupt or stop manufacturing line with remodeling, redirect or replace the memory device tester.This is because the HPI connector 64 of any 2.5 inches SATA or SAS memory device 60 all is placed as orientation identical when being used to test 3.5 inches memory devices with it.Test carrier has base plate, base plate allow the HPI connector 64 of little form parameter memory device extend beyond substrate and with the memory device tester interface that is used for 3.5 inches memory devices.Rely on tester test carrier 10 to be thought 3.5 inches memory devices 60 of standard effectively, no matter form parameter size, height and weight.What this result was suitable saves time.
Those skilled in the art are to be understood that the present invention is not limited only to embodiment described above.Especially, can under the prerequisite of not leaving scope of the present invention, make following modification:
● test carrier 10 can be suitable for and be test other littler SFF memory device except 2.5 inches memory devices.This relate to according to industrial standard add and/or redirect side directed pin 26 be used for littler SFF memory device 60 mounting hole 62 and/or top guided plate 21 and secondary guided plate 80 are adjusted to Desired Height.
● the location of anchor clamps 14 between its primary importance and the second place also can replace mechanical arm to carry out by the people.Especially, square recess 47 is applicable to that people's finger is returned to its first compression position with anchor clamps 14.
● robot can be constructed to based on the quantity unloading of every type memory device 60 and refill the memory device 60 that carries different size.For example, in case the test of 2.5 inches memory devices 60 of requirement is accomplished, machine just automatically unloads 2.5 inches memory devices 60 and 2.5 inches memory devices 60 of new a collection of differing heights is loaded into test carrier 10.
● secondary guided plate 80 can further be constructed to except the 15mm described in the embodiment or other height the 9mm.
The HPI connector can be SATA interface or SAS interface.
Claims (15)
1. be used for the test carrier of memory device, it comprises:
Carrier base with 3.5 inches size memory;
Along the inwall that said carrier base engages, said inwall engages with said carrier base to define and is applicable to and lays the space of form parameter less than 3.5 inches memory device; And
Be installed at least one the side directed pin on the said inwall, be suitable for receiving at least one mounting hole of said memory device less than 3.5 inches,
Wherein said memory device is suitable for being remained in the test position by said at least one side directed pin;
Said test position is configured to be in the orientation that receives external test interface, and said external test interface is the existing test interface that is used for 3.5 inches memory devices.
2. test carrier according to claim 1 further comprises the top guided plate that is attached on the said inwall, and said top guided plate is suitable for receiving the memory device of the maximum height that is used to test.
3. test carrier according to claim 1 and 2 also comprises the anchor clamps that are installed to said carrier base, and said anchor clamps have at least one compressible devices so that said anchor clamps can move to second extended position from first compression position.
4. test carrier according to claim 1 and 2, wherein said carrier base comprise the weight retainer that is used to keep at least one weight.
5. test carrier according to claim 2 further comprises the secondary guided plate that removably is attached on the guided plate of said top.
6. test carrier according to claim 3, the compressible devices of wherein said anchor clamps is by at least one spring pushing.
7. test carrier according to claim 3, wherein said anchor clamps comprise a pair of damper that is used for fixing said memory device.
8. be used to test the method for the memory device of difformity parameter size, it may further comprise the steps:
(a) memory device of form parameter less than 3.5 inches inserted in the test carrier; And
(b) through fixing said memory device at least one side directed pin inserted-shape parameter at least one mounting hole with said test carrier less than 3.5 inches memory device; Wherein said memory device inserts with such orientation; Promptly; Form parameter is exposed to the orientation of external test interface less than the HPI connector of 3.5 inches memory device, and said external test interface is the existing test interface that is used for 3.5 inches memory devices.
9. the described method of claim 8, further comprise step: the contact shape parameter is less than the upper surface of 3.5 inches memory device below the guided plate of top.
10. according to Claim 8 or 9 described methods; Further comprise step: before the inserted-shape parameter is less than 3.5 inches memory device, anchor clamps are moved to first compression position; And said anchor clamps are moved to second extended position with the memory device of contact shape parameter less than 3.5 inches, thereby make the vibration that anchor clamps and form parameter take place at test period less than the contact inhibition between 3.5 inches the memory device.
11. method according to claim 10 further comprises through additional weight to said test carrier reaching the inhibition to the vibration of said memory device.
12. the described method of claim 11, wherein said weight is flexibly remained in the weight retainer.
13. method according to claim 9 comprises step: dismountable secondary guided plate is attached on the guided plate of said top, with the memory device of level altitude less than 15mm.
14. method according to claim 10, wherein said anchor clamps rely on spring to move to said second extended position from said first compression position.
15. method according to claim 10 further comprises through additional a pair of damper on said anchor clamps and suppresses the vibration of form parameter less than 3.5 inches memory device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200901089-3 | 2009-02-16 | ||
| SG200901089-3A SG164291A1 (en) | 2009-02-16 | 2009-02-16 | Adaptable test carrier for storage devices and method of testing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101807421A CN101807421A (en) | 2010-08-18 |
| CN101807421B true CN101807421B (en) | 2012-11-28 |
Family
ID=42561985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102063042A Expired - Fee Related CN101807421B (en) | 2009-02-16 | 2009-10-13 | Adaptable test carrier for storage devices and method of testing the same |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN101807421B (en) |
| MY (1) | MY156387A (en) |
| SG (1) | SG164291A1 (en) |
| WO (1) | WO2010093331A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012170022A1 (en) * | 2011-06-08 | 2012-12-13 | Hewlett-Packard Development Company, L.P. | Mounting frame and supports to mount a component of a computing system |
| CN104409105B (en) * | 2014-11-19 | 2018-04-03 | 苏州欧康诺电子科技股份有限公司 | A kind of universal hard disk testing fixture |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1506968A (en) * | 2002-12-11 | 2004-06-23 | ���ǵ�����ʽ���� | Cumpter disk driver adapter |
| CN1922687A (en) * | 2005-04-26 | 2007-02-28 | 创新塑科技有限公司 | Test bracket for storage device |
| WO2007139520A1 (en) * | 2006-05-31 | 2007-12-06 | Innovative Polymers Pte. Ltd. | Dampening device for a storage device tester and a storage device tester including same |
-
2009
- 2009-02-16 SG SG200901089-3A patent/SG164291A1/en unknown
- 2009-08-31 MY MYPI2011700083A patent/MY156387A/en unknown
- 2009-08-31 WO PCT/SG2009/000304 patent/WO2010093331A1/en active Application Filing
- 2009-10-13 CN CN2009102063042A patent/CN101807421B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1506968A (en) * | 2002-12-11 | 2004-06-23 | ���ǵ�����ʽ���� | Cumpter disk driver adapter |
| CN1922687A (en) * | 2005-04-26 | 2007-02-28 | 创新塑科技有限公司 | Test bracket for storage device |
| WO2007139520A1 (en) * | 2006-05-31 | 2007-12-06 | Innovative Polymers Pte. Ltd. | Dampening device for a storage device tester and a storage device tester including same |
Also Published As
| Publication number | Publication date |
|---|---|
| SG164291A1 (en) | 2010-09-29 |
| CN101807421A (en) | 2010-08-18 |
| WO2010093331A1 (en) | 2010-08-19 |
| MY156387A (en) | 2016-02-15 |
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