KR100867666B1 - Probe card - Google Patents

Abstract

A probe card is provided to enable a user to perform an assembling operation conveniently and accurately and to reduce a fabrication cost by the structure in which probes are coupled to the slots of a supporter having insulation. A probe card which transfers an electrical signal between a test head and the pads of an object includes: a printed circuit board(100) connected to a test head; plural interposers(110) which are mounted at a lower plane of the printed circuit board to be connected to the printed circuit board; plural space transforms(120) which are mounted the lower planes of the interposers to be connected to those interposers and in which plural pads are formed; a supporter(140) which has insulating property and in which plural first and second slots are formed along one direction; and plural probe assemblers having plural probes.

Description

Probe Card {PROBE CARD}

1 is a perspective view separately showing the configuration of a first embodiment of a probe card according to the present invention;

2 is a perspective view partially showing the configuration of the probe assembly in the probe card of the first embodiment according to the present invention;

3 is a cross-sectional view showing the configuration of the probe assembly in the probe card of the first embodiment according to the present invention;

4 is a front view showing the configuration of the probe in the probe card of the first embodiment according to the present invention;

5A and 5B are front views partially showing another embodiment of a probe in the probe card of the first embodiment according to the present invention.

6 is a perspective view separately showing the configuration of the interposer, the space transformer and the probe assembly in the probe card of the second embodiment according to the present invention;

7 is a perspective view partially showing the configuration of the probe assembly in the probe card of the second embodiment according to the present invention;

8 is a cross-sectional view showing the configuration of the probe assembly in the probe card of the second embodiment according to the present invention;

9 is a front view showing the configuration of the probe in the probe card of the second embodiment according to the present invention;

10 is a cross-sectional view illustrating a state in which a supporter is processed by a wheel cutter in the probe card of the second embodiment according to the present invention.

♣ Explanation of symbols for the main parts of the drawing ♣

2: test object 100: printed circuit board

110: interposer 120: space transformer

122: multilayer printed circuit board 130, 430: probe assembly

140, 440: supporters 142a, 442a: first side

142b and 442b: second side surface 144a: first bank

144b: second bank 146: channel

148a, 450a: first slot 148b, 450b: second slot

160, 460: probe 162, 462: vertical arm part

166, 266, 366, 466: connection terminal part 168, 268, 368, 468: contact terminal part

174, 474: reinforcement 180, 480: insulating resin

190: cover 444a: first slope

442b: second slope 446: plane

448a: first channel 448b: second channel

468: inclined arm part

The present invention relates to a probe card, and more particularly to a probe card for testing the electrical characteristics of the object under test, such as a semiconductor device, a flat panel display.

Semiconductor devices are manufactured through many processes, such as manufacturing a wafer, testing a wafer, and packaging a die. The test of the wafer is a so-called electrical die sorting test for testing the electrical properties of semiconductor devices. In the electrical die sorting test, semiconductor devices are classified into good and bad by contacting the pads of the semiconductor device with the probes of the probe card to input and output an electrical signal. In addition to testing semiconductor devices, the probe card can be used for data / gate in flat display cell processes such as thin film transistor-liquid drystal (TFT-LCD), plasma display panel (PDP), and organic electroluminescence (OEL). It is used for testing the line (Data / Gate Line).

The probe card includes a plurality of probes in direct contact with the pads of the wafer for large testing, a supporter for supporting the probes, a test head of the tester, and an electrical signal between the probes. It consists of a printed circuit board. A space transformer and an interposer may be provided between the probes of the probe card and the printed circuit board. The space transformer is configured to arrange a plurality of probes at a fine pitch. The interposer is configured to transfer electrical signals between the printed circuit board and the space transformer and maintain flatness of the probe card.

Probe cards in many documents, such as US Pat. Nos. 7,150,095 and 7,138,812, disclose a technique in which needle type probes are connected to a printed circuit board. The probe card of these patent documents is equipped with a support for supporting the probes on a printed circuit board. The probes are fixed to the supporter by molding of insulating resin, for example, epoxy resin, and connected to the printed circuit board by soldering.

However, in the prior art probe card including the probe card of the above-mentioned patent documents, the operator aligns the probes to the supporter using a jig in which fine holes are formed to determine the positions of the probes, and then the probe Since the molding and soldering of the epoxy resin should be carried out for fixing and connecting them, productivity is greatly reduced, and there is a problem that it is very difficult to control the flatness of the probes. When the probes are fixed to the supporter by molding of epoxy resin, they flow easily in the left and right directions, and when the epoxy resin is fired, defects in which the pitch of the probes cannot be maintained accurately due to heat deformation of the supporter, the probes and the epoxy resin are prevented. There is a problem that occurs frequently.

In addition, when any one of the plurality of probes is bad, there is a problem that the entire probe card needs to be replaced because the probes soldered to the printed circuit board cannot be separated and repaired. In order to prevent short circuits, the probes must separately cover the remaining portions of the printed circuit board and the pads of the semiconductor elements by insulating resins, thereby increasing production costs and lowering productivity.

On the other hand, the diameter of the wafer is produced in 200mm, 300mm to improve the yield, the pattern of the wafer (Pattern) is gradually made finer. However, since the probe card of the related art is configured to inspect the wafer chip at 128 para and 256 para, it is necessary to inspect one wafer through four touchdowns when inspecting 200 and 300 mm wafers. It is accompanied by a disadvantage. As the number of touchdowns of the probe card increases, not only the inspection time is delayed, but also the wear and damage of the probes progress rapidly, thereby reducing the service life. Therefore, by increasing the number of probes, the number of chips that can be processed simultaneously in a single test is greatly increased, but as the number of probes increases, probes that can solve many difficulties such as increase in production cost, decrease in productivity, and increase in defective rate Cards are not being developed.

The present invention has been made to solve the various problems of the prior art as described above, the object of the present invention is to provide a probe card that can greatly improve the inspection speed by reducing the number of touchdown during inspection of the subject. Is in.

Another object of the present invention is to provide a probe card that can be easily and accurately assembled by a structure in which probes are coupled to slots of an insulator supporter, thereby reducing production cost and greatly improving productivity.

Another object of the present invention is to provide a probe card which can reduce maintenance costs since the supporter and the pros constitute a single probe assembly that can be separated from the space transformers.

Still another object of the present invention is to provide a probe card in which probes are accurately connected to an object under test and a printed circuit board to improve reliability.

It is still another object of the present invention to provide a probe card in which connection terminals of probes are connected to space transformers by mechanical contact of a spring structure.

Still another object of the present invention is to provide a probe card, in which plastic deformation of contact terminal portions of probes in contact with pads of an object to be inspected by elastic deformation is prevented and thus life is ensured.

A feature of the present invention for achieving the above object is a probe card for transmitting an electrical signal between a test head and the pad of the object to be tested, comprising: a printed circuit board connected to the test head; A plurality of interposers mounted on a lower surface of the printed circuit board so as to be connected to the printed circuit board; A plurality of space transformers mounted on the lower surfaces of the interposers so as to be connected to the interposers, the plurality of space transformers having a plurality of pads formed therein; It is mounted on the lower surface of the space transformer and a plurality of first and second channels are formed along one direction and have an insulating supporter, and the pads of the test object and the pads of the space transformer are connected to the first and second channels. And a probe card comprising a plurality of probe assemblies having a plurality of probes mounted thereon.

Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments associated with the accompanying drawings.

Hereinafter, preferred embodiments of the probe card according to the present invention will be described in detail with reference to the accompanying drawings.

First, referring to FIG. 1, a probe card of the present invention includes a printed circuit board 100, a plurality of interposers 110, a plurality of space transformers 120, and a plurality of probe assemblies 130. Consists of The printed circuit board 100 is connected to a test head of a tester by a known Pogo Block and a Performance Board Unit. A stiffener 102 is mounted on the upper surface of the printed circuit board 100 to reinforce the rigidity of the printed circuit board 100 and maintain flatness. A stiffener cover 104 that protects the stiffener 102 is mounted on an upper surface of the stiffener 102, and a plurality of knobs 106 are mounted on an upper surface of the stiffener cover 104.

The plurality of interposers 110 are mounted on the lower surface of the printed circuit board 100 so as to be connected to the printed circuit board 100 to transmit electrical signals, and the flatness of the probe card by the interposers 110. Is maintained. The plurality of space transformers 120 are mounted on the lower surface of the interposers 110 to be connected to the interposers 110. The space transformers 120 are formed of a multilayer printed circuit board 122, and a plurality of pads 124 are formed on a bottom surface of the multilayer printed circuit board 122. In FIG. 1, two interposers 110 and space transformers 120 are mounted. However, the number of interposers 110 and space transformers 120 may be increased as necessary. .

1 to 3, the probe assemblies 130 may include a supporter 140 mounted on the bottom surface of the printed circuit board 100 and a plurality of probes 160 fixed to the supporter 140. have. The supporter 140 may be made of an insulating material, for example, ceramic, and the ceramic may be made of zirconia (ZrO ₂ ).

The supporter 140 has first and second side surfaces 142a and 142b parallel to each other along one direction. First and second banks 144a and 144b are formed on both sides of the lower surface of the supporter 140 along one direction, and a channel 146 is formed between the first and second banks 144a and 144b. It is. A plurality of first and second slots in other directions perpendicular to one direction to connect the first and second side surfaces 142a and 142b of the supporter 140 and the first and second banks 144a and 144b. 148a and 148b are formed. A pair of screw holes 150 are formed at both ends of the supporter 140. The pair of screws 152 are fastened to the screw holes 150 through the multilayer printed circuit board 122. The supporter 140 is firmly fixed to the lower surface of the multilayer printed circuit board 122 by fastening the screws 152. Although the supporter 140 is illustrated in FIG. 1 as being composed of a thin and long bar type, the width and length of the supporter 140 may be appropriately changed as necessary, and a block type may be used. It may be configured in various shapes such as.

2 to 4, the probes 160 are mounted in each of the first and second slots 148a and 148b of the supporter 140. One end of the probes 160 is connected to the pads 124 of the multilayered printed circuit board 122, and the other end of the probes 160 contacts the pads 4 of the inspected object 2, such as a wafer and a flat panel display, to input and output electrical signals. . The probes 160 include a vertical arm portion 162, a horizontal arm portion 164 extending perpendicularly from the lower end of the vertical arm portion 162, and a connection terminal portion formed at the end of the vertical arm portion 162. 166 and a contact terminal portion 168 formed at the end of the horizontal arm portion 164.

The vertical and horizontal arm portions 162 and 164 are fitted into and fixed to the first and second slots 148a and 148b of the supporter 140, respectively. A cutout groove 164a is formed at the center of the upper end of the horizontal arm portion 164. The cutout groove 164a contacts both bottom surfaces of the horizontal arm portion 164 with the lower surface of the supporter 140 in which the first and second slots 148a and 148b are formed. The area where the arm portions 164 contact each other is reduced to minimize assembly errors due to machining errors of the first and second slots 148a and 148b and the horizontal arm portions 164.

The connection terminal portion 166 is exposed outside the first and second slots 148a and 148b of the supporter 140 and is connected to each of the pads 124 of the multilayer printed circuit board 122. The connecting terminal portion 166 extends from the end of the vertical arm portion 162 and has a spring 166a having elasticity, and a pad 124 of the multilayer printed circuit board 122 formed at the end of the spring 166b. It consists of the 1st terminal 166b connected to each of these. The contact terminal portion 168 extends from the end of the horizontal arm portion 164 and is formed to be thin and long so as to contact each of the elastic tension bar 168a and the pads 4 of the object 2. The second terminal 168b is formed at the end of the tension bar 168a.

In the corner where the vertical and horizontal arm portions 162 and 164 meet, a first hinge portion 172 having elasticity is formed by the formation of a first relief 170. The tension bar 168a of the contact terminal portion 168 is reinforced by the reinforcement portion 174. The reinforcement part 174 is an extension bar 174a extending perpendicular to the end of the horizontal arm part 164 and a connection bar 174b connecting the upper center of the tension bar 168a and the upper end of the extension bar 174a. It consists of). The horizontal arm portion 164, the tension bar 168a, and the connection bar 174b form a triangle when viewed from each side of the probes 160. In the corner where the horizontal arm portion 164 and the extension bar 174a meet, a second hinge portion 178 having elasticity is formed by the formation of the second relief 176. The vertical and horizontal arm portions 162 and 164 of the probes 160 are firmly fixed to each of the first and second slots 148a and 148b of the supporter 140 via the insulating resin 180. The insulating resin 180 may be composed of an epoxy resin.

The probe card of the present invention has a cover (Cover) 190 to cover the supporter 140 of the probe assemblies 130. The cover 190 is mounted on the bottom surface of the printed circuit board 100 by fastening a plurality of screws 192, and a space 194 for accommodating the probe assemblies 130 is provided at the center of the cover 190. Formed.

The operation of the probe card according to the present invention having such a configuration will now be described.

1 to 3, a worker may insert a probe into each of the first and second slots 148a and 148b of the supporter 140 to assemble the supporter 140 of the probe assemblies 130 and the probes 160. The vertical and horizontal arm portions 162 and 164 of the 160 are inserted and fixed in a corresponding relationship. In this case, the operator places the contact terminal portion 168 of the probes 160 in the channel 144 of the supporter 140, and the connection terminal portion 166 of the probes 160 is exposed above the supporter 140.

The vertical and horizontal arm portions 162 and 164 of the probes 160 are firmly fixed to each of the first and second slots 148a and 148b of the supporter 140 by the insulating resin 180. The operator applies the insulating resin 180 to the first and second slots 148a and 148b of the supporter 140 and the first and second slots 148a and 148b to which the insulating resin 180 is applied. The vertical and horizontal arm portions 162 and 164 of the probe 160 are inserted into and fixed thereto. In addition, the operator applies the insulating resin 180 to the vertical and horizontal arm portions 162 and 164, and the first and second slots on the vertical and horizontal arm portions 162 and 164 to which the insulating resin 180 is applied. It may be fixed to each of the (148a, 148b). When the insulating resin 180 is completely cured, the vertical and horizontal arm portions 162 and 164 of the probes 160 are not separated from the first and second slots 148a and 148b by the bonding force of the insulating resin 180. can not do it.

First and second banks 142a and 142b when coupling the vertical and horizontal arm portions 162 and 164 of the probes 160 to the first and second slots 148a and 148b of the supporter 140, respectively. Both ends are located at the first and second reliefs 170, 176. The first and second reliefs 170 and 176 facilitate the smoothing of the corner where the vertical arm portion 162 and the horizontal arm portion 164 meet and the corner where the horizontal arm portion 164 and the extension bar 174a meet. Become. Further, due to the first and second reliefs 170 and 176, machining errors exist at both ends of the banks 142a and 142b, or the banks 142a and 142b and the first and second reliefs 170 and 176. Even when there is an assembly error between), the vertical and horizontal arm portions 162 and 164 of the probes 160 may be accurately coupled to each of the first and second slots 148a and 148b of the supporter 140. Each of the first and second hinge portions 172 and 178 is subjected to an elastic deformation in the corner of each of the first and second banks 142a and 142b, for example, when it is processed at an obtuse angle instead of being processed at a right angle. Thereby absorbing processing errors. Therefore, the probes 160 may be accurately coupled to each of the first and second slots 148a and 148b of the supporter 140. Finally, the operator mounts the cover 190 by fastening the screws 192 to surround the probe assemblies 130 on the bottom surface of the multilayer printed circuit board 122.

The connection terminal portion 166 of the probes 160 is connected to the pads 124 of the multilayer printed circuit board 122. When the first terminal 166b of the connection terminal portion 166 is in contact with the pads 124 and is stressed, the spring 166a is compressed, and the pads 124 and the first are elastically resilient by the spring 166a. The connection of the terminal 166b is kept tight, and connection failure is prevented.

In this way, since the mechanical contact between the pads 124 and the first terminal 166b is closely maintained by the elastic deformation of the spring 166a, the soldering of the pads 124 and the first terminal 166b becomes unnecessary. Productivity and reliability are greatly improved. In addition, it is necessary to use a jig by vertical and horizontal arm portions 162 and 164 of the probes 160 being fitted and fixed in a relationship corresponding to each of the first and second slots 148a and 148b of the supporter 140. Since the probe assemblies 130 can be assembled easily and accurately without any productivity, the productivity is greatly improved. Since the probes 160 are coupled to each of the first and second slots 148a and 148b of the supporter 140 having an insulating property, the coating of the insulating resin on each of the probes 160 is unnecessary, so that the production cost is increased. Savings and productivity.

3 and 4, after the probe card of the present invention is installed to be connected to the test head, the second terminal 168b of each of the probes 160 is operated by the operation of the test head so that the pad of the test object 2 ( 4) When a contact is applied to each of the stresses, the tension bar 168a is elastically deformed and the connection between the pads 4 of the inspected object 2 and the second terminal 168b is maintained closely to prevent connection failure. do. The connection bar 174b of the reinforcing part 174 supports the center of the upper end of the tension bar 168a which is elastically deformed, thereby preventing plastic deformation of the tension bar 168a. Therefore, the lifespan of the probes 160 is guaranteed and reliability is improved. On the other hand, if any one of the probe assembly 130 of the probe assembly 130 is defective, since only the probe assembly 130 can be removed and replaced easily, maintenance costs of the probe card is greatly reduced. .

In the probe card of the present invention, an electrical signal between the printed circuit board 100 and the probes 160 is transmitted through the interposer 110 and the multilayer printed circuit board 122. When the plurality of probes 160 are arranged at a high density, the multilayer printed circuit board 122 may easily connect the probes 160 and the printed circuit board 100 by the interlayer conductor circuit. In addition, since the probe assemblies 130 may be arranged at a high density by the plurality of interposers 110 and the plurality of space transformers 120, one or two touchdowns may be performed when inspecting a 200 mm or 300 mm wafer. One wafer can be inspected. Therefore, the number of touchdowns during the inspection of the inspected object 2 may be reduced, thereby greatly improving the inspection speed.

5A and 5B show another embodiment of a probe. As shown in FIG. 5A, the connection terminal portion 266 of the probe 160 is formed at the end of the vertical arm portion 162 and is prestressed, that is, an elongated spring that is prestressed and curved. It consists of 266a and the 1st terminal 266b. The curved spring 266a has a structure of a bending beam that is prestressed and has a relatively high flexural stiffness, that is, elastic strain and durability. Therefore, plastic deformation is prevented when the first terminal 266b of the connecting terminal portion 266 is connected to each of the pads 124 of the multilayer printed circuit board 122 with a vertical load, and the first terminal 266b and the pad ( The contact area between the 124 is increased. In addition, the contact between the first terminal 266b and the pads 124 is stably maintained by the elastic deformation of the curved spring 266a, thereby improving reliability.

As shown in FIG. 5B, the connection terminal portion 366 of the probe 160 is formed at the end of the vertical arm portion 162 and includes a spring band 366a and a first terminal 366b. It is. The spring band 366a has a band 366c and a plurality of holes 366d formed at equal intervals along the longitudinal direction of the band 366c. And both ends of the band (366c) is formed in a waveform for elastic deformation. When the first terminal 366b contacts each of the pads 124 of the multilayer printed circuit board 122, the band 366c is smoothly compressed by the formation of the holes 366d, and the elastic restoring force of the band 366c is applied. As a result, the connection between the pads 124 and the first terminal 366b is maintained closely, thereby preventing connection failure.

6 to 10 show a second embodiment of a probe card according to the invention. 6 to 8, the probe card of the second embodiment, like the probe card of the first embodiment, includes a printed circuit board 100, a plurality of interposers 110, a plurality of space transformers 120, and a plurality of probe cards. Of the probe assemblies 430.

The probe assembly 430 includes a supporter 440 mounted on the bottom surface of the multilayer printed circuit board 122 and a plurality of thin plate type probes 460 mounted on both sides of the supporter 440 along one direction. have. The supporter 440 has first and second side surfaces 442a and 442b parallel to each other along one direction. First and second slopes 444a and 444b are formed at both sides of the lower surface of the supporter 440 so as to be inclined downward from the lower ends of the first and second side surfaces 442a and 442b. The corners where the slopes 444a and 444b meet are connected by a plane 446. First and second channels 448a and 448b are formed along one direction of the supporter 440 at the centers of the first and second slopes 444a and 444b. The supporter 440 includes a plurality of first supports along the width direction of the supporter 440 so as to connect the first and second side surfaces 442a and 442b, the first and second slopes 444a and 444b, and the plane 446. And second slots 450a and 450b are formed. A pair of screw holes 452 are formed at both ends of the supporter 440. The pair of screws 454 pass through the multilayer printed circuit board 122 and are fastened to the screw holes 452. Therefore, the supporter 440 is firmly fixed to the lower surface of the multilayer printed circuit board 122 by fastening the screws 454.

6 to 9, the thin plate type probes 460 are mounted in each of the first and second slots 450a and 450b of the supporter 440. One end of the probes 460 is connected to the pads 124 of the multilayer printed circuit board 122, and the other end is in contact with the pads 4 of the test object 2 such as a wafer and a flat panel display to input and output electrical signals. . The probes 460 include a vertical arm portion 462, an inclined arm portion 464, a connection terminal portion 466, and a contact terminal portion 468. The inclined arm portion 464 extends inclined from the lower end of the vertical arm portion 462. The vertical and inclined arm portions 462 and 464 are fitted into and fixed to the first and second slots 450a and 450b of the supporter 440, respectively.

The connection terminal portion 466 is formed at the end of the vertical arm portion 462 so as to be connected to the pads 124 of the multilayer printed circuit board 122. The connection terminal portion 466 is composed of a spring 466a having elasticity and a first terminal 466b. The spring 466a extends from the end of the vertical arm portion 462. The first terminal 466b is formed to be exposed out of the first and second slots 450a and 450b of the supporter 440 at the end of the spring 466a and the pads 124 of the multilayer printed circuit board 122. It is connected to each. The connection terminal portion 466 of the probes 460 may be replaced by the connection terminal portions 266 and 366 shown in FIGS. 5A and 5B.

The contact terminal portion 468 is formed at the end of the inclined arm portion 464 so as to be in contact with the pads 4 of the subject 2. The contact terminal portion 468 is composed of a tension bar 468a having elasticity and a second terminal 468b. The tension bar 468a extends long and thin so as to be elastic from the end of the inclined arm portion 464. The second terminal 468b is formed at the end of the tension bar 468a so as to be in contact with each of the pads 4 of the inspected object 2. A first relief 470 is formed at the inner edge where the vertical arm portion 462 and the inclined arm portion 464 meet.

The probes 460 further include a reinforcement part 472 for reinforcing the rigidity of the tension bar 468a, and the reinforcement part 472 includes an extension bar 472a and a connection bar 472b. The extension bar 472a extends upward at the distal end of the inclined arm portion 464. The connection bar 472b is formed to connect the upper end of the tension bar 468a and the upper end of the extension bar 472a. The horizontal arm portion 464, the tension bar 468a, and the connection bar 472b form a triangle when viewed from each side of the probes 460. The reinforcement part 472 is fitted into the first and second channels 448a and 448b of the supporter 440. A second relief 474 is formed at the corner where the inclined arm portion 464 and the extension bar 472a meet. The vertical and inclined arm portions 462 and 464 of the probes 460 are firmly connected to each of the first and second slots 450a and 450b of the supporter 440 through the insulating resin 480, for example, an epoxy resin. Is fixed.

Referring to FIGS. 7 and 8, the operator may vertically and vertically position the probes 460 in each of the first and second slots 450a and 450b of the supporter 440 to assemble the supporter 440 and the probes 460. The inclined arm portions 462 and 464 and the contact terminal portion 468 are fitted and fixed in a corresponding relationship. At this time, the operator exposes the first terminal 466b of the connection terminal portion 446 above the supporter 440, and places the reinforcement portion 472 in the first and second channels 448a and 448b.

Next, the vertical and inclined arm portions 462 and 464 of the probes 460 are firmly fixed to each of the first and second slots 450a and 450b of the supporter 440 by the insulating resin 480. The operator applies the insulating resin 480 to the first and second slots 450a and 450b of the supporter 440, and the first and second slots 450a and 450b to which the insulating resin 480 is applied. The vertical and inclined arm portions 462 and 464 of the supporter 440 are fixed to each other. When the insulating resin 480 is completely cured, the vertical and inclined arm portions 462 and 464 of the probes 460 are not separated from the first and second slots 450a and 450b by the bonding force of the insulating resin 480. can not do it. The operator mounts the supporter 440 on the bottom surface of the multilayered printed circuit board 122 by fastening the screws 152 through the threaded holes 150 of the supporter 440 through the multilayered printed circuit board 122. The connection terminal portion 446 of the probes 460 is connected to the pads 124 of the printed circuit board 122.

On the other hand, after the probe card is installed to be connected to the test head, the second terminal 468b of each of the probes 460 contacts each of the pads 4 of the test object 2 by the operation of the test head. When the tension bar 468a is elastically deformed, the connection between the pads 4 and the second terminal 468b of the inspected object 2 is closely maintained to prevent connection failure. The connection bar 472b of the reinforcing part 472 supports the center of the upper end of the tension bar 468a to be elastically deformed to prevent plastic deformation of the tension bar 468a. Therefore, the lifespan of the probes 460 is guaranteed and reliability is improved. In addition, since the tension bar 468a of the contact terminal portion 468 is fitted in the first and second slots 450a and 450b, the tension bar 468a may not be bent in one direction of the supporter 440. Therefore, the second terminal 478b is correctly in contact with the pads 4 of the test object 2, thereby greatly improving the reliability and reproducibility of the test of the test object 2.

Referring to FIG. 10, when an operator cuts the first and second slots 450a and 450b of the supporter 440 at a uniform interval by the wheel cutter 6 having a diameter of about 55.4 mm, the first and second slots 450a and 450b may be cut. After the first slots 450a of the slots 450a and 450b are pre-machined on the first slope 444a, the second slots 450b are post-processed on the second slope 444b. The first slots 450a are formed in the first slope 444a and the plane 446, and the second slots 450b are formed in the second slope 444b and the plane 446. The plane 446 may generate an interference point or overlapping point between the first and second slots 450a and 450b that are cut by the wheel cutter 6 at boiling intervals.

As such, even when interference or overlap of the first and second slots 450a and 450b occurs in the plane 446, the first slots 450a pre-machined on the first slope 444a may be divided into the second slot ( It does not interfere with the wheel cutter 6 which post-processes 450b). In addition, since the contact terminal portion 468 of the probes 460 fits into the first and second slots 450a and 450b, the contact terminals 468 operate regardless of the processing form of the plane 446. Therefore, the second terminal 468b of the contact terminal portion 468 is accurately in contact with the pad 4 of the object 2 to be improved in the reliability and reproducibility of the test of the object 2.

The embodiments described above are merely illustrative of the preferred embodiments of the present invention, the scope of the present invention is not limited to the described embodiments, those skilled in the art within the spirit and claims of the present invention It will be understood that various changes, modifications, or substitutions may be made thereto, and such embodiments are to be understood as being within the scope of the present invention.

As described above, according to the probe card according to the present invention, a plurality of interposers and space transformers are adopted so that a plurality of probes can be arranged in a high density, thereby reducing the number of touchdowns when inspecting an object. Inspection speed can be greatly improved. Since the probes are coupled to the slots of the insulator supporter, respectively, it is possible to easily and accurately assemble, thereby reducing the production cost and greatly improving the productivity. Supporters and pros consist of a single probe assembly that can be easily separated from the space transformers, allowing replacement of the defective probe assembly, thereby reducing maintenance costs. In addition, since the probes are correctly connected to the test object and the space transformer, reliability is improved, and plastic deformation of the contact terminal portion of the probes contacted by the pads of the test object by elastic deformation is prevented, thereby ensuring the life.

Claims (13)

A probe card for transmitting an electrical signal between a test head and pads of an object, A printed circuit board connected to the test head; A plurality of interposers mounted on a lower surface of the printed circuit board so as to be connected to the printed circuit board; A plurality of space transformers mounted on a lower surface of the interposers so as to be connected to the interposers, and having a plurality of pads formed therein; A supporter mounted on a lower surface of the space transformer and having a plurality of first and second slots formed along one direction and having insulating property, and pads of the test object and the space transformer in the first and second slots; A probe card comprising a plurality of probe assemblies having a plurality of probes mounted to connect pads. According to claim 1, wherein the supporter has a first side and a second side parallel to each other along one direction, the first bank and the second bank on both sides of the lower surface is formed along one direction with a channel between the first and second, And second slots formed along one direction to connect the first and second side surfaces with the first and second banks. 3. The probe according to claim 1 or 2, wherein each of the probes has vertical and horizontal arm portions fitted into the first and second slots and is connected to ends of the vertical arm portions so as to be connected to pads of the space transformers. A probe card having a terminal portion and a contact terminal portion formed at an end of the horizontal arm portion so as to be connected to pads of the object under test. According to claim 3, wherein the supporter and the horizontal arm portion is formed in the center of the upper end of the horizontal arm portion to reduce the contact area with each other, the corner where the vertical and horizontal arm portion meet by forming a first relief A probe card having a first hinge portion having elasticity. 4. The connecting terminal portion according to claim 3, wherein the connecting terminal portion extends from an end of the vertical arm portion and comprises a spring having elasticity and a first terminal formed at an end of the spring, wherein the contact terminal portion is formed from an end of the horizontal arm portion. A probe card comprising a tension bar that extends thin and long, and a second terminal formed at an end of the tension bar. 6. The tension bar of claim 5, wherein the tension bar is reinforced by a reinforcement part, and the reinforcement part extends perpendicularly to the distal end of the horizontal arm part, and the tension bar supports the elastic deformation of the tension bar. And a connecting bar connecting a center of an upper end and an upper end of the extension bar, and a second hinge part having elasticity by forming a second relief in a corner where the horizontal arm part and the extension bar meet. The probe card of claim 5, wherein the supporter is made of ceramic, the probes are made of tungsten, and each of the probes is coupled to the slots of the supporter by an insulating resin. 4. The connecting terminal portion of claim 3, wherein the connecting terminal portion includes a spring band having an elasticity and extending from an end of the vertical arm portion, and a first terminal formed at an end of the spring band. A probe card having a plurality of holes formed at equal intervals along the longitudinal direction of the According to claim 1, wherein the supporter has a first and second side surfaces parallel to each other in one direction, the first and second slopes are formed to be inclined downward from the lower end of the first and second side surfaces on both sides Edges where the first and second slopes meet are planarly connected, and the first and second slots are formed along one direction to connect the first and second side surfaces with the first and second slopes. Probe card. 10. The apparatus of claim 1 or 9, wherein each of the probes has a vertical arm portion and an inclined arm portion fitted into the first and second slots and connected to an end of the vertical arm portion to be connected to the printed circuit board. A probe card having a terminal portion and a contact terminal portion formed at the end of the inclined arm portion so as to be in contact with the object under test. 11. The terminal of claim 10, wherein the connecting terminal portion comprises a spring having elasticity and extending from an end of the vertical arm portion and a first terminal formed at an end of the spring, wherein the contact terminal portion is formed from an end of the inclined arm portion. It consists of a thin and elongated tension bar and a second terminal formed at the end of the tension bar, the tension bar is reinforced with rigidity by the reinforcement portion, the reinforcement portion extends perpendicular to the end of the inclined arm portion And a connecting bar configured to connect an extension bar which is configured to connect the upper end of the extension bar with the center of the upper end of the tension bar to support the elastic deformation of the tension bar. 12. The method of claim 11, wherein each of the first and second slots are formed at equal intervals along one direction of the supporter, the center of each of the first and second slopes to accommodate the reinforcement portion along one direction of the supporter The probe card further comprises a first channel and a second channel. In the probe card for testing the electrical characteristics of the test object having a plurality of pads, A printed circuit board transferring an electrical signal to the plurality of pads of the object under test; A supporter coupled to the printed circuit board and having a side surface, an inclined surface inclined to the side surface, and a plurality of slots formed in the side surface over the slope; A vertical arm portion inserted into the slots and coupled to the side surface; an inclined arm portion inclinedly connected to the vertical arm portion and coupled to the slope; and at the end of the vertical arm portion so as to be connected to the printed circuit board. And a plurality of probes having a connection terminal portion connected thereto and a contact terminal portion connected to an end of the inclined arm portion so as to be connected to each of the pads of the object under test.

Images