CN101800256A - Film system of thin film solar cell, thin film solar cell and method for manufacturing thin film solar cell - Google Patents

Film system of thin film solar cell, thin film solar cell and method for manufacturing thin film solar cell Download PDF

Info

Publication number
CN101800256A
CN101800256A CN201010122977A CN201010122977A CN101800256A CN 101800256 A CN101800256 A CN 101800256A CN 201010122977 A CN201010122977 A CN 201010122977A CN 201010122977 A CN201010122977 A CN 201010122977A CN 101800256 A CN101800256 A CN 101800256A
Authority
CN
China
Prior art keywords
layer
amorphous silicon
knot
type
solar cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201010122977A
Other languages
Chinese (zh)
Other versions
CN101800256B (en
Inventor
赵一辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Argus Power Technology Co Ltd
Original Assignee
Henan Argus Power Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Argus Power Technology Co Ltd filed Critical Henan Argus Power Technology Co Ltd
Priority to CN2010101229772A priority Critical patent/CN101800256B/en
Publication of CN101800256A publication Critical patent/CN101800256A/en
Application granted granted Critical
Publication of CN101800256B publication Critical patent/CN101800256B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a film system of a thin film solar cell, which comprises a double-junction layer p-i-n/p-i-n consisting of an amorphous silicon p-i-n junction and a microcrystalline silicon p-i-n junction which are connected in series with each other, wherein a p-type microcrystalline silicon layer of the microcrystalline silicon p-i-n junction is arranged on an n-type amorphous silicon layer of the amorphous silicon p-i-n junction; a p-type amorphous silicon layer of the amorphous silicon p-i-n junction is provided with a heavily-doped P+ layer; the n-type microcrystalline silicon layer of the microcrystalline silicon p-i-n junction is provided with a heavily-doped N+ layer; and the structure of the film system is P+/p-i-n/p-i-n/N+. The film system of the thin film solar cell has high photoelectric conversion efficiency and low cost; and the photoelectric conversion efficiency of the thin film solar cell manufactured by a method of the invention reaches 10 percent.

Description

The manufacture method of a kind of thin film solar cell film system and thin film solar cell and thin film solar cell
Technical field
The present invention relates to a kind of thin film solar cell film system and thin film solar cell, also relate to a kind of manufacture method of thin film solar cell, belong to photovoltaic solar battery technology field.
Background technology
Along with worldwide nervous and short of the energy, people improve day by day to the attention degree that taps a new source of energy, and especially pay attention to day by day with the development and utilization of the green energy resource headed by the solar energy.Solar energy is subjected to extensive concern and favor with special advantages such as its pollution-free, no region restriction and round-the-clock utilization.
Based on maturity, reliability, low cost, be easy to be used in combination with other film photovoltaic materials, and have can matching design, preparation method's progress and the characteristic of improved process technology, the film photovoltaic module technology of preparing of thin film solar cell becomes the most potential a kind of solar cell industry.But the present amorphous silicon membrane-low problem of microcrystalline silicon film photovoltaic module ubiquity photoelectric conversion rate still about 8.5%, has restricted the application and the development of thin film solar cell so far.Wherein, the film structure of thin film solar cell is one of key factor that influences film photovoltaic module photoelectric conversion rate.The spectral absorption center that microcrystalline silicon film absorbs sunlight is 1.75ev, and the spectral absorption center that microcrystal silicon absorbs sunlight is 1.0ev, if the two series connection then has more wide spectral absorption space, therefore obtains higher photovoltaic conversion efficiency.Yet hydrogen suspension key and tail band can rank in the i of amorphous silicon layer with the i layer of microcrystal silicon in, cause the internal electric field of distortion, the drift velocity of carrier is reduced.
Summary of the invention
The purpose of this invention is to provide a kind of thin film solar cell film is, the present invention also aims to provide a kind of thin film solar cell, and simultaneously, the present invention also provides a kind of manufacture method of thin film solar cell.
In order to realize above purpose, the technical solution adopted in the present invention is:
A kind of thin film solar cell film is, this film system comprises a binode layer p-i-n/p-i-n who is provided with by amorphous silicon p-i-n knot and the series connection of microcrystal silicon p-i-n knot, the p type microcrystal silicon layer of described microcrystal silicon p-i-n knot is arranged on the n type amorphous silicon layer of described amorphous silicon p-i-n knot, and the p type amorphous silicon layer of described amorphous silicon p-i-n knot is provided with heavily doped P +The type amorphous silicon layer, the n type microcrystal silicon layer of described microcrystal silicon p-i-n knot is provided with heavily doped N +Type microcrystal silicon layer, this film structure are P +/ p-i-n/p-i-n/N +
Further, be provided with resilient coating between the p type microcrystal silicon layer that the n type amorphous silicon layer and the described microcrystal silicon p-i-n of described amorphous silicon p-i-n knot tie, described resilient coating is a transparency conducting layer.
Wherein, described P +The concentration of the alloy of layer and the concentration ratio of silicon atom are (10~100): 100000, and described N +The concentration of the alloy of layer and the concentration ratio of silicon atom are (5~100): 100000.
Described P +The thickness of layer is 1~10nm, described N +The thickness of layer is 2~15nm.The thickness ratio of the p layer of described amorphous silicon p-i-n knot, i layer, n layer is 2: (6~10): 3, and wherein the thickness of p type amorphous silicon layer is 15~30nm.The thickness ratio of the p layer of described microcrystal silicon p-i-n knot, i layer, n layer is 2: (6~10): 3, and wherein the thickness of p type microcrystal silicon layer is 150~300nm.The gross thickness of described amorphous silicon p-i-n knot is 1 with the ratio of the gross thickness of described microcrystal silicon p-i-n knot: (8~15).
A kind of thin film solar cell, comprise substrate, be arranged on transparency conducting layer, the back electrode on the substrate and be arranged on transparency conducting layer and back electrode between solar cell film system, described film is to comprise a binode layer p-i-n/p-i-n who is provided with by amorphous silicon p-i-n knot and the series connection of microcrystal silicon p-i-n knot, the p type microcrystal silicon layer of described microcrystal silicon p-i-n knot is arranged on the n type amorphous silicon layer of described amorphous silicon p-i-n knot, and the p type amorphous silicon layer of described amorphous silicon p-i-n knot is provided with heavily doped P +Layer, the n type microcrystal silicon layer of described microcrystal silicon p-i-n knot is provided with heavily doped N +Layer, this film structure is P +/ p-i-n/p-i-n/N +
Further, be provided with resilient coating between the p type microcrystal silicon layer that the n type amorphous silicon layer and the described microcrystal silicon p-i-n of described amorphous silicon p-i-n knot tie, described resilient coating is a transparency conducting layer.
A kind of manufacture method of thin film solar cell may further comprise the steps:
(1) substrate is put into the vacuum splashing and plating chamber, be coated with nesa coating on a face of substrate, promptly tco layer is used the laser cutting tco layer then;
(2) on tco layer, be coated with P +The type amorphous silicon layer is afterwards at P +Be coated with p type amorphous silicon layer, i type amorphous silicon layer, n type amorphous silicon layer on the layer successively, form amorphous silicon p-i-n knot, on the n type amorphous silicon layer of amorphous silicon p-i-n knot, be coated with p type microcrystal silicon layer, i type microcrystal silicon layer, n type microcrystal silicon layer successively then, make microcrystal silicon p-i-n knot, on the n type microcrystal silicon layer of microcrystal silicon p-i-n knot, be coated with N +The type microcrystal silicon layer;
(3) with the whole P of laser cutting +/ p-i-n/p-i-n/N +Series of strata are again in N +Be coated with ZnO layer and Al layer on the layer successively, i.e. dorsum electrode layer is afterwards again after the complete membrane silicon layer and dorsum electrode layer of laser cutting, to glue together film (EVA) and place on the Al layer, on the gummed film, add back-panel glass again, be solidified into one through the lamination of heating afterwards, encapsulation makes thin film solar cell.
Distribution about pure amorphous area carrier, there are five sections of branch to say, first district is occupied by the electric charge on tail band energy rank, it then is the carrier district, space that constitutes by nominal price suspension key, being one then almost is the neutral zone of waiting electric field, then being an electronegative suspension keypad again, is another conduction tail zone of being made up of the space carrier at last.This analytical model shows, has a kind of electric field of distortion in pure amorphous silicon i layer, and this electric field has limited the drift of carrier stream.Microcrystalline silicon film is to be that the silicon metal crystal of hundreds of micron is distributed in the uniform amorphous silicon membrane by size, what cause so the suspension key is arranged can be to form positive and negative carrier with defective to combine the center, therefore, make the distortion of p-i-n type solar cell internal electric field, the electric field of distortion can not provide the photoelectricity carrier drift velocity in the enough i layer and the time of existence, makes its photoelectric conversion efficiency very low.
The heavily doped P that in thin film solar cell film of the present invention is, is provided with +Type amorphous silicon layer and N +The type microcrystal silicon layer has influenced the CHARGE DISTRIBUTION in the i layer, has reduced the distortion of i layer internal electric field, has improved the drift velocity of carrier stream.With a heavy doping P +Layer connects with the TCO glass of n type, forms a good buffering area, and the nominal price electricity hole that not only helps to be produced by photon enters interface smoothly, can slow down the decay of photovoltaic conversion efficiency simultaneously.P +Layer can reduce free carrier with combining of p layer, and therefore the trap effect in the electric hole of nominal price especially promotes the extendable room of i layer thickness in the manufacture process, simultaneously, the colourity of solar cell also so and improve, photoelectric conversion efficiency improves greatly.In addition, the reduction of i layer internal electric field torsion resistance and increase with the adaptability of thickness can help to reduce the production cost of battery.
Thin film solar cell film system's employing amorphous silicon of the present invention and the overlapping structure of microcrystal silicon, its advantage is, amorphous silicon p-i-n knot can absorb low light level energy, being positioned at microcrystal silicon p-i-n knot that amorphous silicon p-i-n forges layer can absorb with 1.7EV and 1.0EV to be the solar spectrum energy at center, to have improved the utilance of light greatly.Simultaneously, microcrystal silicon p-i-n knot has the characteristics of low decay transfer ratio.Heavily doped P +Layer and N +Layer has the effect of lowering electrified body plyability and anelasticity, has increased electric hole and the drift velocity of electronics in semiconductor because of the torsion resistance that lowers electric field in the i layer simultaneously.
The film of thin film solar cell of the present invention is the photoelectric conversion rate height, and cost is low, and the photoelectric conversion rate of the thin film solar cell that the present invention makes reaches 10%.
Description of drawings
Fig. 1 is the structural representation of the thin film solar cell film system of the embodiment of the invention 1;
Fig. 2 is the structural representation of the thin film solar cell film system of the embodiment of the invention 2;
Fig. 3 is the structural representation of the thin film solar cell of the embodiment of the invention 3;
Fig. 4 is the structural representation of the thin film solar cell of the embodiment of the invention 4.
Embodiment
Embodiment 1
See shown in Figure 1, a kind of thin film solar cell film system, this film system is by forming with the lower part:
Heavily doped P +Type amorphous silicon layer 1;
At heavily doped P +The amorphous silicon p-i-n knot that is provided with on one of them face of layer 1, this amorphous silicon p-i-n knot comprises p type amorphous silicon layer 2, i type amorphous silicon layer 3, n type amorphous silicon layer 4;
The microcrystal silicon p-i-n that ties setting at amorphous silicon p-i-n ties, and this microcrystal silicon p-i-n knot comprises p type microcrystal silicon layer 5, i type microcrystal silicon layer 6, n type microcrystal silicon layer 7;
The heavily doped N that on the n type microcrystal silicon layer 7 of microcrystal silicon p-i-n knot, is provided with +Type microcrystal silicon layer 8.
Embodiment 2
See shown in Figure 2, a kind of thin film solar cell film system, this film system is by forming with the lower part:
Heavily doped P +Type amorphous silicon layer 1;
At heavily doped P +The amorphous silicon p-i-n knot that is provided with on one of them face of layer 1, this amorphous silicon p-i-n knot comprises p type amorphous silicon layer 2, i type amorphous silicon layer 3, n type amorphous silicon layer 4;
The resilient coating 15 that on the n type amorphous silicon layer of amorphous silicon p-i-n knot, is provided with, this resilient coating is a transparency conducting layer;
The microcrystal silicon p-i-n knot that on resilient coating 15, is provided with, this microcrystal silicon p-i-n knot comprises p type microcrystal silicon layer 5, i type microcrystal silicon layer 6, n type microcrystal silicon layer 7;
The heavily doped N that on the n type microcrystal silicon layer 7 of microcrystal silicon p-i-n knot, is provided with +Type microcrystal silicon layer 8.
Increase resilient coating 15 and can increase the refraction number of times of light, thereby improved the assimilation ratio of light in amorphous silicon film solar battery film system, improved the utilance of light.
Embodiment 3
See shown in Figure 3, a kind of thin film solar cell, the film photovoltaic module of this thin film solar cell is: along the incident light direction, be glass substrate 9 successively, be arranged on nesa coating (TCO) 10 on the glass substrate 9, be arranged on the P on the nesa coating (TCO) 10 +Type amorphous silicon layer 1, be arranged on P +The amorphous silicon p-i-n knot by p layer 2, i layer 3, n layer 4 formed of layer on 1, be arranged on amorphous silicon p-i-n knot n layer 4 on the microcrystal silicon p-i-n that forms by p layer 5, i layer 6, n layer 7 tie, be arranged on N on the n layer 7 that microcrystal silicon p-i-n ties +Type microcrystal silicon layer 8, be arranged on N +The ZnO layer 11 of layer on 8, be arranged on Al layer 12 on the ZnO layer 11, be arranged on gummed film (EVA) layer 13 on the Al layer 12, be arranged on the back-panel glass 14 on gummed film (EVA) layer 13,, make thin film solar cell through the lamination of heating, encapsulation.
Embodiment 4
See shown in Figure 4, a kind of thin film solar cell, the film photovoltaic module of this thin film solar cell is: along the incident light direction, be glass substrate 9 successively, be arranged on nesa coating (TCO) 10 on the glass substrate 9, be arranged on the P on the nesa coating (TCO) 10 +Type amorphous silicon layer 1, be arranged on P +The amorphous silicon p-i-n knot by p layer 2, i layer 3, n layer 4 formed of layer on 1, be arranged on amorphous silicon p-i-n knot n layer 4 on resilient coating 15, be arranged on the microcrystal silicon p-i-n that forms by p layer 5, i layer 6, n layer 7 on the resilient coating 15 and tie, be arranged on N on the n layer 7 that microcrystal silicon p-i-n ties +Type microcrystal silicon layer 8, be arranged on N +The ZnO layer 11 of layer on 8, be arranged on Al layer 12 on the ZnO layer 11, be arranged on gummed film (EVA) layer 13 on the Al layer 12, be arranged on the back-panel glass 14 on gummed film (EVA) layer 13,, make thin film solar cell through the lamination of heating, encapsulation.
Embodiment 5
A kind of manufacture method of thin film solar cell may further comprise the steps:
(1) glass substrate is put into the vacuum splashing and plating chamber, be coated with nesa coating on a face of substrate, promptly tco layer is used the laser cutting tco layer then;
(2) put into ion afterwards and help the plating gas reaction chamber, be heated to 200 ℃, using plasma strengthens chemical vapour deposition technique (PECVD), uses the power supply of 13.56MHz, at first feeds SiH 4, B 2H 4And H 2Mist, make gas aggradation on tco layer, make P +Amorphous silicon film layer, in this technical process, that use is TMB, its B 2H 6Content be 3%, among the PECVD, the content of TMB is 1%, so B 2H 6Be about about 0.1% of silane concentration, afterwards with SiH 4, B 2H 4And H 2Mist in B 2H 4Content reduce an order of magnitude, make gas aggradation in P +On the amorphous silicon film layer, make the p amorphous silicon film layer, feed SiH afterwards 4And H 2Mist, on the p amorphous silicon film layer, be coated with the i amorphous silicon film layer, be coated with and feed SiH again after finishing 4, PH 3And H 2Mist, on the i amorphous silicon film layer, be coated with the n amorphous silicon film layer, promptly make amorphous silicon p-i-n knot, adopt the ion of high frequency to help plating evaporating method (VHF-PECVD) afterwards, supply frequency is 30~130MHz, on the n layer of amorphous silicon p-i-n knot, be coated with p microcrystal silicon rete, i microcrystal silicon rete, n microcrystal silicon rete successively, make microcrystal silicon p-i-n knot, afterwards with SiH 4, PH 3And H 2Mist in PH 3Content increase an order of magnitude, on the n microcrystal silicon rete of microcrystal silicon p-i-n knot, be coated with N +The microcrystal silicon rete is coated with back the helping the plating gas reaction chamber from ion that finish and takes out;
(3) with whole amorphous silicon of laser cutting and microcrystal silicon rete, again in N +Be coated with ZnO layer and Al layer on the microcrystal silicon rete successively, it is dorsum electrode layer, afterwards again through laser cutting complete membrane silicon layer and dorsum electrode layer, to glue together film (EVA) places on the Al layer, on the gummed film, add back-panel glass again, be solidified into one through the lamination of heating, encapsulation makes the overlapping thin film solar cell of amorphous silicon and microcrystal silicon.

Claims (13)

1. a thin film solar cell film is, it is characterized in that, this film system comprises a binode layer p-i-n/p-i-n who is provided with by amorphous silicon p-i-n knot and the series connection of microcrystal silicon p-i-n knot, the p type microcrystal silicon layer of described microcrystal silicon p-i-n knot is arranged on the n type amorphous silicon layer of described amorphous silicon p-i-n knot, and the p type amorphous silicon layer of described amorphous silicon p-i-n knot is provided with heavily doped P +The type amorphous silicon layer, the n type microcrystal silicon layer of described microcrystal silicon p-i-n knot is provided with heavily doped N +Type microcrystal silicon layer, this film structure are P +/ p-i-n/p-i-n/N +
2. thin film solar cell film according to claim 1 system is characterized in that, is provided with resilient coating between the p type microcrystal silicon layer of the n type amorphous silicon layer of described amorphous silicon p-i-n knot and described microcrystal silicon p-i-n knot.
3. thin film solar cell film according to claim 2 is, it is characterized in that described resilient coating is a transparency conducting layer.
4. thin film solar cell film according to claim 3 is, it is characterized in that described P +The concentration of the alloy of type amorphous silicon layer and the concentration ratio of silicon atom are (10~100): 100000.
5. thin film solar cell film according to claim 3 is, it is characterized in that described N +The concentration of the alloy of type microcrystal silicon layer and the concentration ratio of silicon atom are (5~100): 100000.
6. thin film solar cell film according to claim 1 is, it is characterized in that described P +The thickness of type amorphous silicon layer is 1~10nm, described N +The thickness of type microcrystal silicon layer is 2~15nm.
7. thin film solar cell film according to claim 1 is to it is characterized in that the thickness ratio of the p layer of described amorphous silicon p-i-n knot, i layer, n layer is 2: (6~10): 3.
8. thin film solar cell film according to claim 1 is to it is characterized in that the thickness ratio of the p layer of described microcrystal silicon p-i-n knot, i layer, n layer is 2: (6~10): 3.
9. thin film solar cell film according to claim 1 is to it is characterized in that the gross thickness of described amorphous silicon p-i-n knot is 1 with the ratio of the gross thickness of described microcrystal silicon p-i-n knot: (8~15).
10. thin film solar cell, comprise substrate, be arranged on transparency conducting layer, the back electrode on the substrate and be arranged on transparency conducting layer and back electrode between solar cell film system, it is characterized in that, described film is to comprise a binode layer p-i-n/p-i-n who is provided with by amorphous silicon p-i-n knot and the series connection of microcrystal silicon p-i-n knot, the p type microcrystal silicon layer of described microcrystal silicon p-i-n knot is arranged on the n type amorphous silicon layer of described amorphous silicon p-i-n knot, and the p type amorphous silicon layer of described amorphous silicon p-i-n knot is provided with heavily doped P +The type amorphous silicon layer, the n type microcrystal silicon layer of described microcrystal silicon p-i-n knot is provided with heavily doped N +Type microcrystal silicon layer, this film structure are P +/ p-i-n/p-i-n/N +
11. thin film solar cell according to claim 10 is characterized in that, is provided with resilient coating between the p type microcrystal silicon layer that the n type amorphous silicon layer and the described microcrystal silicon p-i-n of described amorphous silicon p-i-n knot tie.
12. thin film solar cell according to claim 11 is characterized in that, described resilient coating is a transparency conducting layer.
13. the manufacture method of the described thin film solar cell of claim 10 is characterized in that, may further comprise the steps:
(1) substrate is put into the vacuum splashing and plating chamber, be coated with nesa coating on a face of substrate, promptly tco layer is used the laser cutting tco layer then;
(2) on tco layer, be coated with P +The type amorphous silicon layer is afterwards at P +Be coated with p type amorphous silicon layer, i type amorphous silicon layer, n type amorphous silicon layer on the layer successively, form amorphous silicon p-i-n knot, on the n type amorphous silicon layer of amorphous silicon p-i-n knot, be coated with p type microcrystal silicon layer, i type microcrystal silicon layer, n type microcrystal silicon layer successively then, form microcrystal silicon p-i-n knot, on the n type microcrystal silicon layer of microcrystal silicon p-i-n knot, be coated with N +The type microcrystal silicon layer;
(3) with the whole P of laser cutting +/ p-i-n/p-i-n/N +Series of strata are again in N +Be coated with dorsum electrode layer on the layer, again behind laser cutting silicon layer and dorsum electrode layer, will glue together film and place on the dorsum electrode layer afterwards, on the gummed film, add back-panel glass again, be solidified into one through the lamination of heating afterwards, encapsulate, make thin film solar cell.
CN2010101229772A 2010-03-12 2010-03-12 Film system of thin film solar cell, thin film solar cell and method for manufacturing thin film solar cell Expired - Fee Related CN101800256B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010101229772A CN101800256B (en) 2010-03-12 2010-03-12 Film system of thin film solar cell, thin film solar cell and method for manufacturing thin film solar cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010101229772A CN101800256B (en) 2010-03-12 2010-03-12 Film system of thin film solar cell, thin film solar cell and method for manufacturing thin film solar cell

Publications (2)

Publication Number Publication Date
CN101800256A true CN101800256A (en) 2010-08-11
CN101800256B CN101800256B (en) 2012-07-04

Family

ID=42595832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101229772A Expired - Fee Related CN101800256B (en) 2010-03-12 2010-03-12 Film system of thin film solar cell, thin film solar cell and method for manufacturing thin film solar cell

Country Status (1)

Country Link
CN (1) CN101800256B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102931256A (en) * 2011-08-11 2013-02-13 吉富新能源科技(上海)有限公司 Laser scribing method of transparent thin film solar cell
CN103022059A (en) * 2011-09-23 2013-04-03 吉富新能源科技(上海)有限公司 Technology for manufacturing triple-shroud-plate type silicon thin film solar battery by combining silane and silicon helide
CN103035757A (en) * 2012-12-05 2013-04-10 保定风帆光伏能源有限公司 Thin-film solar cell and p-type semiconductor and preparation method of p-shaped semiconductor
CN113295292A (en) * 2021-05-26 2021-08-24 北京京东方技术开发有限公司 Temperature sensor and device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1851935A (en) * 2006-03-23 2006-10-25 姜堰新金太阳能光伏制造有限公司 Double-junction solar cell and manufacturing method thereof
US20080223440A1 (en) * 2007-01-18 2008-09-18 Shuran Sheng Multi-junction solar cells and methods and apparatuses for forming the same
CN101627478A (en) * 2007-02-16 2010-01-13 三菱重工业株式会社 Photoelectric converter and method for fabricating the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1851935A (en) * 2006-03-23 2006-10-25 姜堰新金太阳能光伏制造有限公司 Double-junction solar cell and manufacturing method thereof
US20080223440A1 (en) * 2007-01-18 2008-09-18 Shuran Sheng Multi-junction solar cells and methods and apparatuses for forming the same
CN101627478A (en) * 2007-02-16 2010-01-13 三菱重工业株式会社 Photoelectric converter and method for fabricating the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102931256A (en) * 2011-08-11 2013-02-13 吉富新能源科技(上海)有限公司 Laser scribing method of transparent thin film solar cell
CN103022059A (en) * 2011-09-23 2013-04-03 吉富新能源科技(上海)有限公司 Technology for manufacturing triple-shroud-plate type silicon thin film solar battery by combining silane and silicon helide
CN103035757A (en) * 2012-12-05 2013-04-10 保定风帆光伏能源有限公司 Thin-film solar cell and p-type semiconductor and preparation method of p-shaped semiconductor
CN103035757B (en) * 2012-12-05 2016-04-13 保定风帆光伏能源有限公司 The preparation method of a kind of thin-film solar cells and p-type semiconductor and p-type semiconductor
CN113295292A (en) * 2021-05-26 2021-08-24 北京京东方技术开发有限公司 Temperature sensor and device

Also Published As

Publication number Publication date
CN101800256B (en) 2012-07-04

Similar Documents

Publication Publication Date Title
Ranabhat et al. An introduction to solar cell technology
CN102097541B (en) Method for enhancing efficiency of industrial single-chamber deposited amorphous silicon-based solar cell
CN103681889B (en) Electret-structure-introduced efficient solar cell and preparing method thereof
CN101866963A (en) Silicon-based multijunction multi-laminated PIN thin film solar cell with high conversion rate and production method thereof
CN103346214B (en) A kind of silica-based radial homogeneity heterojunction solar cell and preparation method thereof
Zeman Thin-film silicon PV technology
CN201562684U (en) Silica-based thin-film solar battery
CN109509807A (en) Emitter structure of silicon/crystalline silicon heterojunction solar battery and preparation method thereof
CN102341919B (en) Solar cell
CN101800256B (en) Film system of thin film solar cell, thin film solar cell and method for manufacturing thin film solar cell
CN101609796B (en) Film forming method and method for manufacturing film solar battery
CN103563091B (en) There is the tandem solaode of the tunnel knot of improvement
Castellano Solar panel processing
CN106449850B (en) A kind of efficient silicon based hetero-junction double-side cell and preparation method thereof
CN201708163U (en) Thin-film solar cell film system and thin-film solar cell
CN102983217B (en) Improving one's methods and structure of solar cell properties
CN101246926A (en) Amorphous boron carbon alloy and photovoltaic application thereof
CN101794828B (en) Film system of thin-film solar cell, thin-film solar cell and manufacturing method thereof
CN102157596B (en) Barrier type silicon-based thin film semi-laminated solar cell
CN106449815A (en) Heterojunction solar cell device production method based on amorphous silicon thin films
CN101794827A (en) Amorphous silicon film solar cell film system, and film solar cell and manufacturing method thereof
US7122736B2 (en) Method and apparatus for fabricating a thin-film solar cell utilizing a hot wire chemical vapor deposition technique
CN103066153A (en) Silicon-based thin-film lamination solar cell and manufacturing method thereof
CN103107236B (en) Heterojunction solar battery and preparation method thereof
CN108172644B (en) A kind of preparation method of phosphorus doping cadmium telluride diaphragm solar battery

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120704

Termination date: 20130312