CN101798226A - High-precision transporting device for processing multi-layer green ceramic chip - Google Patents
High-precision transporting device for processing multi-layer green ceramic chip Download PDFInfo
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- CN101798226A CN101798226A CN 201010127528 CN201010127528A CN101798226A CN 101798226 A CN101798226 A CN 101798226A CN 201010127528 CN201010127528 CN 201010127528 CN 201010127528 A CN201010127528 A CN 201010127528A CN 101798226 A CN101798226 A CN 101798226A
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Abstract
The invention discloses a high-precision transporting device for processing a multi-layer green ceramic chip, which solves the problem that malposition and deformation easily occurs in the transportation process after the multi-layer green ceramic chip is located in a traditional apparatus with high precision. The device comprises a transporting device stand, a linear motor, a cylinder (8) and a porous stone adsorption plate (19), wherein a stator (5) of the linear motor is fixedly arranged on a stator fixed plate (6), a rotor (3) of the linear motor is matched with a guide rail (1) through a rotor connecting plate (24), an inverted L-shaped hook plate (4) and a middle plywood (7) are respectively and fixedly connected at two sides of the lower end face of the rotor connecting plate (24), the cylinder (8) is fixedly arranged at the bottom surface of the rotor connecting plate (24), an output shaft of the cylinder (8), a bottom plate of an L-shaped cylinder fixed plate (15) and the porous stone adsorption plate (19) are fixedly connected, and side plates of the L-shaped cylinder fixed plate (15) are arranged on a crossed roller guide rail (18). The invention meets the requirement of lamination precision as high +/-10 mum.
Description
Technical field
The present invention relates to the high-precision transporting device in the lamination machine in a kind of LTCC system device, particularly a kind of high fix transfer device of processing laminated ceramic chips.
Background technology
Lamination machine major function is to carry out automatic demoulding, vision localization through the ceramic chips of filling and printed figure, again the laminated ceramic chips folded to be carried out fixing between layer and the layer, enters next procedure then and carry out lamination by the mode of four spot weld.And every layer of ceramic chips thickness minimum 100um only, the highest folded 30 laminations tightly weld.In actual production process, after every layer of ceramic chips passed through high fix by high-precision transporting device from positioning table, move on on the lamination platform that is connected with negative-pressure adsorption, and compress down at the vacuum ceramic adsorption plate, flatiron presses down and welds.Each welding has only four flatirons at four jiaos of places to work simultaneously, and other four flatiron work then are replaced by in welding next time, and the lamination precision is up to ± 10um.Displacement precision from positioning table to the lamination platform is one of key factor that guarantees the lamination precision, existing installation is easy to generate dislocation after with the laminated ceramic chips high fix in handling process, and usually produce distortion picking up to free in the ceramics process, and then the dislocation after producing ceramic chips and laminating, cause scrap rate to improve.
Summary of the invention
The invention solves existing installation and in handling process, be easy to generate dislocation after with the laminated ceramic chips high fix, and usually produce distortion in the ceramics process picking up to free, and then produce the dislocation after ceramic chips laminates, the technical problem that causes scrap rate to improve.
The present invention overcomes the above problems by following scheme:
The high-precision transporting device of processing laminated ceramic chips comprises transfer device support body, linear electric motors, cylinder and porous stone adsorption plate, and whole device is fixed together by the upper supporting plate of forward and backward retaining plate and lamination machine.Described transfer device support body is by rear fixed plate, front shoe, guide rail, the stator retaining plate is formed, guide rail and stator retaining plate be arranged in parallel, guide rail is arranged on the top of stator retaining plate, the two ends of stator retaining plate are fixedly connected rear fixed plate and front shoe respectively, on the stator retaining plate, fixedly install the stator of linear electric motors, the upper surface of the mover of linear electric motors and mover web plate are fixed together, be set with four slide blocks on the upper surface of mover web plate, this four slide blocks and guide rail clearance fit, dual-side in the lower surface of mover web plate is fixed with one respectively and falls L shaped hook plate, fall to be fixedly connected with aluminium between the bottom of L shaped hook plate and to prop up piece two, aluminium props up the piece rear end and is connected with middle clamp plate, on the bottom surface of middle clamp plate, be set with the cylinder support plate, on the cylinder support plate, be set with cylinder, the middle part of propping up the piece rear end at aluminium is set with the intersection roller guide rail, the guide rail slide plate is arranged on the movable block of intersection roller guide rail, the output terminal of cylinder and the plate upper surface of L shaped air cylinder fixed plate link together, the side plate of L shaped air cylinder fixed plate is arranged on the guide rail slide plate that intersects on the roller guide rail, and the lower surface of the base plate of L shaped air cylinder fixed plate is fixed together by bottom plate and porous stone adsorption plate.
On the upper supporting plate of described lamination machine, be set with mounting angle plate, be set with the grating reading head permanent seat in the inboard of mounting angle plate, on the grating reading head permanent seat, be set with grating reading head, be set with near switch in the inboard of mounting angle plate, the outside of propping up piece at middle clamp plate and aluminium is set with grating chi retaining plate, is set with the grating chi on grating chi retaining plate.
The invention has the beneficial effects as follows to have realized laminating and to guarantee that the lamination precision is up to ± 10um after the welding through the laminated ceramic chips behind the high fix.Satisfy the design requirements of lamination machine.
Description of drawings:
Fig. 1 is a structural representation of the present invention
Embodiment
The high-precision transporting device of processing laminated ceramic chips, comprise the transfer device support body, linear electric motors, cylinder 8 and porous stone adsorption plate 19, described transfer device support body is by rear fixed plate 10, front shoe 23, guide rail 1, stator retaining plate 6 is formed, guide rail 1 and stator retaining plate 6 be arranged in parallel, guide rail 1 is arranged on the top of stator retaining plate 6, the two ends of stator retaining plate 6 are fixedly connected rear fixed plate 10 and front shoe 23 respectively, on stator retaining plate 6, fixedly install the stator 5 of linear electric motors, the upper surface and the mover web plate 24 of the mover 3 of linear electric motors are fixed together, be set with four slide blocks 2 on the upper surface of mover web plate 24, these four slide blocks 2 are slidingly matched with guide rail 1, dual-side in the lower surface of mover web plate 24 is fixed with one respectively and falls L shaped hook plate 4, be fixedly connected with aluminium in two bottoms of falling L shaped hook plate 4 and prop up piece 20, aluminium props up the piece rear end and is connected with middle clamp plate 7, on the bottom surface of middle clamp plate 7, be set with cylinder support plate 11, on cylinder support plate 11, be set with cylinder 8, the middle part that aluminium props up piece 20 rear ends is set with intersection roller guide rail 18, guide rail slide plate 16 is arranged on the movable block of intersection roller guide rail 18, the plate upper surface of the output terminal of cylinder 8 and L shaped air cylinder fixed plate 15 links together, the side plate of L shaped air cylinder fixed plate 15 is arranged on the guide rail slide plate 16 that intersects on the roller guide rail 18, and the lower surface of the base plate of L shaped air cylinder fixed plate 15 is fixed together by bottom plate 17 and porous stone adsorption plate 19.
On described stator retaining plate 6, be set with mounting angle plate 9, be set with grating reading head permanent seat 14 in the inboard of mounting angle plate 9, on grating reading head permanent seat 14, be set with grating reading head 13, be set with near switch 12 in the inboard of mounting angle plate 9, the outside of propping up piece 20 at middle clamp plate 7 and aluminium is set with grating chi retaining plate 22, is set with grating chi 21 on grating chi retaining plate 22.
A kind of high-precision transporting device of processing laminated ceramic chips comprise linear electric motors finish before and after horizontal transfer movement, cylinder is finished to pick up vertically and is put action.Linear electric motors are made of stator 5 and mover 3.Mover 3 is installed on the mover web plate 24, and mover web plate 24 is lifted on four slide blocks 2 on the guide rail 1.Medianly zygomorphic L hook plate 4 is lifted on the mover web plate 24 again under it.Aluminium props up piece 20 and is lifted on two L hook plates by the left and right sides.Stator 5 is installed on the stator retaining plate 6 from the side, and its rear and front end is installed in respectively on front shoe 23 and the rear fixed plate 10, is contained on the upper supporting plate of lamination machine fixing by front shoe 23 and rear fixed plate 10 again.Cylinder 8 is installed on the cylinder support plate 11, and cylinder support plate 11 is lifted on the middle clamp plate 7, and middle clamp plate 7 props up piece 20 with aluminium and adopts step to be threaded.Middle clamp plate 7 is equipped with grating chi retaining plate 22 with the side that aluminium props up piece 20, and grating chi 21 is housed on it.Grating reading head 13 is installed apart from grating chi 0.8mm.Grating reading head 13 is loaded on the sensor holder (14), is loaded on the mounting angle plate (9) near switch (12).Grating reading head permanent seat 14 refills on the upper supporting plate of lamination machine fixing with after mounting angle plate 9 is connected.The bottom movable end of cylinder 8 is installed on the L shaped air cylinder fixed plate 15, and L shaped air cylinder fixed plate 15 is loaded on the guide rail slide plate 16 of intersection roller guide rail 18.L shaped air cylinder fixed plate is equipped with bottom plate 17 15 times, and the porous stone adsorption plate is lifted on the bottom plate 17.
Claims (2)
1. the high-precision transporting device of a processing laminated ceramic chips, comprise the transfer device support body, linear electric motors, cylinder (8) and porous stone adsorption plate (19), it is characterized in that, described transfer device support body is by rear fixed plate (10), front shoe (23), guide rail (1), stator retaining plate (6) is formed, guide rail (1) and stator retaining plate (6) be arranged in parallel, guide rail (1) is arranged on the top of stator retaining plate (6), the two ends of stator retaining plate (6) are fixedly connected rear fixed plate (10) and front shoe (23) respectively, on stator retaining plate (6), fixedly install the stator (5) of linear electric motors, the upper surface of the mover of linear electric motors (3) and mover web plate (24) are fixed together, be set with four slide blocks (2) on the upper surface of mover web plate (24), these four slide blocks (2) and guide rail (1) clearance fit, dual-side in the lower surface of mover web plate (24) is fixed with one respectively and falls L shaped hook plate (4), fall to be fixedly connected with aluminium between the bottom of L shaped hook plate (4) and to prop up piece (20) two, aluminium props up piece (20) rear end and is connected with middle clamp plate (7), on the bottom surface of middle clamp plate (7), be set with cylinder support plate (11), on cylinder support plate (11), be set with cylinder (8), the middle part of propping up piece (20) rear end at aluminium is set with intersection roller guide rail (18), guide rail slide plate (16) is arranged on the movable block of intersection roller guide rail (18), the plate upper surface of the output shaft of cylinder (8) and L shaped air cylinder fixed plate (15) links together, the side plate of L shaped air cylinder fixed plate (15) is arranged on the guide rail slide plate that intersects on the roller guide rail (18), and the lower surface of the base plate of L shaped air cylinder fixed plate (15) is fixed together by bottom plate (17) and porous stone adsorption plate (19).
2. the high-precision transporting device of a kind of processing laminated ceramic chips according to claim 1, it is characterized in that, on described stator retaining plate (6), be set with mounting angle plate (9), be set with grating reading head permanent seat (14) in the inboard of mounting angle plate (9), on grating reading head permanent seat (14), be set with grating reading head (13), be set with near switch (12) in the inboard of mounting angle plate (9), the outside of propping up piece (20) at middle clamp plate (7) and aluminium is set with grating chi retaining plate (22), is set with grating chi (21) on grating chi retaining plate (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010127528 CN101798226B (en) | 2010-03-19 | 2010-03-19 | High-precision transporting device for processing multi-layer green ceramic chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010127528 CN101798226B (en) | 2010-03-19 | 2010-03-19 | High-precision transporting device for processing multi-layer green ceramic chip |
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| CN101798226A true CN101798226A (en) | 2010-08-11 |
| CN101798226B CN101798226B (en) | 2012-05-23 |
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| CN 201010127528 Active CN101798226B (en) | 2010-03-19 | 2010-03-19 | High-precision transporting device for processing multi-layer green ceramic chip |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105060915A (en) * | 2015-08-17 | 2015-11-18 | 太原风华信息装备股份有限公司 | Surface-pressed type lamination device |
| CN105437393A (en) * | 2015-12-16 | 2016-03-30 | 中国电子科技集团公司第二研究所 | Accurate positioning mechanism for green ceramic chip processing |
| CN105668166A (en) * | 2016-03-20 | 2016-06-15 | 深圳安格锐电气有限公司 | Linear conveying module and conveying module set formed by linear conveying modules |
| CN108831855A (en) * | 2018-05-22 | 2018-11-16 | 中国电子科技集团公司第二研究所 | A kind of flexible base board dynamic positioning mechanism and localization method |
| CN110723539A (en) * | 2019-09-27 | 2020-01-24 | 中国电子科技集团公司第十八研究所 | Cathode lithium piece shifts positioner |
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| CN1336316A (en) * | 2000-08-01 | 2002-02-20 | 日本碍子株式会社 | Conveying system for ceramic mouldings, and supporting therefor |
| CN101015936A (en) * | 2007-02-14 | 2007-08-15 | 徐平 | Blank transfer device of ceramic shaping machine and transfer method thereof |
| CN101059381A (en) * | 2007-05-10 | 2007-10-24 | 大连理工大学 | Piezoelectric film cantilever beam type micro-force sensor micro-force loading device |
| CN101261523A (en) * | 2008-04-02 | 2008-09-10 | 华南理工大学 | Flexible contilever plate vibration control set and control method based on acceleration sensor |
| CN201626038U (en) * | 2010-03-19 | 2010-11-10 | 中国电子科技集团公司第二研究所 | High precision transfer device for processing multilayer green ceramic sheets |
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2010
- 2010-03-19 CN CN 201010127528 patent/CN101798226B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336316A (en) * | 2000-08-01 | 2002-02-20 | 日本碍子株式会社 | Conveying system for ceramic mouldings, and supporting therefor |
| CN101015936A (en) * | 2007-02-14 | 2007-08-15 | 徐平 | Blank transfer device of ceramic shaping machine and transfer method thereof |
| CN101059381A (en) * | 2007-05-10 | 2007-10-24 | 大连理工大学 | Piezoelectric film cantilever beam type micro-force sensor micro-force loading device |
| CN101261523A (en) * | 2008-04-02 | 2008-09-10 | 华南理工大学 | Flexible contilever plate vibration control set and control method based on acceleration sensor |
| CN201626038U (en) * | 2010-03-19 | 2010-11-10 | 中国电子科技集团公司第二研究所 | High precision transfer device for processing multilayer green ceramic sheets |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105060915A (en) * | 2015-08-17 | 2015-11-18 | 太原风华信息装备股份有限公司 | Surface-pressed type lamination device |
| CN105437393A (en) * | 2015-12-16 | 2016-03-30 | 中国电子科技集团公司第二研究所 | Accurate positioning mechanism for green ceramic chip processing |
| CN105437393B (en) * | 2015-12-16 | 2017-07-14 | 中国电子科技集团公司第二研究所 | Ceramic chips precision machining detent mechanism |
| CN105668166A (en) * | 2016-03-20 | 2016-06-15 | 深圳安格锐电气有限公司 | Linear conveying module and conveying module set formed by linear conveying modules |
| CN108831855A (en) * | 2018-05-22 | 2018-11-16 | 中国电子科技集团公司第二研究所 | A kind of flexible base board dynamic positioning mechanism and localization method |
| CN110723539A (en) * | 2019-09-27 | 2020-01-24 | 中国电子科技集团公司第十八研究所 | Cathode lithium piece shifts positioner |
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| Publication number | Publication date |
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| CN101798226B (en) | 2012-05-23 |
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