CN101788840A - Radiator - Google Patents
Radiator Download PDFInfo
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- CN101788840A CN101788840A CN200910002496A CN200910002496A CN101788840A CN 101788840 A CN101788840 A CN 101788840A CN 200910002496 A CN200910002496 A CN 200910002496A CN 200910002496 A CN200910002496 A CN 200910002496A CN 101788840 A CN101788840 A CN 101788840A
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- heat abstractor
- memory modules
- fan
- support
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Abstract
The invention discloses a radiator for radiating a plurality of memory modules inserted into slots of a plurality of memory connectors. The memory modules are substantially parallel to one another, and a snap is arranged at two ends of each slot of each memory connector respectively and used for clamping the corresponding memory module when inserted into the slot. The radiator comprises two fixed brackets, a connecting bracket and two lateral fans, wherein the two fixed brackets are arranged on two opposite ends of the memory connector and embedded with the snaps at the two ends of each slot. In addition, the connecting bracket is connected between two fixed brackets, and the two lateral fans are arranged on the two fixed brackets respectively, wherein the air inlet of one lateral fan is opposite to the air outlet of the other lateral fan.
Description
Technical field
The invention relates to a kind of heat abstractor, and particularly relevant for a kind of heat abstractor that is applied to memory modules.
Background technology
Advancing by leaps and bounds along with computer technology in recent years, the running speed of computer constantly raises, make the heating power of electronic component of host computer inside constantly upwards promote, for the electronic component that prevents host computer inside overheated, thereby cause electronic component that temporary or nonvolatil inefficacy takes place, so that the heat dissipation of the electronic component of computer inside becomes is important unusually.As a result, on computer chassis and power supply unit the radiator fan of carry, also need the electronic component of easy rising temperature such as the CPU (central processing unit) on the mainboard (CPU), graphics processing unit (GPU) and memory modules is installed additional heat abstractor extraly, in order to reducing the temperature of electronic component when the working at high speed, and then make that the running of host computer can be more smooth and easy.
For the heat radiation of memory modules, be directly on memory modules, to dispose heat radiator mostly at present, increase area of dissipation, reach the purpose of heat radiation to utilize heat radiator.Yet, only utilize the natural convection mode also can't dispel the heat to memory modules effectively, cause radiating effect not good.
Summary of the invention
In view of this, the present invention proposes a kind of heat abstractor, and it can firmly be arranged at by the memory modules, and can provide direct and efficient radiating effect to memory modules.
For specifically describing content of the present invention, propose a kind of heat abstractor at this, in order to a plurality of memory modules that are plugged on the mainboard are dispelled the heat, wherein mainboard has a plurality of internal memory connectors, each internal memory connector has a slot, for one of them plant of memory modules.The slot two ends of each internal memory connector are respectively equipped with a trip, in order to the pairing memory modules of clamping when pairing memory modules inserts slot.Heat abstractor of the present invention comprises that two fixed supports, a connection support and both sides are to fan.Described two fixed supports are arranged at the opposite end of internal memory connector respectively, and respectively with the trip tabling at each slot two ends.In addition, connect support and be connected between two fixed supports, and described both sides are arranged at respectively on two fixed supports to fan, wherein the inlet air side of a side direction fan is relative to the air side of fan with opposite side.
In one embodiment of this invention, each fixed support has a location groove in the face of a side of pairing trip, and each trip has a protuberance, snaps in positioning groove.
In one embodiment of this invention, each fixed support has a pilot hole, and described two support bracket fastened pilot holes are inserted at the two ends of connection support respectively.
In one embodiment of this invention, the shape of aforementioned pilot hole matches with the external form that is connected the support two ends respectively.
In one embodiment of this invention, described heat abstractor also comprises two first fixed screws, passes two pilot holes respectively and pairing fixed support is locked in the two ends that connect support.
In one embodiment of this invention, each side direction fan has at least one guide groove of the short transverse that is parallel to memory modules.
In one embodiment of this invention, described heat abstractor also comprises a plurality of second fixed screws, passes the guide groove of aforesaid side direction fan respectively and pairing side direction fan is locked on the fixed support.
In one embodiment of this invention, described heat abstractor also comprises a heat radiator, and it is disposed at the top of memory modules.
In one embodiment of this invention, aforesaid heat abstractor also comprises at least one top fan, is disposed on the described heat radiator.
Based on above-mentioned, the present invention is provided with two fans with identical air-out direction respectively at the two ends of memory modules, directly memory modules is dispelled the heat with the air-flow that causes by these two fans, and better heat radiating effect is provided.In addition, the present invention does not need to be provided with in addition other fixed sturcture on mainboard, just can be by the structure collocation that connects between support, fixed support and the internal memory connector, and fan firmly is fixed on by the memory modules, not only can effectively utilize the space on the mainboard, and can guarantee the appropriate running of side direction fan.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
Fig. 1 is the assembling synoptic diagram according to a kind of heat abstractor of one embodiment of the invention.
Fig. 2 is the exploded view of the heat abstractor of Fig. 1.
Embodiment
Fig. 1 is the assembling synoptic diagram according to a kind of heat abstractor of one embodiment of the invention, and Fig. 2 is the exploded view of the heat abstractor of Fig. 1.Shown in Fig. 1 and 2, heat abstractor 230 is disposed on the mainboard 210, in order to a plurality of memory modules 220 that are plugged on the mainboard 210 are dispelled the heat.In the present embodiment, mainboard 210 has a plurality of internal memory connectors 212 side by side, and each internal memory connector 212 has a slot 212a, and being parallel to each other for memory modules 220 is inserted in wherein.For memory modules 220 being fixed among the slot 212a of internal memory connector 212, the slot 212a two ends of each internal memory connector 212 are respectively equipped with a trip 214, in order to when pairing memory modules 220 inserts slot 212a, the pairing memory modules 220 of clamping.
The heat abstractor 230 of present embodiment comprises that two fixed supports 232, a connection support 234 and both sides are to fan 236.Fixed support 232 is arranged at the opposite end of internal memory connector 212 respectively, and respectively with trip 214 tablings that are arranged at each slot 212a two ends.More specifically, the structure of collocation trip 214, present embodiment is at the side formation one location groove 232a of each fixed support 232 in the face of pairing trip 214.The shape of this positioning groove 232a can match with the protuberance 214a on the trip 214, makes that when fixed support 232 was installed on the internal memory connector 212, the protuberance 214a on the trip 214 snapped in positioning groove 232a, so that firm fixed effect to be provided.
In addition, be fixed on the internal memory connector 212 for the structural strength that improves integral heat dissipation means 230 and with fixed support 232, present embodiment is connected and fixed support 232 by connecting support 234.In the present embodiment, it is shaft-like connecting support 234.When heat abstractor 230 is assembled on the memory modules 220, so that memory modules 220 is dispelled the heat, connect support 234 and be and be arranged between the two adjacent memory modules 220, and the two ends that connect support 234 connects two fixed supports 232 respectively.In addition, for the ease of fixed support 232 and the location that is connected between the support 234, each fixed support 232 for example has a pilot hole 232b, and the two ends that connect support 234 insert the pilot hole 232b of two fixed supports 232 respectively, to connect two fixed supports 232.In addition, the shape of the pilot hole 232b of fixed support 232 for example can match with the external form that is connected support 234 two ends.As, pilot hole 232b shown in Figure 1 is a square opening, connects support 234 two ends and then forms the blocks that just can enter this square pilot hole 232b.On the other hand, present embodiment locks and connects support 234 and fixed support 232 by two first fixed screws 242, wherein this two first fixed screw 242 passes the pilot hole 232b of pairing fixed support 232 respectively, and two fixed supports 232 are locked on the connection support 234.
Refer again to Fig. 1 and 2, the both sides of present embodiment are arranged at respectively on two fixed supports 234 to fan 236, and in order to reach the effect of convection current, both sides are identical to the air-out direction of fan 236, promptly wherein the inlet air side of a side direction fan 236 can be relative to the air side of fan 236 with opposite side, to produce equidirectional radiating airflow between memory modules 220.A plurality of second fixed screws 244 are locked in side direction fan 236 on the fixed support 234.In the present embodiment, each side direction fan 236 has two guide groove 236a of the short transverse that is parallel to memory modules 220, and second fixed screw 244 passes guide groove 236a lock side direction fan 236 and fixed support 234 respectively.In other words,, can adjust side direction fan 236 positions of locking on fixed support 234, just can adjust the height of side direction fan 236, to reach best radiating effect with respect to memory modules 220 by guide groove 236a.Certainly, aforesaid guide groove 236a is optionally or can be substituted by other equivalents, and present embodiment only discloses collocation between the guide groove 236a and second fixed screw 244 as example.
Accept above-mentionedly, present embodiment is to produce radiating airflow to fan 236 by the both sides in memory modules 220 both sides between memory modules 220, so that memory modules 220 is dispelled the heat.This kind radiating mode is comparatively direct and more efficient, and side direction fan 236 be by fixed support 232 be connected support 234 and be fixed on the internal memory connector 212, and provide the effect of auxiliary positioning by the trip 214 of internal memory connector 212, therefore do not need on mainboard 210, to be provided with in addition fixed sturcture and fix side direction fan 236, can effectively save the space on the mainboard 210 and the cost of manufacture of heat abstractor.
In addition, shown in Fig. 1 and 2, present embodiment also can be provided with heat radiator 252 at memory modules 220 tops in addition, and one or more top fan 254 can further be set on heat radiator 252.By the running of top fan 254, can drive the surface of heat radiator 252 and the cross-ventilation between radiating fin 252a, so that better radiating effect to be provided.
What deserves to be mentioned is that it is described that the shape of applied fixed support of the present invention and connection support is not limited to previous embodiment.In response to different design requirements, the fixed support and the connection support that can reach other shape of same effect such as all can be applied in the previous embodiment, provide equivalence or even better fixed effect with offside to fan.In addition, aforementionedly be connected and fixed support and be connected support and connect the side direction fan and support bracket fastened mode is not to be the unique selection of the present invention with screw.Under the prerequisite of effectively fixing associated components, any possible mechanism of ammonium fixation all is the scheme that can be considered and carry out.
In sum, the present invention installs two side direction fans with identical air-out direction respectively at the two ends of internal memory connector, to come memory modules is dispelled the heat by the thermal convection between memory modules by simple structural design.Because the air-flow that the side direction fan is provided can directly be flowed through between the memory modules, therefore can provide direct and efficient radiating effect, in addition, the present invention only just can firmly be fixed on fan by the memory modules by connecting structure collocation between support, fixed support and the internal memory connector, therefore the space on the mainboard and the cost of manufacture of heat abstractor can be saved, and the appropriate running of side direction fan can be guaranteed.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (9)
1. heat abstractor, in order to a plurality of memory modules that are plugged on the mainboard are dispelled the heat, above-mentioned mainboard has a plurality of internal memory connectors, each above-mentioned internal memory connector has slot, one of them is planted for above-mentioned these memory modules, and the slot two ends of each above-mentioned internal memory connector are respectively equipped with trip, in order to the pairing memory modules of clamping when pairing memory modules inserts above-mentioned slot, it is characterized in that above-mentioned heat abstractor comprises:
Two fixed supports are arranged at the opposite end of above-mentioned these internal memory connectors respectively, and respectively with above-mentioned these trip tablings at each above-mentioned slot two ends;
Connect support, be connected between above-mentioned two fixed supports; And
Both sides are arranged at respectively on above-mentioned two fixed supports to fan, and wherein the inlet air side of a side direction fan is relative to the air side of fan with opposite side.
2. heat abstractor according to claim 1 is characterized in that, wherein each said fixing support has positioning groove in the face of a side of pairing above-mentioned these trips, and each above-mentioned trip has protuberance, snaps in above-mentioned positioning groove.
3. heat abstractor according to claim 1 is characterized in that, wherein each said fixing support has pilot hole, and above-mentioned two support bracket fastened above-mentioned two pilot holes are inserted at the two ends of above-mentioned connection support respectively.
4. heat abstractor according to claim 3 is characterized in that, the shape of wherein above-mentioned two pilot holes matches with the above-mentioned external form that is connected the support two ends respectively.
5. heat abstractor according to claim 3 is characterized in that, also comprises two first fixed screws, passes above-mentioned two pilot holes respectively and pairing above-mentioned two fixed supports is locked in the two ends of above-mentioned connection support.
6. heat abstractor according to claim 1 is characterized in that, wherein at least one guide groove of each above-mentioned side direction fan with the short transverse that is parallel to above-mentioned these memory modules.
7. heat abstractor according to claim 6 is characterized in that, also comprises a plurality of second fixed screws, passes above-mentioned at least one guide groove of pairing above-mentioned side direction fan respectively and above-mentioned side direction fan is locked on the said fixing support.
8. heat abstractor according to claim 1 is characterized in that, also comprises heat radiator, is disposed at the top of above-mentioned these memory modules.
9. heat abstractor according to claim 8 is characterized in that, also comprises at least one top fan, is disposed on the above-mentioned heat radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910002496A CN101788840A (en) | 2009-01-23 | 2009-01-23 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910002496A CN101788840A (en) | 2009-01-23 | 2009-01-23 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101788840A true CN101788840A (en) | 2010-07-28 |
Family
ID=42532078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910002496A Pending CN101788840A (en) | 2009-01-23 | 2009-01-23 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101788840A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102375505A (en) * | 2010-08-10 | 2012-03-14 | 技嘉科技股份有限公司 | Radiating device |
| CN102486672A (en) * | 2010-12-04 | 2012-06-06 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating device |
| CN103926987A (en) * | 2013-01-11 | 2014-07-16 | 鸿富锦精密工业（深圳）有限公司 | Memory bank cooling device |
| CN111583989A (en) * | 2020-05-25 | 2020-08-25 | 成都思科瑞微电子股份有限公司 | High-speed memory circuit DDR2 testing arrangement |
-
2009
- 2009-01-23 CN CN200910002496A patent/CN101788840A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102375505A (en) * | 2010-08-10 | 2012-03-14 | 技嘉科技股份有限公司 | Radiating device |
| CN102375505B (en) * | 2010-08-10 | 2016-06-15 | 技嘉科技股份有限公司 | Heat abstractor |
| CN102486672A (en) * | 2010-12-04 | 2012-06-06 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating device |
| CN103926987A (en) * | 2013-01-11 | 2014-07-16 | 鸿富锦精密工业（深圳）有限公司 | Memory bank cooling device |
| CN111583989A (en) * | 2020-05-25 | 2020-08-25 | 成都思科瑞微电子股份有限公司 | High-speed memory circuit DDR2 testing arrangement |
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Application publication date: 20100728 |