CN101787110B - Photoelastic plastic material and preparation method - Google Patents

Photoelastic plastic material and preparation method Download PDF

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Publication number
CN101787110B
CN101787110B CN2009102153068A CN200910215306A CN101787110B CN 101787110 B CN101787110 B CN 101787110B CN 2009102153068 A CN2009102153068 A CN 2009102153068A CN 200910215306 A CN200910215306 A CN 200910215306A CN 101787110 B CN101787110 B CN 101787110B
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solution
plastic material
photoelastic
epoxy
resins
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CN101787110A (en
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陈林
王建国
刘宇雁
李革
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Inner Mongolia University of Science and Technology
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Inner Mongolia University of Science and Technology
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Abstract

The invention relates to a photoelastic plastic material and a preparation method, which belong to the field of materials. The photoelastic plastic material comprises the following raw materials in percentage by weight: 80-100 epoxy resin, 24-60 maleic anhydride, and 32-80 dibutylphthalate. The invention can be used to simulate the stress state analysis of some complicated elements under small elasticoplastic deformation, for example, residual stress study of the elements (for example steel rails, steel plates) in the process of straightening and the like. The most economic photoelasticity method expresses the conspicuous advantage and is effective and convenient. The conventional photoelastic technology is only limited to study of stress and strain in the loading process but the stress and strain state after the loading process can not be studied. By adopting the photoelastic plastic material, after loading and obtaining the isochromatic line on a digital photoelastic instrument and unloading the photoelastic plastic material, changing of fringes in the unloaded photoelastic plastic material is observed. The material ensures that the residual stress of the element can change along with time and can be maintained for 15min.

Description

Photoelastic plastic material and preparation method
Technical field
The present invention relates to a kind of photoelastic plastic material and preparation method, characteristics relate to a kind of photoelastic plastic material in submissile flow shape condition lower member unrelieved stress, belong to the material field.
Background technology
The various mechanical quantities of photoelasticity acquisition works are the basic problems in the engineering, though in engineering mechanics, set up the method that series of theories is analyzed, but the works of required usefulness in a lot of high-technology fields, geometrical shape is complicated especially, load condition and Working environment (in high temperature, high pressure, underground, the liquid, high-intensity magnetic field, severe radiation, dynamic dispatching) are also more and more various, cause theoretical analysis very difficult; Therefore, adopt the way of experiment just to seem particularly important, or even unique means.This method is applicable under the recoverable deformation condition that member unloading back stress-strain state disappears immediately.
Photoplasticity is to be based upon on the classical photoelasticity conceptual foundation, using suitable polymers material analogue formation experimentizes, with the plastic-elastic stress of determining prototype structure, the experimental technique of state of strain, different according to research object and deformation extent, photoplasticity mainly be research structure under large plastometric set, the photoplasticity of the residual strain state after the unloading.
Because the limitation and a large amount of elastoplasticity and the large plastometric set problems of engineering physical presence of photoelasticity, thereby photoplasticity has intuitively, makes things convenient for, the photoplasticity of economic dispatch advantage has been subjected to very big attention in recent years, has obtained very fast development.
Summary of the invention
The object of the present invention is to provide a kind ofly under submissile flow shape condition, to can be used for studying the member unrelieved stress, and still keep the photoelastic plastic material and the preparation method of stress, state of strain after the unloading.
Technical solution: the mass ratio that the present invention includes following raw materials according: Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate (DBP)=80-100: 24-60: 32-80;
The preparation method is as follows: (1) is poured above-mentioned Resins, epoxy in the beaker into, puts in 100 ℃-120 ℃ the water-bath together with beaker then and boils 40-60 minute, and constantly stir, with volatilization impurity and precipitation bits;
(2) water temperature in the water-bath is cooled to 50~60 ℃, add the maleic acid anhydride curing agents in the Resins, epoxy after water-bath, and evenly stirred 20-30 minute, make homogeneous mixture solotion A along a direction;
(3) get above-mentioned dibutyl phthalate (DBP) softening agent and pour beaker into, heating in water bath to solidifying agent melts fully on Electric stove, and temperature is controlled at 80 ℃-95 ℃, makes solution B;
(4) solution A of step (2) is mixed with the solution B of step (3), make C solution, in C solution, add N-N-dimethyl benzene amine catalyst, the add-on of catalyzer is the 0.5-1.0% of C total solution weight, add fashionable limit bevelling and evenly stir along a direction, temperature is controlled between 50~60 ℃, stirs after 20-30 minute, make D solution, pour D solution into mould, put into constant temperature 40-65 ℃ baking oven, quiet putting 40-60 minute, when waiting not have bubble, cast;
(5) after casting is finished, mould put into constant temperature carries out the solidification treatment first time at 42~44 ℃ in the drying baker, 48-72 hour set time, treat the demoulding behind the model complete gelation, carry out 120 ℃ solidification treatment for the second time again, 10-15 hour set time, obtain finished-product material.
(6) finished-product material is carried out machining, on photo-elastic instrument, observe whether initial stress is arranged, if there is initial stress will carry out anneal.
The present invention includes the mass ratio of following raw materials according: Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate (DBP)=100: 30-50: 40-70.
The present invention includes the mass ratio of following raw materials according: Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate (DBP)=80: 24-48: 32-64.
Resins, epoxy is the low-molecular weight polymer of dihydroxyphenyl propane and epoxy chloropropionate alkene.
The present invention just is based between photoelastic method and two kinds of methods of photoplasticity, be mainly used in is that research structure is under little plastoelastic deformation, still the photoelastic plasticity method that keeps stress, state of strain after the unloading by changing the proportioning of elastooptic mateiral, has prepared photoelastic plastic stress material.Experimental result shows: utilize photoelastic plasticity method can be used for simulation under little plastoelastic deformation, the strained condition analysis of some complex components, as study Study on Residual Stresses in member (as rail, steel plate) the aligning process etc., photoelastic plasticity method has been showed great superiority, not only effective, convenient, and be most economical method.Original photoelasticity technique defective is knitted and is confined to the research of loading procedure stress, strained, can not study stress, state of strain after the unloading.Adopt photoelastic plastic material of the present invention to unload after isochromatic line is obtained in loading on the digital photo-elastic instrument, observe the changing conditions of fringe number in the photoelastic plastic material of unloading back, this material can make research member unrelieved stress change in time and keep at least 15 minutes.
Description of drawings
Fig. 1 the present invention is the isochromatic-fringe pattern of photoelastic plastic material disk under different stress conditions;
The isochromatic lines bar graph of Fig. 2 photoelastic plastic material disk of the present invention under different stress conditions;
Fig. 3 for after the photoelastic plastic material of the present invention unloading every one minute isochrome map;
Fig. 4 is curing figure of the present invention;
Fig. 5 is annealing curve figure of the present invention.
Embodiment
Embodiment 1
The present invention includes the mass ratio of following raw materials according: Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate (DBP)=100: 30: 40; Resins, epoxy is the low-molecular weight polymer of dihydroxyphenyl propane and epoxy chloropropionate alkene.
The preparation method is as follows: (1) is poured above-mentioned 100 gram Resins, epoxy in the beaker into, puts in 100 ℃ the water-bath together with beaker then and boils 50 minutes, and constantly stir, with volatilization impurity and precipitation bits;
(2) water temperature in the water-bath is cooled to 55 ℃, add 30 gram maleic acid anhydride curing agents in the Resins, epoxy after water-bath, and evenly stirred 20-minute, make homogeneous mixture solotion A along a direction;
(3) get above-mentioned 40 gram dibutyl phthalate (DBP) softening agent and pour beaker into, heating in water bath to softening agent melts fully on Electric stove, and temperature is controlled at 85 ℃, makes solution B;
(4) with the solution A of step (2) and mixing of step (3) solution B, make C solution, add 0.2 gram N-N-dimethyl benzene amine catalyst in C solution, the limit bevelling evenly stirs along a direction, temperature is controlled between 52 ℃, stir after 20 minutes, make D solution, pour D solution into mould, put into constant temperature at 42 ℃ baking oven, quiet putting 40 minutes when waiting not have bubble, cast;
(5) after casting is finished, mould put into constant temperature carries out solidification treatment first time at 42 ℃ in the drying baker, treat the demoulding behind the model complete gelation 50 hours set times, carry out the solidification treatment of 120 ℃ of the second time again, 12 hours set times, obtain finished-product material.
(6) finished-product material is carried out machining, on photo-elastic instrument, observe whether initial stress is arranged, if there is initial stress will carry out anneal.
Photoelastic plastic material unloads after isochromatic line is obtained in loading on the digital photo-elastic instrument, observes the changing conditions of fringe number in the photoelastic plastic material of unloading back, and this material can make research member unrelieved stress change in time and keep 15 minutes.
Embodiment 2
The present invention includes following raw materials according Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate (DBP), the mass ratio of raw material are Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate (DBP)=90: 50: 60; Wherein: Resins, epoxy is the low-molecular weight polymer of dihydroxyphenyl propane and epoxy chloropropionate alkene.
The preparation method is as follows: (1) is poured above-mentioned 90 gram Resins, epoxy in the beaker into, puts in 100 ℃ the water-bath together with beaker then and boils 50 minutes, and constantly stir, with volatilization impurity and precipitation bits;
(2) water temperature in the water-bath is cooled to 55 ℃, add 50 gram maleic acid anhydride curing agents in the Resins, epoxy after water-bath, and evenly stirred 20 minutes, make homogeneous mixture solotion A along a direction;
(3) get above-mentioned 60 gram dibutyl phthalate (DBP) softening agent and pour beaker into, heating in water bath to softening agent melts fully on Electric stove, and temperature is controlled at 75 ℃, makes solution B;
(4) with the solution A of step (2) and mixing of step (3) solution B, make C solution, add 0.1 gram N-N-dimethyl benzene amine catalyst in C solution, the limit bevelling evenly stirs along a direction, temperature is controlled between 52 ℃, stir after 20 minutes, make D solution, pour D solution into mould, put into constant temperature at 42 ℃ baking oven, quiet putting 40 minutes when waiting not have bubble, cast;
(5) after casting is finished, mould put into constant temperature carries out solidification treatment first time at 42 ℃ in the drying baker, treat the demoulding behind the model complete gelation 50 hours set times, carry out the solidification treatment of 120 ℃ of the second time again, 12 hours set times, obtain finished-product material.
(6) finished-product material is carried out machining, on photo-elastic instrument, observe whether initial stress is arranged, if there is initial stress will carry out anneal.
Photoelastic plastic material unloads after isochromatic line is obtained in loading on the digital photo-elastic instrument, observes the changing conditions of fringe number in the photoelastic plastic material of unloading back, and this material can make research member unrelieved stress change in time and keep 15 minutes.
Embodiment 3
The present invention includes the following raw materials according mass ratio: Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate (DBP)=80: 40: 50; Wherein: Resins, epoxy is the low-molecular weight polymer of dihydroxyphenyl propane and epoxy chloropropionate alkene.
The preparation method is as follows: (1) is poured above-mentioned 80 gram Resins, epoxy in the beaker into, puts in 100 ℃ the water-bath together with beaker then and boils 50 minutes, and constantly stir, with volatilization impurity and precipitation bits;
(2) water temperature in the water-bath is cooled to 55 ℃, add 40 gram maleic acid anhydride curing agents in the Resins, epoxy after water-bath, and evenly stirred 20 minutes, make homogeneous mixture solotion A along a direction;
(3) get above-mentioned 50 gram dibutyl phthalate (DBP) softening agent and pour beaker into, heating in water bath to softening agent melts fully on Electric stove, and temperature is controlled at 75 ℃, makes solution B;
(4) with the solution A of step (2) and mixing of step (3) solution B, make C solution, add 0.1 gram N-N-dimethyl benzene amine catalyst in C solution, the limit bevelling evenly stirs along a direction, temperature is controlled between 52 ℃, stir after 20 minutes, make D solution, pour D solution into mould, put into constant temperature at 40 ℃ baking oven, quiet putting 40 minutes when waiting not have bubble, cast;
(5) after casting is finished, mould put into constant temperature carries out solidification treatment first time at 42 ℃ in the drying baker, treat the demoulding behind the model complete gelation 55 hours set times, carry out the solidification treatment of 110 ℃ of the second time again, 15 hours set times, obtain finished-product material.
(6) finished-product material is carried out machining, on photo-elastic instrument, observe whether initial stress is arranged, if there is initial stress will carry out anneal.

Claims (3)

1. the preparation method of photoelastic plastic material, it is characterized in that: the mass ratio that comprises following raw materials according: Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate=80-100: 24-60: 32-80, Resins, epoxy are the low-molecular weight polymer of dihydroxyphenyl propane and epoxy chloropropionate alkene;
The preparation method is as follows: (1) is poured above-mentioned Resins, epoxy in the beaker into, puts in 100 ℃ the water-bath together with beaker then and boils 40-60 minute, and constantly stir, with volatilization impurity and precipitation bits;
(2) water temperature in the water-bath is cooled to 50~60 ℃, add the maleic acid anhydride curing agents in the Resins, epoxy after water-bath, and evenly stirred 20-30 minute, make homogeneous mixture solotion A along a direction;
(3) get above-mentioned dibutyl phthalate softening agent and pour beaker into, heating in water bath to solidifying agent melts fully on Electric stove, and temperature is controlled at 80 ℃-95 ℃, makes solution B;
(4) solution A of step (2) is mixed with the solution B of step (3), make C solution, in C solution, add N, the accelerine catalyzer, the add-on of catalyzer is the 0.5-1.0% of C total solution weight, adds fashionable limit bevelling and evenly stirs along a direction, temperature is controlled between 50~60 ℃, stir after 20-30 minute, make D solution, pour D solution into mould, put into constant temperature at 40-65 ℃ baking oven, quiet putting 40-60 minute when waiting not have bubble, cast;
(5) after casting is finished, mould put into constant temperature carries out the solidification treatment first time at 42~44 ℃ in the drying baker, 48-72 hour set time, treat the demoulding behind the model complete gelation, carry out 120 ℃ solidification treatment for the second time again, 10-15 hour set time, obtain finished-product material.
(6) finished-product material is carried out machining, on photo-elastic instrument, observe whether initial stress is arranged, if there is initial stress will carry out anneal.
2. the preparation method of photoelastic plastic material according to claim 1 is characterized in that: the mass ratio that comprises following raw materials according: Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate=100: 30-50: 40-70.
3. the preparation method of photoelastic plastic material according to claim 1 is characterized in that: the mass ratio that comprises following raw materials according: Resins, epoxy: MALEIC ANHYDRIDE: dibutyl phthalate=80: 24-48: 32-64.
CN2009102153068A 2009-12-21 2009-12-21 Photoelastic plastic material and preparation method Expired - Fee Related CN101787110B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106928657A (en) * 2017-03-17 2017-07-07 河南理工大学 A kind of production method of the epoxy resin board for photoelastic experiment test

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103698182B (en) * 2013-12-20 2017-02-08 华南理工大学 Photo-elastic particle material with small particle diameter and preparation method thereof
CN113248866B (en) * 2021-03-25 2023-09-01 合肥磐石智能科技股份有限公司 Plastic sheet for stress demonstration
CN117400538A (en) * 2023-12-11 2024-01-16 华侨大学 Three-dimensional photoelastic model rapid forming method combined with 3D printing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106928657A (en) * 2017-03-17 2017-07-07 河南理工大学 A kind of production method of the epoxy resin board for photoelastic experiment test

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