CN103698182B - Photo-elastic particle material with small particle diameter and preparation method thereof - Google Patents
Photo-elastic particle material with small particle diameter and preparation method thereof Download PDFInfo
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- CN103698182B CN103698182B CN201310711774.0A CN201310711774A CN103698182B CN 103698182 B CN103698182 B CN 103698182B CN 201310711774 A CN201310711774 A CN 201310711774A CN 103698182 B CN103698182 B CN 103698182B
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Abstract
The invention discloses a photo-elastic particle material with small particle diameter and a preparation method thereof. The preparation method comprises the following step: (1) cutting a PC (Polycarbonate) board with a smooth surface along a direction vertical to the board surface to obtain cylindrical bodies with small particle diameters, and smooth upper and lower bottom surfaces; and (2) annealing the prepared cylindrical bodies with small particle diameters, and naturally cooling to the room temperature to obtain the photo-elastic particle material with small particle diameter. The method disclosed by the invention comprises a material cutting process and an annealing process for eliminating residual stress, wherein the diameters of the processed regular particles are 1mm and are close to the diameter of sandy soil; when the regular particles are 5mm thick, light transmittance can reach 80%, and therefore, a pivotal role in simulating mechanical properties inside rock-soil particles and promoting a photo-elastic particle test in researching of a basic theory of the rock-soil field is brought into play, and application of a photo-elastic method in a particle mechanics research is expanded. Moreover, the method is simple, the automation production is realized by virtue of computer control, and the processing efficiency is high.
Description
Technical field
The present invention relates to particulate matter Resarch on A New Type field, it is exactly specifically to be added by a kind of processing method
Work goes out small particle（Grade）, the photoelastic granular materials of Merlon of the high grade of transparency, through annealing after obtain answering
Experiment material for ground area research.
Background technology
Ground class particulate matter generally existing in nature, engineering construction and daily life, its mechanical characteristic and dynamic
The research of force-responsive has carried out decades in academia.In passing research, typically all that ground particulate matter is false
It is set as non-individual body to be analyzed, based on classical elastic-plastic mechanics theory, people have developed more Rock And Soil macromechanics mould
Type, but neither one can constitutive equation that is comprehensive, correctly expressing its strain-stress relation.Trace it to its cause, mainly due to being based on
The discontinuous particle characteristics of the hypothesis of non-individual body and ground itself are not inconsistent, and are therefore had important based on the thin sight research of particle level
Learning value.Numerous scholars think, further promote rock-soil mechanics development and change it is critical that to weigh from particle scale
This subject of new knowledge.
In mechanical analysis, mainly adopt theory deduction, simulate calculating and the method for experiment test.But at current
In grain mechanics study, theory analysis runs into extreme difficulties, and numerical simulation calculation because of particulate matter amount of calculation super large and can only be simulated
The particle of single shape and cannot be effectively applied in theoretical research and engineering practice.Therefore experiment test just seems particularly heavy
Will, or perhaps means most suitably used at this stage.
Photoelastic experiment method as a kind of effective experimental technique in Resarch on A New Type field, its clear superiority be exactly with
Intuitively bar graph provides whole field（whole field）The information of stress distribution, that is, characterize the isodiff of deviator stress, again simultaneously
Do not destroy the geometry of granular materials.Photoelastic experiment method possibly so far uniquely one kind can intuitively represent
The laboratory facilities of grain material internal force distribution.
But the general very little of the grain diameter of rock-soil material, than larger sand grains particle size range in 2mm-0.075mm,
But it is limited to the restriction of process equipment and method, photoelastic granular materials size is generally large, differs with rock-soil material grain diameter
Great disparity, causes the result of photoelastic experiment can not effectively reflect the mechanical response of rock-soil material.Therefore research can process less chi
Very little photoelastic granular materials has important value.There is no outside Current Domestic with regard to Photo-elastic particle material with small particle diameter processing method
Report.
Content of the invention
In order to expand the application in ground granular mechanics field for the photoelastic particle test, overcome commonly photoelastic granular materials and rock
The problem that soil material size differs greatly, it is an object of the invention to provide the method for three kinds of photoelastic granular materials of processing and elimination
The annealing process of residual stress, can produce small particle（Grade）, the photoelastic particle of the high grade of transparency, see angle simulation from thin
The mechanical property of rock-soil material, the interior change situation of comprehensive reflection particle.
To achieve these goals, the technical solution used in the present invention is：
A kind of preparation method of Photo-elastic particle material with small particle diameter is it is characterised in that comprise the steps：
（1）PC (Merlon) plate smooth for plate face is cut along the direction of vertical plate face, is obtained bottom surface light
Sliding small particle column, due to PC plate smooth surface, need not polish and can get the fabulous little particle of translucency；
（2）The small particle column of above-mentioned preparation is made annealing treatment through following：
Instrument is numerical control chamber type electric resistance furnace；Heat transfer medium used is air；Heating process is to be heated through 1h by room temperature
To 60 DEG C, it is heated to 100 DEG C through 2h, is incubated 1h, make material internal and external temperature uniformly, be heated to 110 DEG C through 1h, be incubated 1h, through 1h
It is heated to 120 DEG C, is incubated 1h, is heated to 125 DEG C through 1h, insulation 8h is used for eliminating residual stress；Then start to lower the temperature, through 1h fall
To 120 DEG C, it is incubated 1h, drops to 110 DEG C through 1h, be incubated 1h, drop to 100 DEG C through 1h, be incubated 1h, drop to 60 DEG C through 4h, certainly finally
So drop to room temperature, that is, Photo-elastic particle material with small particle diameter is obtained.
Described small particle column is cylinder, and its basal diameter is 1～5mm.
The thickness of described PC plate is 1～5mm.
Described PC plate is cut using numerically-controlled plastic engraving machine.
Described numerically-controlled plastic engraving machine, speed of mainshaft 24000rpm, machining accuracy 0.1mm, operating rate 1000-
1500mm/min.
Compared with prior art, the invention has the advantages that：
（1）The preparation method of the Photo-elastic particle material with small particle diameter that the present invention provides, the cutting including material and elimination are remaining
The annealing process of stress, the rule particle particle diameter minimum being wherein processed into reaches 1mm, and sand is close, and light transmittance is permissible
Reach 80%, for the mechanical property of simulation ground, promote photoelastic particle test to play key effect in the application of ground circle, open up
Open up application in granular mechanics research for the photoelastic method；And the method is simple, has higher working (machining) efficiency.
（2）Because plate material has residual stress in itself, forming residual stress can be produced after machine-shaping, remnants should again
The result of the presence meeting extreme influence photoelastic test of power is it is therefore necessary to take the mode of annealing to eliminate residual stress.The present invention carries
Supply more accurate heat treatment temperature and heat treatment time, the residual stress of product can have been effectively eliminated；Annealing process
Main inclusion heat treatment temperature size variation and corresponding heat treatment time, referring specifically to accompanying drawing.
Brief description
Fig. 1 is the cutting schematic plan view of PC plate in the embodiment of the present invention 1.
Fig. 2 is granular materials annealing curve figure.
Fig. 3 is that have the photoelastic test figure of residual stress before annealing.
Fig. 4 is the photoelastic test figure of elimination residual stress after annealing.
Specific embodiment
With reference to specific embodiment, the present invention is more specifically described in detail, but embodiments of the present invention do not limit
In this, for the technological parameter especially not indicated, can refer to routine techniques and carry out.
Embodiment 1
First PC plate 3 is fixed on numerically-controlled plastic engraving machine processing platform, the thickness of PC plate is 5mm（Can be selected it
His any thickness）；According to the size of particle diameter and PC plate, draw particle processing layout drawing on computers, as shown in Figure 1, 2；
Rotor is attached in PC plate, the regulation speed of mainshaft is 24000rpm, translational speed 100mm/min, then start machine presses arrangement
G- Design is cut；During due to photoelastic experiment, the direction of propagation of light is along the normal direction of PC plate, parallel with cut surface 4, because
The coarse opaque face that this cutting causes does not affect the propagation of light, is not required to polishing and can obtain the high grade of transparency（Light transmittance 80%）
The photoelastic particle of small particle.
Eliminate the test of residual stress
Entirely the principle of test is：When numerical density, the size of brightness represents the size of stress, answers when there being remnants
In the presence of power, particle is originally bright, therefore influences whether the test of stress.As shown in Figure 3,4, Fig. 3 is with significantly bright
Degree, and the brightness of Fig. 4 substantially eliminates it can be seen that, the annealing of the present invention can effectively eliminate the residual stress of product.
Claims (6)
1. a kind of preparation method of Photo-elastic particle material with small particle diameter is it is characterised in that comprise the steps：
（1）PC plate smooth for plate face is cut along the direction of vertical plate face, is obtained the smooth small particle column of bottom surface
Body；
（2）The small particle column of above-mentioned preparation is made annealing treatment through following：Instrument is numerical control chamber type electric resistance furnace；Biography used
Thermal medium is air；Heating process is to be heated to 60 DEG C by room temperature through 1h, is heated to 100 DEG C through 2h, is incubated 1h, makes inside and outside material
Temperature uniformly, is heated to 110 DEG C through 1h, is incubated 1h, is heated to 120 DEG C through 1h, is incubated 1h, is heated to 125 DEG C through 1h, is incubated 8h
For eliminating residual stress；Then start to lower the temperature, drop to 120 DEG C through 1h, be incubated 1h, drop to 110 DEG C through 1h, be incubated 1h, through 1h
Drop to 100 DEG C, be incubated 1h, drop to 60 DEG C through 4h, finally naturally ring to room temperature, that is, Photo-elastic particle material with small particle diameter is obtained.
2. preparation method according to claim 1 it is characterised in that described small particle column be cylinder, its bottom surface
A diameter of 1～5mm.
3. preparation method according to claim 2 is it is characterised in that the thickness of described PC plate is 1～5mm.
4. the preparation method according to claim 1 or 2 or 3 is it is characterised in that described PC plate adopts numerically-controlled plastic engraving machine
Cut.
5. preparation method according to claim 4 is it is characterised in that described numerically-controlled plastic engraving machine, the speed of mainshaft
24000rpm, machining accuracy 0.1mm, operating rate 1000-1500mm/min.
6. the Photo-elastic particle material with small particle diameter according to the preparation of Claims 1 to 5 any one method.
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| CN201310711774.0A CN103698182B (en) | 2013-12-20 | 2013-12-20 | Photo-elastic particle material with small particle diameter and preparation method thereof |
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| CN201310711774.0A CN103698182B (en) | 2013-12-20 | 2013-12-20 | Photo-elastic particle material with small particle diameter and preparation method thereof |
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| CN103698182A CN103698182A (en) | 2014-04-02 |
| CN103698182B true CN103698182B (en) | 2017-02-08 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6156684A (en) * | 1997-06-17 | 2000-12-05 | Hoya Corporation | Light polarization control element using stress-optical coefficient glass and method of producing the stress-optical coefficient glass |
| CN100396828C (en) * | 2005-01-31 | 2008-06-25 | 日立电线株式会社 | Semiconductive GaAs wafer and method of making the same |
| CN101787110A (en) * | 2009-12-21 | 2010-07-28 | 内蒙古科技大学 | Photoelastic plastic material and preparation method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7236241B2 (en) * | 2005-03-30 | 2007-06-26 | Osram Sylvania Inc. | Method of making a standard tool for calibrating stress analysis measuring devices and a set of the standard tools |
| JP4855800B2 (en) * | 2006-02-24 | 2012-01-18 | Ｈｏｙａ株式会社 | Manufacturing method of glass optical element |
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2013
- 2013-12-20 CN CN201310711774.0A patent/CN103698182B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6156684A (en) * | 1997-06-17 | 2000-12-05 | Hoya Corporation | Light polarization control element using stress-optical coefficient glass and method of producing the stress-optical coefficient glass |
| CN100396828C (en) * | 2005-01-31 | 2008-06-25 | 日立电线株式会社 | Semiconductive GaAs wafer and method of making the same |
| CN101787110A (en) * | 2009-12-21 | 2010-07-28 | 内蒙古科技大学 | Photoelastic plastic material and preparation method |
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Granted publication date: 20170208 Termination date: 20211220 |