CN106928657A - A kind of production method of the epoxy resin board for photoelastic experiment test - Google Patents
A kind of production method of the epoxy resin board for photoelastic experiment test Download PDFInfo
- Publication number
- CN106928657A CN106928657A CN201710159052.7A CN201710159052A CN106928657A CN 106928657 A CN106928657 A CN 106928657A CN 201710159052 A CN201710159052 A CN 201710159052A CN 106928657 A CN106928657 A CN 106928657A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resin board
- glass
- rubber tube
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 87
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 87
- 238000002474 experimental method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000012360 testing method Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 21
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 17
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229920001225 polyester resin Polymers 0.000 claims abstract description 13
- 239000004645 polyester resin Substances 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011521 glass Substances 0.000 claims description 59
- 238000007711 solidification Methods 0.000 claims description 22
- 230000008023 solidification Effects 0.000 claims description 22
- 239000011259 mixed solution Substances 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 12
- 238000010792 warming Methods 0.000 claims description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000007605 air drying Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 239000003599 detergent Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000005401 pressed glass Substances 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 8
- 230000003287 optical effect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 230000035882 stress Effects 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4207—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aliphatic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/241—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet by photoelastic stress analysis
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of production method of the epoxy resin board for photoelastic experiment test, the method is using epoxy resin, maleic anhydride, dibutyl phthalate and polyester resin are used as raw material, by the allotment to raw material dosage, and optimize the curing process of mixed material, the epoxy resin board of different performance can be obtained.The inventive method is simple, abundant raw materials, easily production, optical sensitivity is high, and transparency is good, and time edge effect is small, elastic modelling quantity from 1.29MPa~57.32MPa can be produced, Poisson's ratio can be used to the structure scale model in the engineerings such as production machinery, water conservancy, building from 0.35~0.68 neo-epoxy resin elastooptic mateiral, be the excellent material of Plane stress model experiment by photoelastic method.
Description
Technical field
The present invention relates to flash ranging experiment material, the production of more particularly to a kind of epoxy resin board for photoelastic experiment test
Method.
Background technology
Photoelastic method is the method for comparative maturity in flash spotting, and this method is with the material with special optical performance
(such as glass, epoxy resin) makes structural model, the stressing conditions of model is met similar to the stressing conditions of practical structures
Condition, the model after stand under load is placed in polarized light field, obtain light interference fringe picture, these stripeds characterize model boundary and
The stress state of interior point, stress intensity and the direction of each point in model can be tried to achieve according to photoelastic principle, further according to model
The principle of similitude can be converted into stress in practical structures.In the subjects such as mechanical engineering, hydraulic engineering, civil engineering, light
Elastic method is obtained for and is widely applied.Elastooptic mateiral is the key of flash ranging experiment, and its performance and quality will directly affect reality
The carrying out tested and measuring accuracy, and because the shape of experimental model is similar to structure original shape, its processing gets up more difficult,
And be possible to produce machining stress in process, therefore photoelastic simulating method is somewhat limited in practical application.
The content of the invention
In order to solve the above problems, it is an object of the invention to provide a kind of epoxy resin board for photoelastic experiment test
Production method, can produce the neo-epoxy resin photoelasticity material that optical sensitivity is high, transparency is good, time edge effect is small
Material, it is the excellent material of Plane stress model experiment by photoelastic method.
To achieve these goals, the technical solution adopted in the present invention is：
A kind of production method of epoxy resin board for photoelastic experiment test, comprises the following steps：
(1) epoxy resin is heated to 120 DEG C, 2h is incubated while stirring, insulation is naturally cooling to 60 DEG C after terminating, protect
Temperature, it is standby；
(2) maleic anhydride is melted in 70 DEG C of oil baths to maleic anhydride, it is standby；
(3) maleic anhydride of dibutyl phthalate, polyester resin and step (2) is added to step (1)
In epoxy resin, mixed solution is obtained；
(4) by the mixed solution of step (3) under the conditions of 60 DEG C of oil baths, 30min is stirred with electronic stirrer, then stand 2-
4h；
(5) glass mold that will prepare epoxy resin board preheats 40min under the conditions of 60 DEG C, then by the mixing of step (4)
Solution is poured into the glass mold of preheating, and 5d is solidified under the conditions of 42-45 DEG C, and the epoxy resin board of shaping is obtained；
(6) epoxy resin board that will be molded demoulding from glass mold is taken out, and is naturally cooling to room temperature, then carry out secondary solid
Change, the epoxy resin board after solidification is obtained；
(7) epoxy resin board after solidification is processed into required shape, being blown using air blower while processing is carried out
Air cooling, to eliminate machining stress, obtains final product.
The weight ratio of epoxy resin, maleic anhydride, dibutyl phthalate and polyester resin is 8-16:1-3:0-
2:0-6.。
Described polyester resin is 304 polyester resin.
Described epoxy resin is 6101 epoxy resin.
The described glass mold for preparing epoxy resin board, including 2 pieces of glass plates and compression are arranged between 2 pieces of glass plates
Rubber tube, rubber tube is U-shaped, and the U-shaped upper surface of rubber tube and the inner surface of 2 pieces of glass plates surrounds epoxy resin board jointly
Molding space.
Before preheating, the glass mold that will prepare epoxy resin board carries out pre-treatment, comprises the following steps：
A () glass plate and rubber tube are cleaned：First cleaned with liquid detergent, then rinsed with clear water, absolute ethyl alcohol is finally used successively
Cleaned with acetone, it is desirable to glass surface free from dust, without grease, clean transparent, natural air drying；
(b) glass plate and rubber tube surface filming：Glass plate, glass strip and rubber tube are immersed in releasing agent,
Taken out after 5min, lain under normal temperature indoor environment, after after its natural air drying 24h, 24h in releasing agent is immersed in again, taken out,
Lie in Indoor Natural and air-dry film forming；
C () assembles mould：Iron wire is inserted in rubber tube, U-frame frame is converted into, being converted into the rubber tube lining of U-frame frame 2
Between block glass plate, and four corners with glass strip pad between 2 pieces of glass plates, pressed from both sides with the pressing article with connecting bolt
Tightly, connecting bolt pressed glass parting bead and rubber tube are adjusted, the epoxy resin plate thickness for casting out is poured with guarantee uniform.
Described releasing agent collocation method is：Toluene and polystyrene are compared 10 according to weight:1 ratio mixing, fully
Dissolving, dissolution time is 4-5h.
The specific method of described secondary solidification is：
1. 80 DEG C are warming up to the speed of 5 DEG C/h from room temperature, and are incubated 16h；
2. 110 DEG C are warming up to from 80 DEG C of speed with 5 DEG C/h, and are incubated 24h；
3. 60 DEG C are cooled to from 110 DEG C of speed with 3 DEG C/h；
4. room temperature is cooled to from 60 DEG C of speed with 5 DEG C/h, completes secondary solidification.
Beneficial effects of the present invention：
1st, the present invention be using epoxy resin, maleic anhydride, dibutyl phthalate and polyester resin as raw material,
By the allotment to raw material dosage, the epoxy resin board of different performance can be obtained.The present invention is minimum only to need two kinds of raw materials, you can
To make the epoxy resin board of required performance, and the addition of dibutyl phthalate and polyester resin, more can be big model
The performance of the regulation epoxy resin board for enclosing.Flexibly, the scope of application is wider, can adapt in various performances for raw material proportioning of the invention
It is required that epoxy resin board production.
2nd, the present invention is preheated glass mold, it can be ensured that glass mold is consistent with the temperature of raw material mixed solution,
Avoid there is temperature difference with inside due to the glass mold contact surface of epoxy resin solution, splitting occurs in caused epoxy resin board
The problems such as line, uneven, deformation.
3rd, the present invention is solidified twice to epoxy resin board, can improve the performance of epoxy resin board.Especially this hair
It is bright to optimize secondary curing process according to raw materials used, that is, the temperature rate for solidifying, solidification temperature and time, largely
The phenomenon for avoiding the thermal stress of the larger generation of localized temperature gradients from concentrating, it is ensured that epoxy resin board internal structure does not sustain damage,
So as to improve the properties of epoxy resin board.
4th, the inventive method is simple, abundant raw materials, easily production, and optical sensitivity is high, and transparency is good, time edge effect
It is small, elastic modelling quantity from 1.29MPa~57.32MPa can be produced, neo-epoxy resin photoelasticity of the Poisson's ratio from 0.35~0.68
Material, the structure that the neo-epoxy resin elastooptic mateiral of the invention can be used in the engineerings such as production machinery, water conservancy, building is similar
Model, the model after stand under load is placed in polarized light field, obtain light interference fringe picture, these stripeds characterize model boundary and
The stress state of interior point, each point obtains stress intensity and direction in can trying to achieve model according to photoelastic principle, further according to model
The principle of similitude can be converted into stress in practical structures.The present invention can intuitively be used for survey engineering structure in stress,
Strain Distribution, there is huge economic and social benefit.
Brief description of the drawings
Fig. 1 is the structural representation of glass mold of the present invention.
Specific embodiment
Specific embodiment of the invention is described in further detail with reference to embodiments.
Raw material used by the inventive method are market sale, and concrete model and producer are as follows：
Embodiment 1
Glass mold used by the present invention is referring to Fig. 1, including 2 pieces of glass plates 1,2 and compression are arranged between 2 pieces of glass plates
Rubber tube 4, rubber tube 4 is U-shaped, and the U-shaped upper surface of rubber tube and the inner surface of 2 pieces of glass plates surrounds epoxy resin jointly
The molding space of plate.
The pre-treatment of glass mold, comprises the following steps：
A () glass plate and rubber tube are cleaned：First cleaned with liquid detergent, then rinsed with clear water, absolute ethyl alcohol is finally used successively
Cleaned with acetone, it is desirable to glass surface free from dust, without grease, clean transparent, natural air drying；
B () releasing agent is configured：Toluene and polystyrene are compared 10 according to weight:1 ratio mixing, fully dissolving, dissolving
Time is 4-5h；
(c) glass plate and rubber tube surface filming：Glass plate, glass strip and rubber tube are immersed in the de- of step (b)
In mould agent, taken out after 5min, lain under normal temperature indoor environment, after after its natural air drying 24h, be immersed in releasing agent again
24h, takes out, and lies in Indoor Natural and air-dries film forming；
D () assembles mould：Iron wire 5 is inserted in rubber tube 4, U-frame frame is converted into, the rubber tube lining for being converted into U-frame frame
Between 2 pieces of glass plates 1,2, and four corners between 2 pieces of glass plates are padded with glass strip 3, with the pressure with connecting bolt 7
Lath 6 is clamped, and adjusts the pressed glass parting bead of connecting bolt 7 and rubber tube, the epoxy resin plate thickness for casting out is poured with guarantee uniform.
Embodiment 2
A kind of production method of epoxy resin board for photoelastic experiment test, comprises the following steps：
(1) epoxy resin of 517.58g 6101 is heated to 120 DEG C, 2h is incubated while stirring, insulation is dropped naturally after terminating
Temperature is to 60 DEG C, and insulation is standby；
(2) 103.52g maleic anhydrides are melted in 70 DEG C of oil baths to maleic anhydride, it is standby；
(3) by the maleic acid of 77.64g dibutyl phthalates, the polyester resin of 155.27g 304 and step (2)
Acid anhydride is added into 6101 epoxy resin of step (1), obtains mixed solution；
(4) by the mixed solution of step (3) under the conditions of 60 DEG C of oil baths, 30min is stirred with electronic stirrer, then stand
2h；
(5) glass mold (embodiment 1) that will prepare epoxy resin board preheats 40min under the conditions of 60 DEG C, then by step
(4) mixed solution is poured into the glass mold of preheating, and 5d is solidified under the conditions of 42 DEG C, and the epoxy resin board of shaping is obtained；
(6) epoxy resin board that will be molded demoulding from glass mold is taken out, and is naturally cooling to room temperature, then carry out secondary solid
Change, the epoxy resin board after solidification is obtained；
The specific method of described secondary solidification is：
1. 80 DEG C are warming up to the speed of 5 DEG C/h from room temperature, and are incubated 16h；
2. 110 DEG C are warming up to from 80 DEG C of speed with 5 DEG C/h, and are incubated 24h；
3. 60 DEG C are cooled to from 110 DEG C of speed with 3 DEG C/h；
4. room temperature is cooled to from 60 DEG C of speed with 5 DEG C/h, completes secondary solidification.
(7) epoxy resin board after solidification is processed into required shape, being blown using air blower while processing is carried out
Air cooling, to eliminate machining stress, obtains final product.
Epoxy resin board elastic modelling quantity obtained in the present embodiment is measured for 2.55MPa through experiment, and Poisson's ratio is 0.67.
Embodiment 3
A kind of production method of epoxy resin board for photoelastic experiment test, comprises the following steps：
(1) epoxy resin of 449.47g 6101 is heated to 120 DEG C, 2h is incubated while stirring, insulation is dropped naturally after terminating
Temperature is to 60 DEG C, and insulation is standby；
(2) 67.42g maleic anhydrides are melted in 70 DEG C of oil baths to maleic anhydride, it is standby；
(3) by the maleic acid of 67.42g dibutyl phthalates, the polyester resin of 269.68g 304 and step (2)
Acid anhydride is added into 6101 epoxy resin of step (1), obtains mixed solution；
(4) by the mixed solution of step (3) under the conditions of 60 DEG C of oil baths, 30min is stirred with electronic stirrer, then stand
3h；
(5) glass mold (embodiment 1) that will prepare epoxy resin board preheats 40min under the conditions of 60 DEG C, then by step
(4) mixed solution is poured into the glass mold of preheating, and 5d is solidified under the conditions of 43 DEG C, and the epoxy resin board of shaping is obtained；
(6) epoxy resin board that will be molded demoulding from glass mold is taken out, and is naturally cooling to room temperature, then carry out secondary solid
Change, the epoxy resin board after solidification is obtained；
The specific method of described secondary solidification is：
1. 80 DEG C are warming up to the speed of 5 DEG C/h from room temperature, and are incubated 16h；
2. 110 DEG C are warming up to from 80 DEG C of speed with 5 DEG C/h, and are incubated 24h；
3. 60 DEG C are cooled to from 110 DEG C of speed with 3 DEG C/h；
4. room temperature is cooled to from 60 DEG C of speed with 5 DEG C/h, completes secondary solidification.
(7) epoxy resin board after solidification is processed into required shape, being blown using air blower while processing is carried out
Air cooling, obtains final product.
Epoxy resin board elastic modelling quantity obtained in the present embodiment is measured for 43.9MPa through experiment, and Poisson's ratio is 0.38.
Embodiment 4
A kind of production method of epoxy resin board for photoelastic experiment test, comprises the following steps：
(1) epoxy resin of 742.61g 6101 is heated to 120 DEG C, 2h is incubated while stirring, insulation is dropped naturally after terminating
Temperature is to 60 DEG C, and insulation is standby；
(2) 111.39g maleic anhydrides are melted in 70 DEG C of oil baths to maleic anhydride, it is standby；
(3) maleic anhydride of step (2) is added into 6101 epoxy resin of step (1), obtains mixed solution；
(4) by the mixed solution of step (3) under the conditions of 60 DEG C of oil baths, 30min is stirred with electronic stirrer, then stand
4h；
(5) glass mold (embodiment 1) that will prepare epoxy resin board preheats 40min under the conditions of 60 DEG C, then by step
(4) mixed solution is poured into the glass mold of preheating, and 5d is solidified under the conditions of 45 DEG C, and the epoxy resin board of shaping is obtained；
(6) epoxy resin board that will be molded demoulding from glass mold is taken out, and is naturally cooling to room temperature, then carry out secondary solid
Change, the epoxy resin board after solidification is obtained；
The specific method of described secondary solidification is：
1. 80 DEG C are warming up to the speed of 5 DEG C/h from room temperature, and are incubated 16h；
2. 110 DEG C are warming up to from 80 DEG C of speed with 5 DEG C/h, and are incubated 24h；
3. 60 DEG C are cooled to from 110 DEG C of speed with 3 DEG C/h；
4. room temperature is cooled to from 60 DEG C of speed with 5 DEG C/h, completes secondary solidification.
(7) epoxy resin board after solidification is processed into required shape, being blown using air blower while processing is carried out
Air cooling, obtains final product.
Epoxy resin board elastic modelling quantity obtained in the present embodiment is measured for 57.32MPa through experiment, and Poisson's ratio is 0.508.
Typical embodiment of the invention is the foregoing is only, for a person skilled in the art, the present invention can have
Various modifications and variations.All any modification, equivalent substitution and improvements within the spirit and principles in the present invention, made etc., all should
It is included within protection scope of the present invention.
Claims (8)
1. it is a kind of for photoelastic experiment test epoxy resin board production method, it is characterised in that comprise the following steps：
(1) epoxy resin is heated to 120 DEG C, 2h is incubated while stirring, insulation is naturally cooling to 60 DEG C after terminating, insulation is standby
With；
(2) maleic anhydride is melted in 70 DEG C of oil baths to maleic anhydride, it is standby；
(3) maleic anhydride of dibutyl phthalate, polyester resin and step (2) is added to the epoxy of step (1)
In resin, mixed solution is obtained；
(4) by the mixed solution of step (3) under the conditions of 60 DEG C of oil baths, 30min is stirred with electronic stirrer, then stand 2-4h；
(5) glass mold that will prepare epoxy resin board preheats 40min under the conditions of 60 DEG C, then by the mixed solution of step (4)
Pour into the glass mold of preheating, 5d is solidified under the conditions of 42-45 DEG C, the epoxy resin board of shaping is obtained；
(6) epoxy resin board that will be molded demoulding from glass mold is taken out, and is naturally cooling to room temperature, then carries out secondary solidification,
The epoxy resin board after solidification is obtained；
(7) epoxy resin board after solidification is processed into required shape, being blown using air blower while processing carries out air cooling,
To eliminate machining stress, obtain final product.
2. it is according to claim 1 for photoelastic experiment test epoxy resin board production method, it is characterised in that ring
The weight ratio of oxygen tree fat, maleic anhydride, dibutyl phthalate and polyester resin is 8-16:1-3:0-2:0-6..
3. it is according to claim 1 for photoelastic experiment test epoxy resin board production method, it is characterised in that institute
The polyester resin stated is 304 polyester resin.
4. it is according to claim 1 for photoelastic experiment test epoxy resin board production method, it is characterised in that institute
The epoxy resin stated is 6101 epoxy resin.
5. the production method of the epoxy resin board for photoelastic experiment test according to claim any one of 1-4, it is special
Levy and be, the described glass mold for preparing epoxy resin board, including 2 pieces of glass plates (1,2) and compression are arranged on 2 pieces of glass plates
Between rubber tube (4), rubber tube (4) is U-shaped, and the U-shaped upper surface of rubber tube and the inner surface of 2 pieces of glass plates surrounds jointly
The molding space of epoxy resin board.
6. the production method of the epoxy resin board for photoelastic experiment test according to claim 5, it is characterised in that pre-
Before heat, the glass mold that will prepare epoxy resin board carries out pre-treatment, comprises the following steps：
A () glass plate and rubber tube are cleaned：First cleaned with liquid detergent, then rinsed with clear water, absolute ethyl alcohol and third are finally used successively
Ketone is cleaned, it is desirable to glass surface free from dust, without grease, clean transparent, natural air drying；
(b) glass plate and rubber tube surface filming：Glass plate, glass strip and rubber tube are immersed in releasing agent, after 5min
Take out, lie under normal temperature indoor environment, after after its natural air drying 24h, 24h in releasing agent is immersed in again, take out, lie in
Indoor Natural air-dries film forming；
C () assembles mould：Iron wire (5) is inserted in rubber tube (4), U-frame frame is converted into, the rubber tube lining for being converted into U-frame frame
Between 2 pieces of glass plates (1,2), and four corners between 2 pieces of glass plates are padded with glass strip (3), with connecting bolt
(7) pressing article (6) is clamped, and adjusts connecting bolt (7) pressed glass parting bead and rubber tube, to ensure to pour the epoxy resin for casting out
Plate thickness is uniform.
7. it is according to claim 6 for photoelastic experiment test epoxy resin board production method, it is characterised in that institute
The releasing agent collocation method stated is：Toluene and polystyrene are compared 10 according to weight:1 ratio mixing, fully dissolving, during dissolving
Between be 4-5h.
8. the production method of the epoxy resin board for photoelastic experiment test according to claim any one of 1-4, it is special
Levy and be, the specific method of described secondary solidification is：
1. 80 DEG C are warming up to the speed of 5 DEG C/h from room temperature, and are incubated 16h；
2. 110 DEG C are warming up to from 80 DEG C of speed with 5 DEG C/h, and are incubated 24h；
3. 60 DEG C are cooled to from 110 DEG C of speed with 3 DEG C/h；
4. room temperature is cooled to from 60 DEG C of speed with 5 DEG C/h, completes secondary solidification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710159052.7A CN106928657A (en) | 2017-03-17 | 2017-03-17 | A kind of production method of the epoxy resin board for photoelastic experiment test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710159052.7A CN106928657A (en) | 2017-03-17 | 2017-03-17 | A kind of production method of the epoxy resin board for photoelastic experiment test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106928657A true CN106928657A (en) | 2017-07-07 |
Family
ID=59433559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710159052.7A Pending CN106928657A (en) | 2017-03-17 | 2017-03-17 | A kind of production method of the epoxy resin board for photoelastic experiment test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106928657A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117400538A (en) * | 2023-12-11 | 2024-01-16 | 华侨大学 | Three-dimensional photoelastic model rapid forming method combined with 3D printing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101787110B (en) * | 2009-12-21 | 2011-07-27 | 内蒙古科技大学 | Photoelastic plastic material and preparation method |
| CN102642263B (en) * | 2012-05-11 | 2014-06-11 | 中国航空动力机械研究所 | Vacuum casting process method of photoelastic model |
| CN105291326A (en) * | 2015-10-20 | 2016-02-03 | 中国矿业大学(北京) | Epoxy resin photoelastic model and manufacturing method thereof |
-
2017
- 2017-03-17 CN CN201710159052.7A patent/CN106928657A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101787110B (en) * | 2009-12-21 | 2011-07-27 | 内蒙古科技大学 | Photoelastic plastic material and preparation method |
| CN102642263B (en) * | 2012-05-11 | 2014-06-11 | 中国航空动力机械研究所 | Vacuum casting process method of photoelastic model |
| CN105291326A (en) * | 2015-10-20 | 2016-02-03 | 中国矿业大学(北京) | Epoxy resin photoelastic model and manufacturing method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 赵玉如: "光弹模型制模技术研究", 《长江科学院院报》 * |
| 郭继新: "环氧树脂光弹片的制作", 《河北大学学报（自然科学报）》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117400538A (en) * | 2023-12-11 | 2024-01-16 | 华侨大学 | Three-dimensional photoelastic model rapid forming method combined with 3D printing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106248454A (en) | A kind of manufacture method of transparent petrophysical model structural plane test specimen | |
| CN112207233A (en) | Mold manufacturing process based on 3D printing technology | |
| CN111690096A (en) | Preparation method of 3D printing photosensitive resin material | |
| CN106280278B (en) | Dry-type transformer or dry type mutual inductor fast cured epoxy resin castable and its preparation and application | |
| CN106084705B (en) | A kind of high intensity antistatic composite material sheet material and preparation method thereof | |
| CN106928657A (en) | A kind of production method of the epoxy resin board for photoelastic experiment test | |
| CN105666801A (en) | Sandwich tablet sample preparing die for epoxy resin and method | |
| CN109180124A (en) | A kind of preparation method of Quick-dry anti-crack clay sculpture material | |
| CN109575169A (en) | A method of applying film preparation special type aerial organic glass | |
| CN108623964A (en) | A kind of self-cleaning advertising lamp box acrylic board of antistatic and preparation method thereof | |
| CN101642945A (en) | Method for manufacturing imitation jade process photo frame mold | |
| CN103624208A (en) | Hot core box molding technology of riser for casting | |
| CN104359342B (en) | A kind of strengthening boiling micro-structural of metal surface and preparation method thereof | |
| CN104944977A (en) | Production method of flame-retardant fiber board | |
| CN110952046A (en) | Ironwork and forming process thereof | |
| CN107686912A (en) | A kind of high heat conduction aluminium alloy compression casting material | |
| CN105777044A (en) | Preparing method for calcium silicate board | |
| Fessler et al. | Precision casting of epoxy-resin photoelastic models | |
| CN210453376U (en) | Resin tensile sample preparation facilities | |
| CN204988824U (en) | Resin casting thing oxygen index (OI) test preparation mould | |
| CN208247275U (en) | Cast mineral alternating temperature curing system | |
| CN107983914A (en) | A kind of manufacture method of shell backing layer for the big module casting of high temperature alloy and application | |
| CN204202461U (en) | A kind of strengthening boiling micro-structural of metal surface | |
| CN208584710U (en) | Epoxy insulation vacuum pouring mold with cooling structure | |
| CN207594036U (en) | A kind of assembled wall compression test Safety mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |
|
| RJ01 | Rejection of invention patent application after publication |