CN101783379B - Element encapsulation structure of light-emitting diode and manufacturing method thereof - Google Patents
Element encapsulation structure of light-emitting diode and manufacturing method thereof Download PDFInfo
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- CN101783379B CN101783379B CN2009100035936A CN200910003593A CN101783379B CN 101783379 B CN101783379 B CN 101783379B CN 2009100035936 A CN2009100035936 A CN 2009100035936A CN 200910003593 A CN200910003593 A CN 200910003593A CN 101783379 B CN101783379 B CN 101783379B
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Abstract
The invention relates to an element encapsulation structure of a light-emitting diode and a manufacturing method thereof. The element encapsulation structure of the light-emitting diode comprises a lead frame, a first emitted material body, a second emitted material body, a chip and an encapsulation glue, wherein the lead frame is provided with a load bearing part; the first emitted material body is formed on the lead frame and surrounds the load bearing part, and one side section of the first emitted material body is a cone and is provided with a top end, an inner side surface and an outer side surface; the second emitted material body is formed on the lead frame and completely covers the outer side surface of the first emitted material body; the chip is configured on the load bearing part; and the encapsulation glue coats the chip and covers the inner side surface of the first emitted material body, wherein the first emitted material body is a hydrophilic high molecular material, and the second emitted material body is a hydrophobic high molecular material. The invention can reduce the occurrences of the phenomena of the glue overflow and the delaminating, effectively reduce the water absorption rate of the emitted plastic bodies by more than 50 percent, keep the combinability of the emitted plastic bodies and the colloid and further enhance the reliability and the stability.
Description
Technical field
The present invention relates to a kind of component packaging structure and manufacture method thereof, particularly a kind of element encapsulation structure of light-emitting diode and manufacture method thereof.
Background technology
Light-emitting diode (Light Emitting Diode, be called for short LED) have advantages such as high brightness, volume are little, in light weight, cracky, low power consumption and life-span be not long because of it, so be widely used in the various demonstration product, its principle of luminosity is as follows: apply a voltage on diode, the electronics that orders about in the diode combines with electric hole, and this is that form with light discharges in conjunction with the energy that produced.
In general, please refer to Fig. 1 a, the encapsulating structure of light-emitting diode is made of the plastic body 12 of a lead frame 10 and an ejection formation, then on the lead frame 10 that crystal grain 14 is formed at as load bearing seat, utilize a lead 16 to reach electrically connect again, the packaging plastic 18 that pours into a printing opacity at last coats this crystal grain 14 and this lead 16, finishes the encapsulating structure of light-emitting diode, please refer to Fig. 1 b.For making this plastic body 12 have preferable adhesive ability with this packaging plastic 18, generally this plastic body 12 uses hydrophilic macromolecular material as raw material.Yet, because the hydrophily of this plastic body 12 tends to make the relation of the packaging plastic 18 of follow-up formation because of intermolecular active force, cause the situation of the excessive glue 20 in surface to take place, please refer to Fig. 1 c.In addition, because this plastic body 12 is made of hydrophilic plastics fully, therefore after using a period of time (being exposed to atmosphere a period of time), this plastic body 12 causes the phenomenon of delamination to take place easily because absorb the relation of aqueous vapor.
In view of this, the light-emitting diode process technique is demanded a kind of encapsulating structure and technology of novelty urgently, to solve the above-mentioned problem of mentioning.
Summary of the invention
In sum, the objective of the invention is to propose a kind of encapsulating structure and manufacture method thereof of light-emitting diode, it can reduce the phenomenon of glue and delamination of overflowing, and further increases light-emitting diode reliability of products and stability.
According to an aspect of the present invention, provide a kind of encapsulating structure of light-emitting diode, it comprises: a lead frame, and wherein this lead frame has a supporting part; One first penetrates material bodies, be formed on this lead frame, around this supporting part, wherein this first side section that penetrates material bodies is a cone, have a tip, an inner surface and an outer surface, and this first ejaculation material bodies is hydrophilic macromolecular compound; One second penetrates material bodies, coats this first ejaculation material bodies, and covers the outer surface of this first ejaculation material bodies fully, and wherein this second ejaculation material bodies is hydrophobic macromolecular compound; One chip is disposed at this supporting part; And a packaging plastic, coat this chip, and cover this first inner surface that penetrates material bodies.
According to a further aspect in the invention, provide a kind of manufacture method of element encapsulation structure of light-emitting diode, it comprises: a lead frame is provided, and wherein this lead frame has a supporting part; Form one first and penetrate material bodies on this lead frame, expose this supporting part, wherein this first side section that penetrates material bodies is a cone, has a tip, an inner surface and an outer surface, and this first ejaculation material bodies is hydrophilic macromolecular compound; Form one second ejaculation material bodies and coat this first ejaculation material bodies, and cover the outer surface of this first ejaculation material bodies fully, wherein this second ejaculation material bodies is hydrophobic macromolecular compound; Dispose a chip in this supporting part; And form a packaging plastic and coat this chip, and cover this first inner surface that penetrates material bodies.
According to a preferred embodiment of the present invention, the encapsulating structure of this light-emitting diode comprises a lead frame, and wherein this lead frame has a supporting part; One first penetrates material bodies is formed on this lead frame, and around this supporting part, wherein this first side section that penetrates material bodies is a cone, has a tip, an inner surface and an outer surface; One second penetrates material bodies coats this first ejaculation material bodies, and covers the outer surface of this first ejaculation material bodies fully; One chip configuration is in this supporting part; And a packaging plastic coats this chip, and covers the inner surface of this first ejaculation material bodies.
In addition, another preferred embodiment according to the present invention, the present invention also provides the manufacture method of above-mentioned element encapsulation structure of light-emitting diode, comprises: a lead frame is provided, and wherein this lead frame has a supporting part; Form one first and penetrate material bodies on this lead frame, expose this supporting part, wherein this first side section that penetrates material bodies is a cone, has a tip, an inner surface and an outer surface; Form one second ejaculation material bodies and coat this first ejaculation material bodies, and cover the outer surface of this first ejaculation material bodies fully; Dispose a chip in this supporting part; And, form a packaging plastic and coat this chip, and cover the inner surface of this first ejaculation material bodies.
Element encapsulation structure of light-emitting diode provided by the present invention and manufacture method thereof, can reduce the phenomenon of overflow glue and delamination, effectively reduce the water absorption rate of 50% above jet-out plastic body, and keep the associativity of jet-out plastic body and colloid, can further increase light-emitting diode reliability of products and stability thus.
Below by a plurality of embodiment and comparing embodiment, illustrating further method of the present invention, feature and advantage, but it is not to be used for limiting the scope of the invention, and scope of the present invention should be as the criterion with appended claim institute restricted portion.
Description of drawings
Fig. 1 a and Fig. 1 b are the sectional structure chart of a traditional element encapsulation structure of light-emitting diode.
Fig. 1 c shows the phenomenon of the excessive glue of traditional element encapsulation structure of light-emitting diode shown in Fig. 1 a and Fig. 1 b.
Fig. 2 a to Fig. 2 c shows the making flow process profile of the described element encapsulation structure of light-emitting diode of one embodiment of the invention.
Fig. 3 is the generalized section of the described element encapsulation structure of light-emitting diode of another embodiment of the present invention.
Wherein, description of reference numerals is as follows:
Lead frame～10; Plastic body～12; Crystal grain～14; Lead～16; Packaging plastic～18; The excessive glue in surface～20; Lead frame～100; Supporting part～101; First penetrates material bodies～102; Outer surface～103; Second penetrates material bodies～104; Inner surface～105; LED crystal particle～106; Most advanced and sophisticated～107; Lead～108; Second penetrates upper surface～109 of material bodies; And, packaging plastic～110.
Embodiment
Below, with reference to accompanying drawing, describe the manufacture method of the described element encapsulation structure of light-emitting diode of embodiments of the invention in detail.
At first, please refer to Fig. 2 a, a lead frame 100 is provided, this lead frame has a supporting part 101, is used for carrying a LED crystal particle of follow-up formation.This lead frame 100 can be existing employed any material and shape, is simplified illustration, in figure only with simple frame representation.Then, still please refer to Fig. 2 a, plastics are formed one first with injection molding method penetrate material bodies 102 on this lead frame 100, this first ejaculation material bodies 102 is substantially around this supporting part 101.It should be noted that this first ejaculation material bodies 102 is positioned at the part of lead frame top, be roughly a hollow and annular thing, constitute a pothole substantially with this lead frame, and this supporting part 101 is positioned at this pothole.Please refer to Fig. 2 a, this first section that penetrates material bodies 102 either sides is all a bullet, has a tip 107, an inner surface 105 and an outer surface 103.This inner surface 105 and outer surface 103 can be a continuous inclined-plane, also can be a discontinuous surface, as shown in Figure 3.According to one of feature of the present invention, this first ejaculation material bodies is preferably hydrophilic macromolecular compound, thus, the follow-up glue material that is formed in the pothole can have preferable tack with this first ejaculation material bodies, and this first ejaculation material bodies can for example be hydrophilic poly-O-phthalic amine (polyphthalamide), hydrophilic polyvinyl alcohol (poly vinyl alcohol), hydrophilic PVP (poly (vinyl pyrrolidone)) or hydrophilic polyamide (polyamides).
Then, please refer to Fig. 2 b, another plastics are formed one second with injection molding method penetrate material bodies 104 on this lead frame 100, and make this second ejaculation material bodies 104 cover the outer surface 103 of this first ejaculation material bodies 102 fully.It should be noted that, this second ejaculation material bodies 104 coats this first ejaculation material bodies 102 by the outside, and this second upper surface 109 that penetrates material bodies 104 links to each other with this first tip 107 of penetrating material bodies 102, so that this first outer surface 103 that penetrates material bodies 102 is covered by this second ejaculation material bodies 104 fully.According to one of feature of the present invention, this second ejaculation material bodies 104 is preferably hydrophobic macromolecular compound (being difficult for suction), thus, can reduce the water absorption rate of jet-out plastic body, therefore is difficult for the phenomenon of generation delamination.In addition, because this second ejaculation material bodies 104 coats the outer surface 103 of this first ejaculation material bodies 102 fully, so follow-up formed packaging plastic, only can be by the inner surface 103 of limit in this first ejaculation material bodies.Because first hydrophilic surface 105 that penetrates material bodies 102 outsides is isolated by this hydrophobic second ejaculation material bodies 104, so packaging plastic can not overflow because of the chemical action power between material, prevents the phenomenon of the excessive glue in surface.This second ejaculation material bodies 104 can for example be polyester, Merlon (polycarbonate), polyaromatic ethene or polydioxanone (polydioxanone), or the macromolecular material of blending glass fibre
At last, please refer to Fig. 2 c, treat that a LED crystal particle 106 is formed at this supporting part 101 and utilizes a lead 108 to finish electrically connect after, cover this LED crystal particle 106 by a packaging plastic 110.It should be noted that this packaging plastic 110 covers the one the first inner surfaces 105 that penetrate material bodies 102 simultaneously.So far, finish a preferred embodiment of element encapsulation structure of light-emitting diode of the present invention.This LED crystal particle 106 and packaging plastic 110 in the present invention and indefinite, can be existing employed any suitable product.
Element encapsulation structure of light-emitting diode provided by the present invention and manufacture method thereof, can reduce the phenomenon of overflow glue and delamination, effectively reduce the water absorption rate of 50% above jet-out plastic body, and keep the associativity of jet-out plastic body and colloid, can further increase light-emitting diode reliability of products and stability.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; when can doing a little change and modification, so protection scope of the present invention is as the criterion when looking appended claims institute restricted portion.
Claims (12)
1. the encapsulating structure of a light-emitting diode comprises:
One lead frame, wherein this lead frame has a supporting part;
One first penetrates material bodies, be formed on this lead frame, around this supporting part, wherein this first side section that penetrates material bodies is a cone, have a tip, an inner surface and an outer surface, and this first ejaculation material bodies is hydrophilic macromolecular compound;
One second penetrates material bodies, coats this first ejaculation material bodies, and covers the outer surface of this first ejaculation material bodies fully, and this second ejaculation material bodies is hydrophobic macromolecular compound;
One chip is disposed at this supporting part; And
One packaging plastic coats this chip, and covers the inner surface of this first ejaculation material bodies.
2. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein this inner surface or this outer surface are a continuous surface.
3. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein this inner surface or this outer surface are a discontinuous surface.
4. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein this first penetrates material bodies and comprises hydrophilic poly-O-phthalic amine, hydrophilic polyvinyl alcohol, hydrophilic PVP or hydrophilic polyamide.
5. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein this second penetrates material bodies and comprises polyester, Merlon, polyaromatic ethene or polydioxanone.
6. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein this second penetrates the macromolecular material that material bodies comprises the blending glass fibre.
7. the manufacture method of an element encapsulation structure of light-emitting diode comprises:
One lead frame is provided, and wherein this lead frame has a supporting part;
Form one first and penetrate material bodies on this lead frame, expose this supporting part, wherein this first side section that penetrates material bodies is a cone, has a tip, an inner surface and an outer surface, and this first ejaculation material bodies is hydrophilic macromolecular compound;
Form one second ejaculation material bodies and coat this first ejaculation material bodies, and cover the outer surface of this first ejaculation material bodies fully, and this second ejaculation material bodies is hydrophobic macromolecular compound;
Dispose a chip in this supporting part; And
Form a packaging plastic and coat this chip, and cover the inner surface of this first ejaculation material bodies.
8. the manufacture method of element encapsulation structure of light-emitting diode as claimed in claim 7, wherein this inner surface or this outer surface are a continuous surface.
9. the manufacture method of element encapsulation structure of light-emitting diode as claimed in claim 7, wherein this inner surface or this outer surface are a discontinuous surface.
10. the manufacture method of element encapsulation structure of light-emitting diode as claimed in claim 7, wherein this first penetrates material bodies and comprises hydrophilic poly-O-phthalic amine, hydrophilic polyvinyl alcohol, hydrophilic PVP or hydrophilic polyamide.
11. the manufacture method of element encapsulation structure of light-emitting diode as claimed in claim 7, wherein this second ejaculation material bodies comprises polyester, Merlon, polyaromatic ethene or polydioxanone.
12. the manufacture method of element encapsulation structure of light-emitting diode as claimed in claim 7, wherein this second ejaculation material bodies comprises the macromolecular material of blending glass fibre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100035936A CN101783379B (en) | 2009-01-20 | 2009-01-20 | Element encapsulation structure of light-emitting diode and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100035936A CN101783379B (en) | 2009-01-20 | 2009-01-20 | Element encapsulation structure of light-emitting diode and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN101783379A CN101783379A (en) | 2010-07-21 |
| CN101783379B true CN101783379B (en) | 2011-08-24 |
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| CN2009100035936A Expired - Fee Related CN101783379B (en) | 2009-01-20 | 2009-01-20 | Element encapsulation structure of light-emitting diode and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111211209B (en) * | 2020-01-16 | 2021-09-28 | 江西新正耀光学研究院有限公司 | Ultraviolet light-emitting diode and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1917244A (en) * | 2000-04-26 | 2007-02-21 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation emitting semiconductor component with luminescent conversion element |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1917244A (en) * | 2000-04-26 | 2007-02-21 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation emitting semiconductor component with luminescent conversion element |
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| CN101783379A (en) | 2010-07-21 |
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Granted publication date: 20110824 Termination date: 20190120 |