CN101775583B - 铜靶材组件的制造方法 - Google Patents
铜靶材组件的制造方法 Download PDFInfo
- Publication number
- CN101775583B CN101775583B CN 200910215628 CN200910215628A CN101775583B CN 101775583 B CN101775583 B CN 101775583B CN 200910215628 CN200910215628 CN 200910215628 CN 200910215628 A CN200910215628 A CN 200910215628A CN 101775583 B CN101775583 B CN 101775583B
- Authority
- CN
- China
- Prior art keywords
- copper
- backboard
- sputtering plates
- target components
- copper sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010949 copper Substances 0.000 title claims abstract description 109
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 108
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000004544 sputter deposition Methods 0.000 claims abstract description 57
- 230000008569 process Effects 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 14
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 3
- 239000013077 target material Substances 0.000 claims description 15
- 238000007669 thermal treatment Methods 0.000 claims description 15
- 238000005245 sintering Methods 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 230000000740 bleeding effect Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000005096 rolling process Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 238000003490 calendering Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000009924 canning Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008521 reorganization Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910215628 CN101775583B (zh) | 2009-12-30 | 2009-12-30 | 铜靶材组件的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910215628 CN101775583B (zh) | 2009-12-30 | 2009-12-30 | 铜靶材组件的制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101775583A CN101775583A (zh) | 2010-07-14 |
| CN101775583B true CN101775583B (zh) | 2012-09-26 |
Family
ID=42512167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910215628 Active CN101775583B (zh) | 2009-12-30 | 2009-12-30 | 铜靶材组件的制造方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101775583B (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102059582A (zh) * | 2010-12-16 | 2011-05-18 | 宁波江丰电子材料有限公司 | 一种钼靶材的加工方法 |
| CN103143834A (zh) * | 2013-03-20 | 2013-06-12 | 先进储能材料国家工程研究中心有限责任公司 | 由多孔金属材料与金属材料形成结构件的制作方法 |
| CN109420787A (zh) * | 2017-08-23 | 2019-03-05 | 宁波江丰电子材料股份有限公司 | 铜靶材加工方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244826A (zh) * | 1996-12-26 | 2000-02-16 | 约翰逊·马塞电气公司 | 制备高纯铜溅射靶的方法 |
| CN1970209A (zh) * | 2006-12-01 | 2007-05-30 | 宁波江丰电子材料有限公司 | 一种扩散焊接方法 |
| CN101543935A (zh) * | 2009-03-12 | 2009-09-30 | 宁波江丰电子材料有限公司 | 靶材组件的制作方法 |
| CN101579782A (zh) * | 2009-04-20 | 2009-11-18 | 宁波江丰电子材料有限公司 | 铜靶材坯料与铜合金背板的焊接方法 |
-
2009
- 2009-12-30 CN CN 200910215628 patent/CN101775583B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244826A (zh) * | 1996-12-26 | 2000-02-16 | 约翰逊·马塞电气公司 | 制备高纯铜溅射靶的方法 |
| CN1970209A (zh) * | 2006-12-01 | 2007-05-30 | 宁波江丰电子材料有限公司 | 一种扩散焊接方法 |
| CN101543935A (zh) * | 2009-03-12 | 2009-09-30 | 宁波江丰电子材料有限公司 | 靶材组件的制作方法 |
| CN101579782A (zh) * | 2009-04-20 | 2009-11-18 | 宁波江丰电子材料有限公司 | 铜靶材坯料与铜合金背板的焊接方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101775583A (zh) | 2010-07-14 |
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Denomination of invention: Method for manufacturing copper target components Effective date of registration: 20121113 Granted publication date: 20120926 Pledgee: Export Import Bank of China Pledgor: Ningbo Jiangfeng Electronic Materials Co., Ltd. Registration number: 2012990000688 |
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Date of cancellation: 20131206 Granted publication date: 20120926 Pledgee: Export Import Bank of China Pledgor: Ningbo Jiangfeng Electronic Materials Co., Ltd. Registration number: 2012990000688 |
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Denomination of invention: Method for manufacturing copper target components Effective date of registration: 20131220 Granted publication date: 20120926 Pledgee: Export Import Bank of China Pledgor: Ningbo Jiangfeng Electronic Materials Co., Ltd. Registration number: 2013990001013 |
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Address after: 315400, Zhejiang Yuyao Economic Development Zone, state science and Technology Industrial Park, Ann Road Patentee after: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Address before: 315400, Zhejiang Yuyao Economic Development Zone, state science and Technology Industrial Park, Ann Road Patentee before: Ningbo Jiangfeng Electronic Materials Co., Ltd. |
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Denomination of invention: Method for manufacturing copper target components Effective date of registration: 20170510 Granted publication date: 20120926 Pledgee: Bank of China Limited by Share Ltd Yuyao branch Pledgor: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Registration number: 2017330000038 |
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Denomination of invention: Method for manufacturing copper target components Effective date of registration: 20180320 Granted publication date: 20120926 Pledgee: Bank of China Limited by Share Ltd Yuyao branch Pledgor: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Registration number: 2018330000064 |
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Date of cancellation: 20200825 Granted publication date: 20120926 Pledgee: Bank of China Limited by Share Ltd. Yuyao branch Pledgor: KONFOONG MATERIALS INTERNATIONAL Co.,Ltd. Registration number: 2018330000064 |
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Denomination of invention: Manufacturing method of copper target components Effective date of registration: 20200908 Granted publication date: 20120926 Pledgee: Bank of China Limited by Share Ltd. Yuyao branch Pledgor: KONFOONG MATERIALS INTERNATIONAL Co.,Ltd. Registration number: Y2020330000675 |