CN101771228A - 面阵列适配器 - Google Patents

面阵列适配器 Download PDF

Info

Publication number
CN101771228A
CN101771228A CN200910262531A CN200910262531A CN101771228A CN 101771228 A CN101771228 A CN 101771228A CN 200910262531 A CN200910262531 A CN 200910262531A CN 200910262531 A CN200910262531 A CN 200910262531A CN 101771228 A CN101771228 A CN 101771228A
Authority
CN
China
Prior art keywords
lead
wire
circuit board
bga
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910262531A
Other languages
English (en)
Inventor
C·V·德桑蒂斯
D·E·伯彻尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamilton Sundstrand Corp
Original Assignee
Hamilton Sundstrand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamilton Sundstrand Corp filed Critical Hamilton Sundstrand Corp
Publication of CN101771228A publication Critical patent/CN101771228A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2478—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point spherical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Connecting Device With Holders (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明涉及面阵列适配器。一种适配器，利用能够在一端连接到球栅阵列并且在相对端连接到引线栅格阵列垫盘样式的电引线，将球栅阵列部件连接到具有引线栅格阵列接头的电路板上。

Description

面阵列适配器
技术领域
本申请涉及电路板组件，特别地涉及用于将具有球栅阵列接头的电气部件连接到具有引线栅格阵列接头的电路板上的适配器。
背景技术
当建立用于实现特定功能的电路板时，常用的方法是将电气连接“印刷”到电路板上，然后在不可印刷部件(如微芯片、电容、等等)能被连接到印刷电路板的地方使用接头来完成电路。本领域内有多种标准接头类型被用来形成这些连接。
一种类型的接头是球栅阵列(BGA)接头，其中部件在各个连接处具有焊球，所述焊球使用将部件焊到板上的全加热法与板连接。
使用BGA接头类型会产生一个缺点，因为焊料和电气部件具有与其所附连的电路板不同的热膨胀/收缩率。无论存在热膨胀还是收缩，该不同导致位于BGA接头上的应力。由于BGA接头的性质，焊料连接特别易受热膨胀和收缩引起的附加应力。该应力可导致节头寿命的减少，并能导致潜在的断裂。
发明内容
所公开的是一种适配器，所述适配器使用电气引线将具有BGA连接类型的部件连接到电路板，所述电路板具有使用引线栅格阵列(LGA)连接类型的印制垫盘样式(printed pad pattern)。这种引线能在一端连接到BGA部件，在另一端连接到电路板的印制垫盘样式。这使BGA部件能够电连接到LGA电路板。
本发明的这些和其他特点可通过接下来的说明和附图来最好的理解，接下来是附图的简要说明。
附图说明
图1是具有球栅阵列部件的示例性装置的分解视图，所述球栅阵列部件通过面阵列适配器被连接到电路板上的印制垫盘样式。
图2A是示例性适配器引线的侧视图。
图2B是示例性适配器引线的等视轴视图。
图3是根据本公开的例子的引线的铰链部分的放大图。
图4是根据本公开的例子的引线的支撑部分的放大图。
具体实施方式
参照图1，通过分解视图说明了具有BGA部件120、面阵列适配器122、和电路板124的示例性装置。在该例子中，BGA部件120包括在部件工作部分102的底面上的焊球104阵列。在阵列中的各个焊球104能够形成部件工作部分102与其他物体(如适配器122)之间的电气连接。
图1中示出了适配器122的剖面图，提供了位于面阵列适配器122内部的引线106的视图。各个引线106是导电的并且对应于BGA部件120/电路板124连接所需的连接。各个引线106都保持于载体材料108中。载体材料108是不导电的，并且，取决于材料成分，也能够为电路板124、适配器122、以及BGA部件120的热膨胀和收缩提供缓冲。各个引线106具有凹陷的顶部114，该顶部能够与BGA器件(如BGA部件120)上的焊球104连接。各个引线106也具有针状底部116，该底部能够与电路板112上的印制垫盘样式连接。适配器连接可通过对引线106和载体108的较少修改而被翻转过来，由此将无引线部件连接到具有BGA连接的电路板。
图1的电路板124部分能够连接使用LGA接头的电子部件。电路板124具有一组印制垫盘110，其中各个印制垫盘110对应于电子部件的单独的针(或面阵列适配器122的引线106)。印制垫盘110位于较大的电路板基底112上，由此能够形成用于完整电路的所有必要连接。单个电路板124能包含除BGA部件120之外的一些不同部件，由此构成完整的电路。
图2A说明了示例性引线106设计的侧视图并且图2B说明了所述示例性引线106设计的等视轴视图，所述引线106设计能够被用在适配器122中，并且能够缓冲BGA部件120和适配器122之间、以及适配器122和电路板124之间的焊接头上的应力。在所说明的示例性设计中，引线106包含在顶端114上的凹坑202。凹坑202的尺寸略大于适配器122设计成所连接的焊球104(在图1中画出)的尺寸。在焊接之前，焊球104置于凹坑202中。凹坑202在焊接过程中保持焊球104于适当的位置，并且保证不会存在意外的交叉连接。
通过铰链部分204提供了从焊球104到底端116处的引线106的针连接部分的电气连接。铰链部分204能够响应于热相关应力(如热膨胀和压缩)而折曲，由此吸收应力的大部分，并延长焊接头的预期寿命。铰链部分204连接能够被焊到电路板124的针状底端116。
图2A和2B中所说明的适配器引线106包含位于顶端的凹陷部分202，焊球可在全加热过程之前置于该顶端处。顶部另外包含两个向下延伸的叉302、304。第一个叉302向下延伸到铰链部分204(于图3中说明)，第二个叉304向下延伸并且终止于间隙部分350。铰链部分204然后连接到与针部分116相连的支撑部分352。
图3所说明的铰链部分204包括具有四个折曲区域310、320、330、340的固体单元。顶部折曲区域310和底部折曲区域340使引线能够在相对侧上朝间隙部分350折曲，中间折曲区域320和330使引线106能够在相对侧上远离间隙部分350折曲。间隙部分350存在于铰链部分204的相对侧上，允许引线106有空间来响应于热膨胀和收缩而折曲。
紧接在铰链部分204和间隙部分350下面的是支撑部352。支撑部352形成四个翼型部分356和两个间隙358。可替换的，引线106可以通过连接各个翼型部分356的一端构造成在支撑部352中只有一个间隙。
一旦引线106位于载体108中，支撑部352保持引线106于适当位置。当引线106被初次插入载体108中时，引线106在支撑部352处被夹持在一起。一旦引线106位于载体108的内部，引线材料的自然弹性促使引线106弹回到其具有间隙358的原有形状。当支撑部352已经弹回到其原有形状时，各个翼356装配到载体108里合适尺寸的槽中，由此保持引线105于合适的位置，同时仍然使铰链部分204能够响应于热应力而折曲。
面阵列适配器122的使用通过引线106创建了BGA部件120的焊球104连接与LGA电路板124的印制垫盘110之间的完全电连接。
为了形成BGA部件120与电路板124之间的永久连接，可以使用焊接连接。为了创建焊接连接，开始时BGA部件120被置于与适配器122中引线106的顶端114相接触。引线106的底端116被置于电路板124上的印制垫盘110上的焊膏、预制件、或其他焊接应用装置中。一旦三个零件的每一个都已经被适当的放置，该装置就被暴露在足够热来融化BGA的焊球104的温度中。焊球104然后被冷却，由此形成到引线106的凹陷顶端114的永久焊接连接。该过程被称为全加热过程。类似的，通过使用全加热过程能够在引线106的针状底端116与电路板124里的印制垫盘110之间形成焊接连接。
应用于全加热过程的热应该足够融化焊料而不融化或损坏部件。加热所使用的具体温度依据所使用焊料的类型以及具体部件的耐热性而不同。对给定装置确定合适温度的技术为本领域的技术人员所知晓。
在普通应用中根据上述公开所制造的部件将在装置被装配和安装后经历一些加热和冷却循环。由于BGA部件120和电路板124具有不同的热膨胀和收缩率，它们将根据任何温度变化作出响应而膨胀和收缩不同的量。不同的膨胀和收缩率在焊接头上面产生可能弱化或最终毁坏它们的应力。
热应力通过引线106的铰链部分204被减小，给连接增加了柔性，而不损害电连通性。铰链部分204可响应于热应力通过折曲区域310、320、330、340在任何方向折曲。引线106的折曲补偿不同的膨胀率，由此减小焊接头上的应力。使用不同方法来补偿应力或将铰链部分置于不同位置的替代引线设计可以被应用，并且仍然在本公开的范围内。
虽然示例性实施例已被公开，但是本技术领域的普通技术人员将认识到落入在本发明的范围内的某些修改。基于该原因，所附权利要求应该被研究，从而来确定本发明的真实范围和内容。

Claims (20)

1.一种将部件连接到电路板的装置，其中所述部件和所述电路板中的一个具有球栅阵列(BGA)连接，并且所述部件和所述电路板中的一个具有引线栅格阵列(LGA)连接，所述装置包括：
容纳至少一组导电引线的不导电载体；
所述引线能够在第一端形成到BGA接头的电连接；并且
所述引线能够在与所述第一端相对的第二端形成到LGA接头的电连接。
2.如权利要求1所述的装置，其中具有BGA连接的电气部件或具有BGA连接的电路板被连接到所述引线的所述第一端。
3.如权利要求1所述的装置，其中具有用于引线连接的印制垫盘样式的电路板或具有用于引线连接的印制垫盘样式的电气部件被连接到所述引线的所述第二端。
4.如权利要求1所述的装置，其中BGA部件或BGA电路板使用全加热焊接方法焊接到所述装置。
5.如权利要求1所述的装置，其中无引线部件或LGA电路板使用全加热焊接方法焊接到所述装置。
6.如权利要求1所述的装置，其中所述引线包括能够至少部分吸收由于热膨胀和收缩引起的应力的单个导电片。
7.如权利要求6所述的装置，其中所述引线包括凹陷部分、铰链部分、支撑部分和针部分。
8.如权利要求7所述的装置，其中所述铰链部分包括：
向内成角度的顶段，所述顶段连接到向下延伸的中间段；
所述中间段连接到向外成角度的底段；并且
所述铰链部分包括四个折曲区域。
9.如权利要求7所述的装置，其中所述支撑部分包括至少两个翼型部分和至少一个间隙部分，其中所述间隙部分使支撑部分能够夹持在一起，并且其中所述翼型部分能够置于载体的槽中，由此保持所述引线于适当位置。
10.如权利要求9所述的装置，其中所述支撑部分包括恰好四个翼型部分和恰好两个间隙部分。
11.如权利要求7所述的装置，其中所述杯状部分包括至少两个垂直于凹陷部分延伸的叉。
12.如权利要求11所述的装置，其中所述叉的一个连接到所述铰链部分，所述铰链部分连接到所述支撑部分，以及所述支撑部分连接到所述针部分。
13.如权利要求1所述的装置，其中所述引线容纳于由不导电材料构成的壳的空腔内。
14.如权利要求13所述的装置，其中所述壳至少包含半刚性材料。
15.如权利要求13所述的装置，其中所述空腔设置成使所述引线能够至少部分地折曲而不会从所述空腔中移出。
16.一种电路板组件，包括：
至少一个连接到电路板的电气部件；
所述电气部件和所述电路板中的一个具有球栅阵列(BGA)连接类型，并且所述电气部件和所述电路板中的一个具有引线栅格阵列(LGA)连接类型；以及
将所述部件和所述电路板电连接的适配器。
17.如权利要求16所述的装置，其中所述连接器进一步包括一组引线，所述引线能够在第一端连接到BGA接头，并且能够在第二端连接到印制垫盘样式。
18.如权利要求17所述的装置，其中所述引线能够减少由于热膨胀和收缩引起的接头应力。
19.如权利要求17所述的装置，其中所述引线包括：
具有至少一个折曲区域的铰链部分，所述折曲区域能够响应热膨胀和收缩而折曲；并且
所述引线将所述部件和所述电路板电连接。
20.如权利要求19所述的装置，其中所述引线包括具有凹陷部分、铰链部分、间隙部分、支撑部分和针部分的单个导电片。
CN200910262531A 2008-12-29 2009-12-29 面阵列适配器 Pending CN101771228A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/344849 2008-12-29
US12/344,849 US7806700B2 (en) 2008-12-29 2008-12-29 Area array adapter

Publications (1)

Publication Number Publication Date
CN101771228A true CN101771228A (zh) 2010-07-07

Family

ID=42133518

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910262531A Pending CN101771228A (zh) 2008-12-29 2009-12-29 面阵列适配器

Country Status (4)

Country Link
US (1) US7806700B2 (zh)
EP (1) EP2203037B1 (zh)
JP (1) JP2010157701A (zh)
CN (1) CN101771228A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9543679B2 (en) * 2012-10-05 2017-01-10 Tyco Electronics Corporation Electrical contact assembly
WO2014200327A1 (en) * 2013-06-13 2014-12-18 Mimos Berhad A universal connector
US10431912B2 (en) * 2017-09-29 2019-10-01 Intel Corporation CPU socket contact for improving bandwidth throughput

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383726A (en) 1980-12-22 1983-05-17 Carrier Corporation Electric terminal
US4523798A (en) 1983-11-03 1985-06-18 Carrier Corporation Connector block
JPH09219268A (ja) * 1996-02-07 1997-08-19 Toshiba Chem Corp Ｉｃソケット用コンタクトピン
JP3034231B2 (ja) * 1997-10-24 2000-04-17 日本特殊陶業株式会社 中継基板
US6036508A (en) 1998-12-21 2000-03-14 Hamilton Sundstrand Corporation Connector for interconnecting a bus bar to a circuit board
US6375474B1 (en) * 1999-08-09 2002-04-23 Berg Technology, Inc. Mezzanine style electrical connector
US6524115B1 (en) 1999-08-20 2003-02-25 3M Innovative Properties Company Compliant interconnect assembly
US6533589B1 (en) 1999-10-14 2003-03-18 Ironwood Electronics, Inc. Packaged device adapter assembly
US7077659B2 (en) 1999-12-16 2006-07-18 Paricon Technologies Corporation Separable electrical interconnect with anisotropic conductive elastomer and a rigid adapter
US6957963B2 (en) 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
US6884707B1 (en) 2000-09-08 2005-04-26 Gabe Cherian Interconnections
JP2002141151A (ja) 2000-11-06 2002-05-17 Texas Instr Japan Ltd ソケット
US6572386B1 (en) * 2002-02-28 2003-06-03 Hon Hai Precision Ind. Co., Ltd. Socket having low wiping terminals
US6905377B2 (en) * 2002-09-17 2005-06-14 Tyco Electronics Corporation Contact for land grid array socket
US7044795B2 (en) 2003-04-01 2006-05-16 Hamilton Sundstrand Miniature, shielded electrical connector with strain relief
TWM250411U (en) * 2003-07-04 2004-11-11 Hon Hai Prec Ind Co Ltd Land grid array socket
US20050170627A1 (en) * 2004-01-30 2005-08-04 Thomas Mowry Interconnect apparatus, system, and method
TWI323959B (en) * 2005-07-15 2010-04-21 Hon Hai Prec Ind Co Ltd Electrical contact
CN200950516Y (zh) 2006-09-04 2007-09-19 上海莫仕连接器有限公司 插座连接器

Also Published As

Publication number Publication date
EP2203037A3 (en) 2011-05-11
EP2203037A2 (en) 2010-06-30
JP2010157701A (ja) 2010-07-15
US7806700B2 (en) 2010-10-05
EP2203037B1 (en) 2015-06-17
US20100167560A1 (en) 2010-07-01

Similar Documents

Publication Publication Date Title
CN1510788B (zh) 电连接器
JP4950144B2 (ja) コネクタ
US8267701B2 (en) Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing
US6127204A (en) Column grid array or ball grid array pad on via
CN101771228A (zh) 面阵列适配器
CN2395398Y (zh) 电连接器
GB2325354A (en) Electrical connector or connection with concave ball-receiving site
CN101296563B (zh) 电路板、电子组件及电路板组件
US20080032517A1 (en) Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments
WO2000005936A1 (en) Hybrid solder ball and pin grid array circuit board interconnect system and method
EP1109265B1 (en) Electrical connector housing
US6421912B1 (en) Method of making an electrical connector
JP2005535079A (ja) Ｂｇａ接続を有する印刷回路基板組立
CN103069930B (zh) 用于给电路板装备多个构件的方法以及带有电路板和装配在电路板上的多个构件的电路
US7040903B2 (en) Method of connecting a contact with a solder and an electronic device using the method
JP5105053B2 (ja) 支持体、該支持体を用いた電気部品搭載プリント配線基板、該電気部品搭載プリント配線基板の製造方法
CN100391318C (zh) 具有转接构造的电子装置及其转接方法
US20060037778A1 (en) Circuit board with SMD-components and at least one wired component, and a method for populating, securing and electrical contacting of the components
CN100499293C (zh) 一种电连接器制造方法
JP4471917B2 (ja) 複合基板装置におけるハンダ接続のリペア方法
JP4041868B2 (ja) 両面接点用コネクタ
US6929170B2 (en) Solder deposition method
US20110101075A1 (en) Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards
WO2000079853A1 (es) Metodo para conectar pistas electroconductoras separadas por un aislante laminar, y circuito impreso obtenido
JP2004311202A (ja) ヒートコネクタ

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20100707