CN101765316A - Sheet type spout for avoidance of grounding block element - Google Patents
Sheet type spout for avoidance of grounding block element Download PDFInfo
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- CN101765316A CN101765316A CN200810234216A CN200810234216A CN101765316A CN 101765316 A CN101765316 A CN 101765316A CN 200810234216 A CN200810234216 A CN 200810234216A CN 200810234216 A CN200810234216 A CN 200810234216A CN 101765316 A CN101765316 A CN 101765316A
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- tin
- kou
- avoidance
- welding
- grounding block
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Abstract
The invention relates to a component of a soldering furnace for tin soldering of a PCBA board, in particular to a sheet type spout for avoidance of a grounding block element for welding a computer motherboard. The edge of the spout is provided with at least one tin overflow port, the tin overflow port is a rectangular opening and is 3-4mm deep; the side wall of the spout is concave inwards to form an avoidance ring for accommodating a grounding block, and the outer wall of the spout below the avoidance ring is provided with a rectangular tin overflow hole. The invention has simple structure, can effectively improve the welding efficiency, and is applicable to large-scale automated production. In addition, the invention can effectively prevent the oxide layer on the tin liquid surface from being left on the surface of the PCBA board, thereby ensuring the quality of the welding joint.
Description
Technical field
The present invention relates to a kind of tin stove parts of the PCBA of being used for boards solder, especially a kind of sheet type spout for avoidance of grounding block element that is used to weld computer main board.
Background technology
Common wave-soldering adopts manual operations usually, and production efficiency is lower, for the comparatively intensive PCBA plate of need pad, this welding manner is more inadequate, in addition, because stannum export too small (generally long 2 millimeters), can bring the obstruction of scruff, thereby cause the large tracts of land of rosin joint to produce Hu Kou; At the comparatively intensive PCBA plate of pad, the kettle of employing mouth structure is also arranged, but common tin furnace kettle mouth is flat mouthful design, in order to realize scolding tin operation to the PCBA plate, generally need maintenance distance once between PCBA plate and kettle mouth, guarantee to make tin liquor can the electric elements on the PCBA plate of top be welded on the one hand from the Hu Kou ejection, guarantee simultaneously can in time discharge Hu Kou from the tin liquor of Hu Kou ejection subsequently, prevent that the kettle mouth pressure is excessive, influence welding quality, but also there is fault of construction in this structure: when tin liquor when Hu Kou sprays, because the tin liquor of upper space is owing to directly contact the formation oxide layer with air, this part oxide layer at first contacts with the PCBA plate of top along with tin liquor is gushed out from Hu Kou, in the wings under the frontal impact of tin liquor, make this part oxide layer oppressed on PCBA plate face, be difficult for it being taken away, make oxide layer remain between solder joint and the PCBA plate, have a strong impact on welding quality by the kettle mouth tin liquor of gushing out subsequently.
Summary of the invention
In order to overcome the deficiency that above-mentioned various scolding tin exists, when especially adopting the intensive PCBA plate of the point-to-point wave-soldering butt welding point of automatic selectivity to weld, inefficiency, be unsuitable for extensive batch machining, and contact easily forms the deficiency of rosin joint, the invention provides a kind of simple in structurely, can effectively improve welding efficiency, guarantee the tin furnace kettle mouth of the quality of welded contact.
The technical solution adopted for the present invention to solve the technical problems is: a kind of sheet type spout for avoidance of grounding block element, the bead of described Hu Kou is provided with at least one excessive Xi Kou, the concave side wall of Hu Kou is formed for holding the ring of dodging of ground connection piece, offers the excessive tin hole of rectangle on the kettle mouth outer wall of dodging above the ring.
For the ease of the processing of the Xi Kou that overflows, guarantee the tin liquor Xi Kou outflow of can overflowing equably simultaneously, further: described excessive Xi Kou is a rectangle gap.
For the degree of depth of the Xi Kou that overflows rationally is set, cross shallow may rising and come the Xi Kou that overflows excessive tin effect should be arranged, cross may cause deeply tin liquor before the kettle mouth of emerging just from the Xi Kou outflow of overflowing, make the emerge height of Hu Kou of tin ripple on the low side, influence welding quality, more further: the degree of depth of described excessive Xi Kou is 3～4mm.
Damaging in kettle mouth position adjustment for fear of the knuckle of inner groovy, other is positioned at the chip element of kettle mouth inside, and more further: the bottom of described inner groovy is the semicircle cambered surface.In addition, the semicircle cambered surface also is convenient to Hu Kou punch forming in the course of processing.
The existence of excessive Xi Kou can effectively change the flow direction of tin liquor behind ejection Hu Kou.After tin liquor sprays from Hu Kou, tin liquor can preferentially flow out from the Xi Kou that overflows, so just form certain tin stream that flows to, making the oxide layer of the superiors can directly do not impacted is adsorbed onto on the PCBA plate, even there is the partial oxidation layer to be adsorbed onto on the PCBA plate, can be washed away by the tin liquor that sprays from Hu Kou subsequently, having guaranteed can residual oxide layer not influence the soldering quality between scolding tin and PCBA plate yet; On the other hand, because surface tension, tin liquor upper surface in the kettle mouth is spherical shape, make under the not high situation of furnace pressure, may appear at kettle mouth edge and form rosin joint, influence welding quality, the existence of excessive Xi Kou, change the flow direction of kettle mouth tin liquor, made tin liquor can maximum possible cover the PCBA plate of kettle mouth top, guaranteed the adequacy and the fastness of welding.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is a kettle mouth structure schematic diagram of the present invention.
Fig. 2 is the placement location schematic diagram of the present invention on the PCBA plate.
1. excessive tin mouths 2. are dodged ring 3. excessive tin hole 4. ground connection pieces, 5. electronic devices and components 6.PCBA plates among the figure
Embodiment
A kind of sheet type spout for avoidance of grounding block element as shown in Figure 1, the bead of described Hu Kou are provided with at least one excessive tin mouth 1, and described excessive Xi Kou is a rectangle gap, and its degree of depth is 3～4mm.The concave side wall of Hu Kou is formed for holding dodging of ground connection piece and encircles 2, is dodging the excessive tin hole 3 that offers rectangle on the kettle mouth outer wall that encircles below 2.
As shown in Figure 2, ground connection piece 4 is positioned at dodges ring 2, and utilization is dodged groove 2 and with the cooperation of ground connection piece 4 positioning action played in the installation site of Hu Kou, has guaranteed the accuracy of welding position.By offering the tin hole 3 of overflowing dodging on the kettle mouth outer wall of ring below 2, the tin liquor gushed out from kettle mouth extroversion is just flowed out from the tin hole 3 of overflowing before arriving Hu Kou and PCBA plate 6 contact-making surfaces in advance, can effectively control the welding and assembling height that tin liquor is docked 4 surfaces, plot.The position in tin hole 3 and the perforate size of overflowing be according to the welding and assembling height decision of ground connection piece 4, presses when higher when tin, tin hole 3 perforates of overflowing can be increased or move down position of opening, can shift to an earlier date release to guarantee near the kettle mouth tin liquors the ground connection piece 4.
During use, the PCBA plate is placed on the precalculated position of kettle mouth top, and board plane and kettle mouth stannum export are maintained a certain distance, generally be controlled at 2～4mm.The shape of Hu Kou can determine that Hu Kou is designed to rectangular shape usually according to the distribution situation of PCBA plate welding position, and its length is 6～11mm.For the welding position is irregular concentrated distribution, can adopt a plurality of rectangle Hu Kou to piece together required welding shape.Tin liquor keeps earlier certain liquid level to store in the kettle mouth 1～3 minute, the PCBA plate to be welded of top is carried out preheating, so that preceding operation is removed the oxide layer on the PCBA plate at the scaling powder generation chemical reaction of PCBA plate position to be welded spraying.Afterwards, the electronic startup of tin stove, push to Hu Kou by the tin liquor of exerting pressure the tin furnace interior, the continuous lifting of tin liquor face in the kettle mouth, and tin liquor ejects kettle mouth stannum export the most at last, contacts with the PCBA plate of top and welds, and is guaranteeing that tin liquor and PCBA plate fully weld, unnecessary tin liquor can be discharged from the Xi Kou that overflows, and takes away the oxide layer and the impurity of tin liquor top layer.At last, take off the PCBA plate, finish the welding of ground PCBA plate from kettle mouth top.
Because adopted kettle mouth method for designing flexibly, enlarged effective solder side, thereby made speed of welding fast on year-on-year basis more than three times with international " automatic selectivity welding tin stove ".
Because Hu Kou has adopted excessive tin mouth design, this scheme has just been removed the main scruff of welding quality and the oxide skin on tin liquor surface of influencing before welding, the qualification rate of welding is reached more than 99.9%.
Claims (3)
1. sheet type spout for avoidance of grounding block element, it is characterized in that: the bead of described Hu Kou is provided with at least one excessive Xi Kou (1), what the concave side wall of Hu Kou was formed for holding the ground connection piece dodges ring (2), offers the excessive tin hole (3) of rectangle on the kettle mouth outer wall of dodging ring (2) top.
2. sheet type spout for avoidance of grounding block element according to claim 1 is characterized in that: described excessive Xi Kou (1) is a rectangle gap.
3. sheet type spout for avoidance of grounding block element according to claim 2 is characterized in that: the degree of depth of described excessive Xi Kou (1) is 3～4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810234216A CN101765316A (en) | 2008-11-25 | 2008-11-25 | Sheet type spout for avoidance of grounding block element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810234216A CN101765316A (en) | 2008-11-25 | 2008-11-25 | Sheet type spout for avoidance of grounding block element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101765316A true CN101765316A (en) | 2010-06-30 |
Family
ID=42496256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810234216A Pending CN101765316A (en) | 2008-11-25 | 2008-11-25 | Sheet type spout for avoidance of grounding block element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101765316A (en) |
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2008
- 2008-11-25 CN CN200810234216A patent/CN101765316A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100630 |