CN101764590B - Surface-mounting type crystal oscillator - Google Patents

Surface-mounting type crystal oscillator Download PDF

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Publication number
CN101764590B
CN101764590B CN 200910266248 CN200910266248A CN101764590B CN 101764590 B CN101764590 B CN 101764590B CN 200910266248 CN200910266248 CN 200910266248 CN 200910266248 A CN200910266248 A CN 200910266248A CN 101764590 B CN101764590 B CN 101764590B
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CN
China
Prior art keywords
crystal oscillator
electrode
pad
base plate
mounting type
Prior art date
Application number
CN 200910266248
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Chinese (zh)
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CN101764590A (en
Inventor
刘朝胜
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广东大普通信技术有限公司
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Priority to CN 200910266248 priority Critical patent/CN101764590B/en
Publication of CN101764590A publication Critical patent/CN101764590A/en
Application granted granted Critical
Publication of CN101764590B publication Critical patent/CN101764590B/en

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Abstract

The invention discloses a surface-mounting type crystal oscillator which comprises a crystal oscillator shell, a crystal oscillating circuit, a base plate, a plurality of electrodes and a plurality of pads, wherein the crystal oscillating circuit is embedded in the crystal oscillator shell and the base plate and electrically connected with the electrodes; each electrode comprises a first electrode and a second electrode, wherein the first electrode is arranged on the lower surface of the crystal oscillator shell, the second electrode is arranged on the upper surface of the base plate, and the first electrode and the corresponding second electrode are connected by using a surface mounting technology; each pad comprises a first pad and a second pad, wherein the first pad is arranged on the upper surface of the crystal oscillator shell and electrically connected with the first electrode, and the second pad is arranged on the lower surface of the base plate and electrically connected with the second electrode. A groove is arranged on the second pad. A through groove is formed by depressing a side wall of the base plate. The groove is corresponding to the through groove and is communicated with the through groove. The first pad is formed by the part of the first electrode which goes through the crystal oscillator shell, and the second pad is formed by the part of the second electrode which goes through the base plate.

Description

Surface-mounting type crystal oscillator
Technical field
The utility model relates to the crystal oscillator field, relates more specifically to a kind of surface-mounting type crystal oscillator.
Background technology
The application of quartz oscillator has the history of decades, because it has high these characteristics of frequency stability, so occupy an important position in electronic technology field always.Especially the high speed development of IT industry more makes this crystal oscillator shine vitality.Quartz oscillator is in telecommunication, satellite communication, mobile telephone system, global positioning system, navigation, remote control, Aero-Space, high-speed computer, accurate measuring instrument and consumer consumer electronic product, as standard frequency source or pulse signal source, frequency reference is provided, and is that the oscillator of at present other type is irreplaceable.Quartz oscillator is divided into non-Temp .-compensation type crystal oscillator, temperature compensating crystal oscillator, voltage controlled crystal oscillator, constant-temperature crystal oscillator and digitlization/several types such as the compensation crystal oscillator of μ p.At present, crystal oscillator is all very good because of its performance at aspects such as ageing rate, temperature stability, frequency stability and accuracy, so the accurate time frequency signal of Chang Zuowei source is widely used in the electronic instruments such as global positioning system, communication, metering, remote measuring and controlling, frequency spectrum and network analyzer.
Existing crystal oscillator adopts dual in-line package usually, this crystal oscillator comprises crystal oscillator body and base, the crystal oscillator body is fixedly connected on the base, base comprises base plate and functional pin, this functional pin is electrically connected with crystal oscillating circuit, and centering on around it has the insulating barrier of ring-type to insulate with metal base plate.The functional pin of this crystal oscillator inserts the circuit board of product and is electrically connected with circuit board, on the one hand, the height of this crystal oscillator is higher, be unfavorable for the miniaturization production of electronic product, on the other hand, need manual operation when adopting the crystal oscillator of direct insertion encapsulation to install, cost height and production efficiency are extremely low.In order to enhance productivity, realize the miniaturization of electronic product, the crystal oscillator manufacturer improves the crystal oscillator of existing employing contact pin mode.With reference to figure 1, this crystal oscillator 1 also comprises crystal oscillator body 11 and base 12, different from above-mentioned dual inline type crystal oscillator is, crystal oscillator 1 adopts the surface mounting technology encapsulation, be provided with pad 13 to be connected with circuit board at base 12, the volume of crystal oscillator has been dwindled in this design.But, more and more with the connection line of product circuit plate because the function that current crystal oscillator is born is various, so its pad number also correspondingly increases; Therefore, crystal oscillator 1 as shown in Figure 1, because pad 13 only is arranged on the base 12 of crystal oscillator 1, and the plane space on the base 12 is limited, this arranges and has limited to the circuit that crystal oscillator 1 is electrically connected with the product circuit plate, so that the pad number of crystal oscillator and its application function that grows with each passing day are not complementary, limited to the range of application of crystal oscillator.
Therefore, demand a kind ofly can increasing the pad number urgently, production technology is simple, low-cost and realize that the surface-mounting type crystal oscillator of high efficiency assembling overcomes defects.
Summary of the invention
The object of the present invention is to provide a kind of pad number, production technology of can increasing simple, low-cost and realize the surface-mounting type crystal oscillator of high efficiency assembling.
In order to achieve the above object, the invention provides a kind of surface-mounting type crystal oscillator, it comprises the crystal oscillator housing, crystal oscillating circuit, base plate, some electrodes and some pads, described crystal oscillating circuit be embedded in the described crystal oscillator housing with described base plate in, and described crystal oscillating circuit is electrically connected with described electrode, described electrode comprises the first electrode and the second electrode, described the first electrode is arranged at the lower surface of described crystal oscillator housing, described the second electrode is arranged at the upper surface of described base plate, described the first electrode is connected by surface mounting technology with corresponding described the second electrode, described pad comprises the first pad and the second pad, described the first pad is arranged at the upper surface of described crystal oscillator housing and is electrically connected with described the first electrode, and described the second pad is arranged at the lower surface of described base plate and is electrically connected with corresponding described the second electrode;
Offer groove on described the second pad, the sidewall of the described base plate formation groove that caves inward, described groove is through to the lower surface of described base plate from the upper surface of described base plate, and described groove is corresponding with described groove and be connected.When the second pad is connected with circuit board by surface mounting technology, unnecessary solder(ing) paste can flow into this groove and then flow into groove, this design has not only effectively utilized the space of surface-mounting type crystal oscillator of the present invention, so that surface-mounting type crystal oscillator is more attractive in appearance, and make this surface-mounting type crystal oscillator more stable with being electrically connected of circuit board;
Described the first pad is formed by the part that described the first electrode passes the upper surface of described crystal oscillator housing, and described the second pad is formed by the part that described the second electrode passes the lower surface of described base plate.This design simplification the production technology of this surface-mounting type crystal oscillator, strengthened its electrical connection properties.
Compared with prior art, pad in the surface-mounting type crystal oscillator of the present invention not only is arranged on the base plate, and be arranged on the upper surface of crystal oscillator housing, limitation formula layout-pad that this design has broken through conventional surface-mounting type crystal oscillator pad only is laid on the base plate, by laying the first pad at the upper surface of crystal oscillator housing, and the first pad is electrically connected with electrode in the surface-mounting type crystal oscillator, thereby effectively utilized the confined space of surface-mounting type crystal oscillator, so that the pad number of crystal oscillator and its application function that grows with each passing day be complementary, and then enlarge the range of application of this surface-mounting type crystal oscillator.In addition, described the first electrode is connected by surface mounting technology with corresponding described the second electrode, the internal circuit that surface mounting technology is applied to crystal oscillator connects, having broken through in the past, the crystal oscillator internal electrical connects the limitation that adopts binding technique, thereby simplified the fabrication processing of surface-mounting type crystal oscillator of the present invention, reduce its cost of manufacture, realized high efficiency machine batch production.
Preferably, offer depressed part on described the first electrode in the surface-mounting type crystal oscillator, described depressed part is the formation that caves inward of the sidewall of described crystal oscillator housing.When described the first electrode is connected by surface mounting technology with corresponding described the second electrode, unnecessary solder(ing) paste can flow into this depressed part, such design has not only effectively utilized the space of surface-mounting type crystal oscillator of the present invention, and so that surface-mounting type crystal oscillator is more attractive in appearance.
Preferably, the described depressed part in the surface-mounting type crystal oscillator extends towards the direction of the upper surface of described crystal oscillator housing, the height of described depressed part be described crystal oscillator housing sidewall height 2/3rds.
Preferably, the described crystal oscillator housing in the surface-mounting type crystal oscillator offers through hole, and described through hole runs through the upper surface of described crystal oscillator housing.This through hole be designed with two kinds of effects, one, the design of this through hole has increased crystal oscillator and extraneous communicating passage, is conducive to the heat radiation of device in the surface-mounting type crystal oscillator of the present invention, so that the surface-mounting type crystal oscillator place of working is more stable; Its two, for this surface-mounting type crystal oscillator provides filling channel, the staff can be by this passage filler in this crystal oscillator, thereby strengthens the steadiness of the device in this crystal oscillator.
By following description also by reference to the accompanying drawings, it is more clear that the present invention will become, and these accompanying drawings are used for explaining embodiments of the invention.
Description of drawings
Fig. 1 is the schematic perspective view of existing a kind of surface-mounting type crystal oscillator.
Fig. 2 is the schematic perspective view of surface-mounting type crystal oscillator of the present invention.
Fig. 3 is the three-dimensional exploded view of surface-mounting type crystal oscillator shown in Figure 2.
Fig. 4 is the structural representation of the upper surface of crystal oscillator housing in the surface-mounting type crystal oscillator shown in Figure 2.
Fig. 5 is the structural representation of the lower surface of crystal oscillator housing in the surface-mounting type crystal oscillator shown in Figure 2.
Fig. 6 is the structural representation of the upper surface of base plate in the surface-mounting type crystal oscillator shown in Figure 2.
Fig. 7 is the structural representation of the lower surface of base plate in the surface-mounting type crystal oscillator shown in Figure 2.
Embodiment
With reference now to accompanying drawing, describe embodiments of the invention, similar element numbers represents similar element in the accompanying drawing.It is simple, low-cost and realize the surface-mounting type crystal oscillator of high efficiency assembling to the invention provides a kind of pad number, production technology of can increasing.
Figure 2 shows that the schematic perspective view of surface-mounting type crystal oscillator of the present invention.With reference to figure 2-3, surface-mounting type crystal oscillator 2 of the present invention comprises crystal oscillator housing 21, crystal oscillating circuit (not shown), base plate 22, some electrodes and some pads 24.Described crystal oscillating circuit is embedded in the described crystal oscillator housing 21, and is embedded in the described base plate 22, and described crystal oscillating circuit is electrically connected with described electrode.Described crystal oscillator housing 21 offers through hole 211, and described through hole 211 runs through the upper surface 212 of described crystal oscillator housing.This through hole 211 be designed with the heat radiation that is beneficial to the device in the surface-mounting type crystal oscillator 2, so that the work of surface-mounting type crystal oscillator 2 is more stablized is safer, and, this through hole provides filling channel for this surface-mounting type crystal oscillator, the staff can be by this passage filler in this crystal oscillator, thereby strengthens the steadiness of the device in this crystal oscillator.
With reference to figure 2-7, described electrode comprises the first electrode 231 and the second electrode 232, is arranged at respectively the lower surface 213 of described crystal oscillator housing and the upper surface 221 of base plate.Described the first electrode 231 that is laid in the lower surface 213 of described crystal oscillator housing is four, is arranged at respectively the edge of the lower surface 213 of crystal oscillator housing, and is bordered with the sidewall 215 of crystal oscillator housing.Several described second electrodes 232 are arranged on the upper surface 221 of described base plate, wherein, have four the second electrode 232a to be laid in the edge of the upper surface 221 of described base plate, and are positioned at the corresponding position of described the first electrode 231.When described crystal oscillator housing 21 covers on described base plate 22, the first electrode 231 is connected by surface mounting technology with the second electrode 232a, this electric connection technology has broken through in the past, and the crystal oscillator internal electrical connects the limitation that adopts binding technique, simplified the fabrication processing of surface-mounting type crystal oscillator 2 of the present invention, reduce its cost of manufacture, realized high efficiency machine batch production.In addition, all offer depressed part 214 on four described the first electrodes 231, the sidewall 215 that four described depressed parts 214 the are respectively described crystal oscillator housing formation that caves inward, and described depressed part 214 extends towards the direction of the upper surface 212 of described crystal oscillator housing from the lower surface 213 of described crystal oscillator housing.Preferably, the height of described depressed part 214 be described crystal oscillator housing sidewall 215 height 2/3rds.When four described the first electrodes 231 and corresponding described the second electrode 232a be connected by surface mounting technology stable after, unnecessary solder(ing) paste can flow in the described depressed part 214, such design has not only effectively utilized the limited space of surface-mounting type crystal oscillator of the present invention 2, and so that surface-mounting type crystal oscillator 2 is more attractive in appearance.
With reference to figure 2-7, the pad 24 of surface-mounting type crystal oscillator 2 of the present invention comprises the first pad 241 and the second pad 242.Described the first pad 241 is arranged at the upper surface 212 of described crystal oscillator housing and is electrically connected with the first electrode 231, in the present embodiment, described the first pad 241 be by described the first electrode 231 pass described crystal oscillator housing upper surface 212 part through the casting or stamping forming, same the first electrode 231 can be divided into multichannel and pass the upper surface 212 of crystal oscillator housing and form a plurality of the first pads 241.Described the second pad 242 is arranged at the lower surface 222 of described base plate and is electrically connected with the second electrode 232a, in the present embodiment, described the second pad 242 be by part the second electrode 232 pass described base plate lower surface 222 part through the casting or stamping forming, in the present embodiment, a plurality of described the second electrodes 232 can be merged into one the tunnel and pass the lower surface 222 of described base plate and form second pad 242.Offer groove 2421 on described the second pad 242, the sidewall 223 of described base plate caves inward and forms groove 224, described groove 224 is through to the lower surface 222 of described base plate from the upper surface 221 of described base plate, and described groove 2421 is with described groove 224 corresponding settings and be connected.When the second pad 242 be connected with the circuit board (not shown) by surface mounting technology stable after, unnecessary solder(ing) paste can flow into this groove 2421 and then flow into groove 224, this design has not only effectively utilized the confined space of surface-mounting type crystal oscillator 2 of the present invention, so that surface-mounting type crystal oscillator 2 is more attractive in appearance, and make this surface-mounting type crystal oscillator 2 more stable with being electrically connected of circuit board.
Surface-mounting type crystal oscillator 2 of the present invention on the basis of existing technology, upper surface 212 at the crystal oscillator housing has increased by the first pad 241, limitation formula layout-pad that this design has broken through conventional surface-mounting type crystal oscillator pad only is laid on the base plate, effectively utilized the confined space of surface-mounting type crystal oscillator 2, so that the pad number of above-mentioned surface-mounting type crystal oscillator and its application function that grows with each passing day be complementary, and then enlarge the range of application of surface-mounting type crystal oscillator 2 of the present invention.
Need to prove, the corresponding annexation of the first pad and the first electrode in the surface-mounting type crystal oscillator of the present invention, and the second pad designs with the visual concrete condition of corresponding annexation of the second electrode.The number of pad is not limited to the number in above-described embodiment, visual concrete condition increases or reduces the number of pad, in addition, the size of surface-mounting type crystal oscillator integral body of the present invention is also decided on the specific requirement of client product, this is well known to those skilled in the art, and does not repeat them here.
Above invention has been described in conjunction with most preferred embodiment, but the present invention is not limited to the embodiment of above announcement, and should contain various modification, equivalent combinations of carrying out according to essence of the present invention.

Claims (4)

1. surface-mounting type crystal oscillator, it is characterized in that: comprise the crystal oscillator housing, crystal oscillating circuit, base plate, some electrodes and some pads, described crystal oscillating circuit be embedded in the described crystal oscillator housing with described base plate in, and described crystal oscillating circuit is electrically connected with described electrode, described electrode comprises the first electrode and the second electrode, described the first electrode is arranged at the lower surface of described crystal oscillator housing, described the second electrode is arranged at the upper surface of described base plate, described the first electrode is connected by surface mounting technology with corresponding described the second electrode, described pad comprises the first pad and the second pad, described the first pad is arranged at the upper surface of described crystal oscillator housing and is electrically connected with described the first electrode, described the second pad is arranged at the lower surface of described base plate and is electrically connected with corresponding described the second electrode, offer groove on described the second pad, the sidewall of the described base plate formation groove that caves inward, described groove is through to the lower surface of described base plate from the upper surface of described base plate, described groove is corresponding with described groove and be connected, described the first pad is formed by the part that described the first electrode passes the upper surface of described crystal oscillator housing, and described the second pad is formed by the part that described the second electrode passes the lower surface of described base plate.
2. surface-mounting type crystal oscillator as claimed in claim 1 is characterized in that: offer depressed part on described the first electrode, described depressed part is the formation that caves inward of the sidewall of described crystal oscillator housing.
3. surface-mounting type crystal oscillator as claimed in claim 2, it is characterized in that: described depressed part extends towards the direction of the upper surface of described crystal oscillator housing, the height of described depressed part be described crystal oscillator housing sidewall height 2/3rds.
4. surface-mounting type crystal oscillator as claimed in claim 1, it is characterized in that: described crystal oscillator housing offers through hole, and described through hole runs through the upper surface of described crystal oscillator housing.
CN 200910266248 2009-12-24 2009-12-24 Surface-mounting type crystal oscillator CN101764590B (en)

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Application Number Priority Date Filing Date Title
CN 200910266248 CN101764590B (en) 2009-12-24 2009-12-24 Surface-mounting type crystal oscillator

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Application Number Priority Date Filing Date Title
CN 200910266248 CN101764590B (en) 2009-12-24 2009-12-24 Surface-mounting type crystal oscillator

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CN101764590B true CN101764590B (en) 2013-03-20

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106788319B (en) * 2016-12-15 2020-12-11 广东大普通信技术有限公司 Miniaturized SMD crystal oscillator

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1938944A (en) * 2004-03-30 2007-03-28 时至准钟表股份有限公司 Quartz oscillator manufacturing method and quartz oscillator
CN101610074A (en) * 2009-07-16 2009-12-23 东莞市大普通信技术有限公司 Constant-temperature crystal oscillator
CN201584947U (en) * 2009-12-24 2010-09-15 广东大普通信技术有限公司 Surface-mounting crystal oscillator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1938944A (en) * 2004-03-30 2007-03-28 时至准钟表股份有限公司 Quartz oscillator manufacturing method and quartz oscillator
CN101610074A (en) * 2009-07-16 2009-12-23 东莞市大普通信技术有限公司 Constant-temperature crystal oscillator
CN201584947U (en) * 2009-12-24 2010-09-15 广东大普通信技术有限公司 Surface-mounting crystal oscillator

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