CN101764333A - Method for electrically conducting electric element and production method of microphone by using method - Google Patents
Method for electrically conducting electric element and production method of microphone by using method Download PDFInfo
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- CN101764333A CN101764333A CN200910190505A CN200910190505A CN101764333A CN 101764333 A CN101764333 A CN 101764333A CN 200910190505 A CN200910190505 A CN 200910190505A CN 200910190505 A CN200910190505 A CN 200910190505A CN 101764333 A CN101764333 A CN 101764333A
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Abstract
The invention discloses a method for electrically conducting an electric element and a production method of a microphone by using the method. The method comprises the following steps of: providing a first electric element and a second electric element which are required to be conductive, wherein the first electric element and the second electric element are respectively provided with a bonding pad; coating anisotropic conductive adhesive on the bonding pad of the first electric element or the bonding pad of the second electric element; applying force on the direction required to be electrically conducted; pressing the first electric element and the second electric element; and then heating, curing and cooling the first electric element and the second electric element. The method can prevent the short circuit between the bonding pads.
Description
Technical field
The present invention relates to a kind of method that realizes that electric elements conduct, relate in particular to and a kind ofly can be used for the method that the small electronic equipment electric elements conduct.
Background technology
Mobile communication technology is rapidly developed in recent years.The consumer uses small electronic equipment more and more, and for example portable phone, the portable phone that can surf the Net, personal digital assistant, laptop computer, laptop computer, figure input card maybe can be by other equipment public or that dedicated communications network communicates.The technological progress of the expansion at honeycomb networking and mobile communication aspect makes more consumers use mobile communication equipment.
Small electronic equipment conducts requirement than higher for the electric elements of inside.As, the consumer not only is satisfied with and can converses the requirement of mobile communication equipment, and wants high-quality communication effect can be provided, the especially development of mobile multimedia technology, and the speech quality of mobile phone becomes more important,
The capacitance microphone of correlation technique comprises two wiring boards that are oppositely arranged, and respectively with these two cavitys that wiring board links to each other, being electrically connected of wiring board and cavity is to realize by being separately positioned on the pad on wiring board and the cavity respectively coated with conductive glue.But this method also will apply the glue non-conductive, that bonding force is strong around pad.This method program complexity, and the non-conductive adhesive between the pad is difficult to conducting resinl is separated fully, is easy to cause the short circuit between the pad.
Therefore, provide a kind of conducting between the electric elements of realizing, can be good at preventing the short circuit between the pad, becoming needs the problem that solves; In microphone, just provide a kind of manufacture method of microphone, can prevent the short circuit between the pad, the performance that improves microphone becomes the problem that needs solution.
Summary of the invention
The object of the present invention is to provide a kind of method that realizes that electric elements conduct, can prevent the short circuit between the pad.
For reaching above-mentioned technical purpose, the technical solution used in the present invention is:
The method that a kind of electric elements conduct, this method comprises the steps:
First electric elements and second electric elements that need conducting are provided, be respectively equipped with pad on first electric elements and second electric elements, on the pad of the pad of first electric elements or second electric elements, apply different in nature conducting resinl, apply power on the direction that realizes conducting at needs, push first electric elements and second electric elements, be heated then and solidify the back cooling.
Preferably, described different in nature conducting resinl is different in nature conductive glue or different in nature conductive adhesive film.
Preferably, cooling step carries out at normal temperatures.
The present invention also provides a kind of manufacture method of microphone, and this method comprises the steps:
The required wiring board that has pad of microphone, the cavity that has pad, control circuit chip and transducer are provided, and wiring board is provided with tone-entering hole;
Assembling applies different in nature conducting resinl on the pad of the pad of wiring board or cavity, apply power on the direction vertical with pad, and extruding wiring board and pad are heated then and solidify the back cooling; Wiring board and cavity form host cavity, and transducer and control circuit chip are placed in this host cavity.
Preferably, described different in nature conducting resinl is different in nature conductive glue or different in nature conductive adhesive film.
Preferably, cooling step carries out at normal temperatures.
Beneficial effect of the present invention is:
Owing on the pad that first wiring board or second wiring board are provided with, apply different in nature conducting resinl, on the direction of promptly wishing to realize conducting perpendicular to the direction of pad, apply certain power, push first wiring board and second wiring board, then through being heating and curing, characteristic according to different in nature conducting resinl, just can realize lead in the direction of promptly wishing perpendicular to the direction of pad to conduct, and can not conduct electricity in the other direction, so method provided by the invention has prevented the short circuit between the pad when realizing conducting;
In the invention provides the manufacture method of microphone, owing on the pad of the pad of cavity or wiring board, be coated with different in nature conducting resinl, in direction perpendicular to pad, wish that just the direction that conducts applies certain power, extrusion chamber and wiring board, be heating and curing then, characteristic according to different in nature conducting resinl, just can realize conducting in the direction of promptly wishing perpendicular to the direction of pad to conduct, and can not conduct electricity in the other direction, so method provided by the invention when realizing conducting, has prevented the short circuit between the pad, only through once beating the glue process, simplified manufacture craft simultaneously.
Description of drawings
Fig. 1 is the method for attachment schematic diagram that electric elements conduct among the embodiment provided by the invention;
Fig. 2 is the three-dimensional coordinate figure of Fig. 1, and wherein directions X is represented the horizontal direction of pad, and the representative of Y direction applies the direction of power;
Fig. 3 is to use the cutaway view of the microphone that manufacture method provided by the invention makes;
Fig. 4 is the arrangement mode of pad on second wiring board among Fig. 3.
Embodiment
The present invention will be further described below in conjunction with accompanying drawing.
As shown in Figure 1, in the method that realization electric elements provided by the invention conduct, provide first electric elements as first wiring board 1 and second electric elements as second wiring board 2, first wiring board 1 is provided with first pad 11 and second pad 12, be provided with the 3rd pad 21 and the 4th pad 22 at second wiring board 2, certainly, the number of the pad that is provided with at first wiring board 11 and second wiring board 12 is not limited to 2.
On first pad 11 and second pad 12, apply different in nature conducting resinl respectively, certainly, also can on the 3rd pad 21 or the 4th pad 22, apply different in nature conducting resinl respectively, also can on first pad 11, second pad 12, the 3rd pad 21 and the 4th pad 22, distinguish coated with conductive glue, as shown in Figure 2, apply power F on the direction that realizes conducting at needs, promptly on Y direction, apply power, be heated then and solidify the back cooling perpendicular to pad.Like this, just can be implemented on the Y direction perpendicular to pad and apply power, and on directions X and Z direction, can not conduct.Like this, just prevented to conduct between first pad 11 and second pad 12, also prevented to conduct between the 3rd pad 21 and the 4th pad 22.
Wherein, different in nature conducting resinl can be different in nature conducting film, also can be different in nature conductive glue.
Opposite sex conducting film (ACF Anisotropic Conductive Film) is the polymeric membrane that has conduction, insulation, three functions of bonding simultaneously.Be adhesive agent and conducting particles main the composition.The composition of opposite sex conductive glue is the same with function with different in nature conducting film.
Cooling is carried out at normal temperatures.
The method of manufacturing microphone provided by the invention, as shown in Figure 3, required first wiring board 31 that has pad (not shown) of microphone 3 is provided, has second wiring board 32 of pad (not shown), the cavity 33, control circuit chip 35 and transducer 34, the second wiring boards 32 that have pad (not shown) are provided with tone-entering hole 36.
Opposite sex conducting resinl can be different in nature conductive glue, also can be different in nature conductive adhesive film.Cooling can be carried out at normal temperatures.
Referring to Fig. 4, adopt this kind method to make microphone 3, make be arranged on second wiring board 32 the first wiring board pad 321, the second wiring board pad 322, tertiary circuit plate pad 323 and the 4th wiring board pad 324 apply different in nature conducting resinl, through after being heating and curing, can keep the cavity 32 and second wiring board 32 under the situation of junction 37 conductings, not conducting between these four pads, thereby prevented the short circuit between the pad, only through once beating the glue process, simplified manufacture craft simultaneously.
Certainly, as described above, different in nature conducting resinl is not limited only to be coated on the pad of second wiring board 32, also can be coated on the pad of first wiring board 31, can also be coated on the pad of cavity 33, can reach same effect.
Protection scope of the present invention is not exceeded with above-mentioned execution mode, as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (6)
1. method that electric elements conduct, it is characterized in that: this method comprises the steps:
First electric elements and second electric elements that need conducting are provided, be respectively equipped with pad on first electric elements and second electric elements, on the pad of the pad of first electric elements or second electric elements, apply different in nature conducting resinl, apply power on the direction that realizes conducting at needs, push first electric elements and second electric elements, be heated then and solidify the back cooling.
2. the method that electric elements according to claim 1 conduct is characterized in that: described different in nature conducting resinl is different in nature conductive glue or different in nature conductive adhesive film.
3. the method that electric elements according to claim 1 conduct is characterized in that: cooling step carries out at normal temperatures.
4. the manufacture method of a microphone is characterized in that, this method comprises the steps:
The required wiring board that has pad of microphone, the cavity that has pad, control circuit chip and transducer are provided, and wiring board is provided with tone-entering hole;
Assembling applies different in nature conducting resinl on the pad of the pad of wiring board or cavity, apply power on the direction vertical with pad, and extruding wiring board and pad are heated then and solidify the back cooling; Wiring board and cavity form host cavity, and transducer and control circuit chip are placed in this host cavity.
5. the manufacture method of microphone according to claim 4, it is characterized in that: described different in nature conducting resinl is different in nature conductive glue or different in nature conductive adhesive film.
6. the manufacture method of microphone according to claim 4, it is characterized in that: cooling step carries out at normal temperatures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910190505A CN101764333A (en) | 2009-09-28 | 2009-09-28 | Method for electrically conducting electric element and production method of microphone by using method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910190505A CN101764333A (en) | 2009-09-28 | 2009-09-28 | Method for electrically conducting electric element and production method of microphone by using method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101764333A true CN101764333A (en) | 2010-06-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910190505A Pending CN101764333A (en) | 2009-09-28 | 2009-09-28 | Method for electrically conducting electric element and production method of microphone by using method |
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| CN (1) | CN101764333A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569239A (en) * | 2010-12-01 | 2012-07-11 | 海力士半导体有限公司 | Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package |
| CN103323916A (en) * | 2012-03-22 | 2013-09-25 | 鸿富锦精密工业（深圳）有限公司 | High frequency transmission module and optical fiber connector |
-
2009
- 2009-09-28 CN CN200910190505A patent/CN101764333A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569239A (en) * | 2010-12-01 | 2012-07-11 | 海力士半导体有限公司 | Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package |
| CN103323916A (en) * | 2012-03-22 | 2013-09-25 | 鸿富锦精密工业（深圳）有限公司 | High frequency transmission module and optical fiber connector |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100630 |