CN101762749A - Device for testing impedance of chip mounting plate assembly - Google Patents
Device for testing impedance of chip mounting plate assembly Download PDFInfo
- Publication number
- CN101762749A CN101762749A CN 201010122839 CN201010122839A CN101762749A CN 101762749 A CN101762749 A CN 101762749A CN 201010122839 CN201010122839 CN 201010122839 CN 201010122839 A CN201010122839 A CN 201010122839A CN 101762749 A CN101762749 A CN 101762749A
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- CN
- China
- Prior art keywords
- anchor clamps
- chip mounting
- testing
- clamp seat
- multimeter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Measurement Of Resistance Or Impedance (AREA)
Abstract
The invention provides a device for testing an impedance of a chip mounting plate assembly, which comprises a pedestal, a multimeter and a clamp. The clamp comprises an upper clamp seat and a lower clamp seat. The pedestal is provided with a vertical plate. The vertical plate is provided with a vertical lifting mechanism. The upper clamp seat is horizontally fixed on the vertical lifting mechanism. The lower clamp seat is horizontally fixed on the pedestal. The lower clamp seat is opposite to the upper clamp seat. The surface of the lower clamp seat is provided with a testing thimble. The testing thimble is electrically connected with the multimeter. The device realizes rapid detection, improves the testing efficiency of the SMT chip mounting element, reduces the misdetection value and saves the detection time by using the vertical lifting mechanism to drive the upper clamp seat to move up and down to cause an element on an SMT chip mounting plate fixed by the upper clamp seat to sufficiently contact with the testing thimble, carrying out testing by contacting the testing thimble with the SMT chip mounting component to acquire a value, and reading the value of the element of the SMT chip mounting component by a multimeter.
Description
Technical field
The present invention relates to a kind of device that is used for testing impedance of chip mounting plate assembly.
Background technology
SMT patch plate element is more at present, and during test, the tester adopts the point-to-point test mode of instrument more loaded down with trivial details, need to arrange many people to test, also can occur the problem of test leakage, mistake survey sometimes, not only increased personnel's man-hour, also increased the false pass rate of product, brought influence to production.
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, a kind of device of testing impedance of chip mounting plate assembly is provided, be intended to improve not high-technology problem of the loaded down with trivial details and testing efficiency of existing SMT patch plate test.
Purpose of the present invention is achieved through the following technical solutions:
The device of testing impedance of chip mounting plate assembly, comprise base and anchor clamps, described anchor clamps comprise following of the anchor clamps seat of honour and anchor clamps, characteristics are: a riser is set on the described base, and described riser is provided with vertical lifting mechanism, and the described anchor clamps seat of honour is horizontally fixed on the vertical lifting mechanism, following of described anchor clamps are horizontally fixed on the base, following of anchor clamps are relative with the anchor clamps seat of honour, and the surface that anchor clamps are following is provided with the test thimble, and described test thimble and multimeter electrically connect.
Further, the device of above-mentioned testing impedance of chip mounting plate assembly, wherein, described test thimble is connected with the data line jack by lead, and the lead of multimeter inserts in the data line jack.
The substantive distinguishing features of technical solution of the present invention and progressive being mainly reflected in:
Structure uniqueness of the present invention, SMT paster mainboard is read test data by closely contacting with the test thimble by tester, realizes the fast detecting of tab member performance; Promoted SMT testing surface mounted element efficient, reduced the mistake measured value, saved detection time.Change single working method of testing multiple spot simultaneously into by the point-to-point test mode of original many people, controlled personnel's increase, reduced cost.
Description of drawings
Below in conjunction with accompanying drawing technical solution of the present invention is described further:
Fig. 1: the synoptic diagram of testing impedance anchor clamps of the present invention.
The implication of each Reference numeral sees the following form among the figure:
| Reference numeral | Implication | Reference numeral | Implication | Reference numeral | Implication |
| ??1 | Base | ??2 | Riser | ??3 | Vertical lifting mechanism |
| ??4 | The anchor clamps seat of honour | ??5 | Following of anchor clamps | ??6 | The test thimble |
| Reference numeral | Implication | Reference numeral | Implication | Reference numeral | Implication |
| ??7 | The data line jack | ??8 | Multimeter |
Embodiment
As shown in Figure 1, the device of testing impedance of chip mounting plate assembly, comprise base 1, multimeter 8 and anchor clamps, anchor clamps comprise following 5 of the anchor clamps seat of honour 4 and anchor clamps, one riser 2 is set on the base 1, riser 2 is provided with vertical lifting mechanism 3, the anchor clamps seat of honour 4 is horizontally fixed on the vertical lifting mechanism 3, following 5 of anchor clamps are horizontally fixed on the base 1, following 5 of anchor clamps are relative with the anchor clamps seat of honour 4, and the surface that anchor clamps are following 5 is provided with test thimble 6, and test thimble 6 is connected with data line jack 7 by lead, the lead of multimeter 8 inserts in the data line jack 7, thereby test thimble 6 electrically connects with multimeter 8.
Following 5 of anchor clamps position punching according to the element two ends correspondence position that needs on SMT (surface mount) patch plate to test, test point thimble position is relevant with position of components on the SMT patch plate, test thimble 6 is installed in the corresponding aperture, one end of lead welds with the lower end of test thimble 6, the other end of lead is welded on the data line jack 7, the point-to-point welding, multimeter 8 upper conductors insert in the data line jack 7.Promptly finished the lifting of SMT adhesive sheet element detection clamp performance by above-mentioned installation process.During as desire dismounting separating component, then opposite with aforementioned operation, can finish isolation of components smoothly.
During test, vertical lifting mechanism 3 drives the anchor clamps seat of honour 4 and moves downward, make on the fixing SMT patch plate in the anchor clamps seat of honour 4 element and test thimble 6 and fully contact, contact with the SMT surface mount elements by test thimble 6 and to measure numerical value and test, and be wired on the multimeter 8, thereby read the numerical value of element on the SMT patch plate.According to actual needs, set up many digital multimeter, realize multi-point sampler.
In sum, modern design of the present invention, SMT paster mainboard is read test data by closely contacting with the test thimble by tester, realizes the fast detecting of tab member performance; Promoted SMT testing surface mounted element efficient, reduced the mistake measured value, saved the detection performance time.Change single working method of testing multiple spot simultaneously into by the point-to-point test mode of original many people, controlled personnel's increase, reduced personnel cost; Significantly reduce the consuming time of whole test operation link, also promoted test mass (testing element quantity is more on original SMT patch plate, and the test leakage problem often appears in long-time test).
It is emphasized that: above only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (2)
1. the device of testing impedance of chip mounting plate assembly, comprise base and anchor clamps, described anchor clamps comprise following of the anchor clamps seat of honour and anchor clamps, it is characterized in that: a riser is set on the described base, and described riser is provided with vertical lifting mechanism, and the described anchor clamps seat of honour is horizontally fixed on the vertical lifting mechanism, following of described anchor clamps are horizontally fixed on the base, following of anchor clamps are relative with the anchor clamps seat of honour, and the surface that anchor clamps are following is provided with the test thimble, and described test thimble and multimeter electrically connect.
2. the device of testing impedance of chip mounting plate assembly according to claim 1, it is characterized in that: described test thimble is connected with the data line jack by lead, and the lead of multimeter inserts in the data line jack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010122839 CN101762749A (en) | 2010-03-05 | 2010-03-05 | Device for testing impedance of chip mounting plate assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010122839 CN101762749A (en) | 2010-03-05 | 2010-03-05 | Device for testing impedance of chip mounting plate assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101762749A true CN101762749A (en) | 2010-06-30 |
Family
ID=42494038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010122839 Pending CN101762749A (en) | 2010-03-05 | 2010-03-05 | Device for testing impedance of chip mounting plate assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101762749A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102944746A (en) * | 2012-11-11 | 2013-02-27 | 广西梧州市平洲电子有限公司 | Chip inductor impedance detection equipment |
| CN109541340A (en) * | 2018-10-29 | 2019-03-29 | 山东同方鲁颖电子有限公司 | A kind of chip electronic component test device |
| CN110045185A (en) * | 2019-04-17 | 2019-07-23 | 深圳振华富电子有限公司 | Patch products D.C. resistance test fixture |
| CN111239513A (en) * | 2020-01-16 | 2020-06-05 | 深圳市蓝眼博科科技有限公司 | Measuring device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2539970Y (en) * | 2002-01-15 | 2003-03-12 | 禾咏丰科技股份有限公司 | Detector for testing electric resistance of passive element |
| CN1763524A (en) * | 2005-09-29 | 2006-04-26 | 重庆大学 | Novel full automatic Vicat apparatus |
| CN200947100Y (en) * | 2005-09-29 | 2007-09-12 | 重庆大学 | Automatic vicat apparatus of cement setting time |
| CN201018149Y (en) * | 2006-12-20 | 2008-02-06 | 王镇 | Minitype contact pin connector for great current situation |
| CN201262592Y (en) * | 2008-09-05 | 2009-06-24 | 无锡市江益轴承自动化设备有限公司 | Contraposition detection device for bearings bulb separation retainer assembly machine |
-
2010
- 2010-03-05 CN CN 201010122839 patent/CN101762749A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2539970Y (en) * | 2002-01-15 | 2003-03-12 | 禾咏丰科技股份有限公司 | Detector for testing electric resistance of passive element |
| CN1763524A (en) * | 2005-09-29 | 2006-04-26 | 重庆大学 | Novel full automatic Vicat apparatus |
| CN200947100Y (en) * | 2005-09-29 | 2007-09-12 | 重庆大学 | Automatic vicat apparatus of cement setting time |
| CN201018149Y (en) * | 2006-12-20 | 2008-02-06 | 王镇 | Minitype contact pin connector for great current situation |
| CN201262592Y (en) * | 2008-09-05 | 2009-06-24 | 无锡市江益轴承自动化设备有限公司 | Contraposition detection device for bearings bulb separation retainer assembly machine |
Non-Patent Citations (1)
| Title |
|---|
| 《湖北广播电视大学学报》 20070630 周煜 如何对表面贴装印刷电路板（SMT PCB）进行缺陷检查 第27卷, 第6期 2 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102944746A (en) * | 2012-11-11 | 2013-02-27 | 广西梧州市平洲电子有限公司 | Chip inductor impedance detection equipment |
| CN109541340A (en) * | 2018-10-29 | 2019-03-29 | 山东同方鲁颖电子有限公司 | A kind of chip electronic component test device |
| CN110045185A (en) * | 2019-04-17 | 2019-07-23 | 深圳振华富电子有限公司 | Patch products D.C. resistance test fixture |
| CN111239513A (en) * | 2020-01-16 | 2020-06-05 | 深圳市蓝眼博科科技有限公司 | Measuring device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100630 |